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WO2008153558A2 - Dispositif d'essai de semi-conducteur avec intercalaire en élastomère - Google Patents

Dispositif d'essai de semi-conducteur avec intercalaire en élastomère Download PDF

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Publication number
WO2008153558A2
WO2008153558A2 PCT/US2007/069896 US2007069896W WO2008153558A2 WO 2008153558 A2 WO2008153558 A2 WO 2008153558A2 US 2007069896 W US2007069896 W US 2007069896W WO 2008153558 A2 WO2008153558 A2 WO 2008153558A2
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
substrate
interposer
probe contactor
piercing structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/069896
Other languages
English (en)
Other versions
WO2008153558A3 (fr
Inventor
Ken Karklin
Raffi Garabedian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Touchdown Technologies Inc
Original Assignee
Touchdown Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Touchdown Technologies Inc filed Critical Touchdown Technologies Inc
Priority to PCT/US2007/069896 priority Critical patent/WO2008153558A2/fr
Publication of WO2008153558A2 publication Critical patent/WO2008153558A2/fr
Publication of WO2008153558A3 publication Critical patent/WO2008153558A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Definitions

  • the present invention relates to devices for testing semiconductor wafers and more particularly to a novel structure for a probe card interposer.
  • PCB printed circuit board
  • probe contactor substrate a substrate to which thousands of probe contactors are coupled
  • connector also referred to herein as an interposer
  • the interposer electrically interconnects the individual electrical contacts of the PCB to the corresponding electrical contacts on the probe contactor substrate which relay signals to the individual probe contactors.
  • the PCB and the probe contactor substrate must be roughly parallel and in close proximity, and the required number of interconnects may be in the thousands or tens of thousands.
  • the vertical space between the PCB and the probe contactor substrate is generally constrained to a few millimeters by the customary design of the probe card assembly and the associated semiconductor test equipment.
  • solder connection technology involves electrically connecting an interposer to the PCB by means of melting solder balls.
  • solder connection technology involves electrically connecting an interposer to the PCB by means of melting solder balls.
  • U.S. Patent Number 3,806,801 assigned to IBM, describes a vertical buckling beam probe card with an interposer situated between the probe contactor substrate and a PCB. The interposer is electrically connected to the PCB, terminal to terminal, by means of melting solder balls (see FIG. 5).
  • An alternative to solder area array interposers is the general category of vertically compliant interposers. These interposers provide an array of vertical springs with a degree of vertical compliance, such that a vertical displacement of a contact or array of contacts results in some vertical reaction force.
  • An elastomeric vertical interposer is an example of one type of a vertically compliant interposer. Elastomeric vertical interposers use either an anisotropically conductive elastomer or conductive metal leads embedded into an elastomeric carrier to electrically interconnect the probe contactor substrate to the PCB. Examples of elastomeric vertical interposers are described in U.S. Patent No. 5,635,846, assigned to IBM (see FIG. 7), and U.S. Patent No. 5,828,226, assigned to Cerprobe Corporation (see FIG. 8).
  • Elastomeric vertical interposers often create distortion of the probe contactor substrate due to the forces applied on the probe contactor substrate as a result of the vertical interposer itself. These forces are necessary to ensure that the probe contactor substrate maintains a reliable electrical contact to the PCB. Additionally, elastomers as a material group tend to exhibit compression-set effects (the elastomer permanently deforms over time with applied pressure) which can result in degradation of electrical contact over time. The compression-set effect is accelerated by exposure to elevated temperatures as is commonly encountered in semiconductor probe test environments where high temperature tests are carried out between 75° C and 150° C or above. [0009] A second type of vertical compliant interposer is the vertical spring interposer.
  • the interposer springs In order to achieve electrical contact between the PCB and the substrate with probe contactors, the interposer springs must be compressed vertically.
  • the compressive force required for a typical spring interposer interconnect is in the range of lgf to 20gf per electrical contact.
  • the aggregate force from the multitude of vertical contacts in the interposer causes the probe contactor substrate to bow or tent since it can only be supported from the edges (or from the edges and a limited number of points in the central area) due to the required active area for placement of probe contactors on the substrate.
  • the tenting effect causes a planarity error at the tips of the probe contactors located on the surface of the probe contactor substrate (see FIG. 11).
  • FIGS. 12A and 12B disclose a laterally compliant interposer as shown in FIGS. 12A and 12B.
  • FIG. 12A illustrates a lateral interposer (1200) in an unengaged state, that is, the interposer substrate (1205) is not in a position wherein it can affect an electrical contact between the PCB (1210) and the probe contactor substrate (1215).
  • the interposer contactor (1220) does not make contact with the either the contact pad/bump (1225) on the probe contactor substrate (1215) or the contact pad/bump (1230) on the PCB (1210).
  • the interposer is engaged by shifting it in the direction of arrow 1235 such that the interposer contactor (1215) makes contact with both the pad/bumps of the PCB (1210) and the probe contactor substrate (1215) (see outlined region 1240).
  • the PCB (1210) In the engaged position the PCB (1210) is in electrical connection with the probe contactor substrate (1215).
  • the laterally compliant interposer is an improvement over the prior art because, inter alia, it relieves the stresses inherent in the vertical interposer, thus minimizing the planarity error and its attendant drawbacks.
  • the interposer can introduce some lateral stress to the probe contactor substrate and the PCB, and the lateral interposer can be an intricate part to manufacture.
  • the device comprises a printed circuit board (PCB) that has at least one PCB piercing structure, a probe contactor substrate that has at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer that has at least one electrical via made of a conductive elastomer.
  • PCB printed circuit board
  • the substrate piercing structure is electrically connected to a probe contactor
  • an interposer that has at least one electrical via made of a conductive elastomer.
  • the device comprises a PCB with at least one PCB bond pad, a probe contactor substrate with at least one substrate bond pad, wherein the substrate bond pad is electrically connected to a probe contactor, and an interposer with at least one electrical via made of a conductive elastomer.
  • the PCB and substrate bond pads are adhered to the elastomer by an adhesive, the PCB becomes electrically connected to the probe contactor.
  • the device comprises a PCB with at least one
  • PCB bond pad a probe contactor substrate with at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer comprising at least one electrical via made of a conductive elastomer.
  • the device comprising a PCB with at least one
  • PCB piercing structure a probe contactor substrate with at least one substrate bond pad, wherein the substrate bond pad is electrically connected to a probe contactor, and an interposer comprising at least one electrical via made of a conductive elastomer.
  • the device may experience zero (or near zero) nascent force - i.e., the force required to maintain a reliable connection between the PCB and probe contactor substrate.
  • the PCB piercing structure and the substrate piercing structure can be selected from a group consisting of: flying lead wire, soldered pins, pressed pins and combinations thereof.
  • several types of conductive adhesives may be used, including, but not limited to various types of screenable conductive surface mount adhesives such as CE3103 and CE3100 from Emerson Cummings and Ablebond 8175 from Ablestik Labs.
  • a diagnostic computer may be electrically connected to the PCB.
  • FIGS. 1A-1E illustrate a method and structure that employ piercing structures and conductive elastomers to form a novel interposer.
  • FIG. 2A illustrates a type of substrate piercing structure.
  • FIG. 2B illustrates a type of PCB piercing structure.
  • FIGS. 2C-2F show a stud bump bonding (SBB) method to form the piercing structure.
  • FIGS. 3A-3H illustrate a method and structure that employ adhesives and conductive elastomers to form a novel interposer.
  • FIGS. 4A-4F show a method and structure that employ adhesives, piercing structures and conductive elastomers to form a novel interposer.
  • FIG. 5 is an illustration of a prior art interposer that employs melted solder balls.
  • FIG. 6 is an illustration of a prior art interposer that employs an area array of solder balls.
  • FIG. 7 is an illustration of a prior art interposer that employs elastomeric vertical interposers.
  • FIG. 8 is an illustration of a prior art interposer that employs elastomeric vertical interposers.
  • FIGS. 9A and 9B are illustrations of a prior art interposers that employs vertical spring interposers.
  • FIGS. 1OA and 1OB are illustrations of a prior art interposer that employs vertical spring interposers.
  • FIG. 11 is an illustration of a planarity error associated with prior art interposers.
  • FIGS. 12A and 12B is an illustration of a laterally compliant interposers disclosed in United States Patent Application SN 11/226,568 by Raffi Garabedian (a common inventor to the present application), Nim Tea and Salleh Ismail, which is assigned to Touchdown Technologies, Inc. the same assignee of the present application.
  • a novel device for testing semiconductor chips is disclosed. A benefit is that the device may experience zero (or near zero) nascent force, such that the device overcomes the deficiencies in the prior art. Also, because the device uses a conductive elastomer, the device allows for adjustments in the X, Y and Z directions. [0034] Referring to FIGS.
  • the device is comprised of a printed circuit board (PCB) that has at least one PCB piercing structure, a probe contactor substrate that has at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer that has at least one electrical via made of a conductive elastomer.
  • PCB printed circuit board
  • the substrate piercing structure is electrically connected to a probe contactor
  • an interposer that has at least one electrical via made of a conductive elastomer.
  • the conductive elastomer (110) is a conductive metal partially embedded in an elastomer by molding. Some examples include, Tyco Electronics Metallized Particle Interconnect, Paricon Pariposer®, Fujipoly, and Shin-Etsu Polymer anisotropic conductive sheet (MT-P type). Other types of conductive elastomers are available and would be apparent to one skilled in the art. Because of the deformable nature of the conductive elastomer, an added benefit is that the probe contactor substrate (115) can be precisely aligned in the X, Y and Z directions. This is unlike previous interposers which were either rigid or where such movement would compromise the complete electrical connectivity needed. [0036] Now specifically referring to FIG.
  • the interposer (105) contains at least one electrical via (110) made of a conductive elastomer.
  • the probe contactor substrate (115) contains at least one substrate piercing structure (120).
  • interposer (105) contains several electrical via (in FIG. IA, seven such via are illustrated) and the probe contactor substrates (115) would also contain multiple substrate piercing structures (in FIG. IA, seven such piercing structures are illustrated).
  • the benefit of multiple electrical via is that ultimately the PCB (not shown in FIG. IA) can make several separate electrical connections with several separate probe contactors.
  • the interposer (105) contains a conductive elastomer that forms a single electrical via (110).
  • the probe contactor substrate (115) contains a substrate piercing structure (120) electrically connected to a probe contactor (125).
  • FIG. 1C when the electrical via made of conductive elastomer (110) is brought down in the direction of arrowl30, it is pierced by the substrate piercing structure (120). In this configuration, a contact placed at position 135 would be in electrical contact with the probe contact (125) - through the electrical via made of conductive elastomer (110) and the substrate piercing structure (120).
  • a PCB (140) is introduced and makes contact with the electrical via made of conductive elastomer (110) by means of a PCB piercing structure (145) in the same way as described with reference to FIGS. IB and 1C.
  • a contact made with the PCB (140) at position 150 would be in electrical contact with the probe contact (125) - through the PCB piercing structure (145), the electrical via made of conductive elastomer (110) and the substrate piercing structure (120).
  • the PCB is connected to an external diagnostic computer (155) that assists in testing the semiconductor that is under inspection.
  • IA through ID illustrate multiple electrical via such that the PCB (140), and consequently the diagnostic computer (155), can be in separate electrical contact with multiple probe contactors.
  • the single electrical via made of conductive elastomer (110) is illustrated as seven separate conductive elastomer structures, i.e., parts 110 and 160. However, it is possible to use a single conductive elastomer structure that contains multiple separate electrical via. This configuration is shown in FIG. IE which illustrates a single conductive elastomer structure (165) that allows for multiple electrical via (170).
  • some conductive elastomers use highly organized conductive columns of spherical particles supported in an elastomeric matrix; thus a single piece of conductive elastomer can support multiple electrical via in the direction of the columns of conductive electrical spheres.
  • Other conductive elastomers embed fine wires vertically in an elastomer. Again allowing a single piece of conductive elastomer to support multiple electrical via in the direction of the fine wires.
  • One benefit to using piercing structures in a conductive elastomer is that the PCB and the probe contactor substrate can be separated from the interposer after they have been joined, if a repair or rework becomes necessary.
  • the PCB can once again pierce the interposer, as can the probe contactor substrate.
  • This flexibility increases efficiency yield. For example, should the PCB used on one device become irreversibly damaged (while the probe card substrate to which it is connected remains operational) and the probe contactor substrate on another becomes irreversibly damaged (while the PCB to which it is connected remains operational), then the operational PCB and the operational probe card substrate can be separated from their respective interposers and rejoined to each other using an interposer. This results in a device that is operational, despite previously having two damaged devices.
  • FIG. 2 A illustrates the substrate piercing structure (201) affixed to the probe contactor substrate (202).
  • the substrate piercing structure (201) is electrically connected (through electrical conduit 203) to the probe contactor (204).
  • FIG. 2B illustrates the PCB piercing structure (205) affixed to the PCB substrate (206).
  • the PCB piercing structure (205) is electrically connected (through electrical conduit 207) to position 208, which may further be connected to a diagnostic computer (245).
  • piercing structure may include pins soldered to the substrate, pins pressed into the substrate or by stud bump bonding (SBB) (described in more detail below with reference to FIGS. 2C-2F).
  • SBB stud bump bonding
  • One method to form the piercing structure is SBB.
  • the tip of the bond wire generally gold
  • the tip of this assembly (260) is brought close to the bond pad (265) in the direction of arrow 270 such that the ball (250) is in contact with the bond pad (265).
  • Applying mechanical force in the direction of arrow 270 deforms the ball (250) for more surface area contact with the bond bad (265), and by adding heat and ultrasonic energy, the ball (250) creates a metallic connection to the bond pad (265) as shown in FIG. 2D.
  • the wire bonding assembly (255) finishes by moving in the direction of arrow 275 and breaking off the bond wire (280) from the ball (250) to begin another cycle as shown in FIG. 2E. Often this break creates a sharp structure (285) that may be used as piercing structure. Alternatively, or in addition, the structure (285) may be sharpened by techniques commonly known to those of skill in the art. Current wire bonding assemblies can make more than 12 of these structures per second, with improvement made constantly.
  • the device is comprised of a PCB with at least one PCB bond pad, a probe contactor substrate with at least one substrate bond pad, wherein the substrate bond pad is electrically connected to a probe contactor, and an interposer with at least one electrical via made of a conductive elastomer.
  • the PCB and substrate bond pads are adhered to the elastomer by an adhesive, the PCB becomes electrically connected to the probe contactor.
  • probe contactor substrate 305 contains at least one substrate bond pad (310) that is electrically connected to a probe contactor (315).
  • an adhesive (320) is applied to the substrate bond pad (310). This may be applied by any suitable means including screening and dispensing. It would be apparent to one skilled in the art that several types of conductive adhesives may be used, including but not limited to, screenable conductive surface mount adhesives such as CE3103 and CE3100 from Emerson Cummings and Ablebond 8175 from Ablestik Labs.
  • an interposer (325) that contains at least one electrical via (330) made of a conductive elastomer is brought into contact with the substrate bond pad (310) as shown in FIG. 3C.
  • the adhesive may be applied to the conductive elastomer surface instead of the substrate bond pad (310) and the interposer could then be brought into contact with the substrate bond pad (310).
  • the adhesive may be applied to both the conductive elastomer surface and the substrate bond pad (310).
  • the PCB (335) contains at least one PCB bond pad (340).
  • the PCB bond pad (340) may be in electrical connection with a diagnostic computer (345).
  • an adhesive (350) is applied to the PCB bond pad (340). This may be applied by any suitable means including screening and dispensing. It would be apparent to one skilled in the art that several types of conductive adhesives may be used, including but not limited to, screenable conductive surface mount adhesives such as CE3103 and CE3100 from Emerson Cummings and Ablebond 8175 from Ablestik Labs.
  • the interposer (325) that contains at least one electrical via (330) made of a conductive elastomer is brought into contact with the PCB bond pad (340) as shown in FIG. 3F. Force is applied to sandwich the interposer (325) between the PCB and the probe contactor substrate so that the adhesive (both parts 350 and 320) can set and ensure a reliable electrical connection.
  • the adhesive may be applied to the conductive elastomer surface instead of the PCB bond pad (340), and the interposer could then be brought into contact with the PCB bond pad (340).
  • the adhesive may be applied to both the conductive elastomer surface and the PCB bond pad (340).
  • interposer (325) contains several electrical via (in FIGS 3A-3H, seven such via are illustrated) and the probe contactor substrate (305) would also contain multiple bond pads (in FIGS 3A-3H, seven such pads are illustrated).
  • the benefit of multiple electrical via is that ultimately the PCB can make several separate electrical connections with several separate probe contactors.
  • the single electrical via made of conductive elastomer (330) is illustrated as seven separate conductive elastomer structures i.e., parts 330 and 355 in FIG. 3F.
  • FIG. 3 G illustrates a single conductive elastomer structure (360) that allows for multiple electrical via (365).
  • the both piercing structures and adhesives may be used to achieve an electrical connection with a conductive elastomer.
  • the PCB (405) contains PCB piercing structures (410) that pierce the conductive elastomer (420) of the interposer (425).
  • an adhesive (435) that joins the conductive elastomer (420) to the substrate bond pad (440).
  • a contact made with the PCB (405) at position 445 would be in electrical contact with the probe contactor (450) - through the PCB piercing structure (410), the conductive elastomer (420), the adhesive (435), the substrate bond pad (440).
  • the PCB is connected to an external diagnostic computer that assists in testing the semiconductor that is under inspection.
  • a single elastomer structure (460) may be use as shown in 4B.
  • both piercing structures and adhesives may be used to achieve an electrical connection with a conductive elastomer.
  • the piercing structures are used on the probe card substrate, while adhesives are used with the PCB.
  • the interposer may have several conductive elastomer structures as in FIG. 4C, or a single elastomer structure as in FIG. 4D.
  • FIGS. 4E and 4F it would be apparent given this disclosure, that both piercing structures and adhesives can be used on the PCB to electrically bind it to the interposer; and it would be apparent that piercing structures and adhesives can be used on the probe contactor substrate to electrically bind it to the interposer.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un nouveau dispositif pour essayer des puces semi-conductrices. Le bénéfice avec tous les modes de réalisation décrits ici provient du fait que le dispositif peut éprouver une force naissante nulle (ou pratiquement nulle). Le dispositif peut être constitué d'une carte à circuit imprimé (PCB) ayant au moins une structure de perforations de PCB, un substrat de contacteur de sonde ayant au moins une structure de perforations de substrat, la structure de perforations de substrat étant connectée électriquement à un contacteur de sonde, et un intercalaire ayant au moins une voie électrique constituée d'un élastomère conducteur. Lorsque la structure de perforations de PCB et la structure de perforations de substrat traversent l'élastomère, la PCB devient connectée électriquement au contacteur de sonde. Au lieu de la structure de perforations, la PCB ou le substrat de contacteur de sonde peut être collé(e) sur l'élastomère par un adhésif, de sorte que la PCB devienne connectée électriquement au contacteur de sonde. La structure de perforations de PCB et la structure de perforations de substrat peuvent inclure un fil conducteur volant, des broches soudées ou des broches estampées. Les adhésifs peuvent comprendre, mais ne sont pas limités à ceux-ci, des adhésifs de montage en surface conducteurs pouvant être criblés. Enfin, un ordinateur de diagnostic peut être connecté électriquement à la PCB pour aider à essayer la buse semi-conductrice.
PCT/US2007/069896 2007-05-29 2007-05-29 Dispositif d'essai de semi-conducteur avec intercalaire en élastomère Ceased WO2008153558A2 (fr)

Priority Applications (1)

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PCT/US2007/069896 WO2008153558A2 (fr) 2007-05-29 2007-05-29 Dispositif d'essai de semi-conducteur avec intercalaire en élastomère

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PCT/US2007/069896 WO2008153558A2 (fr) 2007-05-29 2007-05-29 Dispositif d'essai de semi-conducteur avec intercalaire en élastomère

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WO2008153558A2 true WO2008153558A2 (fr) 2008-12-18
WO2008153558A3 WO2008153558A3 (fr) 2009-04-09

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410258A (en) * 1993-10-01 1995-04-25 Db Design Group, Inc. Self-guiding receptacle for a semiconductor test socket
US20030095388A1 (en) * 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly

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