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WO2008146705A1 - プローブカードの固定装置 - Google Patents

プローブカードの固定装置 Download PDF

Info

Publication number
WO2008146705A1
WO2008146705A1 PCT/JP2008/059457 JP2008059457W WO2008146705A1 WO 2008146705 A1 WO2008146705 A1 WO 2008146705A1 JP 2008059457 W JP2008059457 W JP 2008059457W WO 2008146705 A1 WO2008146705 A1 WO 2008146705A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
holder
fixing device
fluctuation
contraction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059457
Other languages
English (en)
French (fr)
Inventor
Yoshihiro Abe
Shigeru Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2009516278A priority Critical patent/JP5306192B2/ja
Priority to US12/598,216 priority patent/US8212579B2/en
Priority to CN200880015743A priority patent/CN101681861A/zh
Priority to KR1020097026136A priority patent/KR101142760B1/ko
Publication of WO2008146705A1 publication Critical patent/WO2008146705A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H10P74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

プローブカードをスティフナ（５４）部でホルダ（７０）に固定する固定装置（６０Ａ）は、ホルダ（７０）に固定され、鉛直方向においてプローブカードをホルダ（７０）に拘束しているネジ部材（６１）と、ネジ部材（６１）の頭部（６１ａ）とプローブカードとの間に介装され、水平方向においてネジ部材（６１）に対するプローブカードの伸縮を許容する第１のベアリング部材（６２）と、プローブカードとホルダ（７０）との間に介装され、水平方向においてホルダ（７０）に対するプローブカードの伸縮を許容する第２のベアリング部材（６３）と、を備えている。 これにより、プローブカードの熱膨張又は熱収縮による変動量を水平方向に逃がすことができるので、垂直方向への変動が減少し、プローブ針の先端の高さの変動が少なくなる。
PCT/JP2008/059457 2007-05-31 2008-05-22 プローブカードの固定装置 Ceased WO2008146705A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009516278A JP5306192B2 (ja) 2007-05-31 2008-05-22 プローブカードの固定装置
US12/598,216 US8212579B2 (en) 2007-05-31 2008-05-22 Fixing apparatus for a probe card
CN200880015743A CN101681861A (zh) 2007-05-31 2008-05-22 探针卡的固定装置
KR1020097026136A KR101142760B1 (ko) 2007-05-31 2008-05-22 프로브 카드의 고정장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007145410 2007-05-31
JP2007-145410 2007-05-31

Publications (1)

Publication Number Publication Date
WO2008146705A1 true WO2008146705A1 (ja) 2008-12-04

Family

ID=40074958

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059457 Ceased WO2008146705A1 (ja) 2007-05-31 2008-05-22 プローブカードの固定装置

Country Status (6)

Country Link
US (1) US8212579B2 (ja)
JP (1) JP5306192B2 (ja)
KR (1) KR101142760B1 (ja)
CN (1) CN101681861A (ja)
TW (1) TW200903705A (ja)
WO (1) WO2008146705A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102094188A (zh) * 2009-12-10 2011-06-15 奥博泰克Lt太阳能公司 用于真空处理设备的喷头组件
JP2011141227A (ja) * 2010-01-08 2011-07-21 Yokogawa Electric Corp 半導体試験装置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101688049B1 (ko) * 2010-12-03 2016-12-20 삼성전자 주식회사 테스터 및 그 테스터를 포함한 테스트 장치
US8736294B2 (en) * 2010-12-14 2014-05-27 Formfactor, Inc. Probe card stiffener with decoupling
US9134357B1 (en) 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
US8878794B2 (en) 2011-09-27 2014-11-04 Z124 State of screen info: easel
ITVI20110343A1 (it) * 2011-12-30 2013-07-01 St Microelectronics Srl Sistema e adattatore per testare chips con circuiti integrati in un package
JP6054150B2 (ja) * 2012-11-22 2016-12-27 日本電子材料株式会社 プローブカードケース及びプローブカードの搬送方法
CN103018496A (zh) * 2012-12-14 2013-04-03 深圳市天微电子有限公司 晶圆测试装置
TWI565951B (zh) * 2015-08-24 2017-01-11 旺矽科技股份有限公司 探針頭
TWI604198B (zh) * 2016-06-22 2017-11-01 思達科技股份有限公司 測試裝置、夾持組件及探針卡載具
CN108490925A (zh) * 2018-05-30 2018-09-04 苏州智华汽车电子有限公司 车载摄像头控制器功能检测治具
JP7129261B2 (ja) * 2018-07-27 2022-09-01 キオクシア株式会社 試験装置
KR102228162B1 (ko) * 2020-06-24 2021-03-15 오창준 프로브 홀더
JP7730666B2 (ja) * 2021-06-01 2025-08-28 株式会社ディスコ 加工方法および加工装置
US12487251B2 (en) * 2023-07-10 2025-12-02 Semight Instruments Co., Ltd Adaptive chip testing apparatus and formation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005328053A (ja) * 2004-05-14 2005-11-24 Feinmetall Gmbh 電気検査装置
JP2007057438A (ja) * 2005-08-25 2007-03-08 Tokyo Electron Ltd プローブカード

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6972578B2 (en) 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
JP3621938B2 (ja) 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US7221430B2 (en) 2004-05-11 2007-05-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4589710B2 (ja) * 2004-12-13 2010-12-01 株式会社日本マイクロニクス プローバ
JP4486880B2 (ja) * 2004-12-27 2010-06-23 日本電子材料株式会社 コンタクトプローブ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005328053A (ja) * 2004-05-14 2005-11-24 Feinmetall Gmbh 電気検査装置
JP2007057438A (ja) * 2005-08-25 2007-03-08 Tokyo Electron Ltd プローブカード

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102094188A (zh) * 2009-12-10 2011-06-15 奥博泰克Lt太阳能公司 用于真空处理设备的喷头组件
US20110139372A1 (en) * 2009-12-10 2011-06-16 Wendell Thomas Blonigan Showerhead assembly for vacuum processing apparatus
CN102094188B (zh) * 2009-12-10 2015-02-18 奥博泰克Lt太阳能公司 用于真空处理设备的喷头组件
JP2011141227A (ja) * 2010-01-08 2011-07-21 Yokogawa Electric Corp 半導体試験装置

Also Published As

Publication number Publication date
CN101681861A (zh) 2010-03-24
TW200903705A (en) 2009-01-16
TWI373093B (ja) 2012-09-21
KR20100017810A (ko) 2010-02-16
US8212579B2 (en) 2012-07-03
US20100127726A1 (en) 2010-05-27
JPWO2008146705A1 (ja) 2010-08-19
JP5306192B2 (ja) 2013-10-02
KR101142760B1 (ko) 2012-05-08

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