WO2008153086A1 - Substrate detecting apparatus, substrate aligning apparatus, substrate bonding apparatus having substrate detecting apparatus and substrate aligning apparatus, wafer outer shape detecting apparatus, wafer aligning apparatus, and wafer bonding apparatus having wafer outer shape detecting apparatus and wafer outer shape detec - Google Patents

Abstract

A wafer outer shape detecting apparatus (10) is provided with a rotating apparatus (12) for rotating a wafer (11); an edge detecting apparatus (15) for detecting the edge of the wafer placed on the rotating apparatus; a servo apparatus (16) for making the edge detecting apparatus follow displacement of the wafer edge; and a position detecting apparatus (17) for detecting the position of the edge detecting apparatus to the radius direction of the wafer.

Description

 Description Substrate detection device, substrate positioning device, substrate bonding device having these, wafer outer shape detection device, wafer positioning device, and wafer bonding device having wafer eight shape detection device and wafer outer shape detection device Technical field

 The present invention relates to a substrate detection device, a substrate positioning device, a substrate bonding device having these, a wafer contour detection device, a wafer positioning device, a wafer contour detection device, and a wafer contour detection, which are used in the field of manufacturing electronic devices. The present invention relates to a wafer bonding apparatus having the apparatus. Background art

 One of the promising means to achieve the improvement of operation speed, functional advancement, and capacity increase of electronic devices is the three-dimensional stacking of wafers on which electronic devices are formed. This is because the derailment length of the circuit can be shortened, and the device can be made faster and the heat generation can be reduced by laminating a wafer with a lead wire penetrating inside the semiconductor substrate (wafer) and connecting and thinning the lead wire. . In addition, by increasing the number of layers in the wafer stack, the circuit functions can be improved and the memory capacity can be increased.

 To perform three-dimensional stacking of wafers, a bonding electrode is formed on the wafer surface after circuit formation, and positioning is performed so that the electrodes of two wafers or a wafer that has already been stacked and the next wafer to be stacked are aligned. Thus, a wafer bonding apparatus has been proposed (for example, Japanese Patent Application Laid-Open No. 2 005-3 0 2 8 5 8).

In the conventional wafer bonding apparatus, in order to detect the outer shape of the wafer, a wafer outer shape detection device that irradiates light from above the wafer and detects the outer shape of the wafer with a photodetector arranged below the wafer is used. ing. However, in the conventional wafer outline detection device, when detecting the outline of a laminated wafer in which a plurality of wafers are laminated (hereinafter also referred to as a wafer), the maximum outline of the entire wafer is detected, and the bonding surface There is a problem that the outer shape of the wafer corresponding to the above cannot be detected correctly. Disclosure of the invention

 The present invention has been made in view of the above problems, and includes a substrate detection device, a substrate positioning device, a substrate bonding device having these, a wafer outer shape detection device, a wafer positioning device, and a wafer eight shape detection. It is an object of the present invention to provide a wafer bonding apparatus having an apparatus and a wafer outer shape detection apparatus.

 In order to solve the above-described problem, a first aspect of the present invention provides a substrate detection apparatus comprising a detection unit that detects an uppermost substrate constituting an uppermost layer among a plurality of stacked substrates.

 According to the first aspect of the present invention, the detection unit is an edge detection device that detects an edge of the uppermost substrate, a rotation device that rotates the plurality of stacked substrates, and the rotation device. The apparatus further comprises a servo device that causes the edge detection device to follow the displacement of the edge of the rotating uppermost substrate, and a position detection device that detects a position of the edge detection device.

 According to the first aspect of the present invention, the edge detecting device detects a step of the edge of the uppermost substrate.

 According to the first aspect of the present invention, the edge detection device is characterized by detecting an inclination of the uppermost layer substrate.

 Further, according to the first aspect of the present invention, the edge detection device detects a change in optical characteristics of the edge of the uppermost substrate.

According to the first aspect of the present invention, the optical characteristic includes at least one of a color and a reflectance of the uppermost substrate. According to the second aspect of the present invention, the apparatus includes: the substrate detection device; a substrate holder stage that positions the substrate holder that holds the substrate; and a transport unit that transfers the substrate to the substrate holder. A featured substrate positioning apparatus is provided. According to the third aspect of the present invention, the substrate positioning device, and a substrate bonding unit that joins the two substrates positioned using the substrate positioning device via the substrate holder, There is provided a substrate bonding apparatus characterized by comprising:

 According to the fourth aspect of the present invention, a rotating device for rotating a wafer, an edge detecting device for detecting an edge of the wafer placed on the rotating device, and the edge detecting device for the edge of the wafer. There is provided a wafer contour detecting device characterized by comprising: a servo device that follows displacement; and a position detecting device that detects a position of the edge detecting device with respect to a radial direction of the wafer.

 According to a fourth aspect of the present invention, the edge detecting device detects a step of the eight edge.

 According to a fourth aspect of the present invention, the edge detecting device detects the inclination of the eight edge.

 According to the fourth aspect of the present invention, the edge detection device detects a change in optical characteristics of the wafer edge.

 According to a fourth aspect of the present invention, the optical characteristic includes at least one of the color of the wedge edge and the reflectance.

 According to the fourth aspect of the present invention, there is further provided a fixed edge detection device that is disposed in the vicinity of the outer peripheral portion of the wafer and detects the wafer edge.

According to a fourth aspect of the present invention, a notch position formed on an outer peripheral portion of the wafer is detected based on at least one signal of the edge detection device and the fixed edge detection device. And Further, according to the fourth aspect of the present invention, the number of stacked layers of the wafer is detected by the edge detection device, and the notch position is detected by the edge detection device when the wafer is a laminated wafer. And

 According to the fourth aspect of the present invention, the number of stacked layers of the wafer is detected by the edge detection device, and when the wafer is a single layer wafer, the notch is detected by the fixed edge detection device. The position is detected.

 According to a fourth aspect of the present invention, an error display is displayed when the detected number of stacked wafers is different from the wafer stacking information at the time of wafer insertion. Further, according to the fourth aspect of the present invention, it is characterized in that either the edge detection device or the fixed edge detection device is selected based on the wafer stacking information at the time of wafer insertion. .

 Further, according to the fifth aspect of the present invention, the wafer outer shape detecting device, a wafer holder stage for positioning a wafer holder for holding the wafer, and a transfer means for transferring the wafer to the wafer holder are provided. A wafer positioning device is provided.

 Further, according to the fifth aspect of the present invention, the wafer relative to a predetermined position of the wafer holder based on a detection result of the eccentric amount, notch position or orientation flat position of the wafer using the wafer outer shape detection apparatus. And correcting the notch position or the orientation flat position, and positioning the wafer on the wafer holder.

 Further, according to the sixth aspect of the present invention, the wafer positioning device, a wafer bonding unit that joins two wafers positioned using the wafer positioning device via a wafer holder, There is provided a wafer bonding apparatus characterized by comprising:

According to the present invention, it is possible to correctly measure the outer shape corresponding to the uppermost bonding surface of the substrates, the substrate detection device, the substrate positioning device, and the substrate bonding device including these. Can be provided.

 In addition, a wafer outer shape detecting device, a wafer positioning device, and a wafer bonding device having a wafer outer shape detecting device and a wafer outer shape detecting device capable of correctly measuring the outer shape corresponding to the uppermost bonding surface of the wafer. Can be provided.

 In addition, the above-mentioned apparatus can measure the amount of deviation of the substrate or wafer at the time of bonding for each layer, so that the bonding conditions can be optimized. Brief Description of Drawings

 FIG. 1 is a schematic configuration diagram of a wafer bonding apparatus according to an embodiment.

 FIG. 2 is a schematic configuration diagram of the wafer outline detecting apparatus according to the first embodiment. FIG. 3 is a wafer contour detection sequence diagram of the wafer contour detector.

 FIG. 4A shows an enlarged view of the edge of wafer 11.

 Fig. 4B shows an example of the signal from the edge detection sensor 15 in the wafer radial direction.

 FIG. 5A shows an enlarged view of the edge of wafer 11.

 Fig. 5B shows an example of the signal from the edge detection sensor 15 along the wafer radial direction.

 FIG. 5C shows an example in which a signal defining the edge range is formed based on the signal of FIG. 5B. FIG. 6 is an edge tracking control block diagram of the edge detection device of the wafer outline detection device according to the first embodiment.

 Figure 7 shows an example of the result of detecting the wafer surface height variation.

 Figure 8 shows an example of the servo pull-in characteristics with respect to the edge.

 Figure 9 shows an example of the wafer outline measurement result by the edge detection sensor.

 FIG. 10 is a schematic configuration diagram of a wafer positioning apparatus.

FIG. 11 is a schematic configuration diagram of a wafer outline detecting apparatus according to a second embodiment. FIG. 12 is a wafer contour detection sequence diagram of the wafer contour detector of the second embodiment.

 FIG. 13 is a schematic configuration diagram of a wafer positioning apparatus according to the second embodiment. BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, a wafer bonding apparatus according to an embodiment of the present invention will be described in detail.

 In all of the following embodiments, a semiconductor wafer will be described as a representative, but it goes without saying that various substrates such as a glass substrate, a ceramic substrate, and a ferrite substrate can be used in addition to the semiconductor wafer used for manufacturing an electronic device. .

 It goes without saying that it can also be used for chips on which electronic devices are formed.

 FIG. 1 is a schematic configuration diagram of a wafer bonding apparatus according to an embodiment.

 The wafer bonding apparatus 1 according to the embodiment includes a wafer positioning apparatus 50 having a built-in wafer outer shape detection apparatus 10 described later, and two positioned wafers bonded together via a wafer holder. It is composed of a wafer bonding part 90 that forms eight.

 After the previous process, the wafer that has been put into the wafer outer shape detection device 10 of the wafer positioning device 50 is transferred to the wafer outer shape detection device 10 by the wafer outer shape detection device 10 or the wafer outer shape corresponding to the uppermost bonding surface. Notch position or orientation flat position is detected.

 It should be noted that a substrate corresponding to the notch position or orientation flat position may be formed on a substrate other than a semiconductor wafer.

Based on the detection result of the wafer outer shape detection device 10, the notch portion or orientation flat position of the wafer is positioned at a predetermined position of a wafer holder described later by a wafer positioning device 50 described later. The wafer and wafer holder set positioned on the wafer holder by the wafer positioning device 50 are transferred to the wafer bonding unit 90 by the transfer robot 2, and the two wafers are joined by the wafer bonding unit 90 via the wafer holder. As a result, a bonded wafer 11 (hereinafter referred to simply as a single wafer or a laminated wafer) is formed.

 (First embodiment)

 Next, the wafer outline detecting apparatus 10 according to the first embodiment will be described.

02 is a schematic configuration diagram of the wafer contour detection device 10 according to the first exemplary embodiment. FIG. 3 is a wafer contour detection sequence diagram of the wafer contour detector 10. Fig. 4A, Fig. 4B, Fig. 5A, Fig. 5B, and Fig. 5C show examples of wafer detection output. FIG. 6 is an edge tracking control block diagram of the edge detection apparatus in the wafer outline detection apparatus according to the first embodiment.

 In FIG. 2, for example, a wafer 11 on which two wafers 1 1 a and 1 1 b are bonded together is placed on a turntable 13 fixed to the rotary shaft of a rotary motor 1 2, which will be described later. 1 (see Fig. 10). The wafers l l a and 1 l b may be single-plate wafers or laminated wafers.

The rotary motor evening 1 2 mouths for detecting a rotational position of the rotary motor 1 2 (rotation angle) - Tari - encoder 1 ₄ is incorporated. In the following description, the case where the (laminated) wafer 11 is placed on the turntable 13 will be described, but it goes without saying that it may be a single wafer 11.

 Above the wafer 1 1 is an edge detection sensor 1 5 for detecting the outer edge of the wafer 1 1, and this edge detection sensor 1 5 is supported, and the edge detection sensor 1 1 5 is attached to the edge of the wafer 1 1 Servo mechanism 16 to follow is arranged. The support mechanism 16 is composed of a linear motor 18 including a linear encoder 17, and moves the edge detection sensor 15 in the radial direction of the wafer 11.

Also controls rotary motor 1 2, edge detection sensor 1 1 5, linear motor 1 8 etc. And a control device 20 composed of various control units to be described later for processing each signal.

 Hereinafter, components of the wafer outer shape detection apparatus 10 will be described.

 The edge detection sensor 15 can extract the displacement in the thickness direction of the wafer 11, and as shown in Figs. 4A and 4B, it can detect the level difference at the edge of the wafer 11. It is a system. In addition, the edge detection sensor 15 can also measure the thickness of the wafer 11, and if the wafer 11 is a laminated wafer, the number of laminations is detected if the wafer thickness for each layer is known in advance. You can also.

 FIG. 4A shows an enlarged view of the edge portion of the wafer 11 and FIG. 4B shows an example of a signal from the edge detection sensor 15 in the wafer radial direction.

 In addition, the edge detection sensor 15 has a tilt detection function and can detect a portion where the edge region of the wafer 1 1 is tilted. As shown in FIGS. 5A to 5C, the wafer 1 1 It is possible to determine the area of one edge.

 Figure 5A shows an enlarged view of the edge of wafer 11; Figure 5B shows an example of the signal from edge detection sensor 15 along the wafer radial direction; Figure 5C shows the signal of Figure 5B. Each example shows a signal that defines the edge range.

 In addition, the edge detection sensor 15 can detect a change in reflectance, and when the reflectance is different in the vicinity of the edge of each layer of the wafer 11 (for example, 1 1 a, lib), Edge identification of a specific layer becomes possible.

 In addition, the edge detection sensor 15 can detect the hue, and when the hue is different in the vicinity of the edge of each layer of the wafer 11, it is possible to determine the edge of a specific layer.

 Further, in this embodiment, a linear contact optical displacement meter capable of extracting a thickness direction displacement is used, which has the widest linear puddle for edge following.

The linear motor 18 is a mechanism that enables the edge detection sensor 15 to be driven in the radial direction of the wafer 11, and is a movable that generates electromagnetic driving force using a three-phase coil and magnet. The movable portion is driven by electromagnetic driving force with respect to the fixed portion. The edge detection sensor 15 is fixed to the movable part. The linear motor 18 also has a built-in guide mechanism and positioning resolution of several meters. Note that the resolution required for edge detection on wafer 11 depends on the number of sampling data, but approximately 1 0 ^ 111 is required. Therefore, if the driving configuration has a positioning ability of 111, single-phase VCM A pneumatic actuator with evening air driving force other than driving or electromagnetic driving force may be used. In addition, it is desirable to use a mechanical system with low sliding resistance, such as a guide, to follow the edge.

 The linear encoder 17 is built in the linear motor 18 and detects the position of the movable part in the driving direction (wafer radial direction). The linear encoder 17 can determine the position with the pulse force count, but resets the count with the origin sensor (not shown) when the linear motor 18 is initialized. The conversion from the count value to the position in the wafer radial direction is performed by the data processing unit (C PU) 21 of the controller 20. In this embodiment, the linear encoder 17 is built in, but the linear encoder 17 may be externally attached.

 As the wafer 11, a single layer wafer, a laminated (bonded) wafer, or the like is used. In this embodiment, a 200 mm wafer mainly stacked is targeted, but the present invention is not limited to this.

 The rotary motor 12 has a rotor and a stator (not shown), and the rotor can be rotated by generating torque by electromagnetic force or the like.

The rotary encoder 14 is built in the rotation mode 12 (not shown) and detects the rotation angle according to the rotation angle of the rotation mode 12 and can determine the angle by pulse count. The rotary encoder 1 4 resets the count with a home sensor (not shown) when the rotary motor 1 2 is initialized, and the data processing unit (CPU) 2 1 converts the count value to the motor rotation angle. To do. In this embodiment, the mouth-tally encoder 14 is built-in, but may be externally attached. The turntable 1 3 is attached to the rotor of the rotary motor 1 2 and has a function of sucking the wafer 1 1. The sucked wafer 1 1 rotates as the rotary motor 1 2 rotates. In this embodiment, vacuum suction is used, and vacuum introduction to the turntable 13 is performed by relaying a mouth union (not shown) or the like. In place of vacuum suction, electrostatic suction or the like can be used.

 The linear motor driver 2 2 in the control device 20 is a control driver for driving the linear motor 18 and transmits a position command to position the linear motor 18 to a predetermined position and transmits a thrust command. Then, the mover can be driven with a predetermined thrust, and various parameters such as the driving conditions of the linear motor 18 can be set, and the linear motor can be driven according to the parameters.

 The rotary motor driver 2 3 is a controller driver for driving the rotary motor 1 2 .When a rotation command is sent, rotation at the commanded rotation speed is possible, and a position command to the target rotation angle is sent. Then, positioning to a predetermined rotation angle becomes possible, and various parameters such as the drive condition of the rotation mode 12 can be set, and the rotation motor 12 can be driven according to the parameters.

 The support control unit 24 is an electric circuit having a support function for causing the edge detection sensor 15 to follow the edge of the wafer 11, and the functional configuration of the circuit is described with reference to the block diagram of FIG. 6. explain.

 The function of this circuit is a comparator of blocks B 1 and B 2 in the block diagram, and E t and E s. Block B 3 has the current sensitivity characteristics (AZV) of the linear motor driver 22, Block B 4 has the thrust characteristics (NZA) of the linear motor 28, and Block B 5 (dotted line) is mounted on the mover. The edge detection sensor 15 moves in the radial direction of the wafer as a single block.

Block B 5 has a moving part mass consisting of a linear motor movable element and an edge detection sensor. 15 The thrust becomes acceleration due to the acceleration characteristics ((mZ s ² ) ZN), and the acceleration time integral is the speed (mZ s ), The flow in which the time integral of velocity is converted to position (m) Is represented by an integral element.

 As shown in Fig. 2, Fig. 4A, Fig. 4B, Fig. 5A to Fig. 5C, the edge detection sensor 15 measures the wafer surface when it is inside the wafer 1 lb edge (on the wafer inner circumference side). If it is outside the edge, it measures the state where the lower wafer 1 1 a surface or measurement surface is not present.

 When the displacement detection function in the thickness direction of the edge detection sensor 15 is used, a signal output Es as shown in FIG. 4B is obtained according to the radius of the wafer 11. At that time, the threshold E t is set to a value lower than the value of Es corresponding to the surface height of the wafer 11 b on the uppermost surface of the wafer 11. Considering the comparison between E s and E t in the block diagram of Fig. 6, block B 1 is E with the edge detection sensor 15 on the outer peripheral side of wafer 1 lb with respect to the edge of wafer 1 1 b in Fig. 4 A. t -E s = ε> 0. Conversely, if the edge detection sensor 15 is located on the inner peripheral side of the wafer 11 b with respect to the edge of the wafer 11 b, E t—E s = ε <0. In ブ ロ ッ ク 1 in the block diagram of Fig. 6, a voltage of + E (V) is generated if ε is positive, and a voltage of -E (V) is generated if ε is negative. + E (V) corresponds to the thrust polarity where the movement of the edge detection sensor 15 on the wafer radius moves toward the inner periphery, and one E (V) corresponds to the thrust polarity which moves toward the outer periphery. The edge detector performs phase compensation using the filter of block B 2 to stabilize the feedback control operation. These circuit configurations enable automatic tracking to the edge of the wafer 11b. The edge detection device can read the position of the edge detection sensor 15 from the linear encoder 17 information and handle it as edge position information by maintaining the following state of the edge.

 The measurement data reading unit 25 shown in Fig. 2 has a function to read the output voltage of the edge detection sensor 15, lip encoder —or encoder 14 or linear encoder 17 in time synchronization or encoder count synchronization. Have. The read data is transmitted to the data processing unit 21.

In the case of the wafer outline detector 10, the data processor (CPU) 21 Performs arithmetic processing and storage, issues an edge follow-up servo on / off command to the support control unit, issues commands to each driver, reads the status of the driver, etc. Determine the status and issue processing commands corresponding to the status.

 Next, referring to Fig. 3, the wafer outline detection (measurement) sequence will be described step by step.

 The wafer 11 is loaded on the turntable 13 of the rotary motor 12 by automatic transfer by a robot (not shown) or manual transfer by a person.

 Step (S 1): We eight surface measurement

 In order to set the threshold E t, it is necessary to obtain the surface height of the uppermost wafer 1 1 b (see Fig. 2) of the wafer to be measured. In order to measure the surface height of the uppermost layer, it is necessary to position the edge detection sensor 15 to the inner peripheral side of the wafer 11b. Taking the case of a 200 mm wafer as an example, the edge near R = 100 mm with respect to the rotation center of the turntable 13 is an edge. However, since the edge detection sensor 15 has a deviation when the wafer 11 is loaded on the turntable 13, it is necessary to set a positioning position in consideration of the deviation amount. Since it is necessary to set the height of the surface of the wafer 8 at a position as close to the edge as possible for accurate threshold setting, the eccentricity of the wafer 11 on the turntable 1 3 is preferably 5 mm or less. Therefore, it is desirable to position the edge detection sensor 15 at a radius R = 90 to 94 mm from the center of the turntable 13. This value is changed depending on the size of the wafer 11 placed on the turntable 13.

Next, the wafer outline detecting device 10 rotates the turntable 13 and measures the surface shake of the wafer 1 lb corresponding to the wafer rotation angle. After the measurement is finished, turn table 1 3 stops. If the edge step is small, setting the threshold in consideration of the surface blur of the wafer 11 makes it possible for the edge detection sensor 15 to follow the target edge without fail. Therefore, the target threshold E t is This parameter depends on the rotation angle with a certain amount of offset from the surface height of the uppermost wafer 11 b. FIG. 7 shows an example of the height variation of the wafer 11b surface. The standard for the offset amount is about half of the level difference that follows. In terms of control, this offset amount is controlled by converting it to analog voltage or digital value. As a result, the target threshold E t (Θ) (see Fig. 7) corresponding to the wafer rotation angle 0 is obtained and stored. In addition, the control device 20 may register the number of stacked wafers in the control device 20 in advance, and if the measured wafer height is different from the registered value, the data processing unit 21 may determine an error. Is possible.

 Step (S2): From edge servo ○ N to wait processing

 The data processing unit 21 issues a support ON command to the servo control unit 24 so that the wafer 11 is in the edge-following state (the state shown in the block diagram of FIG. 6) while the rotation is stopped.

 When the edge is stationary, the behavior of the edge detection sensor 15 is as shown in FIG. Figure 8 shows an example of the servo pull-in characteristic for the edge. Since the movement of the edge detection sensor 15 is expressed by the output of the linear encoder 17, the transient pull-in completion status can be obtained by monitoring the output of the linear encoder 17.

 The servo control unit 24 starts the rotary motor 12 at the stage when the pull-in of the servo is completed, and rotates the wafer 11 at a predetermined rotational speed. Since the servo control unit 24 may have an error in the tracking of the edge servo due to the start of rotation, a wait sequence (wait time) that delays the data acquisition timing by a fixed time is set. This time depends on the rotation speed of the rotation motor 12 and the mounting eccentricity of the wafer 11, and the wait time becomes longer when the rotation speed and eccentricity are large. Note that when the eccentricity is about 5 mm, the circuit constant for the fill of block B 2 in Fig. 6 is the weight if the lead lug fill is set to 30 Hz and the rotation speed is 0.2 rps or less. The time can be 0.

 Step (S3): Wafer outline data acquisition

The external data of wafer 1 1 b is the rotary motor 1 2 rotary encoder 1 4 The value and the corresponding position of the edge detection sensor 15 (linear encoder 17 value) are stored in the measurement data reading unit 25 as pair data. FIG. 9 shows an example of the wafer outer shape detection result detected by the edge detection sensor 15, in which the wafer edge and the notch position are detected over one round.

 The support control unit 24, after measuring the data for one rotation, transfers the stored data to the data processing unit 21. The control device 20 extracts from the wafer outer shape data the data without a notch part (not shown) or an orientation flat part (not shown) formed on the outer peripheral part of the wafer lib, and the diameter of the wafer 11 b, Calculate the eccentricity.

 The control device 20 uses the calculated value to re-extract the wafer outer periphery data excluding the notch or orientation flat part, and the wafer with the correct diameter, eccentric coordinates, and notch part (notch wafer) or orientation flat part. It is determined whether it is a wafer that has a notch part or an orientation flat part. If it is a notch wafer, the angle of the notch position is calculated. If it is an orientation flat wafer, the angle of the orientation flat position is calculated.

'Ru. In this case, the angle reference is based on the origin of the rotary motor 12. For example, in the case of FIG. 9, the notch position is about 3.14 r a d.

 If the wafer 11 type is registered in the controller 20 in advance and the measured wafer 11 results differ from the registered data, for example, a wafer without a notch When it is inserted, or when an orientation flat wafer is inserted instead of a notch, the data processing unit 21 can also determine an error.

 Step (S4): Precision measurement of wafer notch

In the case of a notch wafer, in order to accurately calculate the angle of the notch position, re-data acquisition near the notch position is performed with the wafer rotation speed reduced. Since the approximate angle of the notch position is obtained in step S3, the rotary motor 1 2 is driven and positioned up to the front of the notch position, the data processor 2 1 is servo-controlled while the rotary motor 1 2 is stopped. A servo ON command is sent to part 24 so that the edge follows the edge. The support controller 24 determines the rotation of the wafer at a predetermined angle after determining whether the support pull-in is complete. Do it only once. The control device 2 0 uses the local contour including the notch position as the edge detection sensor 15 position corresponding to the rotary encoder 1 4 value of the rotary motor 1 2 position (linear encoder 1 7 value). 2 Memorize in 5.

 Step (S5): Wafer eccentricity, notch position calculation

 Using the result of step S3 and the measurement data obtained in step S4, the data processing unit 2 1 uses the origin of the rotary motor 1 2 as a reference, and the eccentric coordinates of the wafer 1 1 b on the turntable 1 3 and the notch wafer. If so, the re-measured notch position angle is calculated. If it is an orientation flat wafer, the eccentric flat position angle corrected for eccentricity is calculated.

 This completes the eccentricity and notch position detection of the wafer 11b, and the eccentricity and notch position angle of the wafer 11b obtained here are used for correction in the next process.

 Next, the configuration of the wafer positioning device 50 incorporating the wafer outer shape detection device 10 and the wafer positioning sequence will be described.

 The hardware configuration will be described below. FIG. 10 is a schematic configuration diagram of the wafer positioning apparatus 50, and the XY Z axes are determined and described as shown in FIG.

 The wafer loading robot 5 1 is a robot for loading the wafer 1 1 from a predetermined storage location onto the turntable 1 3 of the rotary motor 1 2. The wafer 5 1 is sucked and held at the tip of the arm 5 1 a and transferred. I do. Further, the wafer loading robot 51 has an articulated structure, and the arm 51a can be expanded and contracted.

 The rotary motor lifting mechanism 52 is a drive unit that moves the rotary motor 12 up and down in the vertical direction.

 The wafer transfer mechanism (Y axis) 5 3 is a mechanism for transferring the wafer 1 1 from the rotary motor 1 2 position to the wafer holder stage 5 4, and holds the wafer 1 1 at the tip of the arm 5 3 a by suction. Transport.

 The wafer transfer mechanism (Z-axis) 55 is a drive unit that moves the wafer 11 up and down in the vertical direction, and has suction pins for sucking and holding the wafer 11.

The wafer holder 5 6 is a base material for holding the removable wafer 1 1. It has a surface that adsorbs 1. .

 The wafer holder stage (0 axis) 5 4 a has a mechanism for mounting the wafer transfer mechanism (Z axis) 55 on the drive unit that rotates the wafer holder 56 and holding the wafer holder 56 by suction.

 Wafer holder stage (X-axis) 5 4 b is a drive unit that moves wafer holder 56 in the X-axis direction, and is equipped with wafer holder stage axis 5 4 a.

 Wafer holder stage (Y-axis) 5 4 c is a drive unit that moves wafer holder 56 in the Y-axis direction, and is equipped with wafer holder stage (X-axis) 5 4 b.

 The wafer holder loading robot 5 7 is a mouth pot for transferring the wafer holder 56 to the wafer holder stage 54. Note that the wafer holder loading pot.pot 5 7 may also be used as the wafer loading pot 51.

 In addition, the wafer positioning device 50 includes a driver controller for each of the drive mechanisms of the rotary motor lifting mechanism unit 52, the wafer transfer mechanism unit (Y axis) 53, and the wafer transfer mechanism unit (Z axis) 55. , Wafer holder stage (0-axis) 5 4 a, (X-axis) 5 4 b, (Y-axis) 5 4 c Drive mechanism controller (not shown) including drive controller and control unit (CPU), etc. have. These dry controllers and the data processing unit 21 shown in FIG. 2 communicate to perform the following wafer positioning sequence control.

 The wafer positioning sequence is explained step by step

 Step S 1 1: Wafer loading sequence

Wafer loading pot 5 1 carries wafer 1 1 onto turntable 1 3. Step S12: Wafer holder loading sequence

The wafer holder loading pot 5 7 carries the wafer holder 5 6 onto the wafer holder stage 5 4.

 Step S 1 3: Wafer outline measurement sequence

The control device 20 executes Steps S1 to S5 shown in FIG. Step S 14: Wafer notch (orientation flat) positioning

 The wafer contour detection device 10 positions the notch (orientation flat) position to a predetermined angle based on the angle of the notch (orientation flat) position obtained in step S13.

 Step 15: Move the wafer holder stage delivery position

 The wafer contour detector 10 positions the wafer holder stage 5 4 at a position corresponding to the eccentric coordinates based on the wafer eccentric coordinates obtained in step S 1 3, and the center of the wafer holder stage 5 4 and the wafer 1 1 bAlign the center.

 Step S 1 6: Transfer wafer 1 1 from rotary motor 1 2 to wafer transfer mechanism (Y axis) 5 3

Wafer outline detector 1 0 uses rotating motor lifting mechanism 5 2 to lower rotating motor 1 2 and turn wafer 1 1 attracted to turntable 1 3 to wafer transfer mechanism (Y axis) Arm 5 3 a Transport to. Wafer pick-up on turntable 1 3 is carried off to wafer transfer mechanism (Y-axis) arm 53 after confirming pick-up of wafer 11 on wafer 53, wafer transfer mechanism (Y-axis) to arm 53 Is completed. The rotary motor lifting / lowering mechanism part 52 moves to the lower retreat position, and the wafer transfer mechanism part (Y axis) 53 can be driven to the wafer holder stage 54 side.

 Step S 17: Transfer wafer 1 1 from wafer transfer mechanism (Y axis) 5 3 to Weno, transfer mechanism (Z axis) 5 4 a

The wafer positioning device 50 moves the wafer transfer mechanism (Y axis) 5 3 in the Y direction to the transfer position with the wafer holder stage 54, and the wafer transfer mechanism (Z axis) 5 4 a carries the wafer. Mechanism part (Y-axis) 5 3 Moves upward after stopping, Wafer transfer mechanism part (Z-axis) 5 4 When the suction pin (not shown) of the a is turned on and lifted to the delivery position, the suction state of the suction pin Is monitored until the suction force is generated. When the suction force on the suction pin side exceeds the specified threshold, the wafer transfer mechanism (Y axis) 5 3 side arm 5 3 a Turn off. The wafer positioning device 50 further raises the suction pins to lift the wafer 11 to the upper standby position, and then the wafer transfer machine Retract the structural part (Y-axis) 5 3.

 Step S 1 8: Wafer transfer mechanism (axis) 5 4 a to transfer wafer 1 1 to wafer holder 5 6

 The wafer positioning device 50 lowers the wafer transfer mechanism (Z-axis) 5 4 a while holding the suction pin in the wafer suction state, turns the wafer holder 56 into the suction-on state, and delivers the suction pin. When the wafer holder is lowered to the position and the suction force of the wafer holder exceeds the specified threshold, the suction on the suction pin side is turned off. The suction pin further descends and finishes operating at the lower standby position. In addition, the confirmation of the suction force may be confirmation of the vacuum pressure, or it may be a time-controlled conveyance that ignores the confirmation of the vacuum pressure.

 With the above sequence, the notch position of the uppermost wafer 1 lb of the wafer 11 is positioned at a predetermined position of the wafer holder 56.

 In this way, the set of the wafer 11 and the wafer holder 5 6 positioned on the wafer holder 56 is based on the other wafer 111 and the set of the wafer holder 56 and the mark 58 formed on the wafer holder 56. 1 is pressed and heated through the wafer holder 56 in the wafer bonding section 90 shown in FIG. 1 and bonded, for example, to the electrodes, which are the bonding sections of the two wafers 11, 11. ) Wafer 1 1 (see Fig. 1) is completed.

According to the wafer bonding apparatus 1 according to the first embodiment, by using the wafer outer shape detection apparatus 10 to detect the edge of the uppermost wafer 11 b of the wafer 11 1 and the notch position, Even if wafer 1 1 before bonding is wafer 1 1 with multiple substrates bonded together, it is possible to correctly detect the outer shape and notch position of wafer lib corresponding to the uppermost bonding surface of wafer 1 1. It becomes possible. Also, based on the edge detection result of the wafer outline detector 10, the eccentricity and notch position of the wafer 11 (lib) are corrected, and the wafer 1 is placed at a predetermined position on the wafer holder 56 by the wafer positioning device 50. 1 (1 1 b) can be accurately positioned. After that, a set of two wafers 11 (lib) and a wafer holder 56 is formed at the bonding part 90. It is possible to manufacture a bonded wafer with no bonding position deviation by pressurizing and heating the wafer via the wafer holder 56.

 (Second embodiment)

 Next, a weft bonding apparatus according to a second embodiment of the present invention will be described. The main difference between the wafer bonding apparatus according to the present embodiment is that a fixed WE8 outline detection sensor using a transmission type line sensor is added to the wafer outline detection apparatus of the first embodiment. In other respects, the same reference numerals are used for other similar components, and the description thereof is omitted. In addition, the configuration and operation of the WE8 bonding apparatus shown in FIG. FIG. 11 is a schematic configuration diagram of a wafer contour detection device according to the second embodiment, and FIG. 12 is a wafer contour detection sequence diagram of the wafer contour detection device 110. FIG. FIG. 13 is a schematic configuration diagram of a wafer positioning apparatus according to the second embodiment. In FIG. 11, in addition to the components shown in FIG. 2, a wafer outline detecting device 110 is disposed in the vicinity of the outer peripheral portion of the wafer 11 on which the transparent line sensor 11 2 rotates. The same components as those of the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only the added transmission line sensor 1 1 2 will be described.

 The transmissive line sensor 1 1 2 is a commonly used wafer outline detection sensor that emits line-shaped parallel light from the light emitting part 1 1 2 a, and the transmitted light is detected by the light receiving part 1 1 2 b. And a sensor that outputs the position of the boundary between the shielding portions. The transmissive line sensor 1 1 2 is provided together with the edge detection sensor 15 in the first embodiment. The installation angle of the transmission line sensor 1 1 2 and the edge detection sensor 15 can be arbitrarily set in the wafer rotation direction.

 Next, a wafer contour measurement sequence using the wafer contour detector 0 according to the second embodiment will be described step by step with reference to FIG.

 Step S6: External shape measurement with two types of sensors.

The edge detection sensor 15 measures the step S 1 shown in FIG. Simultaneous transmission The mold line sensor 1 1 2 measures the outer shape of the wafer 11 at the time of turning the turntable 1 3 in step S 1 shown in FIG.

 Step S7: Select two types of sensors

 The precise detection of the notch position is as follows. At the end of step S1 shown in Fig. 3, if the wafer 1 1 is detected as a single-layer wafer from the edge detection sensor —1 5 height measurement, the transmission line sensor 1 1 The external shape measurement result of 2 is used.

 On the other hand, when it is detected that the wafer 11 is a laminated wafer, the outer shape and notch position of the wafer 11 are measured using the edge detection sensor 15. When the wafer 11 is a single layer, even the transmission line sensor 1 1 2 has no problem in outline detection, so the measurement time can be shortened.

 Step S8: Detection of wafer stacking status

If wafer 1 1 is a laminated wafer in step S 6, execute steps S 3 to S 5 shown in Fig. 3 with the edge detection sensor 15, and simultaneously use the transmission line sensor 1 1 2. ^ Perform μ-type measurement.

 Step S9: Processing such as eccentricity coordinate calculation

The control device 20 uses the measurement result of the edge detection sensor 15 to calculate the eccentric coordinates of the wafer 11 and the notch position. The calculation result is used for wafer positioning in the wafer positioning apparatus 50 described in the first embodiment.

 In this step, the deviation of the overlapping state of the wafer 11 can be detected from the output results of both the edge detection sensor 1 15 and the transmission line sensor 1 1 1 2. It is possible to manage the quality of the wafer bonding process performed in the previous step.

As described above, in the wafer contour detection device 1 1 0 according to the second embodiment, the wedge detection sensor 15 and the transmission line sensor 1 1 2 are shared, so that the single layer wafer and the laminated wafer 8 are shared. This makes it possible to shorten the time required to detect the Ue-8 when there is a mixture. The configuration other than the wafer contour detection apparatus 110 is the same as that of the first embodiment, and the description of the subsequent processes after the wafer contour detection is omitted.

 In addition, edge detection sensors 15 are arranged on both the front and back sides of the wafer, and wafer ID management is performed, so that the center deviation of the upper wafer relative to the center of the lowermost wafer is detected for each layer. Therefore, it is possible to keep a history of center misalignment of each layer.

 The above-described embodiment is merely an example, and is not limited to the above-described configuration and shape, and can be appropriately modified and changed within the scope of the present invention.

Claims

The scope of the claims 1. A substrate detection apparatus comprising a detection unit for detecting an uppermost substrate constituting an uppermost layer among a plurality of stacked substrates. 2. The detection unit is an edge detection device that detects an edge of the uppermost substrate, a rotation device that rotates the plurality of stacked substrates, and  A servo device that causes the edge detection device to follow the displacement of the edge of the uppermost substrate rotated by the rotation device;  The substrate detection apparatus according to claim 1, further comprising a position detection device that detects a position of the edge detection device. 3. The substrate detection device according to claim 2, wherein the edge detection device detects a step of the edge of the uppermost substrate. 4. The substrate detection device according to claim 2, wherein the edge detection device detects an inclination of the uppermost substrate. 5. The substrate detection device according to claim 2, wherein the edge detection device detects a change in optical characteristics of the edge of the uppermost substrate. 6. The substrate detection apparatus according to claim 5, wherein the optical characteristic includes at least one of a color and a reflectance of the uppermost substrate. 7. The substrate detection device according to any one of claims 1 and 6, and A substrate holder stage for positioning a substrate holder for holding the substrate; A substrate positioning apparatus, comprising: a transfer unit that transfers the substrate to the substrate holder. 8. A substrate positioning device according to claim 7;  A substrate bonding apparatus, comprising: a substrate bonding section that bonds the two substrates positioned using the substrate positioning apparatus via the substrate holder. 9. a rotating device for rotating the wafer;  An edge detection device for detecting the edge of the wafer mounted on the rotating device, a servo device for causing the edge detection device to follow the displacement of the wafer edge, and the edge detection device for the radial direction of the wafer A wafer outer shape detecting device comprising: a position detecting device for detecting a position; 10. The wafer outline detecting apparatus according to claim 9, wherein the edge detecting apparatus detects a step of the wafer edge. 11. The wafer outer shape detection device according to claim 9, wherein the edge detection device detects an inclination of the wafer edge. 10. The wafer outer shape detection device according to claim 9, wherein the edge detection device detects a change in optical characteristics of the wafer edge. 13. The wafer outline detecting apparatus according to claim 12, wherein the optical characteristic includes at least one of a color and a reflectance of the wafer edge. 1. The wafer outer shape detection device according to claim 9, further comprising a fixed edge detection device that is disposed in the vicinity of an outer peripheral portion of the wafer and detects the wafer edge. 15. The notch position formed in the outer peripheral portion of the wafer is detected based on at least one signal of the edge detection device and the fixed edge detection device. Wafer outline detector. 1 6. The edge detection device detects the number of stacked wafers,  16. The wafer contour detection device according to claim 15, wherein when the wafer is a laminated wafer, the notch position is detected by the edge detection device. 1 7. The edge detector detects the number of stacked wafers,  17. The wafer shape detecting device according to claim 16, wherein when the wafer is a single layer wafer, the notch position is detected by the fixed edge detecting device. 18. The wafer outline detecting apparatus according to claim 17, wherein an error display is displayed when the detected number of stacked wafers is different from the wafer stacking information at the time of loading the wafer. 19. The wafer contour detection device according to claim 18, wherein either one of the edge detection device and the fixed edge detection device is selected based on wafer lamination information at the time of loading the wafer. . 2 0. The wafer outline detecting device according to any one of claims 9 to 19, a wafer holder stage for positioning a wafer holder for holding a wafer, A wafer positioning apparatus comprising: a transfer unit that transfers the wafer to the wafer holder. 21. Based on the detection result of the eccentric amount of the wafer, the notch position or the orientation flat position using the wafer outline detecting device, the eccentric amount of the wafer and the notch position or the predetermined position of the wafer holder The wafer positioning apparatus according to claim 20, wherein an orientation flat position is corrected, and the wafer is positioned on the wafer holder. 2 2. The wafer positioning apparatus according to claim 20 or 21,  A wafer bonding apparatus, comprising: a wafer bonding unit that bonds two wafers positioned using the wafer positioning apparatus via a wafer holder.