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WO2008140049A1 - 照明装置及び照明装置の製造方法 - Google Patents

照明装置及び照明装置の製造方法 Download PDF

Info

Publication number
WO2008140049A1
WO2008140049A1 PCT/JP2008/058652 JP2008058652W WO2008140049A1 WO 2008140049 A1 WO2008140049 A1 WO 2008140049A1 JP 2008058652 W JP2008058652 W JP 2008058652W WO 2008140049 A1 WO2008140049 A1 WO 2008140049A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting element
light emitting
semiconductor light
substrate
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058652
Other languages
English (en)
French (fr)
Inventor
Takaki Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to US12/304,096 priority Critical patent/US20100230692A1/en
Publication of WO2008140049A1 publication Critical patent/WO2008140049A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W72/07251—
    • H10W72/20—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W90/724—

Landscapes

  • Led Device Packages (AREA)

Abstract

　本発明の照明装置は、無機物絶縁体からなるベース基体及びカバー部材が接合用の金属層を介して接合されてなる基体と、前記基体に取り付けられた半導体発光素子とを具備してなり、前記基体の前記カバー部材側の一面上に凹部が設けられ、前記凹部には前記半導体発光素子が収納され、前記凹部の側壁面のうち前記半導体発光素子と対向する領域に前記金属層の端面が配置され、前記端面によって前記半導体発光素子の放射光を反射する光反射部が構成されている。
PCT/JP2008/058652 2007-05-09 2008-05-09 照明装置及び照明装置の製造方法 Ceased WO2008140049A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/304,096 US20100230692A1 (en) 2007-05-09 2008-05-09 Lamp and production method of lamp

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007124618A JP5183965B2 (ja) 2007-05-09 2007-05-09 照明装置の製造方法
JP2007-124618 2007-05-09

Publications (1)

Publication Number Publication Date
WO2008140049A1 true WO2008140049A1 (ja) 2008-11-20

Family

ID=40002245

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058652 Ceased WO2008140049A1 (ja) 2007-05-09 2008-05-09 照明装置及び照明装置の製造方法

Country Status (6)

Country Link
US (1) US20100230692A1 (ja)
JP (1) JP5183965B2 (ja)
KR (1) KR20090115811A (ja)
CN (1) CN101641802A (ja)
TW (1) TW200921946A (ja)
WO (1) WO2008140049A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9795775B2 (en) 2013-05-23 2017-10-24 Kimberly-Clark Worldwide, Inc. Microneedles with improved open channel cross-sectional geometries

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI431218B (zh) * 2011-03-11 2014-03-21 菱生精密工業股份有限公司 The manufacturing method and structure of LED light bar
CN105206734A (zh) * 2015-09-09 2015-12-30 梁高华 一种led支架及其制造方法
WO2021039825A1 (ja) * 2019-08-28 2021-03-04 京セラ株式会社 発光素子搭載用パッケージおよび発光装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261290A (ja) * 2005-03-16 2006-09-28 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージの製造方法
JP2006287126A (ja) * 2005-04-04 2006-10-19 Toyoda Gosei Co Ltd Ｌｅｄランプ、およびそのユニット板の製造方法
JP2006303039A (ja) * 2005-04-18 2006-11-02 Kyocera Corp 発光装置およびそれを用いた照明装置
JP2006339224A (ja) * 2005-05-31 2006-12-14 Tanazawa Hakkosha:Kk Ｌｅｄ用基板およびｌｅｄパッケージ
JP2006351611A (ja) * 2005-06-13 2006-12-28 Rohm Co Ltd 発光素子搭載用基板及びそれを用いた光半導体装置
JP2007251043A (ja) * 2006-03-17 2007-09-27 Ngk Spark Plug Co Ltd 発光素子収納用パッケージ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773048B2 (ja) * 2003-09-30 2011-09-14 シチズン電子株式会社 発光ダイオード
US7745832B2 (en) * 2004-09-24 2010-06-29 Epistar Corporation Semiconductor light-emitting element assembly with a composite substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261290A (ja) * 2005-03-16 2006-09-28 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージの製造方法
JP2006287126A (ja) * 2005-04-04 2006-10-19 Toyoda Gosei Co Ltd Ｌｅｄランプ、およびそのユニット板の製造方法
JP2006303039A (ja) * 2005-04-18 2006-11-02 Kyocera Corp 発光装置およびそれを用いた照明装置
JP2006339224A (ja) * 2005-05-31 2006-12-14 Tanazawa Hakkosha:Kk Ｌｅｄ用基板およびｌｅｄパッケージ
JP2006351611A (ja) * 2005-06-13 2006-12-28 Rohm Co Ltd 発光素子搭載用基板及びそれを用いた光半導体装置
JP2007251043A (ja) * 2006-03-17 2007-09-27 Ngk Spark Plug Co Ltd 発光素子収納用パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9795775B2 (en) 2013-05-23 2017-10-24 Kimberly-Clark Worldwide, Inc. Microneedles with improved open channel cross-sectional geometries

Also Published As

Publication number Publication date
JP2008282920A (ja) 2008-11-20
US20100230692A1 (en) 2010-09-16
JP5183965B2 (ja) 2013-04-17
KR20090115811A (ko) 2009-11-06
TW200921946A (en) 2009-05-16
CN101641802A (zh) 2010-02-03

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