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WO2008108160A1 - 半導体ウエハ収納容器 - Google Patents

半導体ウエハ収納容器 Download PDF

Info

Publication number
WO2008108160A1
WO2008108160A1 PCT/JP2008/052685 JP2008052685W WO2008108160A1 WO 2008108160 A1 WO2008108160 A1 WO 2008108160A1 JP 2008052685 W JP2008052685 W JP 2008052685W WO 2008108160 A1 WO2008108160 A1 WO 2008108160A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
placing frame
semiconductor
semiconductor wafer
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052685
Other languages
English (en)
French (fr)
Inventor
Nobuyuki Kasama
Yukihiro Hyobu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Priority to US12/442,476 priority Critical patent/US8397917B2/en
Publication of WO2008108160A1 publication Critical patent/WO2008108160A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

ウエハ保持ユニット（２０）には、半導体ウエハ（Ｗ）の外周の下端エッジ縁部分のみに当接するウエハ載置枠（２１）と、ウエハ載置枠（２１）に対し上下方向に可動に配置されて半導体ウエハ（Ｗ）の外周の上端エッジ縁部分のみに当接するウエハ固定枠（２２）と、半導体ウエハ（Ｗ）をウエハ載置枠（２１）から上方に離脱した位置に押し上げてその状態を保持するウエハリフト部材（２３）と、を備えた単一ウエハ保持部（２１）～（２３）が複数上下に重ね合わせられた状態に配置されている。その結果、複数の半導体ウエハ（Ｗ）どうしの間の間隔を大きく離すことなく効率よく安全に収納することができると同時に、半導体ウエハ（Ｗ）の出し入れを良好に行うことができる。
PCT/JP2008/052685 2007-03-05 2008-02-19 半導体ウエハ収納容器 Ceased WO2008108160A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/442,476 US8397917B2 (en) 2007-03-05 2008-02-19 Semiconductor wafer container

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-053870 2007-03-05
JP2007053870A JP5043475B2 (ja) 2007-03-05 2007-03-05 半導体ウエハ収納容器

Publications (1)

Publication Number Publication Date
WO2008108160A1 true WO2008108160A1 (ja) 2008-09-12

Family

ID=39738057

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052685 Ceased WO2008108160A1 (ja) 2007-03-05 2008-02-19 半導体ウエハ収納容器

Country Status (3)

Country Link
US (1) US8397917B2 (ja)
JP (1) JP5043475B2 (ja)
WO (1) WO2008108160A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789566B2 (ja) * 2005-09-30 2011-10-12 ミライアル株式会社 薄板保持容器及び薄板保持容器用処理装置
WO2014081825A1 (en) * 2012-11-20 2014-05-30 Entegris, Inc. Substrate container with purge ports
US9543175B2 (en) 2013-09-25 2017-01-10 International Business Machines Corporation Package assembly for thin wafer shipping and method of use
SG11201607061WA (en) 2014-02-25 2016-09-29 Entegris Inc Wafer shipper with stacked support rings
US10832927B2 (en) * 2015-12-18 2020-11-10 Texas Instruments Incorporated Interlocking nest wafer protector
US11315815B2 (en) * 2016-01-05 2022-04-26 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer container and method for holding wafer
TW201737398A (zh) * 2016-02-09 2017-10-16 恩特葛瑞斯股份有限公司 用於可撓性基板之微環境
US12165905B2 (en) * 2019-05-20 2024-12-10 Applied Materials, Inc. Process kit enclosure system
KR102777080B1 (ko) * 2020-06-05 2025-03-05 삼성전자주식회사 개폐형 기판 수용 카세트 및 그 시스템
CN114373705B (zh) * 2022-01-11 2022-11-15 无锡京运通科技有限公司 用于单晶硅生产的插片机用硅片装载机构
EP4492441A1 (en) * 2022-03-08 2025-01-15 Murata Machinery, Ltd. Wafer container and wafer support

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005006407A1 (de) * 2003-07-11 2005-01-20 Tec-Sem Ag Vorrichtung zum lagern und/oder transportieren von plattenförmigen substraten in der fertigung von elektronischen bauteilen
JP2005142443A (ja) * 2003-11-07 2005-06-02 Yaskawa Electric Corp カセット装置および薄型基板移載システム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3454154A (en) * 1968-05-07 1969-07-08 Us Air Force Integrated circuit carrier
US3552548A (en) * 1968-08-05 1971-01-05 Fluroware Inc Wafer storage and shipping container
JP3089590B2 (ja) * 1991-07-12 2000-09-18 キヤノン株式会社 板状物収納容器およびその蓋開口装置
US5445271A (en) * 1992-11-17 1995-08-29 Kabushiki Kaisha Kakizaki Seisakusho Resin-made basket for thin sheets
US5894924A (en) * 1997-11-25 1999-04-20 Koch; Hans G. Alternative CD-ROM/DVD packaging device
US6568526B1 (en) * 1999-07-27 2003-05-27 Tdk Electronics Corporation Stackable compact disk case
JP2002222852A (ja) 2001-01-24 2002-08-09 Nec Kansai Ltd 半導体ウエハ収納容器
US6837374B2 (en) * 2001-07-15 2005-01-04 Entegris, Inc. 300MM single stackable film frame carrier
JP4096636B2 (ja) * 2002-06-12 2008-06-04 トヨタ自動車株式会社 ウエハ支持治具およびそれを用いた半導体素子製造方法
JP2006093274A (ja) 2004-09-22 2006-04-06 Hitachi Cable Ltd ウェハ収納容器
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005006407A1 (de) * 2003-07-11 2005-01-20 Tec-Sem Ag Vorrichtung zum lagern und/oder transportieren von plattenförmigen substraten in der fertigung von elektronischen bauteilen
JP2005142443A (ja) * 2003-11-07 2005-06-02 Yaskawa Electric Corp カセット装置および薄型基板移載システム

Also Published As

Publication number Publication date
JP5043475B2 (ja) 2012-10-10
US8397917B2 (en) 2013-03-19
JP2008218694A (ja) 2008-09-18
US20090250374A1 (en) 2009-10-08

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