WO2008106942A1 - Lighting device, display device, and method for the operation thereof - Google Patents
Lighting device, display device, and method for the operation thereof Download PDFInfo
- Publication number
- WO2008106942A1 WO2008106942A1 PCT/DE2008/000364 DE2008000364W WO2008106942A1 WO 2008106942 A1 WO2008106942 A1 WO 2008106942A1 DE 2008000364 W DE2008000364 W DE 2008000364W WO 2008106942 A1 WO2008106942 A1 WO 2008106942A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light
- semiconductor body
- housing
- lighting device
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0204—Compact construction
- G01J1/0209—Monolithic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/10—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void
- G01J1/20—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle
- G01J1/28—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle using variation of intensity or distance of source
- G01J1/30—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle using variation of intensity or distance of source using electric radiation detectors
- G01J1/32—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle using variation of intensity or distance of source using electric radiation detectors adapted for automatic variation of the measured or reference value
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/40—Lighting for industrial, commercial, recreational or military use
- F21W2131/405—Lighting for industrial, commercial, recreational or military use for shop-windows or displays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0488—Optical or mechanical part supplementary adjustable parts with spectral filtering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J2001/4247—Photometry, e.g. photographic exposure meter using electric radiation detectors for testing lamps or other light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
Definitions
- Lighting device display device and method for their operation
- the invention relates to a lighting device in which a semiconductor body suitable for emitting light is arranged in a space enclosed by a housing.
- the invention also relates to a display device suitable for displaying information that is illuminated by the illumination device.
- the invention relates to a method by which the illumination device can be operated and a method by which the display device can be operated.
- Conventional lighting devices comprise a housing with a recess which defines a space in which a semiconductor body suitable for emitting light is arranged. Such lighting devices are also referred to as LED - light emitting device.
- a potting compound covers and protects the light-emitting semiconductor chip.
- the housing may be suitable for mounting on a circuit board.
- the light emission by the semiconductor chip is subject to fluctuations which are caused by aging processes in the semiconductor chip and within the arrangement and which, moreover, can be dependent on the temperature. Therefore, corresponding arrangements are used to achieve a predetermined luminance by the LED, which is resistant to aging and / or temperature.
- Such arrangements may include a light sensor, which reacts by means of appropriate control measures on the LED and compensates for any deviation from a predetermined value.
- An object of the present invention is to provide a lighting device in which the optical coupling between LED and sensor is improved.
- a lighting device according to the features of claim 1 is given.
- a display device with such a lighting device is the subject of patent claim 10.
- a method for operating a lighting device or a display device are the subject of claims 12 and 13. Refinements and developments of the lighting device, and the display device are specified in the dependent claims. The disclosure of the claims is hereby expressly incorporated by reference to the description.
- the invention relates to a lighting device which contains a housing with a space surrounded by the housing.
- the illumination device has a semiconductor body suitable for emitting light during operation, which is arranged inside the space. Further, it has a photosensitive sensor which is disposed within the space and is adapted to produce an output signal dependent on reception of light.
- the semiconductor body suitable for emitting light and the sensor device are integrated in a single housing.
- the light-emitting semiconductor body and the light sensor device can each be realized as semiconductor chips.
- the light sensor can, for example be formed as a silicon photodiode sensor.
- a sufficient portion of the light emitted by the LED chip is reflected on the walls of the housing, which also serve as a reflector, so that the photosensor chip can receive directly emitted and / or reflected light.
- a potting compound may be provided which covers LED chip and / or photosensor chip and provides good optical coupling between the arranged in the reflector housing components. The potting compound can also be omitted in other versions.
- the senor which is in particular a photosensor chip, is connected to corresponding signal lines so that the electrical signals generated by it, representing a detected photo event, can be emitted to the outside, outside the housing.
- corresponding metallic signal lines are led through the housing wall in order to contact the photo-chip in the interior of the housing with a connection section of the signal line.
- the contacting can be produced for example by direct contact or via a bonding wire or via alternative bonding technologies.
- a generated in response to the light received by the photo-chip output signal is fed via the signal lines to the outside and can be tapped outside the housing.
- the housing can be mounted on a circuit board, for example by means of SMT (Surface Mount Technology).
- the signal line is then connected to a corresponding signal line on the circuit board.
- the sensor is connected to corresponding signal lines with a control circuit, which is included in the lighting device itself, ie in particular in the housing.
- a control circuit which is included in the lighting device itself, ie in particular in the housing.
- LED chips and sensor chips are possible. For example, there are three LED chips that emit light at different wavelength ranges. This makes it possible to produce a desired color by mixing.
- the light sensor is arranged in the immediate vicinity of the three semiconductor chips and detects the light emitted by them. Of course, it is possible to arrange less than two or more than three light-emitting chips within the housing interior. In addition, it is possible to provide more than one light sensor there.
- the light sensor can record emitted light in a wide spectral range or be provided with a color filter, so that only light of a specific wavelength or a narrow spectral range is added to the active part of the light sensor. Depending on the application, different conditions are conceivable.
- three LED chips and a light sensor can be used, which are in particular positioned in each case in the vicinity of corners of a quadrilateral, in particular a rectangle or square. This results in a point-symmetrical arrangement of the three LED chips and the light sensor.
- the light sensor can be arranged on the edge of the three LEDs or can be arranged between two LEDs.
- combinations of linearly arranged and arranged in a rectangular shape positioning are possible.
- the invention can be used in all applications of lighting equipment.
- an illumination device according to an embodiment of the invention can be used in a conventional LED array for illuminating an environment.
- Regular light detection comparison of the received light intensity with a threshold value and feedback of the light emission of the light-emitting LED (s) can be used to calibrate the brightness of each LED.
- the brightness adjustment can be performed unnoticed for a viewer briefly during operation or, for example, when switching on or off the lighting device. This makes it possible to compensate for aging processes. As is known, aging processes take place differently with different LED chips and therefore cause different LEDs after aging to have a different state of aging and to be able to emit different light intensity.
- the specified illumination device with the light sensor integrated in the same housing makes it possible to dynamically determine the respective individual aging state of an LED during operation and then compensate it.
- a lighting device of the type described here can be used particularly advantageously for the backlighting of an LC (liquid crystal) display (LCD).
- LCD liquid crystal
- LCD liquid crystal
- the backlighting within the LCD may be controlled in sections depending on the information displayed in the LCD. This increases the contrast of the displayed image information.
- a control device which receives and evaluates the output signals of the respective sensor chips of each individual lighting element and feeds back a control signal to the LED chips in order to compensate for aging and / or temperature-induced light intensity fluctuations.
- the illumination device described here in which LED chips and sensor chip are integrated in a housing, are not limited in their application to the application examples shown here in particular, but can in principle be used for any illumination arrangement which has at least a portion of the same homogeneous light emission intensity needed to be used.
- FIG. 1 shows a schematic plan view of a lighting device
- FIG. 2 shows a schematic plan view of another illumination device
- FIG. 3 shows a schematic cross section through the illumination device of FIG. 2,
- FIG. 4 shows a schematic plan view of an LC display with an array of illumination devices for backlighting
- FIG. 5 shows a schematic cross section through part of the LCD display of FIG. 4.
- FIG. 1 shows a plan view of a lighting device according to one exemplary embodiment.
- the lighting device 10 has a housing 15 which surrounds an interior 16.
- the interior 16 in the exemplary embodiment shown, there are four semiconductor chips, namely three chips 12, 13, 14 suitable for emitting light and a chip 11 suitable for the detection of light.
- the chips or LED chips 12, 13, 14 suitable for emitting light are respectively suitable.
- the semiconductor chip 12 is an LED which predominantly emits red light
- semiconductor chip 13 an LED which predominantly emits green light
- semiconductor chip 14 an LED which emits predominantly blue light.
- LEDs for R, G and B allow all colors, including white light, to be mixed. It is also possible that other colors are generated by the respective LED chips.
- the semiconductor chip 11 is a photodiode designed as a silicon detector, which is sensitive to the incidence of light and generates a dependent on the intensity of the incident light dependent electrical output signal.
- All chips 11, ..., 14 are aligned along a line 17.
- the sensor chip 11 is arranged between the G chip 13 and the B chip 14.
- Other arrangements in the order of the chips are also possible.
- all of the R, G, B chips can be arranged one behind the other and the sensor chip 11 is located outside of the triple arrangement adjacent to the edge of the housing.
- the sensor chip 11 is arranged together with the light-emitting chips 12,..., 14 within the same interior 16 enclosed by the housing 15. It is also possible for the sensor chip 11 to be arranged with any other number of light-emitting semiconductor chips within the interior of a housing. These can be a single light-emitting semiconductor chip or two light-emitting semiconductor chips or more than three light-emitting semiconductor chips.
- FIG. 2 shows a plan view of another illumination device, in which the four semiconductor chips are positioned within the space 16 enclosed by the housing 15 in a square arrangement.
- the semiconductor housing 15 has a recess with a round cross section, which encloses the space 16.
- the semiconductor chips are arranged near corners of a square 18. In particular, the focus of the respective semiconductor chips at the corners 181, 182, 183, 184 of the square 18 are arranged.
- the sensor chip 11 is located near the corner 184.
- the R, G, B chips 12, 13, 14 are located at the other corners of the square 18. In this embodiment, as compared to the embodiment of FIG of the sensor chip 11 to the LED chips 12, 13, 14 lower.
- the interior 16 of the housing is expediently filled with a potting compound.
- the potting compound protects against mechanical external influences.
- the potting compound can also be omitted.
- a lens body may also be provided, which is placed on the potting compound or on the housing base to bundle or expand the emitted light (not shown).
- the LED chips 12, 13, 14 are supplied with supply voltage and emit light of the characteristic wavelength range for them.
- the emitted light is scattered, partially reflected by the side wall 161 of the reflective housing and radiated after passage through the potting compound.
- a portion of the emitted light is coupled into the sensor chip 11.
- the sensor chip 11 may be sensitive within a wide range of light wavelengths. If the semiconductor chip 11 is to receive only within a certain wavelength range, ie light of a specific color, the semiconductor chip 11 can be covered with a corresponding color filter material.
- FIG. 3 shows a cross section through the illumination device illustrated in FIG. 2 along the section line AA.
- the cross-section shows the reflective sidewalls 161 of the reflector 15.
- the sidewalls enclose a space 16 which is filled with potting compound 162.
- the B chip 14 that is to say the semiconductor body emitting in the blue spectral range, and the photosensitive photodetector 11 are shown in cross section. Both chips are connected to a common ground line 143 and otherwise have respective further signal terminals of another pole.
- the B-chip 14 is connected to the metallic signal line 141 via a bonding wire 142. Supply voltage is supplied via the line 141, so that the semiconductor chip 14 emits blue light during operation.
- the light emitted by the semiconductor chip 14 is emitted, for example, directly via the potting compound 162 to the outside. A portion of the light generated in the chip 14 is reflected by the side walls 161 and reaches the photodetector 11.
- the photodetector 11 is connected to a signal line 111 via a bonding wire 112. This signal line 111 leads from the inner space of the housing via the housing wall to the outside.
- the metallic lines 141, 111 are correspondingly shaped such that the illumination device 10 can be arranged and electrically connected to a circuit board by means of SMT (Surface Mount Technology).
- the housing has a rear side 162, which is designed so that the housing with its rear side 163 can be placed on the circuit board.
- line 111 is connected in an extension to a controller chip, such as a microprocessor.
- FIG. 4 shows a plan view of a backlit LC display (LCD).
- the LCD shows a matrix arrangement of lighting devices of the kind previously described and illustrated in Figs. 2 and 3.
- Each of these lighting devices e.g. B. 20, 21, 22, 23, serves to backlight a certain surface portion of the LCD.
- LEDs age differently and therefore emit light of varying intensity.
- the emitted light intensity varies with temperature. It is therefore necessary that as far as possible all illumination devices of the backlighting of the LCD be corrected, so that they emit as constant a light intensity and / or light as possible a constant color locus regardless of any deviation due to aging and / or temperature. This achieves a homogeneous backlighting.
- the light intensity emitted by the respective LEDs present there can be individually determined by each sensor chip 11 of each illumination element 20, 21, 22, 23, and then a correction and corresponding activation for the respective LEDs take place in the connected control device 120.
- the evaluation and control algorithm, which the control device 120 handles, is designed in such a way that the feedback loop controls that all illumination devices 20, 21, 22, 23 emit the same light intensity and / or light with the same color location.
- the backlighting can be individually controlled, for example, depending on the image content displayed in the LCD. For example, brightly displayed image content is more strongly backlit, while dark image content is little backlit. This increases the image contrast. Since in this case individually controllable lighting elements 20, 21, 22, 23 are present in the backlighting of the LCD, it is necessary for them to radiate a reference light intensity which is as constant as possible.
- FIG. 5 also shows a cross section through the LC display shown in FIG. 4 along the line B-B.
- the layer arrangement 121 of the liquid crystal display Near the surface, so the outer environment 123 and in particular facing a viewer, there is the layer arrangement 121 of the liquid crystal display.
- an optical matching layer 122 serves, for example, to ensure homogeneous mixing of the light generated by the three LEDs of a respective lighting element 20, 21, so that, for example, homogeneous white light is generated.
- the lighting elements 20, 21 are the lighting elements 20, 21.
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Beschreibungdescription
Beleuchtungseinrichtung, Anzeigeeinrichtung sowie Verfahren zu deren BetriebLighting device, display device and method for their operation
Diese Patentanmeldung beansprucht die Priorität der deutschen Patentanmeldungen 102007010554.3 und 102007012381.9, deren Offenbarungsgehalt hiermit durch Rückbezug aufgenommen wird.This patent application claims the priority of German patent applications 102007010554.3 and 102007012381.9, the disclosure of which is hereby incorporated by reference.
Technisches Gebiet der ErfindungTechnical field of the invention
Die Erfindung betrifft eine Beleuchtungseinrichtung, bei der ein zur Aussendung von Licht geeigneter Halbleiterkörper in einem von einem Gehäuse umschlossenen Raum angeordnet ist. Die Erfindung betrifft außerdem eine Anzeigeeinrichtung, geeignet zur Anzeige von Information, die durch die Beleuchtungseinrichtung beleuchtet wird. Außerdem betrifft die Erfindung ein Verfahren, durch das die Beleuchtungseinrichtung betrieben werden kann und ein Verfahren, durch das die Anzeigeeinrichtung betrieben werden kann.The invention relates to a lighting device in which a semiconductor body suitable for emitting light is arranged in a space enclosed by a housing. The invention also relates to a display device suitable for displaying information that is illuminated by the illumination device. Moreover, the invention relates to a method by which the illumination device can be operated and a method by which the display device can be operated.
Hintergrund der ErfindungBackground of the invention
Herkömmliche Beleuchtungseinrichtungen umfassen ein Gehäuse mit einer Aussparung, die einen Raum definiert, in dem ein zur Aussendung von Licht geeigneter Halbleiterkörper angeordnet ist. Solche Beleuchtungseinrichtungen werden auch als LED - Light Emitting Device - bezeichnet. Eine Vergussmasse bedeckt und schützt den Licht aussendenden Halbleiterchip. Das Gehäuse kann zur Montage auf einer Schaltungsplatine geeignet sein. Die Lichtaussendung durch den Halbleiterchip unterliegt Schwankungen, die durch Alterungsprozesse im Halbleiterchip und innerhalb der Anordnung hervorgerufen werden und die darüber hinaus abhängig von der Temperatur sein können. Es werden deshalb entsprechende Anordnungen verwendet, um durch die LED eine vorgegebene Leuchtdichte zu erreichen, die alte- rungs- und/oder temperaturbeständig ist. Solche Anordnungen können einen Lichtsensor umfassen, der mittels entsprechender Steuermaßnahmen auf die LED rückwirkt und eine eventuelle Abweichung von einem vorgegebenen Wert kompensiert.Conventional lighting devices comprise a housing with a recess which defines a space in which a semiconductor body suitable for emitting light is arranged. Such lighting devices are also referred to as LED - light emitting device. A potting compound covers and protects the light-emitting semiconductor chip. The housing may be suitable for mounting on a circuit board. The light emission by the semiconductor chip is subject to fluctuations which are caused by aging processes in the semiconductor chip and within the arrangement and which, moreover, can be dependent on the temperature. Therefore, corresponding arrangements are used to achieve a predetermined luminance by the LED, which is resistant to aging and / or temperature. Such arrangements may include a light sensor, which reacts by means of appropriate control measures on the LED and compensates for any deviation from a predetermined value.
Eine solche Anordnung ist beispielsweise in der US-Patentanmeldung US 2006/0066265 Al beschrieben. Die bekannte Anordnung verwendet einen diskreten Lichtsensor, der außerhalb der LEDs auf einer Schaltungsplatine angeordnet ist. Eine solche Anordnung ist wenig integrierbar und die optische Kopplung zwischen LED und Lichtsensor entspricht dem diskreten Aufbau. Für mögliche Anwendungen bei modernen Anzeigeeinrichtungen mit Hinterleuchtung ist daher die bekannte Anordnung nur bedingt geeignet.Such an arrangement is described, for example, in US patent application US 2006/0066265 A1. The known arrangement uses a discrete light sensor located outside the LEDs on a circuit board. Such an arrangement is less integrated and the optical coupling between LED and light sensor corresponds to the discrete structure. For possible applications in modern display devices with backlighting, therefore, the known arrangement is only partially suitable.
Eine Aufgabe der vorliegenden Erfindung besteht darin, eine Beleuchtungseinrichtung anzugeben, bei der die optische Kopplung zwischen LED und Sensor verbessert ist.An object of the present invention is to provide a lighting device in which the optical coupling between LED and sensor is improved.
Darüber hinaus soll eine vorteilhafte Verwendung für die Beleuchtungseinrichtung in einer hinterleuchteten Anzeigeeinrichtung angegeben werden. Ebenso sollen entsprechende Betriebsverfahren der Erfindung zugrunde gelegt werden. Kurzfassung der ErfindungIn addition, an advantageous use for the lighting device in a backlit display device should be specified. Likewise, appropriate operating methods of the invention are to be based. Summary of the invention
Gemäß einer Ausführungsform der Erfindung wird eine Beleuchtungseinrichtung gemäß den Merkmalen des Patentanspruchs 1 angegeben.According to one embodiment of the invention, a lighting device according to the features of claim 1 is given.
Eine Anzeigeeinrichtung mit einer solchen Beleuchtungseinrichtung ist Gegenstand des Patentanspruchs 10. Verfahren zum Betrieb einer Beleuchtungseinrichtung bzw. einer Anzeigeeinrichtung sind Gegenstand der Patentansprüche 12 und 13. Ausgestaltungen und Weiterbildungen der Beleuchtungseinrichtung, und der Anzeigeeinrichtung sind in den abhängigen Ansprüchen angegeben. Der Offenbarungsgehalt der Patentansprüche wird hiermit ausdrücklich durch Rückbezug in die Beschreibung mit aufgenommen.A display device with such a lighting device is the subject of patent claim 10. A method for operating a lighting device or a display device are the subject of claims 12 and 13. Refinements and developments of the lighting device, and the display device are specified in the dependent claims. The disclosure of the claims is hereby expressly incorporated by reference to the description.
Es wird eine Beleuchtungseinrichtung angegeben, die ein Gehäuse mit einem vom Gehäuse umgebenen Raum enthält. Die Beleuchtungseinrichtung weist einen im Betrieb zur Aussendung von Licht geeigneten Halbleiterkörper auf, der innerhalb des Raums angeordnet ist. Weiter weist sie einen lichtempfindlichen Sensor auf, der innerhalb des Raums angeordnet ist und geeignet ist, ein von Empfang von Licht abhängiges Ausgangssignal zu erzeugen.The invention relates to a lighting device which contains a housing with a space surrounded by the housing. The illumination device has a semiconductor body suitable for emitting light during operation, which is arranged inside the space. Further, it has a photosensitive sensor which is disposed within the space and is adapted to produce an output signal dependent on reception of light.
Gemäß einer Ausführungsform sind der zur Lichtaussendung geeignete Halbleiterkörper sowie die Sensoreinrichtung, also insbesondere der Sensor, in einem einzigen Gehäuse integriert. Es wird dadurch eine ausreichende optische Kopplung zwischen Licht aussendendem Halbleiterkörper und Lichtsensoreinrichtung erreicht. Der Licht aussendende Halbleiterkörper und die Lichtsensoreinrichtung können jeweils als Halbleiterchips realisiert werden. Der Lichtsensor kann beispielsweise als Silizium-Fotodiodensensor ausgebildet werden. Ein ausreichender Teil des vom LED-Chip ausgesandten Lichts wird an den Wänden des Gehäuses, die gleichzeitig als Reflektor dienen, reflektiert, sodass der Fotosensor-Chip direkt abgestrahltes und/oder reflektiertes Licht aufnehmen kann. In manchen Ausführungen kann eine Vergussmasse vorgesehen werden, die LED- Chip und/oder Fotosensor-Chip bedeckt und für gute optische Kopplung zwischen den im Reflektorgehäuse angeordneten Komponenten sorgt. Die Vergussmasse kann in anderen Ausführungen auch entfallen.According to one embodiment, the semiconductor body suitable for emitting light and the sensor device, that is to say in particular the sensor, are integrated in a single housing. As a result, a sufficient optical coupling between the light emitting semiconductor body and the light sensor device is achieved. The light-emitting semiconductor body and the light sensor device can each be realized as semiconductor chips. The light sensor can, for example be formed as a silicon photodiode sensor. A sufficient portion of the light emitted by the LED chip is reflected on the walls of the housing, which also serve as a reflector, so that the photosensor chip can receive directly emitted and / or reflected light. In some embodiments, a potting compound may be provided which covers LED chip and / or photosensor chip and provides good optical coupling between the arranged in the reflector housing components. The potting compound can also be omitted in other versions.
Der Sensor, der insbesondere ein Fotosensor-Chip ist, ist bei einer Ausgestaltung mit entsprechenden Signalleitungen verbunden, sodass die von ihm erzeugten elektrischen, ein detek- tiertes Fotoereignis repräsentierenden Signale nach außen, außerhalb des Gehäuses abgegeben werden können. Beispielsweise sind entsprechende metallische Signalleitungen durch die Gehäusewand geführt, um im Innenraum des Gehäuses den Foto- Chip an einen Anschlussabschnitt der Signalleitung zu kontaktieren. Die Kontaktierung kann beispielsweise durch Direktkontakt oder über einen Bonddraht oder über alternative Bondtechnologien hergestellt werden. Ein in Abhängigkeit vom empfangenen Licht durch den Foto-Chip erzeugtes Ausgangssignal wird über die Signalleitungen nach außen gespeist und ist außerhalb des Gehäuses abgreifbar. Das Gehäuse kann auf eine Schaltungsplatine aufgesetzt werden, beispielsweise mittels SMT (Surface Mount Technology) . Die Signalleitung wird dann mit einer entsprechenden Signalleitung auf der Schaltungsplatine verbunden. Bei einer anderen Ausgestaltung ist der Sensor mit entsprechenden Signalleitungen mit einer Regelungs- Schaltung verbunden, die in der Beleuchtungseinrichtung selbst, also insbesondere in dem Gehäuse, enthalten ist. Es sind verschiedene Anordnungen von LED-Chips und Sensor- Chips möglich. Beispielsweise sind drei LED-Chips vorhanden, die jeweils bei unterschiedlichen Wellenlängenbereichen Licht emittieren. Dadurch ist es möglich, durch Mischung eine gewünschte Farbe zu erzeugen. Der Lichtsensor ist in unmittelbarer Nähe der drei Halbleiterchips angeordnet und detektiert das von diesen ausgesandte Licht. Selbstverständlich ist es möglich, weniger als zwei oder mehr als drei Licht emittierende Chips innerhalb des Gehäuseinneren anzuordnen. Außerdem ist es möglich, mehr als nur einen Lichtsensor dort vorzusehen.In one embodiment, the sensor, which is in particular a photosensor chip, is connected to corresponding signal lines so that the electrical signals generated by it, representing a detected photo event, can be emitted to the outside, outside the housing. By way of example, corresponding metallic signal lines are led through the housing wall in order to contact the photo-chip in the interior of the housing with a connection section of the signal line. The contacting can be produced for example by direct contact or via a bonding wire or via alternative bonding technologies. A generated in response to the light received by the photo-chip output signal is fed via the signal lines to the outside and can be tapped outside the housing. The housing can be mounted on a circuit board, for example by means of SMT (Surface Mount Technology). The signal line is then connected to a corresponding signal line on the circuit board. In another embodiment, the sensor is connected to corresponding signal lines with a control circuit, which is included in the lighting device itself, ie in particular in the housing. Various arrangements of LED chips and sensor chips are possible. For example, there are three LED chips that emit light at different wavelength ranges. This makes it possible to produce a desired color by mixing. The light sensor is arranged in the immediate vicinity of the three semiconductor chips and detects the light emitted by them. Of course, it is possible to arrange less than two or more than three light-emitting chips within the housing interior. In addition, it is possible to provide more than one light sensor there.
Der Lichtsensor kann ausgesandtes Licht in einem breiten Spektralbereich aufnehmen oder mit einem Farbfilter versehen werden, sodass nur Licht einer bestimmten Wellenlänge oder eines engen Spektralbereichs dem aktiven Teil des Lichtsensors hinzugeführt wird. Je nach Anwendungsfall sind verschiedene Verhältnisse denkbar.The light sensor can record emitted light in a wide spectral range or be provided with a color filter, so that only light of a specific wavelength or a narrow spectral range is added to the active part of the light sensor. Depending on the application, different conditions are conceivable.
Bei einer Ausgestaltung können beispielsweise drei LED-Chips und ein Lichtsensor verwendet werden, die insbesondere jeweils in der Nähe von Ecken eines Vierecks, insbesondere eines Rechtecks oder Quadrats, positioniert sind. Dadurch ergibt sich eine punktsymmetrische Anordnung der drei LED-Chips und des Lichtsensors. Andererseits ist es auch möglich, sämtliche LED-Chips und den Lichtsensor linear entlang einer Geraden ausgerichtet zu positionieren. Der Lichtsensor kann am Rande der drei LEDs angeordnet werden oder kann zwischen zwei LEDs angeordnet werden. Schließlich sind Kombinationen aus linear angeordneten und in Rechteckform angeordneten Positionierungen möglich. Die Erfindung ist bei sämtlichen Anwendungsfällen von Beleuchtungseinrichtungen einsetzbar. Beispielsweise kann eine Beleuchtungseinrichtung gemäß einer Ausführungsform der Erfindung in einem herkömmlichen LED-Array zur Beleuchtung einer Umgebung eingesetzt werden. Durch regelmäßige Lichtdetek- tion, Vergleich der empfangenen Lichtintensität mit einem Schwellwert und rückkoppelnde Nachsteuerung der Lichtabgabe der Licht aussendenden LED(s) kann ein Helligkeitsabgleich für jede LED erfolgen. Der Helligkeitsabgleich kann für einen Betrachter unbemerkt kurzzeitig während des laufenden Betriebs durchgeführt werden oder beispielsweise beim Einschalten oder Ausschalten der Beleuchtungseinrichtung. Dadurch wird ermöglicht, dass Alterungsvorgänge ausgeglichen werden. Bekanntlich laufen Alterungsvorgänge bei verschiedenen LED- Chips unterschiedlich ab und bewirken daher, dass verschiedene LEDs nach erfolgter Alterung einen unterschiedlichen Alterungszustand aufweisen und unterschiedliche Lichtintensität aussenden können. Durch die angegebene Beleuchtungseinrichtung mit dem im gleichen Gehäuse integrierten Lichtsensor wird ermöglicht, dass dynamisch im Betrieb der jeweilige individuelle Alterungszustand einer LED ermittelt und anschließend ausgeglichen werden kann.In one embodiment, for example, three LED chips and a light sensor can be used, which are in particular positioned in each case in the vicinity of corners of a quadrilateral, in particular a rectangle or square. This results in a point-symmetrical arrangement of the three LED chips and the light sensor. On the other hand, it is also possible to position all the LED chips and the light sensor aligned linearly along a straight line. The light sensor can be arranged on the edge of the three LEDs or can be arranged between two LEDs. Finally, combinations of linearly arranged and arranged in a rectangular shape positioning are possible. The invention can be used in all applications of lighting equipment. For example, an illumination device according to an embodiment of the invention can be used in a conventional LED array for illuminating an environment. Regular light detection, comparison of the received light intensity with a threshold value and feedback of the light emission of the light-emitting LED (s) can be used to calibrate the brightness of each LED. The brightness adjustment can be performed unnoticed for a viewer briefly during operation or, for example, when switching on or off the lighting device. This makes it possible to compensate for aging processes. As is known, aging processes take place differently with different LED chips and therefore cause different LEDs after aging to have a different state of aging and to be able to emit different light intensity. The specified illumination device with the light sensor integrated in the same housing makes it possible to dynamically determine the respective individual aging state of an LED during operation and then compensate it.
Eine Beleuchtungseinrichtung der hier beschriebenen Art kann besonders vorteilhaft zur Hinterleuchtung eines LC- (Liquid Crystal) -Displays (LCD) eingesetzt werden. Hierzu befinden sich auf der der Umgebung und insbesondere einem Betrachter zugewandten Seite des LCD die LCD-Schichten, welche eine meist digital zugeführte Information anzeigen. Darunter, bezüglich der LCD-Schicht umgebungsabgewandt , befindet sich eine Lichtquelle. Bei einem LCD größerer Fläche können mehrere der hier beschriebenen Beleuchtungseinrichtungen in Matrixanordnung vorgesehen werden. Erforderlich ist, dass sämtliche Beleuchtungseinrichtungen im Hintergrund gleiche Lichtintensität liefern, damit Homogenität der Hinterleuchtung sichergestellt ist. In manchen Ausführungsformen lässt sich die Hinterleuchtung innerhalb des LCD abschnittsweise und abhängig von der im LCD dargestellten Information steuern. Dadurch wird der Kontrast der dargestellten Bildinformation erhöht.A lighting device of the type described here can be used particularly advantageously for the backlighting of an LC (liquid crystal) display (LCD). For this purpose, located on the environment and in particular a viewer facing side of the LCD LCD layers, which display a mostly digitally supplied information. Underneath, with respect to the LCD layer facing away from the environment, there is a light source. For a larger area LCD, multiple of the lighting devices described herein may be provided in matrixed form. It is necessary that all Provide lighting equipment in the background equal light intensity, so that homogeneity of the backlighting is ensured. In some embodiments, the backlighting within the LCD may be controlled in sections depending on the information displayed in the LCD. This increases the contrast of the displayed image information.
Beispielsweise ist eine Steuerungseinrichtung vorgesehen, die die Ausgangssignale der jeweiligen Sensor-Chips jedes einzelnen Beleuchtungselements aufnimmt, bewertet und ein Steuersignal an die LED-Chips zurückspeist, um alterungs- und/oder temperaturbedingte Lichtintensitätsschwankungen auszugleichen.For example, a control device is provided which receives and evaluates the output signals of the respective sensor chips of each individual lighting element and feeds back a control signal to the LED chips in order to compensate for aging and / or temperature-induced light intensity fluctuations.
Die hier beschriebene Beleuchtungseinrichtung, bei der LED- Chips und Sensor-Chip in einem Gehäuse integriert sind, sind in ihrer Anwendung nicht nur auf die hier im Speziellen dargestellten Anwendungsbeispiele beschränkt, sondern können prinzipiell für jede Beleuchtungsanordnung, die zumindest in einem Abschnitt derselben homogene Lichtabgabeintensität benötigt, verwendet werden.The illumination device described here, in which LED chips and sensor chip are integrated in a housing, are not limited in their application to the application examples shown here in particular, but can in principle be used for any illumination arrangement which has at least a portion of the same homogeneous light emission intensity needed to be used.
Kurze Beschreibung der FigurenBrief description of the figures
Nachfolgend wird die Erfindung im Einzelnen anhand der in der Zeichnung dargestellten Figuren erläutert. Gleiche oder einander entsprechende Elemente in verschiedenen Figuren sind durch gleiche Bezugszeichen bezeichnet. Die Figuren und die in den Figuren dargestellten Elemente sind grundsätzlich nicht als maßstabsgetreu zu betrachten. Vielmehr können einzelne Elemente zum besseren Verständnis und/oder zur besseren Darstellbarkeit übertrieben groß dargestellt sein. Es zeigen: Figur 1 eine schematische Aufsicht auf eine Beleuchtungseinrichtung,The invention will be explained in detail with reference to the figures shown in the drawing. Identical or corresponding elements in different figures are designated by like reference numerals. The figures and the elements shown in the figures are not to be considered as true to scale. Rather, individual elements for exaggerated understanding and / or better representability can be exaggerated. Show it: FIG. 1 shows a schematic plan view of a lighting device,
Figur 2 eine schematische Aufsicht auf eine andere Beleuchtungseinrichtung,FIG. 2 shows a schematic plan view of another illumination device,
Figur 3 einen schematischen Querschnitt durch die Beleuchtungseinrichtung der Figur 2,FIG. 3 shows a schematic cross section through the illumination device of FIG. 2,
Figur 4 eine schematische Aufsicht auf ein LC-Display mit einem Array von Beleuchtungseinrichtungen zur Hin- terleuchtung und4 shows a schematic plan view of an LC display with an array of illumination devices for backlighting and
Figur 5 einen schematischen Querschnitt durch einen Teil des LCD-Displays der Figur 4.FIG. 5 shows a schematic cross section through part of the LCD display of FIG. 4.
Detaillierte Beschreibung von AusführungsformenDetailed description of embodiments
Figur 1 zeigt eine Aufsicht auf eine Beleuchtungseinrichtung gemäß einem Ausführungsbeispiel. Die Beleuchtungseinrichtung 10 weist ein Gehäuse 15 auf, das einen Innenraum 16 umgibt. Im Innenraum 16 befinden sich im gezeigten Ausführungsbeispiel vier Halbleiterchips, nämlich drei zur Lichtaussendung geeignete Chips 12, 13, 14 sowie ein zur Detektion von Licht geeigneter Chip 11. Die zur Lichtaussendung geeigneten Chips oder LED-Chips 12, 13, 14 sind jeweils geeignet, Licht bei unterschiedlicher Wellenlänge auszusenden. Beispielsweise ist der Halbleiterchip 12 eine LED, die vorwiegend rotes Licht aussendet, Halbleiterchip 13 eine LED, die vorwiegend grünes Licht aussendet, und Halbleiterchip 14 eine LED, die vorwiegend blaues Licht aussendet. Durch LEDs für R, G und B lassen sich sämtliche Farben einschließlich weißen Lichts mischen. Es ist auch möglich, dass andere Farben von den jeweiligen LED-Chips erzeugt werden.FIG. 1 shows a plan view of a lighting device according to one exemplary embodiment. The lighting device 10 has a housing 15 which surrounds an interior 16. In the interior 16, in the exemplary embodiment shown, there are four semiconductor chips, namely three chips 12, 13, 14 suitable for emitting light and a chip 11 suitable for the detection of light. The chips or LED chips 12, 13, 14 suitable for emitting light are respectively suitable. To emit light at different wavelengths. By way of example, the semiconductor chip 12 is an LED which predominantly emits red light, semiconductor chip 13 an LED which predominantly emits green light, and semiconductor chip 14 an LED which emits predominantly blue light. LEDs for R, G and B allow all colors, including white light, to be mixed. It is also possible that other colors are generated by the respective LED chips.
Der Halbleiterchip 11 ist eine als Siliziumdetektor ausgeführte Fotodiode, die auf Lichteinfall empfindlich reagiert und ein entsprechend der Intensität des einfallenden Lichts abhängiges elektrisches Ausgangssignal erzeugt.The semiconductor chip 11 is a photodiode designed as a silicon detector, which is sensitive to the incidence of light and generates a dependent on the intensity of the incident light dependent electrical output signal.
Sämtliche Chips 11, ..., 14 sind entlang einer Linie 17 ausgerichtet. Zweckmäßigerweise ist der Sensorchip 11 zwischen dem G-Chip 13 und dem B-Chip 14 angeordnet. Andere Anordnungen in der Reihenfolge der Chips sind ebenfalls möglich. Beispielsweise können sämtliche R-, G-, B-Chips hintereinander angeordnet werden und der Sensorchip 11 liegt außerhalb der Dreieranordnung benachbart zum Gehäuserand. Jedenfalls ist in allen Fällen der Sensorchip 11 gemeinsam mit den Licht aussendenden Chips 12, ..., 14 innerhalb des gleichen vom Gehäuse 15 eingeschlossenen Innenraums 16 angeordnet. Es ist auch möglich, dass der Sensorchip 11 mit einer beliebigen anderen Anzahl von Licht aussendenden Halbleiterchips innerhalb des Innenraums eines Gehäuses angeordnet ist. Dies können ein einziger Licht aussendender Halbleiterchip sein oder zwei Licht aussendende Halbleiterchips oder mehr als drei Licht aussendende Halbleiterchips.All chips 11, ..., 14 are aligned along a line 17. Expediently, the sensor chip 11 is arranged between the G chip 13 and the B chip 14. Other arrangements in the order of the chips are also possible. For example, all of the R, G, B chips can be arranged one behind the other and the sensor chip 11 is located outside of the triple arrangement adjacent to the edge of the housing. In any case, in all cases the sensor chip 11 is arranged together with the light-emitting chips 12,..., 14 within the same interior 16 enclosed by the housing 15. It is also possible for the sensor chip 11 to be arranged with any other number of light-emitting semiconductor chips within the interior of a housing. These can be a single light-emitting semiconductor chip or two light-emitting semiconductor chips or more than three light-emitting semiconductor chips.
In Figur 2 ist eine Aufsicht auf eine andere Beleuchtungseinrichtung dargestellt, bei der die vier Halbleiterchips innerhalb des vom Gehäuse 15 umschlossenen Raums 16 in quadratischer Anordnung positioniert sind. Das Halbleitergehäuse 15 weist eine Aussparung mit rundem Querschnitt auf, die den Raum 16 umschließt. Innerhalb der Aussparung bzw. des Raums 16 sind die Halbleiterchips in der Nähe von Ecken eines Quadrats 18 angeordnet. Im Speziellen können die Schwerpunkte der jeweiligen Halbleiterchips an den Ecken 181, 182, 183, 184 des Quadrats 18 angeordnet werden. Der Sensorchip 11 befindet sich in der Nähe der Ecke 184. Die R-, G-, B-Chips 12, 13, 14 befinden sich an den anderen Ecken des Quadrats 18. Bei dieser Ausführung verglichen zur Ausführung der Figur 1 ist der mittlere Abstand des Sensor-Chips 11 zu den LED-Chips 12, 13, 14 geringer. Der Innenraum 16 des Gehäuses ist zweckmäßigerweise mit einer Vergussmasse gefüllt. Dadurch wird für gute optische Kopplung zwischen den Elementen gesorgt. Außerdem schützt die Vergussmasse vor mechanischen äußeren Einflüssen. In anderen Ausführungen kann die Vergussmasse auch entfallen. Optional kann je nach Anwendungsfall auch ein Linsenkörper vorgesehen werden, der auf die Vergussmasse oder auf den Gehäusegrundkörper aufgesetzt ist, um das ausgesandte Licht zu bündeln oder aufzuweiten (nicht dargestellt) .FIG. 2 shows a plan view of another illumination device, in which the four semiconductor chips are positioned within the space 16 enclosed by the housing 15 in a square arrangement. The semiconductor housing 15 has a recess with a round cross section, which encloses the space 16. Within the recess or space 16, the semiconductor chips are arranged near corners of a square 18. In particular, the focus of the respective semiconductor chips at the corners 181, 182, 183, 184 of the square 18 are arranged. The sensor chip 11 is located near the corner 184. The R, G, B chips 12, 13, 14 are located at the other corners of the square 18. In this embodiment, as compared to the embodiment of FIG of the sensor chip 11 to the LED chips 12, 13, 14 lower. The interior 16 of the housing is expediently filled with a potting compound. This provides good optical coupling between the elements. In addition, the potting compound protects against mechanical external influences. In other embodiments, the potting compound can also be omitted. Optionally, depending on the application, a lens body may also be provided, which is placed on the potting compound or on the housing base to bundle or expand the emitted light (not shown).
Im Betrieb werden die LED-Chips 12, 13, 14 mit Versorgungsspannung versorgt und senden Licht des für sie charakteristischen Wellenlängenbereichs aus. Das ausgesandte Licht wird gestreut, teilweise von der Seitenwand 161 des reflektierenden Gehäuses reflektiert und nach Durchgang durch die Vergussmasse abgestrahlt. Ein Teil des ausgesandten Lichts wird in den Sensorchip 11 eingekoppelt. Der Sensorchip 11, beispielsweise eine Fotodiode, erzeugt daraufhin ein elektrisches Ausgangssignal, das von der empfangenen Lichtintensität abhängt. Der Sensorchip 11 kann innerhalb eines breiten Lichtwellenlängenbereichs empfindlich sein. Wenn der Halbleiterchip 11 nur innerhalb eines bestimmten Wellenlängenbereichs, also Licht einer bestimmten Farbe, empfangen soll, kann der Halbleiterchip 11 mit einem entsprechenden Farbfiltermaterial bedeckt werden. Figur 3 zeigt einen Querschnitt durch die in Figur 2 dargestellte Beleuchtungseinrichtung entlang der Schnittlinie A-A. Der Querschnitt zeigt die reflektierenden Seitenwände 161 des Reflektors 15. Die Seitenwände schließen einen Raum 16 ein, der mit einer Vergussmasse 162 gefüllt ist. Am Boden der den Raum 16 bildenden Ausnehmung im Gehäuse sind der B-Chip 14, also der im blauen Spektralbreich emittierende Halbleiterkörper, sowie der lichtempfindliche Fotodetektor 11 im Querschnitt dargestellt. Beide Chips sind mit einer gemeinsamen Masseleitung 143 verbunden und weisen ansonsten jeweilige weitere Signalanschlüsse eines anderen Pols auf. So ist der B-Chip 14 mit der metallischen Signalleitung 141 über einen Bonddraht 142 verbunden. Es wird Versorgungsspannung über die Leitung 141 zugeführt, sodass der Halbleiterchip 14 im Betrieb blaues Licht aussendet. Das vom Halbleiterchip 14 ausgesandte Licht wird beispielsweise direkt über die Vergussmasse 162 nach außen abgestrahlt. Ein Teil des im Chip 14 erzeugten Lichts wird über die Seitenwände 161 reflektiert und gelangt auf den Fotodetektor 11. Der Fotodetektor 11 ist über einen Bonddraht 112 mit einer Signalleitung 111 verbunden. Diese Signalleitung 111 führt vom inneren Raum des Gehäuses über die Gehäusewand nach außen. Die metallischen Leitungen 141, 111 sind entsprechend geformt, dass die Beleuchtungseinrichtung 10 auf einer Schaltungsplatine mittels SMT (Surface Mount Technology) angeordnet und elektrisch angeschlossen werden kann. Hierzu weist das Gehäuse eine Rückseite 162 auf, die ausgeführt ist, sodass das Gehäuse mit seiner Rückseite 163 auf die Platine aufgesetzt werden kann. Die entfernten Enden der metallischen Leiterbahnen 141, 111 sind ebenfalls in die gleiche Ebene gebogen. Während die Leiterbahn 141 zur Zuführung einer Versorgungsspannung dient, kann über die Leiterbahn 111 das vom Halbleitersensor 11 erzeugte Ausgangssignal außerhalb des Gehäuses 15 abgegriffen werden. Beispiels- weise wird die Leitung 111 in einer Verlängerung mit einem Controllerchip verbunden, beispielsweise einem Mikroprozessor.In operation, the LED chips 12, 13, 14 are supplied with supply voltage and emit light of the characteristic wavelength range for them. The emitted light is scattered, partially reflected by the side wall 161 of the reflective housing and radiated after passage through the potting compound. A portion of the emitted light is coupled into the sensor chip 11. The sensor chip 11, for example a photodiode, then generates an electrical output signal which depends on the received light intensity. The sensor chip 11 may be sensitive within a wide range of light wavelengths. If the semiconductor chip 11 is to receive only within a certain wavelength range, ie light of a specific color, the semiconductor chip 11 can be covered with a corresponding color filter material. FIG. 3 shows a cross section through the illumination device illustrated in FIG. 2 along the section line AA. The cross-section shows the reflective sidewalls 161 of the reflector 15. The sidewalls enclose a space 16 which is filled with potting compound 162. At the bottom of the recess 16 forming the space 16 in the housing, the B chip 14, that is to say the semiconductor body emitting in the blue spectral range, and the photosensitive photodetector 11 are shown in cross section. Both chips are connected to a common ground line 143 and otherwise have respective further signal terminals of another pole. Thus, the B-chip 14 is connected to the metallic signal line 141 via a bonding wire 142. Supply voltage is supplied via the line 141, so that the semiconductor chip 14 emits blue light during operation. The light emitted by the semiconductor chip 14 is emitted, for example, directly via the potting compound 162 to the outside. A portion of the light generated in the chip 14 is reflected by the side walls 161 and reaches the photodetector 11. The photodetector 11 is connected to a signal line 111 via a bonding wire 112. This signal line 111 leads from the inner space of the housing via the housing wall to the outside. The metallic lines 141, 111 are correspondingly shaped such that the illumination device 10 can be arranged and electrically connected to a circuit board by means of SMT (Surface Mount Technology). For this purpose, the housing has a rear side 162, which is designed so that the housing with its rear side 163 can be placed on the circuit board. The distal ends of the metal traces 141, 111 are also bent in the same plane. While the conductor track 141 serves to supply a supply voltage, the output signal generated by the semiconductor sensor 11 outside the housing 15 can be picked off via the conductor track 111. Beispiels- For example, line 111 is connected in an extension to a controller chip, such as a microprocessor.
In Figur 4 ist eine Aufsicht auf ein hinterleuchtetes LC- Display (LCD) dargestellt. Das LCD zeigt eine Matrixanordnung von Beleuchtungseinrichtungen der vorher beschriebenen und in den Figuren 2 und 3 dargestellten Art. Jede dieser Beleuchtungseinrichtungen, z. B. 20, 21, 22, 23, dient dazu, einen gewissen Flächenabschnitt des LCD zu hinterleuchten. Bekanntlich altern LEDs unterschiedlich und senden daher Licht unterschiedlicher Intensität aus. Außerdem variiert die abgestrahlte Lichtintensität mit der Temperatur. Daher ist es erforderlich, dass möglichst alle Beleuchtungseinrichtungen der Hinterleuchtung des LCD korrigiert werden, sodass sie eine möglichst konstante Lichtintensität und/oder Licht eines möglichst konstanten Farborts aussenden und zwar unabhängig von etwaiger Abweichung bedingt durch Alterung und/oder Temperatur. Damit wird eine homogene Hinterleuchtung erreicht.FIG. 4 shows a plan view of a backlit LC display (LCD). The LCD shows a matrix arrangement of lighting devices of the kind previously described and illustrated in Figs. 2 and 3. Each of these lighting devices, e.g. B. 20, 21, 22, 23, serves to backlight a certain surface portion of the LCD. As is known, LEDs age differently and therefore emit light of varying intensity. In addition, the emitted light intensity varies with temperature. It is therefore necessary that as far as possible all illumination devices of the backlighting of the LCD be corrected, so that they emit as constant a light intensity and / or light as possible a constant color locus regardless of any deviation due to aging and / or temperature. This achieves a homogeneous backlighting.
Durch die beschriebene Beleuchtungseinrichtung kann durch jeden Sensorchip 11 eines jeden Beleuchtungselements 20, 21, 22, 23 individuell die durch die jeweiligen dort vorhandenen LEDs ausgestrahlte Lichtintensität ermittelt werden und daraufhin in der angeschlossenen Steuereinrichtung 120 eine Korrektur und entsprechende Ansteuerung für die jeweiligen LEDs erfolgen. Der Auswerte- und Ansteuerungsalgorithmus, den die Steuerungseinrichtung 120 abwickelt, ist derart ausgestaltet, dass die Rückkopplungsschleife eine Regelung bewirkt, dass sämtliche Beleuchtungseinrichtungen 20, 21, 22, 23 gleiche Lichtintensität und/oder Licht mit dem gleichen Farbort abstrahlen. Die Hinterleuchtung ist beispielsweise individuell ansteuerbar in Abhängigkeit vom im LCD dargestellten Bildinhalt. Beispielsweise werden hell dargestellte Bildinhalte stärker hinterleuchtet, während dunkle Bildinhalte wenig hinterleuchtet werden. Dadurch wird der Bildkontrast erhöht. Da in diesem Fall einzeln ansteuerbare Beleuchtungselemente 20, 21, 22, 23 in der Hinterleuchtung des LCD vorhanden sind, ist es erforderlich, dass diese eine möglichst konstante Referenzleuchtintensität abstrahlen.By means of the illumination device described, the light intensity emitted by the respective LEDs present there can be individually determined by each sensor chip 11 of each illumination element 20, 21, 22, 23, and then a correction and corresponding activation for the respective LEDs take place in the connected control device 120. The evaluation and control algorithm, which the control device 120 handles, is designed in such a way that the feedback loop controls that all illumination devices 20, 21, 22, 23 emit the same light intensity and / or light with the same color location. The backlighting can be individually controlled, for example, depending on the image content displayed in the LCD. For example, brightly displayed image content is more strongly backlit, while dark image content is little backlit. This increases the image contrast. Since in this case individually controllable lighting elements 20, 21, 22, 23 are present in the backlighting of the LCD, it is necessary for them to radiate a reference light intensity which is as constant as possible.
Schließlich ist in Figur 5 noch ein Querschnitt durch das in der Figur 4 dargestellte LC-Display längs der Linie B-B dargestellt. Nahe der Oberfläche, also der äußeren Umgebung 123 und insbesondere einem Betrachter zugewandt, befindet sich die Schichtanordnung 121 der Flüssigkristallanzeige. Darunter befindet sich eine optische Anpassungsschicht 122. Die optische Anpassungsschicht 122 dient beispielsweise dazu, für eine homogene Durchmischung des von den drei LEDs eines jeweiligen Beleuchtungselements 20, 21 erzeugten Lichts zu sorgen, sodass beispielsweise homogenes weißes Licht erzeugt wird. Darunter befinden sich die Beleuchtungselemente 20, 21.Finally, FIG. 5 also shows a cross section through the LC display shown in FIG. 4 along the line B-B. Near the surface, so the outer environment 123 and in particular facing a viewer, there is the layer arrangement 121 of the liquid crystal display. Below this is an optical matching layer 122. The optical matching layer 122 serves, for example, to ensure homogeneous mixing of the light generated by the three LEDs of a respective lighting element 20, 21, so that, for example, homogeneous white light is generated. Below these are the lighting elements 20, 21.
Die Erfindung ist nicht durch die Beschreibung anhand der Ausführungsbeispiele auf diese beschränkt. Vielmehr umfasst die Erfindung jedes neue Merkmal sowie jede Kombination von Merkmalen, was insbesondere jede Kombination von Merkmalen in den Patentansprüchen beinhaltet, auch wenn dieses Merkmal oder diese Kombination selbst nicht explizit in den Patentansprüchen oder Ausführungsbeispielen angegeben ist. The invention is not limited by the description based on the embodiments of these. Rather, the invention encompasses any novel feature as well as any combination of features, including in particular any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the patent claims or exemplary embodiments.
Claims
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007010554 | 2007-03-05 | ||
| DE102007010554.3 | 2007-03-05 | ||
| DE102007012381.9 | 2007-03-14 | ||
| DE102007012381A DE102007012381A1 (en) | 2007-03-05 | 2007-03-14 | Lighting device, display device and method for their operation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008106942A1 true WO2008106942A1 (en) | 2008-09-12 |
Family
ID=39678068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2008/000364 Ceased WO2008106942A1 (en) | 2007-03-05 | 2008-03-03 | Lighting device, display device, and method for the operation thereof |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102007012381A1 (en) |
| TW (1) | TW200842277A (en) |
| WO (1) | WO2008106942A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201040433A (en) | 2009-05-14 | 2010-11-16 | Young Lighting Technology Corp | Illumination apparatus |
| CN104094143B (en) * | 2011-12-22 | 2018-01-12 | 3M创新有限公司 | Optical devices with sensor and production and preparation method thereof |
| DE102013102905A1 (en) * | 2013-03-21 | 2014-10-09 | Matthias Borst | Circuit for operating a traffic sign device with solar powered lighting |
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| US20020047624A1 (en) * | 2000-03-27 | 2002-04-25 | Stam Joseph S. | Lamp assembly incorporating optical feedback |
| US20040119908A1 (en) * | 2002-12-18 | 2004-06-24 | Advanced Display Inc. | Planar light source device, liquid crystal display apparatus, and display apparatus |
| US20050127381A1 (en) * | 2003-12-10 | 2005-06-16 | Pranciskus Vitta | White light emitting device and method |
| WO2007020720A1 (en) * | 2005-08-12 | 2007-02-22 | Sharp Kabushiki Kaisha | Light source control device, illumination device, and liquid crystal display device |
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|---|---|---|---|---|
| US5783909A (en) * | 1997-01-10 | 1998-07-21 | Relume Corporation | Maintaining LED luminous intensity |
| US6611000B2 (en) * | 2001-03-14 | 2003-08-26 | Matsushita Electric Industrial Co., Ltd. | Lighting device |
| US7002546B1 (en) * | 2002-05-15 | 2006-02-21 | Rockwell Collins, Inc. | Luminance and chromaticity control of an LCD backlight |
| US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
| TWI329724B (en) * | 2003-09-09 | 2010-09-01 | Koninkl Philips Electronics Nv | Integrated lamp with feedback and wireless control |
| US7482567B2 (en) * | 2004-09-24 | 2009-01-27 | Koninklijke Philips Electronics N.V. | Optical feedback system with improved accuracy |
| DE102004047669A1 (en) | 2004-09-30 | 2006-04-13 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lighting device and method of control |
| US7208738B2 (en) * | 2005-02-28 | 2007-04-24 | Sundar Natarajan Yoganandan | Light source utilizing an infrared sensor to maintain brightness and color of an LED device |
| DE102005012627A1 (en) * | 2005-03-18 | 2006-08-10 | Siemens Ag | Liquid crystal display module for flat screen, has printed circuit board with LEDs or organic LED segments that are arranged in matrix form, where intensity of respective LED or organic LED segment is controlled using control unit |
| DE102005022832A1 (en) * | 2005-05-11 | 2006-11-16 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Headlamp for film and video recordings |
| US7350933B2 (en) * | 2005-05-23 | 2008-04-01 | Avago Technologies Ecbu Ip Pte Ltd | Phosphor converted light source |
| DE102005061204A1 (en) * | 2005-12-21 | 2007-07-05 | Perkinelmer Elcos Gmbh | Lighting device, lighting control device and lighting system |
-
2007
- 2007-03-14 DE DE102007012381A patent/DE102007012381A1/en not_active Withdrawn
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2008
- 2008-03-03 WO PCT/DE2008/000364 patent/WO2008106942A1/en not_active Ceased
- 2008-03-03 TW TW097107262A patent/TW200842277A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020047624A1 (en) * | 2000-03-27 | 2002-04-25 | Stam Joseph S. | Lamp assembly incorporating optical feedback |
| US20040119908A1 (en) * | 2002-12-18 | 2004-06-24 | Advanced Display Inc. | Planar light source device, liquid crystal display apparatus, and display apparatus |
| US20050127381A1 (en) * | 2003-12-10 | 2005-06-16 | Pranciskus Vitta | White light emitting device and method |
| WO2007020720A1 (en) * | 2005-08-12 | 2007-02-22 | Sharp Kabushiki Kaisha | Light source control device, illumination device, and liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200842277A (en) | 2008-11-01 |
| DE102007012381A1 (en) | 2008-09-11 |
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