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WO2008108097A1 - Liquid droplet discharging device and method - Google Patents

Liquid droplet discharging device and method Download PDF

Info

Publication number
WO2008108097A1
WO2008108097A1 PCT/JP2008/000433 JP2008000433W WO2008108097A1 WO 2008108097 A1 WO2008108097 A1 WO 2008108097A1 JP 2008000433 W JP2008000433 W JP 2008000433W WO 2008108097 A1 WO2008108097 A1 WO 2008108097A1
Authority
WO
WIPO (PCT)
Prior art keywords
plunger
liquid
droplet discharging
leading end
discharging device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000433
Other languages
French (fr)
Japanese (ja)
Inventor
Kazumasa Ikushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Priority to KR1020147015070A priority Critical patent/KR101521902B1/en
Priority to KR1020157002787A priority patent/KR101600432B1/en
Priority to CN2008800075621A priority patent/CN101646502B/en
Priority to HK10107193.8A priority patent/HK1140720B/en
Priority to JP2009502468A priority patent/JP5271254B2/en
Priority to KR1020097018853A priority patent/KR101499597B1/en
Publication of WO2008108097A1 publication Critical patent/WO2008108097A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04586—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2002/041—Electromagnetic transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/05—Heads having a valve

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Intended is to provide a liquid droplet discharging technique for holding the leading end of a plunger at a discharging time, in a state out of contact with the inner wall of a liquid chamber. Specifically provided are liquid droplet discharging device and method, which can discharge satisfactorily even a liquid material containing a filler such as solder paste. The liquid droplet discharging device comprises a liquid chamber having a discharge port for discharging a liquid material, a through hole communicating with the liquid chamber, a plunger inserted into the through hole and having its leading end portion moved back and forth in the liquid chamber, plunger moving means for moving the plunger back and forth, and plunger position deciding means for regulating the position of the leading end portion of the plunger. The liquid droplet discharging device moves and stops the plunger, while the leading end portion of the plunger and the inner wall of the liquid chamber being out of contact, so that the liquid material is given an inertial force and discharged in the state of droplets. The liquid droplet discharging device and method are characterized in that the plunger position deciding means regulates the position of the leading end portion of the plunger stopped, in the vicinity of the inner wall of the liquid chamber in the moving direction.
PCT/JP2008/000433 2007-03-08 2008-03-04 Liquid droplet discharging device and method Ceased WO2008108097A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020147015070A KR101521902B1 (en) 2007-03-08 2008-03-04 Liquid droplet discharging device and method
KR1020157002787A KR101600432B1 (en) 2007-03-08 2008-03-04 Liquid droplet discharging device and method
CN2008800075621A CN101646502B (en) 2007-03-08 2008-03-04 Liquid droplet discharging device and method
HK10107193.8A HK1140720B (en) 2007-03-08 2008-03-04 Liquid droplet discharging device and method
JP2009502468A JP5271254B2 (en) 2007-03-08 2008-03-04 Droplet ejection apparatus and method
KR1020097018853A KR101499597B1 (en) 2007-03-08 2008-03-04 Liquid droplet discharging device and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007057963 2007-03-08
JP2007-057963 2007-03-08

Publications (1)

Publication Number Publication Date
WO2008108097A1 true WO2008108097A1 (en) 2008-09-12

Family

ID=39737994

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000433 Ceased WO2008108097A1 (en) 2007-03-08 2008-03-04 Liquid droplet discharging device and method

Country Status (5)

Country Link
JP (4) JP5271254B2 (en)
KR (3) KR101521902B1 (en)
CN (1) CN101646502B (en)
TW (4) TWI426973B (en)
WO (1) WO2008108097A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100294810A1 (en) * 2007-03-30 2010-11-25 Musashi Engineering, Inc. Liquid material discharge device and liquid material discharge method
WO2011001810A1 (en) * 2009-07-01 2011-01-06 武蔵エンジニアリング株式会社 Method, apparatus and program for jetting liquid material
JP2011224436A (en) * 2010-04-16 2011-11-10 Alps Electric Co Ltd Discharge device and discharge method
WO2013008799A1 (en) 2011-07-11 2013-01-17 武蔵エンジニアリング株式会社 Droplet discharge device and method
WO2013118669A1 (en) 2012-02-06 2013-08-15 武蔵エンジニアリング株式会社 Liquid material discharge device and discharge method
JP2014030813A (en) * 2012-08-06 2014-02-20 Fujitsu Ltd Coating nozzle, coating device, and coating method
KR20140074974A (en) 2011-10-07 2014-06-18 무사시 엔지니어링 가부시키가이샤 Liquid material discharge apparatus and method
WO2015039783A1 (en) * 2013-09-20 2015-03-26 Smart Pac Gmbh Technology Services Arrangement and method for the reproducible application of small amounts of liquid
JP2018058007A (en) * 2016-10-04 2018-04-12 武蔵エンジニアリング株式会社 Fluid discharge device
WO2018221432A1 (en) * 2017-05-31 2018-12-06 武蔵エンジニアリング株式会社 Liquid material application method and device for implementing said method
IT201700067828A1 (en) * 2017-06-19 2018-12-19 Kromia S R L Glazing machine for ceramic supports.
EP3104979B1 (en) * 2014-02-14 2020-07-22 Nordson Corporation Jetting dispenser, and a method for jetting droplets of fluid material
CN114405764A (en) * 2022-02-23 2022-04-29 无锡冰平自动化技术有限公司 Injecting glue body that disk seat die cavity stroke is the same
WO2024171566A1 (en) * 2023-02-16 2024-08-22 パナソニックＩｐマネジメント株式会社 Droplet ejecting device

Families Citing this family (16)

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KR101869089B1 (en) * 2011-01-04 2018-06-19 주식회사 탑 엔지니어링 Jetting apparatus for viscous material
JP6180283B2 (en) * 2013-11-06 2017-08-16 武蔵エンジニアリング株式会社 Liquid material discharging apparatus and method
KR101512766B1 (en) * 2013-11-14 2015-04-16 한형수 Solder paste dispenser
EP3117909B1 (en) * 2014-03-10 2025-12-03 Musashi Engineering, Inc. Application device and application method
KR102036680B1 (en) * 2014-05-20 2019-10-25 엔지니아린구 시스템 가부시키가이샤 Microvolume liquid dispensing method and microvolume liquid dispenser
JP5802347B1 (en) * 2014-05-20 2015-10-28 エンジニアリングシステム株式会社 Trace liquid dropping method and trace liquid dispenser
JP6582238B2 (en) * 2016-01-18 2019-10-02 パナソニックＩｐマネジメント株式会社 Liquid ejection device
JP6842152B2 (en) * 2016-05-31 2021-03-17 武蔵エンジニアリング株式会社 Liquid material discharge device, its coating device and coating method
CN106076693A (en) * 2016-07-15 2016-11-09 苏州锡友微连电子科技有限公司 A kind of tin cream injection valve
JP6772725B2 (en) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 Fluid discharge device and method of discharging fluid
JP7218299B2 (en) 2017-04-14 2023-02-06 イリノイ トゥール ワークス インコーポレイティド ASSEMBLY AND METHOD FOR SUPPLIING SOLDER PASTE
JP6892686B2 (en) * 2017-12-27 2021-06-23 株式会社日本スペリア社 Nozzle for solder coating equipment
AT522763B1 (en) * 2019-12-05 2021-01-15 Metallconcept Gmbh Printhead
KR102446597B1 (en) * 2020-11-17 2022-09-23 주식회사 엠아이티 High-precision soldering device and its control method
JP7066229B2 (en) * 2021-01-06 2022-05-13 武蔵エンジニアリング株式会社 Liquid material discharge device, its coating device and coating method
TWI775477B (en) * 2021-06-07 2022-08-21 萬潤科技股份有限公司 Liquid chamber mechanism and liquid material extrusion device

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Cited By (31)

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US8448818B2 (en) * 2007-03-30 2013-05-28 Musashi Engineering, Inc. Drop forming discharge device having collision member and method of using same
US20100294810A1 (en) * 2007-03-30 2010-11-25 Musashi Engineering, Inc. Liquid material discharge device and liquid material discharge method
US8807400B2 (en) 2007-03-30 2014-08-19 Musashi Engineering, Inc. Liquid droplet discharging device having advanced position specifying mechanism
WO2011001810A1 (en) * 2009-07-01 2011-01-06 武蔵エンジニアリング株式会社 Method, apparatus and program for jetting liquid material
JP2011011142A (en) * 2009-07-01 2011-01-20 Musashi Eng Co Ltd Method and apparatus for discharging liquid material, and program
JP2011224436A (en) * 2010-04-16 2011-11-10 Alps Electric Co Ltd Discharge device and discharge method
JP2013017945A (en) * 2011-07-11 2013-01-31 Musashi Eng Co Ltd Droplet discharge device and method
EP2732883A4 (en) * 2011-07-11 2016-11-23 Musashi Engineering Inc DEVICE AND METHOD FOR EXPULSION OF DROPLETS
WO2013008799A1 (en) 2011-07-11 2013-01-17 武蔵エンジニアリング株式会社 Droplet discharge device and method
US9440781B2 (en) 2011-07-11 2016-09-13 Musashi Engineering, Inc. Droplet discharge device and method
US9919336B2 (en) 2011-10-07 2018-03-20 Musashi Engineering, Inc. Liquid material discharge apparatus and method
KR20140074974A (en) 2011-10-07 2014-06-18 무사시 엔지니어링 가부시키가이샤 Liquid material discharge apparatus and method
US9260234B2 (en) 2011-10-07 2016-02-16 Musashi Engineering, Inc. Liquid material discharge apparatus and method
JPWO2013118669A1 (en) * 2012-02-06 2015-05-11 武蔵エンジニアリング株式会社 Liquid material discharge apparatus and discharge method
US9889463B2 (en) 2012-02-06 2018-02-13 Musashi Engineering, Inc. Liquid material discharge device and discharge method
CN104245152A (en) * 2012-02-06 2014-12-24 武藏工业株式会社 Liquid material discharge device and discharge method
KR20140127306A (en) 2012-02-06 2014-11-03 무사시 엔지니어링 가부시키가이샤 Liquid material discharge device and discharge method
WO2013118669A1 (en) 2012-02-06 2013-08-15 武蔵エンジニアリング株式会社 Liquid material discharge device and discharge method
JP2014030813A (en) * 2012-08-06 2014-02-20 Fujitsu Ltd Coating nozzle, coating device, and coating method
US9975195B2 (en) 2013-09-20 2018-05-22 Pac Tech-Packaging Technologies Gmbh Arrangement and method for the reproducible application of small amounts of liquid
JP2016533266A (en) * 2013-09-20 2016-10-27 スマート パック ゲゼルシャフト ミット ベシュレンクテル ハフツンク − テクノロジー サーヴィシズ Composition and method for reproducibly applying small amounts of liquid
WO2015039783A1 (en) * 2013-09-20 2015-03-26 Smart Pac Gmbh Technology Services Arrangement and method for the reproducible application of small amounts of liquid
EP3104979B1 (en) * 2014-02-14 2020-07-22 Nordson Corporation Jetting dispenser, and a method for jetting droplets of fluid material
JP2018058007A (en) * 2016-10-04 2018-04-12 武蔵エンジニアリング株式会社 Fluid discharge device
WO2018221432A1 (en) * 2017-05-31 2018-12-06 武蔵エンジニアリング株式会社 Liquid material application method and device for implementing said method
JPWO2018221432A1 (en) * 2017-05-31 2020-04-16 武蔵エンジニアリング株式会社 Liquid material application method and apparatus for performing the method
JP7100373B2 (en) 2017-05-31 2022-07-13 武蔵エンジニアリング株式会社 Liquid material application method and equipment for carrying out the method
US11958072B2 (en) 2017-05-31 2024-04-16 Musashi Engineering, Inc. Liquid material application method and device for implementing said method
IT201700067828A1 (en) * 2017-06-19 2018-12-19 Kromia S R L Glazing machine for ceramic supports.
CN114405764A (en) * 2022-02-23 2022-04-29 无锡冰平自动化技术有限公司 Injecting glue body that disk seat die cavity stroke is the same
WO2024171566A1 (en) * 2023-02-16 2024-08-22 パナソニックＩｐマネジメント株式会社 Droplet ejecting device

Also Published As

Publication number Publication date
KR101499597B1 (en) 2015-03-06
JP5684853B2 (en) 2015-03-18
JP5271254B2 (en) 2013-08-21
KR20090119770A (en) 2009-11-19
KR20140077222A (en) 2014-06-23
JP6312758B2 (en) 2018-04-18
JP2013208613A (en) 2013-10-10
TW200918229A (en) 2009-05-01
HK1140720A1 (en) 2010-10-22
TW201427788A (en) 2014-07-16
JP5990290B2 (en) 2016-09-14
TWI426973B (en) 2014-02-21
TWI590904B (en) 2017-07-11
CN101646502B (en) 2013-02-20
KR20150029008A (en) 2015-03-17
TWI631997B (en) 2018-08-11
TWI537084B (en) 2016-06-11
JP2017006916A (en) 2017-01-12
KR101521902B1 (en) 2015-05-20
JP2015134347A (en) 2015-07-27
CN101646502A (en) 2010-02-10
TW201642983A (en) 2016-12-16
TW201733685A (en) 2017-10-01
KR101600432B1 (en) 2016-03-08
JPWO2008108097A1 (en) 2010-06-10

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