WO2008022822A1 - Apparatus with a basic body and cover, method for producing the apparatus, use of the apparatus - Google Patents

Abstract

Apparatus with a basic body and a cover, method for producing the apparatus, use of the apparatus the invention relates to an apparatus with a basic body, a conductor mount, which frames at least a predetermined region of the basic body and is coupled to the basic body in sealing fashion by means of a first adhesive layer, a cover, which covers the predetermined region of the basic body and is coupled to the conductor mount in a sealing manner by means of a second adhesive layer, wherein the second adhesive layer frames the predetermined region of the basic body. The invention also relates to a method for producing the apparatus and to a use for the apparatus.

Description

description

Device with base and lid, method of manufacturing the device, use of the device

The invention relates to a device having a base body, a conductor carrier and a lid and a method for producing a device having a base body, a conductor carrier and a lid. Furthermore, the invention also relates to a use of a device having a base body, a conductor carrier and a lid.

Such a device with a main body a conductor carrier and a lid forms, for example, a housing for electronic circuits. In this case, a substrate may be arranged on the base body, which comprises the electronic circuits. The substrate may be formed of ceramic or be part of a "printed circuit board." The electronic circuits are supplied with input signals and produce output signals according to predetermined rules Output signals is set up the conductor carrier.

In motor vehicles, especially with internal combustion engine, the proportion of electronics increases steadily. The electronics serve to support and improve the vehicle characteristics and to relieve the driver. A motor vehicle is exposed during operation vibrations, a wide variety of temperatures, humidity and various other influences, so that the vehicle components of a vehicle must withstand these influences without having any interference or be sensitive to these influences. The demand of customers for vehicles is, among other things, the desire to have a highly reliable, economical and safe means of transport. Of the Claim of the manufacturers to the vehicles is not only to satisfy the customer's request, but also to obtain the most cost-effective manufacturing process for the vehicles as a whole and thus for the individual components in particular.

With electronics, a lot of safety and a lot of fuel economy has gone into the vehicles, but electronics has meanwhile reached a level of complexity which can lead to errors in the production process and operation and thus to unreliability. So far, electronic transmission controls are often arranged because of sealing problems against the oily equipment in the gearbox on a housing outside of the transmission or on the body. All relevant inputs and outputs of the electronic transmission control had to be connected to the gearbox after mounting the gearbox. This does not happen in the production process of the gearbox, but rather only after installation of the gearbox in the vehicle and is susceptible to errors.

To avoid assembly errors, transmission control systems are therefore already integrated in the gearbox manufacturer by automatable processes in the transmission and installed in the vehicle.

From the publication, manual of the vehicle technology; Vieweg Verlag; Page 277-279 an integrated transmission control is known. The integrated transmission control comprises an electronic circuit and is coupled with sensors within a hydraulic transmission unit. In addition, the integrated transmission unit also other input signals, such as operating conditions of a drive unit coupled to the transmission, or operating commands supplied to a vehicle driver. The transmission control generates output signals according to predetermined algorithms, which in turn are supplied to actuators which are located within the hydraulic system. gear unit are arranged. These cause, for example, a switching operation of the transmission.

The term integrated transmission control describes the arrangement of the transmission control within the transmission housing. Within the gearbox prevail during vehicle operation extreme environmental conditions. For example, integrated gearbox control systems must withstand high vibration loads and high temperature loads. Another aspect is that a housing surrounding the transmission control must meet high demands on the tightness. This particular because there are oily fluids in the transmission housing, which heat up during driving.

It is the object of the invention to design a device of the type mentioned above such that the device is designed with the least possible outlay in such a way that an electronic circuit arranged therein is protected against environmental influences.

The object is solved by the features of the independent claims. Advantageous embodiments of the invention are characterized in the subclaims.

The invention is characterized according to a first aspect by a device having a base body, a conductor carrier, which frames at least a predetermined area of the base body and is sealingly coupled to the base body by means of a first adhesive layer. The device further has a lid which covers the predetermined region of the base body and is sealingly coupled to the conductor carrier by means of a second adhesive layer, the second adhesive layer surrounding the predetermined region of the base body. This allows a simple manufacture of the device with low material costs. In addition, an electronic circuit can be arranged in the predetermined area, which is protected against external environmental influences.

According to an advantageous embodiment of the first aspect, the first adhesive layer and the second adhesive layer are formed by an acrylic adhesive or an epoxy adhesive. These adhesives are temperature resistant over a wide range and also have pronounced chemical resistance. Furthermore, these adhesives can easily be integrated into a production process, in particular an automated production process.

According to an alternative advantageous embodiment of the first aspect, the first adhesive layer and the second adhesive layer are formed by an acrylic adhesive film or an epoxy adhesive film. The films can be prefabricated in predetermined geometric shapes and are thus very easy to integrate into a production process.

According to a further advantageous embodiment of the first aspect, at least one force receiving device is provided, which absorbs forces acting between the base body and the cover. The force-receiving device is set up so that mechanical forces acting on the adhesive bond are directly discharged into the main body by means of the force-receiving device. Thus, the adhesive connection is relieved, and it is achieved a higher degree of reliability and longevity of the device.

According to an advantageous embodiment of the first aspect, the acrylic adhesive film or the epoxy adhesive film is arranged one above the other in a plurality of individual layers. Thus, taking advantage of the cost-effective processing of the adhesive sheets in a simple way compensation of component tolerances is possible. There are thus component tolerances on the Contact surfaces, or the contact areas of directly adjacent components compensated. If, for example, the lid has a slight unevenness at the contact surface, it will be filled by the adhesive films.

According to an advantageous embodiment of the first aspect, the conductor carrier is a flexible printed circuit board of film-like structure. This allows a thinner design of the device. As an alternative to a flexible printed circuit board, the conductor carrier is formed from a rigid printed circuit board, for example a PCB, a printed circuit board. The use of a (flexible) printed circuit board affords the further advantage that a direct through-connection of the outputs and inputs of the electronic circuit, up to the peripheral devices, is made possible.

The invention is characterized according to a second aspect by a method for producing the device described above. In this case, a conductor carrier is arranged on a base body such that at least one predetermined area of the base body is framed by the conductor carrier, wherein a first adhesive layer is applied so that it also frames the predetermined area of the base body. Furthermore, the conductor carrier is sealingly coupled to the base body by means of the first adhesive layer. A cover which covers the predetermined area of the main body is sealingly coupled to the conductor carrier by means of a second adhesive layer.

According to an advantageous embodiment of the second aspect, an acrylic adhesive film or an epoxy adhesive film is applied as a second adhesive layer. Films can be prefabricated in predetermined geometric shapes and are easy and thus inexpensive to integrate into a production process. According to an advantageous embodiment of the second aspect, the acrylic adhesive film is arranged in a plurality of individual layers one above the other. Thus, taking advantage of the cost-effective processing of the adhesive films in a simple way a compensation of component tolerances of the adhesive film materially connected components possible. Also, by means of this procedure, a use of films of different film thicknesses is not necessary, since different film thicknesses can be easily produced by the layered arrangement of the individual films.

According to an advantageous embodiment of the second aspect, the adhesive layers are stimulated by means of a lamination process with joint or sequential application of pressure and temperature, or with the alternative application of pressure or temperature, to give a cohesive connection. This offers the advantage that the individual components with the adhesive films can be guided to one another before lamination without being inextricably linked to one another. Subsequently, the components can be exactly aligned with each other and then laminated. Alternatively, it is possible to carry out the laminating method in one step as one of the last method steps for producing the integral connection across all adhesive layers.

The invention is preferably provided as a housing for electronic circuits in a mechanical vehicle component, such as a vehicle transmission, in particular a vehicle automatic transmission.

The invention is explained in more detail below with reference to an embodiment with two figures.

It shows: Fig. 1 is a side view in section of a device according to the principle of the invention and

Fig. 2 is a block diagram of the process flow for manufacturing the device.

Fig. 1 shows an advantageous embodiment of the device in a sectional view as a side view. For the sake of completeness it should be mentioned that, although various shapes are possible, the embodiment has a rectangular symmetrical basic shape and the sectional view is formed by an imaginary axial section. In this case, a flat main body 1 is formed, for example, of aluminum or another metal in a rectangular shape. On this base body 1, a first adhesive layer 2 is arranged. This is executed in the embodiment in the form of an adhesive film 2. The adhesive film 2 can be embodied in various material thicknesses of, for example, 25 μm, 50 μm, 75 μm and 100 μm. The thickness of the film is preferably to be selected in terms of dimensional tolerances on the contact surfaces between the individual components of the device so that gaps formed by the dimensional tolerances are filled. By a combination of adhesive films of the same or different material thickness, further material thicknesses of the adhesive layer 2 can be produced. The compensation of dimensional tolerances is important to achieve a permanent tightness of the device. If a too thin adhesive film 2 is used for large dimensional tolerances, then the adhesive film 2 does not fill gaps formed by dimensional tolerances on the contact surfaces between two components in a sealing manner. A thick adhesive film 2 is suitable to fill larger, formed by dimensional tolerances gaps.

The adhesive film 2 is arranged on the base body such that a predetermined area is free of adhesive film. This area is adapted to receive a ceramic substrate 4. The ceramic substrate is in the embodiment in this area laminated. The ceramic substrate 4 comprises an electronic circuit.

A conductor carrier 3 is arranged on the adhesive film 2 and forms by means of the adhesive film 2 with the base body 1 a sealing cohesive connection. The conductor carrier is designed in the embodiment as a flexible film with integrated conductor tracks. The interconnects are connected to the inputs and outputs of the electronic circuit on the ceramic substrate 4 by means of electrically conductive connections 5, so-called bonding wires. As an alternative to the flexible conductor carrier used in the exemplary embodiment, it is also possible to use an inflexible conductor carrier, for example a PCB, a "printed circuit board." The material thickness of such a conductor carrier is generally higher than the material thickness of a flexible conductor carrier Both embodiments of the conductor carrier provide the principal advantages of the device in the case of both conductor carrier variants. so that peripheral devices can be connected directly to the conductor carrier.

On the conductor carrier a second adhesive film 6 is arranged. Depending on the dimensional tolerances of the components, the second adhesive film 6 may have a different material thickness to the first adhesive film 2. The second adhesive film 6 is arranged on the conductor carrier so that the contact surface is covered with the second adhesive film 6, which is covered with a cover 7 in the subsequent step. This results in a layering of base body 1, first adhesive layer 2, conductor carrier 3 and second adhesive layer 6, which is completed by the cover 7. The lid 7 completely covers the predetermined area in which the ceramic substrate 4 is disposed, and hermetically seals this area from the outside. The region in which the ceramic substrate 4 is disposed is thus hermetically sealed and sealed. Neither gases nor liquids can penetrate to this area from the outside. Destruction of the electronic circuit by gases or liquids is thus prevented.

Due to the particular chemical resistance and strength, acrylic adhesives or epoxy resin adhesives are particularly advantageous for producing the cohesive and sealing compound. By means of a lamination process, the adhesive films or the adhesives are adhesively bonded to the adjacent components of the device by applying pressure and temperature. This creates a frictional and sealing connection that has high chemical resistance and strength. The chemical resistance of the acrylic adhesive or epoxy adhesive ensures lasting tightness even in aggressive media such as gear oil. Even high temperatures beyond 100 and 150 ° C can not destroy the tightness of this connection. Acrylic adhesive or epoxy adhesive is therefore particularly suitable for the production of this sealing adhesive bond, as it is temperature-resistant and chemically resistant over a wide range.

The contacting of the inputs and outputs of the electrical circuit and thus the connection to sensors and actuators which are connected to the electronic circuit, by means of a plug contact 10 which is arranged and fixed at the edge of the device. At the plug contact 10 mechanical tensile forces can occur. It is advantageous to relieve the adhesive bond between the lid 7, conductor carrier 3 and body 1 of these mechanical tensile forces and derive the mechanical tensile forces in the solid structure of the body 1. This is done by means of a mecha- niche force-absorbing device 8 such as a rivet, crimp, clamp or screw connection. By means of the force receiving device 8 is advantageously prevented that the cohesive adhesive bond is overstressed by mechanical tensile forces.

Preferably, the housing cover 7 is provided with a conductive surface 9, so as to additionally keep electromagnetic influences away from the electronic circuit on the ceramic carrier.

Alternatively, a lid which is made of metal, preferably aluminum, is also suitable. This not only electromagnetic interference from the electronic circuit are shielded, but also the mechanical strength of a metal lid is greater than that of a Kunststoffdeckeis. Ideally, the base body and lid are of the same material and therefore also have the same thermal expansion coefficients. This can be advantageous in a temperature change of the environment, which also affects the device, avoid a different expansion between the base and lid. The adhesive bond is thus not unnecessarily burdened.

Another advantage of the invention is not only the fulfillment of the tightness requirements. In addition, the device is very inexpensive to produce. The application of the conductor carrier on the base body by means of an adhesive layer and further the application of the lid by means of a further adhesive layer combines the required properties of the tightness and strength of the cohesive connection advantageous. With the aid of FIG. 2, a preferred method for producing the device is described below by way of example.

In order to produce the device, in a first method step 20 on a flat main body 1 by a tunable area around, an adhesive applied in a first adhesive layer 2. An acrylic adhesive or an epoxy adhesive is advantageous because these adhesives have a particular chemical resistance and high strength. An advantageous variant of this process step provides to apply the adhesive by means of a film, for example an acrylic adhesive film or an epoxy adhesive film. The application of an adhesive film simplifies the process and enables a simple variation of the thickness of the first adhesive layer 2. By means of different thicknesses of the adhesive films themselves or by means of a multilayer arrangement of the adhesive films, different adhesive layer thicknesses can be achieved. This is particularly advantageous for the sealing filling of gaps, which are formed by dimensional tolerances between the components.

In a second method step 30, it is provided to apply a conductor carrier 3 to the first adhesive layer 2 or the first adhesive film. The conductor carrier 3 is applied in the form of a flexible conductor foil or else a "printed circuit board", a solid and inflexible printed circuit board.

Alternatively, the conductor carrier 3 itself can be provided with adhesive film or adhesive and applied to the base body 1.

After the application of the conductor carrier 3, in a first intermediate step 35, for example a ceramic substrate 4 or another carrier which comprises the electronic circuit, should be applied. This is done, for example, by a lamination process. Subsequently, in a second intermediate step 36, the establishment of the electrical connection from the electronic circuit to the conductor carrier 3. In the case of an electronic circuit, which already on the Conductor carrier 3 is arranged, eliminating the most favorable case establishing the electrical connection.

A third method step 40 provides for applying a second adhesive layer 6. This is applied to the conductor carrier 3 and / or on a cover 7. It is advantageous to do this in the same procedure and also with the same adhesives as was done in the first adhesive layer 2.

Finally, the cover 7 is applied to the second adhesive layer 6 in a fourth method step 50. Also in the case of the second adhesive layer 6, gaps formed on the contact surfaces between the cover 7 and the conductor carrier 3 can be compensated for by means of dimensional tolerances with variable thicknesses of the adhesive layer. The lid 7 is sealingly connected to the conductor carrier by means of the second adhesive layer 6 or the adhesive film, be it an epoxy adhesive film or an acrylic adhesive film.

By means of a laminating process 50, the adhesive layers are stimulated under simultaneous or sequential action of pressure and / or temperature to develop the adhesive cohesive properties. This can be done in separate steps, alternatively, a summary of the steps to a single step is possible. After a curing process of the adhesive portion of the device, a permanently strong and sealing connection between the components is produced.

As a result, a cavity has been formed in the device, in which the electronics are arranged on the ceramic body, and to which the outer space and medium surrounding the device is hermetically sealed.

Claims

claims 1. Device with a base body (1), - A conductor support (3), the at least a predetermined area of the base body (1) framed and with the base body (1) is sealingly coupled by means of a first adhesive layer (2), - A lid (7) which covers the predetermined area of the base body (1) and is sealingly coupled to the conductor carrier (3) by means of a second adhesive layer (6), wherein the second adhesive layer (6) the predetermined area of the base body (1) framed. 2. Device according to claim 1, characterized in that the first adhesive layer (2) and / or the second adhesive layer (6) is formed by an acrylic adhesive or an epoxy adhesive. 3. A device according to claim 1, characterized in that the first adhesive layer (2) and / or the second adhesive layer (6) is formed by an acrylic adhesive film or a Epoxydklebefolie. 4. Device according to one of the claims 1 to 3, characterized in that at least one force receiving device (8) is provided, which receives between the base body (1) and cover (7) acting forces. 5. Device according to one of the claims 3 to 4, characterized in that the acrylic adhesive film or the Epoxydklebefolie is arranged one above the other in a plurality of individual layers. 6. Device according to one of the claims 1 to 5, characterized in that the conductor carrier (3) is a flexible printed circuit board of film-like structure or a rigid printed circuit board. 7. A method for producing a device according to one of the claims 1 to 6, wherein on a base body (1) a conductor carrier (3) is arranged such that at least a predetermined area of the base body (1) by the conductor carrier (3) is framed and wherein, by means of a first adhesive layer (2) the conductor carrier (3) with the main body (1) is sealingly coupled, and wherein, a cover (7) which covers the predetermined area of the base body (1) with the conductor carrier (3) by means of a second adhesive layer (6) is sealingly coupled, and wherein, the first adhesive layer (2) is applied so that it framed the predetermined area of the base body (1). 8. The method according to claim 7, characterized in that an acrylic adhesive film or an epoxy adhesive film is applied as a second adhesive layer (6). 9. The method according to claim 8, characterized in that the acrylic adhesive film is arranged in a plurality of individual layers ü- one above the other. 10. The method according to any one of claims 7 to 9, characterized in that the adhesive layers result in a cohesive connection by means of a lamination process with the application of pressure and / or temperature. 11. Use of a device according to one of the claims 1 to 6, characterized in that the device is integrated as a housing which is adapted to receive electronic control devices in a housing of a mechanical vehicle component. 12. Use according to claim 11, characterized in that the mechanical vehicle component is a vehicle transmission, in particular an automatic transmission.