WO2008142744A1 - Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device - Google Patents
Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device Download PDFInfo
- Publication number
- WO2008142744A1 WO2008142744A1 PCT/JP2007/059595 JP2007059595W WO2008142744A1 WO 2008142744 A1 WO2008142744 A1 WO 2008142744A1 JP 2007059595 W JP2007059595 W JP 2007059595W WO 2008142744 A1 WO2008142744 A1 WO 2008142744A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component carrier
- carrier device
- recognizing
- adsorption head
- optimal distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A device carrier (310) has :an adsorption head (320) which adsorbs and holds an IC device; a vacuum pressure sensor (330) which detects the presence/absence of adsorption of the IC device by the adsorption head (320); an actuator (318a) which moves the adsorption head (320); and a controller (340) which controls the movement operation of the adsorption head (320). The controller (340) controls the actuator (318a) to move the adsorption head (320) depending on the result of detection by the vacuum pressure sensor (330), or sets the distance between the position (A) of starting movement and the position of the adsorption head (320) after moved to be an optimal distance.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/059595 WO2008142744A1 (en) | 2007-05-09 | 2007-05-09 | Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device |
| TW097113468A TWI395283B (en) | 2007-05-09 | 2008-04-14 | Element handling device, electronic component testing device, and identification of the optimum distance of the component handling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/059595 WO2008142744A1 (en) | 2007-05-09 | 2007-05-09 | Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008142744A1 true WO2008142744A1 (en) | 2008-11-27 |
Family
ID=40031471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/059595 Ceased WO2008142744A1 (en) | 2007-05-09 | 2007-05-09 | Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TWI395283B (en) |
| WO (1) | WO2008142744A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114345742A (en) * | 2021-12-31 | 2022-04-15 | 苏州汇川控制技术有限公司 | Method, apparatus, device and medium for detecting chip mounting position |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01183900A (en) * | 1988-01-19 | 1989-07-21 | Yamagata Kashio Kk | Method for judging sucking of part in electronic part mounting machine |
| JPH06232599A (en) * | 1993-02-05 | 1994-08-19 | Yamagata Casio Co Ltd | Component pickup apparatus |
| JPH0726783U (en) * | 1993-10-22 | 1995-05-19 | 株式会社アドバンテスト | Pick and place equipment for automated test handlers |
| JPH07193397A (en) * | 1993-12-27 | 1995-07-28 | Yamaha Motor Co Ltd | Mounter suction point correction device |
| JPH08204391A (en) * | 1995-01-31 | 1996-08-09 | Matsushita Electric Ind Co Ltd | Semiconductor mounting equipment |
| JP2004035718A (en) * | 2002-07-03 | 2004-02-05 | Sharp Corp | Ink jet ink composition and ink jet recording method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101339205B (en) * | 2002-07-30 | 2011-08-31 | 株式会社爱德万测试 | Electronic parts test device |
| JP3851854B2 (en) * | 2002-08-30 | 2006-11-29 | 山形カシオ株式会社 | Electronic component mounting device |
| JP2006286781A (en) * | 2005-03-31 | 2006-10-19 | Yamagata Casio Co Ltd | Mounting head of electronic parts, parts mounting device, and its control method |
-
2007
- 2007-05-09 WO PCT/JP2007/059595 patent/WO2008142744A1/en not_active Ceased
-
2008
- 2008-04-14 TW TW097113468A patent/TWI395283B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01183900A (en) * | 1988-01-19 | 1989-07-21 | Yamagata Kashio Kk | Method for judging sucking of part in electronic part mounting machine |
| JPH06232599A (en) * | 1993-02-05 | 1994-08-19 | Yamagata Casio Co Ltd | Component pickup apparatus |
| JPH0726783U (en) * | 1993-10-22 | 1995-05-19 | 株式会社アドバンテスト | Pick and place equipment for automated test handlers |
| JPH07193397A (en) * | 1993-12-27 | 1995-07-28 | Yamaha Motor Co Ltd | Mounter suction point correction device |
| JPH08204391A (en) * | 1995-01-31 | 1996-08-09 | Matsushita Electric Ind Co Ltd | Semiconductor mounting equipment |
| JP2004035718A (en) * | 2002-07-03 | 2004-02-05 | Sharp Corp | Ink jet ink composition and ink jet recording method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114345742A (en) * | 2021-12-31 | 2022-04-15 | 苏州汇川控制技术有限公司 | Method, apparatus, device and medium for detecting chip mounting position |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI395283B (en) | 2013-05-01 |
| TW200908194A (en) | 2009-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| 122 | Ep: pct application non-entry in european phase |
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