WO2008011865A1 - Procédé de mesure d'épaisseur de paroi - Google Patents
Procédé de mesure d'épaisseur de paroi Download PDFInfo
- Publication number
- WO2008011865A1 WO2008011865A1 PCT/DE2007/001279 DE2007001279W WO2008011865A1 WO 2008011865 A1 WO2008011865 A1 WO 2008011865A1 DE 2007001279 W DE2007001279 W DE 2007001279W WO 2008011865 A1 WO2008011865 A1 WO 2008011865A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- complex
- wall thickness
- wall
- glass
- reflection factor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
Definitions
- the invention relates to a method for wall thickness measurement. It can be used to measure the wall thickness of insulator materials such as flat and round glass, ceramics, plastics, glass fiber reinforced plastics and natural fiber reinforced plastics.
- the aim of the invention is therefore to develop a microwave-based measurement method, which largely independent of lift-off effects, a wall thickness measurement of insulation materials, but in particular glass objects allows.
- the essence of the invention is that the known method of microwave-assisted detection of geometric workpiece parameters is corrected by the inclusion of storage-stored calibration data.
- FIG. 1 shows a block diagram of an arrangement for carrying out the method according to the invention
- Fig. 2 a representation of the complex reflection factor as a function of
- FIG. 3 shows a further illustration of the complex reflection factor as a function of the glass thickness and the lift-off, supplemented by interpolated calibration curves and FIG
- an arrangement for carrying out the claimed method for wall thickness measurement comprises a microwave circuit 1 with a waveguide antenna 2 and an evaluation unit 3.
- the waveguide antenna 2 opposite a measuring object is arranged, here a glass container 4, the wall thickness to be measured.
- the microwave circuit 1 consists in the present embodiment of an oscillator 11, three power dividers 12 to 14, a circulator 15, a phase shifter 16 and two mixers 17 and 18.
- the listed elements are, as shown in Figure 1, connected to each other and ensure the following functionality in the implementation of the method:
- Waveguide antenna 2 radiates a high-frequency electromagnetic wave 5 - here with a frequency of 11 GHz - against glass container. 4
- the wave 6 reflected by the glass container 4 is in turn received by the waveguide antenna 2 and transferred to the circulator 15 of the microwave circuit 1.
- the values for real part Re and imaginary part Im transferred from the microwave circuit 1 are compared with values of calibration curves stored in the evaluation unit 3 and assignments to wall thickness values are made.
- the calibration curves are obtained beforehand by measuring the complex reflection factor at interpolation points with different glass thicknesses and different lift-off in calibration measuring processes. This results in significant families of curves that are almost parallel under different microwave conditions for different glass thicknesses. This can be seen from the curves of Figure 2, in which the dependence of the complex reflection factor of wall thickness of the glass and lift-off is shown.
- Fig. 3 is a further representation of the complex reflection factor as a function of the glass thickness and the lift-off to see in the interpolated calibration curves allow a finer classification of complex measured values and thus come to actual thickness values for the measurement objects.
- the method according to the invention can be used for measuring the wall thickness of articles made of insulator materials, such as flat and round glass, ceramics, plastics, glass fiber reinforced plastics and natural fiber reinforced plastics. However, it is still applicable in various embodiments for solving further measurement tasks in connection with materials of the aforementioned type. a quasi-continuous detection of the thickness of a material flow in the glass production or similar process monitoring are advantageously carried out with the inventive method.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Abstract
L'invention concerne un procédé de mesure d'épaisseur de paroi. Elle peut être appliquée à la mesure de l'épaisseur des parois d'objets en matières isolantes comme le verre plat ou arrondi, la céramique, les plastiques, les plastiques renforcés de fibre de verre et les plastiques renforcés de fibres naturelles. Dans ce procédé de mesure d'épaisseur de paroi de matériaux isolants, des ondes électromagnétiques à haute fréquence sont émises sur la paroi dont l'épaisseur doit être mesurée et le rayonnement réfléchi par la paroi en question est reçu afin de calculer un facteur de réflexion complexe à partir du signal émis et réfléchi. Le facteur de réflexion complexe calculé est classé en fonction de ses parties réelle et imaginaire ou en fonction de sa somme et de sa phase dans une famille de courbes de calibrage complexe. L'épaisseur de paroi à mesurer est obtenue à partir de la position du facteur de réflexion complexe dans la famille de courbes de calibrage complexe. La famille de courbes de calibrage complexe est calculée à partir des facteurs de réflexion complexes calculés de mesures de calibrage d'épaisseurs de parois réelles dans des valeurs témoins différentes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200610034458 DE102006034458A1 (de) | 2006-07-26 | 2006-07-26 | Verfahren zur Wandstärkenmessung |
| DE102006034458.8 | 2006-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008011865A1 true WO2008011865A1 (fr) | 2008-01-31 |
Family
ID=38582149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2007/001279 Ceased WO2008011865A1 (fr) | 2006-07-26 | 2007-07-18 | Procédé de mesure d'épaisseur de paroi |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102006034458A1 (fr) |
| WO (1) | WO2008011865A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3985348A1 (fr) | 2020-10-15 | 2022-04-20 | Instytut Wysokich Cisnien Polskiej Akademii Nauk | Dispositif et procédé pour tester l'épaisseur d'une paroi d'un objet tubulaire diélectrique |
| US20230003508A1 (en) * | 2019-12-02 | 2023-01-05 | Krones Aktiengesellschaft | Method for checking a wall thickness of a container made of an at least partially transparent material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6815947B2 (en) * | 2003-01-12 | 2004-11-09 | Nova Measuring Instruments Ltd. | Method and system for thickness measurements of thin conductive layers |
| WO2005119169A2 (fr) * | 2004-04-19 | 2005-12-15 | Arist Instruments, Inc. | Systeme et procede de reflectance complexe du profil d'un faisceau lumineux pour la mesure de films minces et de dimensions critiques |
-
2006
- 2006-07-26 DE DE200610034458 patent/DE102006034458A1/de not_active Ceased
-
2007
- 2007-07-18 WO PCT/DE2007/001279 patent/WO2008011865A1/fr not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6815947B2 (en) * | 2003-01-12 | 2004-11-09 | Nova Measuring Instruments Ltd. | Method and system for thickness measurements of thin conductive layers |
| WO2005119169A2 (fr) * | 2004-04-19 | 2005-12-15 | Arist Instruments, Inc. | Systeme et procede de reflectance complexe du profil d'un faisceau lumineux pour la mesure de films minces et de dimensions critiques |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230003508A1 (en) * | 2019-12-02 | 2023-01-05 | Krones Aktiengesellschaft | Method for checking a wall thickness of a container made of an at least partially transparent material |
| US12298119B2 (en) * | 2019-12-02 | 2025-05-13 | Krones Aktiengesellschaft | Method for checking a wall thickness of a container made of an at least partially transparent material |
| EP3985348A1 (fr) | 2020-10-15 | 2022-04-20 | Instytut Wysokich Cisnien Polskiej Akademii Nauk | Dispositif et procédé pour tester l'épaisseur d'une paroi d'un objet tubulaire diélectrique |
| WO2022079670A1 (fr) | 2020-10-15 | 2022-04-21 | Instytut Wysokich Cisnien Polskiej Akademii Nauk | Dispositif et procédé de test de l'épaisseur d'une paroi d'un objet tubulaire diélectrique |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006034458A1 (de) | 2008-01-31 |
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|---|---|---|---|
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