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WO2008106813A1 - Capteur constitué de matériaux organiques pour mesurer puis interpréter des grandeurs mécaniques - Google Patents

Capteur constitué de matériaux organiques pour mesurer puis interpréter des grandeurs mécaniques Download PDF

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Publication number
WO2008106813A1
WO2008106813A1 PCT/CH2008/000082 CH2008000082W WO2008106813A1 WO 2008106813 A1 WO2008106813 A1 WO 2008106813A1 CH 2008000082 W CH2008000082 W CH 2008000082W WO 2008106813 A1 WO2008106813 A1 WO 2008106813A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
intrinsically conductive
printing
sensor
strain gauge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH2008/000082
Other languages
German (de)
English (en)
Inventor
Udo Lang
Jürg Dual
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eidgenoessische Technische Hochschule Zurich ETHZ
Original Assignee
Eidgenoessische Technische Hochschule Zurich ETHZ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eidgenoessische Technische Hochschule Zurich ETHZ filed Critical Eidgenoessische Technische Hochschule Zurich ETHZ
Publication of WO2008106813A1 publication Critical patent/WO2008106813A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B1/00—Measuring instruments characterised by the selection of material therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends

Definitions

  • the present invention relates to a sensor for measuring dynamic and static mechanical magnitudes according to the preamble of claim 1, to a method for its production and to a use according to claim 5.
  • the present invention is concerned with the measurement of dynamic and static mechanical magnitudes.
  • the signal supplied by the sensor can be transmitted by means of a measuring bridge (Wheatstone bridge) and an amplifier to a transmitting device for wireless reading by external reading devices, to a display or only to tapping contacts.
  • All modules of the system shown in FIG. 1 are said to consist of organic materials due to the general advances in the field of organic electronics.
  • FIG. 2 shows how accelerations can be measured with the aid of a bending beam 1 with seismic mass 2 at the end. Due to the inertia of the seismic mass, the beam 1 is deflected, which leads to strains in the edge, which can be measured by an intrinsically conductive polymer 3, which is structured meandering into a strain gauge (DMS).
  • the further modules 4 shown in FIG. 1, which comprise a measuring bridge, an amplifier and a transmitting device, an optical display or electrodes, can be integrated on the substrate 5.
  • a frame 6 can be provided which simplifies the handling of the overall system and can protect the bending beam against mechanical influences in the substrate plane.
  • FIG. 3 shows a possibility for measuring pressures.
  • a membrane 7 is deformed by pressure differences, which leads to strains on the membrane surface, which in turn can be measured with a DMS.
  • the sensor effect is based in both cases on the piezoresistive effect in electrical conductors.
  • the elongation changes the length and cross-sectional area and thus also the resistance.
  • the piezoresistive effect is to be exploited in intrinsically conductive organic conductors.
  • the document US Pat. No. 5,505,093 discloses a process with which, on the one hand, solvent-based intrinsically conductive polymers, such as polyaniline, can be structured into DMS.
  • non-intrinsically conductive solvent-based polymers such as polystyrene are partially rendered conductive by ion implantation.
  • the production of lateral structures in the micron range takes place by means of photoresist layers as masking layers and subsequent dry etching by means of reactive ion etching.
  • the primary objective of this research is to produce these RFID tags for wholesalers to identify individual goods.
  • RFID tags are achieved. However, no sensor elements are integrated yet.
  • the present invention therefore has for its object to provide sensors for measuring mechanical magnitudes, which can be combined with elements for evaluation to form a new overall system.
  • sensors In order to achieve a low-cost production, such materials and methods are to be used, which are compatible with the aforementioned radio tags.
  • sensors having the features designated in claim 1.
  • By embedding mechanical sensors for measuring dynamic or static mechanical magnitudes it is possible to check, for example, during shipment of packages with sensitive contents, whether inadmissible stresses such as falls or impacts have occurred on the transport path when the system is to measure accelerations according to claim 10.
  • the system can also be used according to claim 10.
  • FIG. 1 shows a block diagram of the basic mode of operation when the sensor is in a
  • FIG. 4 process flow of production:
  • FIG. 6 structuring of the substrate by laser or water cutting
  • FIG. 8 Structuring of the Substrate by Punching
  • FIG. 9 Membrane Production
  • FIG. 10 Microstructuring of intrinsically conductive polymers by so-called lift-off
  • FIG. 11 Microstructuring of intrinsically conductive polymers by inkjet printing
  • FIG. 12 Microstructuring of Intrinsically Conductive Polymers by Imprinting
  • FIG. 13 Microstructuring of Intrinsically Conductive Polymers by Printing Methods
  • FIG. 14 Microstructuring of Intrinsically Conductive Polymers by Vapor Deposition
  • the manufacture of the sensor is shown schematically in FIGS. 4 and 5.
  • a first possibility consists in firstly structuring the substrate 5 and then first applying the organic functional layers 3 and 4; the second possibility is the reverse process order.
  • the substrate 5 may consist of thermoplastic polyesters such as polyethylene terephthalate (PET) or polyimide (PI), for example, but is not limited thereto. However, when selecting the substrate material, it must be ensured that it has sufficient flexibility to be used for roll-to-roll production.
  • FIG. 6 shows a first variant for structuring the substrate 5
  • FIG. 7 shows a possible structuring of the substrate 5 when the substrate 5 consists of photolithographically structurable polymers such as the polyimide PI 2723 from HD Microsystems GmbH (Bad Homburg, Germany).
  • the polymer is first applied to another auxiliary substrate 9. Methods for this purpose are distributing by means of a doctor blade or pipetting up and then allowing to run.
  • the auxiliary substrate must be flexible so that it can also be used in printing presses in a roll-to-roll process.
  • a mask 10 is required which covers the areas not to be exposed during the irradiation with UV light 11. Subsequently, it is developed with a developer solution, whereby the later form stops and other areas are removed.
  • the auxiliary substrate 9 should be chosen so that it also dissolves in the developer and thus only the main substrate 5 stops.
  • FIG. 8 shows the possibility that the mold 1, 2 is defined by punching out of the substrate 5 with the aid of a correspondingly shaped tool 12. In order to allow roll-to-roll production, material which later does not belong to the substrate 5 is punched out.
  • Figure 9 shows a roll-to-roll fabrication compatible method of making a membrane.
  • a heated stamp 13 is pressed into the flexible thermoplastic substrate 5 so far that the softened polymer is partially displaced until only a thin layer remains and thus creates a membrane.
  • the previous steps involved the structuring of the substrate 5.
  • the structuring of the sensitive material 3 will be described in the following steps.
  • the intrinsically conductive and in aqueous dispersion present poly (3,4-ethylenedioxythiophene) / polystyrene sulfonate (PEDOT / PSS) or other intrinsically conductive polymers can be used.
  • FIG. 10 shows a structuring option if the intrinsically conductive polymer 3 and the substrate 5 can not be dissolved in organic solvents. This is the case, for example, with PEDOT / PSS.
  • the method used is in the field of In the process, a photoresist layer 14 is first photolithographically patterned on the substrate and subsequently the intrinsically conductive polymer 3 is deposited by spin-coating, spray coating or pattering, after drying the layer either in air or by heat As with a hot plate or a hair dryer, the layer composite is immersed in organic solvent, whereby the photoresist areas 14 and other layers located thereon are dissolved in.
  • the said method was presented in [3].
  • Figure 11 shows another possibility.
  • the intrinsically conductive polymer 3 can also be deposited as defined by an ink jet printer 15. It is a cost effective method because complicated photolithography steps can be dispensed with.
  • FIG. 12 shows another cost-effective way of depositing.
  • a structured stamp 16 for example of polydimethylsiloxane (PDMS)
  • PDMS polydimethylsiloxane
  • Figure 13 shows a process which is very suitable for roll-to-roll production.
  • the structures are printed on the substrate 5 by, for example, a cylinder 17 using standard printing methods such as flexographic printing, offset printing, gravure printing or screen printing.
  • Wireless tags without sensor function produced by this method will be launched in the near future by PoIyIC (Fürth, Germany).
  • FIG. 14 shows a structuring possibility for organic substances whose molecules consist only of short chains and can thus be vaporized.
  • a shadow mask 18 areas of the substrate 5 to which no material is to be vapor-deposited are covered.
  • Another possible structuring of the intrinsically conductive polymer 3 results when the substrate material 5 is transparent to Nd-YAG laser.
  • [5] it is described how structures made of PEDOT / PSS can be produced by Nd. ⁇ AG laser cutting.
  • the previous embodiments have shown the variant of the process sequence shown in FIG.
  • the other variant in FIG. 5 is based on first applying one of the possibilities shown in FIGS. 10-14 for structuring the intrinsically conductive polymer 3 and then, in a second step, one of the possibilities for structuring the substrate shown in FIGS 5th

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne un capteur qui est constitué de matériaux organiques et peut être utilisé pour mesurer des grandeurs mécaniques statiques et dynamiques. Les accélérations sont mesurées à l'aide d'une tige flexible (1) pourvue d'une masse sismique (2) à l'extrémité, la tige et la masse étant constituées d'un polymère flexible. L'inertie de la masse sismique fait dévier la tige, ce qui produit dans le bord de la tige flexible (1) des extensions qui peuvent être mesurées à l'aide d'un polymère intrinsèquement conducteur (3) qui est structuré en une jauge extensométrique. Les autres modules (4), qui comprennent un pont de mesure, un circuit amplificateur ainsi qu'un organe émetteur, un affichage optique ou des électrodes, sont intégrés sur le substrat (5). Un cadre (6) peut être en outre prévu, qui simplifie la manipulation de l'ensemble du système et peut protéger la tige flexible d'effets latéraux. Le substrat (5) et le cadre (6) sont constitués du même polymère flexible que la tige flexible (1) et la masse sismique (2).
PCT/CH2008/000082 2007-03-02 2008-02-29 Capteur constitué de matériaux organiques pour mesurer puis interpréter des grandeurs mécaniques Ceased WO2008106813A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH3372007 2007-03-02
CH337/07 2007-03-02

Publications (1)

Publication Number Publication Date
WO2008106813A1 true WO2008106813A1 (fr) 2008-09-12

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PCT/CH2008/000082 Ceased WO2008106813A1 (fr) 2007-03-02 2008-02-29 Capteur constitué de matériaux organiques pour mesurer puis interpréter des grandeurs mécaniques

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009155367A3 (fr) * 2008-06-17 2010-02-25 Lumimove, Inc., D/B/A Crosslink Capteurs de contrôle d'état des systèmes compatibles et sans fil pour structures composites
AT511330B1 (de) * 2011-06-03 2012-11-15 Piezocryst Advanced Sensorics Sensor für die messung von druck und/oder kraft
CN109238438A (zh) * 2018-09-13 2019-01-18 太原理工大学 一种基于纳米材料的柔性薄膜声矢量传感器
CN111551269A (zh) * 2020-05-11 2020-08-18 浙江大学 一种基于形状记忆聚合物的结构健康监测系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060071286A1 (en) * 2004-08-17 2006-04-06 California Institute Of Technology Polymeric piezoresistive sensors
ES2264900A1 (es) * 2005-07-13 2007-01-16 Fundacion Cidetec Sensores de presion distribuidos de gran superficie basados en politiofenos.
EP1912051A2 (fr) * 2005-07-13 2008-04-16 Fundacion Cidetec Capteurs de pression repartis sur une grande surface, a base de polythiophenes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060071286A1 (en) * 2004-08-17 2006-04-06 California Institute Of Technology Polymeric piezoresistive sensors
ES2264900A1 (es) * 2005-07-13 2007-01-16 Fundacion Cidetec Sensores de presion distribuidos de gran superficie basados en politiofenos.
EP1912051A2 (fr) * 2005-07-13 2008-04-16 Fundacion Cidetec Capteurs de pression repartis sur une grande surface, a base de polythiophenes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
A SAWHNEY ET AL: "Piezoresistive Sensors on Textiles by Inkjet Printing and Electroless Plating", MRS SYMPOSIUM PROCEEDINGS, vol. 920, 2006, XP002485382 *
MATEIU ET AL: "Reliability of poly 3,4-ethylenedioxythiophene strain gauge", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 84, no. 5-8, 8 February 2007 (2007-02-08), pages 1270 - 1273, XP022061995, ISSN: 0167-9317 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009155367A3 (fr) * 2008-06-17 2010-02-25 Lumimove, Inc., D/B/A Crosslink Capteurs de contrôle d'état des systèmes compatibles et sans fil pour structures composites
AT511330B1 (de) * 2011-06-03 2012-11-15 Piezocryst Advanced Sensorics Sensor für die messung von druck und/oder kraft
AT511330A4 (de) * 2011-06-03 2012-11-15 Piezocryst Advanced Sensorics Sensor für die messung von druck und/oder kraft
CN109238438A (zh) * 2018-09-13 2019-01-18 太原理工大学 一种基于纳米材料的柔性薄膜声矢量传感器
CN111551269A (zh) * 2020-05-11 2020-08-18 浙江大学 一种基于形状记忆聚合物的结构健康监测系统
CN111551269B (zh) * 2020-05-11 2021-09-10 浙江大学 一种基于形状记忆聚合物的结构健康监测系统

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