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WO2008108413A1 - 微小構造体装置および微小構造体装置の製造方法 - Google Patents

微小構造体装置および微小構造体装置の製造方法 Download PDF

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Publication number
WO2008108413A1
WO2008108413A1 PCT/JP2008/053976 JP2008053976W WO2008108413A1 WO 2008108413 A1 WO2008108413 A1 WO 2008108413A1 JP 2008053976 W JP2008053976 W JP 2008053976W WO 2008108413 A1 WO2008108413 A1 WO 2008108413A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
balls
microstructure apparatus
paste
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053976
Other languages
English (en)
French (fr)
Inventor
Itaru Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2009502614A priority Critical patent/JP5500983B2/ja
Priority to US12/530,182 priority patent/US20100059244A1/en
Publication of WO2008108413A1 publication Critical patent/WO2008108413A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H10W76/60—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H10W72/01257—
    • H10W72/07227—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/225—
    • H10W72/251—
    • H10W72/252—
    • H10W72/253—
    • H10W72/285—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/952—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Powder Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

　本発明は、微小構造体装置の製造方法に関する。第２基板３の表面上に、ロウ材からなるボールと金属ボールとを含むペーストを塗布する塗布ステップと、ペーストを、ロウ材からなるボールの融点以上であって、かつ該ロウ材からなるボールおよび金属ボールにそれぞれ含まれる材料の化合物を介して金属ボール同士が連結される温度未満の温度に加熱する加熱ステップと、ペーストに第１基板２の表面を接触させて、第１基板と第２基板とを熱圧着し、第１基板および第２基板を、化合物と金属ボールとを介して接続する熱圧着ステップとを備えてなる。
PCT/JP2008/053976 2007-03-05 2008-03-05 微小構造体装置および微小構造体装置の製造方法 Ceased WO2008108413A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009502614A JP5500983B2 (ja) 2007-03-05 2008-03-05 微小構造体装置および微小構造体装置の製造方法
US12/530,182 US20100059244A1 (en) 2007-03-05 2008-03-05 Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007054569 2007-03-05
JP2007-054569 2007-03-05
JP2007255338 2007-09-28
JP2007-255338 2007-09-28

Publications (1)

Publication Number Publication Date
WO2008108413A1 true WO2008108413A1 (ja) 2008-09-12

Family

ID=39738286

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053976 Ceased WO2008108413A1 (ja) 2007-03-05 2008-03-05 微小構造体装置および微小構造体装置の製造方法

Country Status (3)

Country Link
US (1) US20100059244A1 (ja)
JP (1) JP5500983B2 (ja)
WO (1) WO2008108413A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153447A (ja) * 2008-12-24 2010-07-08 Fujikura Ltd 半導体パッケージ及びその製造方法
JP2010281641A (ja) * 2009-06-03 2010-12-16 Denso Corp 力学量センサ、及び該力学量センサの製造方法
CN102148262A (zh) * 2010-02-08 2011-08-10 艾普特佩克股份有限公司 电子装置封装及其制造方法
JP2013541850A (ja) * 2010-10-21 2013-11-14 レイセオン カンパニー 電子デバイスをパッケージングするためのシステムおよび方法
CN104030229A (zh) * 2013-03-08 2014-09-10 先技股份有限公司 薄膜装置
JP6237969B1 (ja) * 2017-03-29 2017-11-29 三菱電機株式会社 中空封止デバイス及びその製造方法
WO2019064430A1 (ja) * 2017-09-28 2019-04-04 三菱電機株式会社 アレーアンテナ装置
JP2022502271A (ja) * 2018-09-26 2022-01-11 Ｉｇｎｉｔｅ株式会社 Ｍｅｍｓパッケージ

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5542470B2 (ja) * 2009-02-20 2014-07-09 パナソニック株式会社 はんだバンプ、半導体チップ、半導体チップの製造方法、導電接続構造体、および導電接続構造体の製造方法
WO2012023899A1 (en) * 2010-08-16 2012-02-23 Agency For Science, Technology And Research Hermetic seal and method of manufacture thereof
EP2631934A4 (en) * 2010-10-22 2018-02-07 Panasonic Intellectual Property Management Co., Ltd. Semiconductor junction structure and method for manufacturing semiconductor junction structure
IN2014DN07833A (ja) * 2012-03-20 2015-04-24 Alpha Metals
JP5795050B2 (ja) * 2013-12-27 2015-10-14 田中貴金属工業株式会社 気密封止パッケージ部材及びその製造方法、並びに、該気密封止パッケージ部材を用いた気密封止パッケージの製造方法
JP5897062B2 (ja) * 2014-05-08 2016-03-30 三菱電機株式会社 圧縮機用電動機及び圧縮機及び冷凍サイクル装置及び圧縮機用電動機の製造方法
JP2016206458A (ja) * 2015-04-23 2016-12-08 株式会社フジクラ 光学装置および光学装置の製造方法
US10340241B2 (en) 2015-06-11 2019-07-02 International Business Machines Corporation Chip-on-chip structure and methods of manufacture
FR3043671A1 (fr) * 2015-11-12 2017-05-19 Commissariat Energie Atomique Procede de preparation d'un support
US9793232B1 (en) 2016-01-05 2017-10-17 International Business Machines Corporation All intermetallic compound with stand off feature and method to make
KR102373440B1 (ko) * 2017-03-17 2022-03-14 삼성디스플레이 주식회사 디스플레이 패널 및 이를 구비하는 디스플레이 장치
DE102018113498B4 (de) * 2018-06-06 2024-02-22 Tdk Corporation MEMS-Vorrichtung
US20230187367A1 (en) * 2021-12-10 2023-06-15 Advanced Semiconductor Engineering, Inc. Electronic package structure and method for manufacturing the same
CN116705743A (zh) * 2023-08-04 2023-09-05 深圳平创半导体有限公司 一种器件及其封装方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07235565A (ja) * 1994-02-23 1995-09-05 Toshiba Corp 電子回路装置
JP2002261105A (ja) * 2000-06-12 2002-09-13 Hitachi Ltd 電子機器
JP2003260587A (ja) * 2002-03-08 2003-09-16 Hitachi Ltd はんだ
JP2003282766A (ja) * 2002-03-27 2003-10-03 Kyocera Corp 電子部品収納用容器
JP2005262382A (ja) * 2004-03-18 2005-09-29 Kyocera Corp 電子装置およびその製造方法
JP2006041312A (ja) * 2004-07-29 2006-02-09 Kyocera Corp 多数個取り電子部品封止用基板および電子装置ならびに電子装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3260941B2 (ja) * 1993-06-18 2002-02-25 株式会社日立製作所 多層配線基板および多層配線基板の製造方法
US6849939B2 (en) * 2001-03-27 2005-02-01 Neomax Co., Ltd. Electronic component package and method of manufacturing same
JP2003142620A (ja) * 2001-10-30 2003-05-16 Kyocera Corp 電子装置
KR100442830B1 (ko) * 2001-12-04 2004-08-02 삼성전자주식회사 저온의 산화방지 허메틱 실링 방법
JP4312631B2 (ja) * 2004-03-03 2009-08-12 三菱電機株式会社 ウエハレベルパッケージ構造体とその製造方法、及びそのウエハレベルパッケージ構造体から分割された素子
US20080271908A1 (en) * 2004-11-05 2008-11-06 Neomax Materials Co., Ltd. Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07235565A (ja) * 1994-02-23 1995-09-05 Toshiba Corp 電子回路装置
JP2002261105A (ja) * 2000-06-12 2002-09-13 Hitachi Ltd 電子機器
JP2003260587A (ja) * 2002-03-08 2003-09-16 Hitachi Ltd はんだ
JP2003282766A (ja) * 2002-03-27 2003-10-03 Kyocera Corp 電子部品収納用容器
JP2005262382A (ja) * 2004-03-18 2005-09-29 Kyocera Corp 電子装置およびその製造方法
JP2006041312A (ja) * 2004-07-29 2006-02-09 Kyocera Corp 多数個取り電子部品封止用基板および電子装置ならびに電子装置の製造方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153447A (ja) * 2008-12-24 2010-07-08 Fujikura Ltd 半導体パッケージ及びその製造方法
JP2010281641A (ja) * 2009-06-03 2010-12-16 Denso Corp 力学量センサ、及び該力学量センサの製造方法
US8225660B2 (en) 2009-06-03 2012-07-24 Denso Corporation Dynamic quantity sensor and method of manufacturing the same
CN102148262A (zh) * 2010-02-08 2011-08-10 艾普特佩克股份有限公司 电子装置封装及其制造方法
JP2013541850A (ja) * 2010-10-21 2013-11-14 レイセオン カンパニー 電子デバイスをパッケージングするためのシステムおよび方法
CN104030229A (zh) * 2013-03-08 2014-09-10 先技股份有限公司 薄膜装置
JP6237969B1 (ja) * 2017-03-29 2017-11-29 三菱電機株式会社 中空封止デバイス及びその製造方法
WO2018179153A1 (ja) * 2017-03-29 2018-10-04 三菱電機株式会社 中空封止デバイス及びその製造方法
US10950567B2 (en) 2017-03-29 2021-03-16 Mitsubishi Electric Corporation Hollow sealed device and manufacturing method therefor
WO2019064430A1 (ja) * 2017-09-28 2019-04-04 三菱電機株式会社 アレーアンテナ装置
JP6516939B1 (ja) * 2017-09-28 2019-05-22 三菱電機株式会社 アレーアンテナ装置
KR20200035161A (ko) * 2017-09-28 2020-04-01 미쓰비시덴키 가부시키가이샤 어레이 안테나 장치
KR102218801B1 (ko) 2017-09-28 2021-02-22 미쓰비시덴키 가부시키가이샤 어레이 안테나 장치
JP2022502271A (ja) * 2018-09-26 2022-01-11 Ｉｇｎｉｔｅ株式会社 Ｍｅｍｓパッケージ
JP7266914B2 (ja) 2018-09-26 2023-05-01 Ｉｇｎｉｔｅ株式会社 Ｍｅｍｓパッケージ

Also Published As

Publication number Publication date
JP5500983B2 (ja) 2014-05-21
US20100059244A1 (en) 2010-03-11
JPWO2008108413A1 (ja) 2010-06-17

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