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WO2008011630A3 - Apparatus for ejecting fluid onto a substrate and system and method incorporating the same - Google Patents

Apparatus for ejecting fluid onto a substrate and system and method incorporating the same Download PDF

Info

Publication number
WO2008011630A3
WO2008011630A3 PCT/US2007/074133 US2007074133W WO2008011630A3 WO 2008011630 A3 WO2008011630 A3 WO 2008011630A3 US 2007074133 W US2007074133 W US 2007074133W WO 2008011630 A3 WO2008011630 A3 WO 2008011630A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
same
fluid onto
ejecting fluid
method incorporating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/074133
Other languages
French (fr)
Other versions
WO2008011630A2 (en
Inventor
Christopher Hahn
Hanjoo Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akrion Technologies Inc
Original Assignee
Akrion Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW096126671A external-priority patent/TWI352628B/en
Application filed by Akrion Technologies Inc filed Critical Akrion Technologies Inc
Publication of WO2008011630A2 publication Critical patent/WO2008011630A2/en
Publication of WO2008011630A3 publication Critical patent/WO2008011630A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A fluid dispenser for use in the processing of substrates. The dispenser has a dome shaped body with a convex upper surface and has a number of conduits designed to supply fluid to the surface of a substrate at predetermined points.
PCT/US2007/074133 2006-07-21 2007-07-23 Apparatus for ejecting fluid onto a substrate and system and method incorporating the same Ceased WO2008011630A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US83263106P 2006-07-21 2006-07-21
US60/832,631 2006-07-21
TW096126671A TWI352628B (en) 2006-07-21 2007-07-20 Nozzle for use in the megasonic cleaning of substr
TW096126671 2007-07-20

Publications (2)

Publication Number Publication Date
WO2008011630A2 WO2008011630A2 (en) 2008-01-24
WO2008011630A3 true WO2008011630A3 (en) 2008-10-09

Family

ID=38957689

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/074133 Ceased WO2008011630A2 (en) 2006-07-21 2007-07-23 Apparatus for ejecting fluid onto a substrate and system and method incorporating the same

Country Status (1)

Country Link
WO (1) WO2008011630A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357457B1 (en) * 1998-03-16 2002-03-19 Tokyo Electron Limited Substrate cleaning apparatus and method
US6684890B2 (en) * 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US6848455B1 (en) * 2002-04-22 2005-02-01 Novellus Systems, Inc. Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357457B1 (en) * 1998-03-16 2002-03-19 Tokyo Electron Limited Substrate cleaning apparatus and method
US6684890B2 (en) * 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US6848455B1 (en) * 2002-04-22 2005-02-01 Novellus Systems, Inc. Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species

Also Published As

Publication number Publication date
WO2008011630A2 (en) 2008-01-24

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