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WO2008011630A2 - Appareil pour amener un fluide sur un substrat et système et procédé incorporant ce dernier - Google Patents

Appareil pour amener un fluide sur un substrat et système et procédé incorporant ce dernier Download PDF

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Publication number
WO2008011630A2
WO2008011630A2 PCT/US2007/074133 US2007074133W WO2008011630A2 WO 2008011630 A2 WO2008011630 A2 WO 2008011630A2 US 2007074133 W US2007074133 W US 2007074133W WO 2008011630 A2 WO2008011630 A2 WO 2008011630A2
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
conduits
header
substrate
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/074133
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English (en)
Other versions
WO2008011630A3 (fr
Inventor
Christopher Hahn
Hanjoo Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akrion Technologies Inc
Original Assignee
Akrion Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW096126671A external-priority patent/TWI352628B/zh
Application filed by Akrion Technologies Inc filed Critical Akrion Technologies Inc
Publication of WO2008011630A2 publication Critical patent/WO2008011630A2/fr
Publication of WO2008011630A3 publication Critical patent/WO2008011630A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Definitions

  • the present invention relates generally to the field of processing substrates, such as semiconductor wafers, and specifically to fluid dispensers that apply fluids to the surface of substrates during processing.
  • An object of the present invention is to provide a system, apparatus and method that minimizes the deposit of contaminants on the surface of a substrate.
  • a further object of the present invention is to provide an apparatus that allows for multiple fluids to be discharged through the same apparatus without cleaning out the apparatus.
  • Another object of the present invention is to provide a fluid dispenser that simplifies the hardware required in the processing of a substrate.
  • a still further object of the present invention is to provide a fluid dispenser that improves the cleaning of the backside of substrates.
  • a system for processing substrates comprising: a rotatable support for supporting and rotating a substrate about a rotational center-point; a fluid dispensing apparatus comprising a body with a substantially dome-shaped outer surface and a plurality of conduits terminating as holes in the outer surface of the body, wherein the conduits are adapted to eject fluid out of the holes; and wherein the fluid dispensing apparatus is positioned so that fluid dispensed out of the holes contacts a surface of a substrate on the rotatable support.
  • the invention can be a system for processing substrates comprising: a rotatable support for supporting and rotating a substrate about a rotational center-point; a fluid dispensing apparatus comprising a body, a first header and a second header; the first header having an inlet adapted to introduce a first fluid into the first header; the second header having an inlet adapted to introduce a second fluid into the second header; a first array of conduits extending from the first header and terminating as holes in an outer surface of the body, the first array of conduits adapted to eject the first fluid from the first header and onto a substrate located on the rotatable support; and a second array of conduits extending from the second header and terminating as holes in the outer surface of the body, the second array of conduits adapted to eject the second fluid from the second header and onto a substrate located on the rotatable support.
  • the invention can be an apparatus for applying a fluid to a surface of a substrate comprising: a body having a first header and a second header; a first inlet for introducing a first fluid into the first header; a second inlet for introducing a second fluid into the second header; a first array of conduits extending from the first header and terminating as holes in an outer surface of the body, the first array of conduits adapted to eject the first fluid; and a second array of conduits extending from the second header and terminating as holes in the outer surface of the body, the second array of conduits adapted to eject the second fluid.
  • the invention can be a method of processing a substrate comprising: supporting a substrate in a horizontal orientation; rotating the substrate; providing a fluid dispensing apparatus adjacent a surface of the substrate, the fluid dispensing apparatus comprising a body having a first header and a second header, a first inlet for introducing a first fluid into the first header, a second inlet for introducing a second fluid into the second header, a first array of conduits extending from the first header and terminating as holes in an outer surface of the body, the first array of conduits adapted to eject the first fluid, a second array of conduits extending from the second header and terminating as holes in the outer surface of the body, the second array of conduits adapted to eject the second fluid; applying a first fluid to the surface of the substrate via the first array of conduits of fluid dispensing apparatus; and applying a second fluid to the surface of the substrate via the second array of conduits of the fluid dispensing apparatus.
  • Figure 1 is a schematic of a cleaning system according to one embodiment of the present invention.
  • Figure 3 is a top perspective view of a liquid dispenser according to one embodiment of the present invention.
  • Figure 4 is a side view of the liquid dispenser of FIG. 3.
  • Figure 5 is a top view of the liquid dispenser of FIG. 3.
  • Figure 6 is a cross-sectional view of the liquid dispenser along line C-C of FIG. 5.
  • Figure 8 is a bottom perspective view of a liquid dispenser according to one embodiment of the present invention.
  • Figure 9 is a top view of the liquid dispenser wherein an internal first header and first array of conduits is illustrated.
  • Figure 10 is a top view of the liquid dispenser wherein an internal second header and second array of conduits is illustrated.
  • Figure 11 is a top view of the liquid dispenser wherein an internal third header and third array of conduits is illustrated.
  • Figure 12 is a top view of the liquid dispenser wherein an internal fourth header and fourth array of conduits is illustrated.
  • Figure 13 is a schematic illustrating a liquid ejection profile according to one embodiment of the present invention.
  • cleaning system 1000 a schematic of an acoustic energy cleaning system 1000 (hereinafter referred to as "cleaning system 1000") is illustrated according to one embodiment of the present invention.
  • cleaning system 1000 acoustic energy cleaning system 1000
  • inventive system and methods of the drawings will be discussed in relation to the cleaning of semiconductor wafers.
  • the invention is not so limited and can be utilized for any desired wet processing of any flat article.
  • the cleaning system 1000 generally comprises a top transducer assembly 200, a rotatable support 10 for supporting a semiconductor wafer 50 in a substantially horizontal orientation, a top dispenser 13 and a bottom dispenser 14.
  • the semiconductor wafer 50 is supported so its top surface 51 is the device side of the wafer 50 while the bottom surface 56 is the non-device side.
  • the wafer can be supported so that its top surface 51 is the non-device side while the bottom surface 56 is the device side, if desired.
  • the rotatable support 10 is designed to contact and engage only a perimeter of the substrate 50 in performing its support function.
  • the exact details of the structure of the rotatable support 10 are not limiting of the present invention and a wide variety of other support structures can be used, such as chucks, support plates, etc.
  • the support structure support and rotate the semiconductor wafer in a substantially horizontal orientation
  • the system may be configured so that the semiconductor wafer is supported in other orientations, such as vertical or at an angle.
  • the remaining components of the cleaning system 1000, including the transducer assembly 200 can be correspondingly repositioned in the system so as to be capable of performing the desired functions and/or the necessary relative positioning with respect to other components of the system as discussed below.
  • the rotary support 10 is operably coupled to a motor 11 to facilitate rotation of the wafer 50 within the horizontal plane of support.
  • the motor 11 is preferably a variable speed motor that can rotate the support 10 at any desired rotational speed ⁇ .
  • the motor 11 is electrically and operably coupled to the controller 12.
  • the controller 12 controls the operation of the motor 11, ensuring that the desired rotational speed ⁇ and desired duration of rotation are achieved.
  • the top dispenser 13 is positioned and oriented so that when a liquid is flowed therethough, the liquid is applied to the top surface 51 of the substrate 50. When the substrate 50 is rotating, this liquid forms a layer or film of the liquid across the entirety of the top surface 51 of the substrate 50.
  • the bottom dispenser 14 is positioned and oriented so that when a liquid is flowed therethough, the liquid is applied to the bottom surface 56 of the substrate 50. When the substrate 50 is rotating, this liquid forms a layer or film of the liquid across the entirety of the bottom surface 56 of the substrate 50.
  • Both the top dispenser 13 and the bottom dispenser 14 are operably and fluidly coupled to a liquid supply subsystem 16 via liquid supply lines 17, 18A-D.
  • the liquid supply subsystem 16 is in turn fluidly connected to the liquid reservoirs 15A-D.
  • the liquid supply subsystem 16 controls the supply of liquid to both the top dispenser 13 and the bottom dispenser 14.
  • the bottom dispenser 14 is operably and fluidly connected all four liquid reservoirs 15A-D. As will be discussed in further detail below, this allows for the application of four different liquids to various points on the bottom surface 56 of the wafer 50 through the bottom dispenser 14.
  • the cleaning system 1000 further comprises a horizontal actuator 250 that is operably coupled to the top transducer assembly 200.
  • the actuator 250 is operably coupled to and controlled by the controller 12.
  • the actuator 250 can be a pneumatic actuator, drive- assembly actuator, or any other style desired to effectuate the necessary movement.
  • the horizontal actuator 250 can horizontally translate the top transducer assembly 200 between a retracted position and a processing position. When in the retracted position, the top transducer assembly 200 is withdrawn sufficiently away from the rotatable support 10 so that the wafer 50 can be loaded and unloaded without obstruction onto and from the support 10.
  • the controller 12 may be a processor, which can be a suitable microprocessor based programmable logic controller, personal computer, or the like for process control.
  • the controller 12 preferably includes various input/output ports used to provide connections to the various components of the cleaning system 1000 that need to be controlled and/or communicated with. The electrical and/or communication connections are indicated in dotted line in FIG. 2.
  • the controller 12 also preferably comprises sufficient memory to store process recipes and other data, such as thresholds inputted by an operator, processing times, rotational speeds, processing conditions, processing temperatures, flow rates, desired concentrations, sequence operations, and the like.
  • the controller 12 can communicate with the various components of the cleaning system 1000 to automatically adjust process conditions, such as flow rates, rotational speed, movement of the components of the cleaning system 1000, etc. as necessary.
  • top transducer assembly 200 is generically illustrated as a box. This is done because, in its broadest sense, the invention is not limited to any particular structure, shape and/or assembly arrangement for the transducer assembly 200.
  • any of the transducer assemblies disclosed in United States Patent 6,039,059 (“Bran”), issued March 21, 2000, United States Patent 7,145,286 (“Beck et al.”), issued December 5, 2006, United States Patent 6,539,952 (“Itzkowitz”), issued April 1, 2003, and United States Patent Application Publication 2006/0278253 (“Verhaverbeke et al.”), published December 14, 2006, can be used as the top transducer assembly 200.
  • other styles of transducer assemblies can be used, such as those having an elongated transmitter rod supported at an angle to the surface of the wafer.
  • the top transducer assembly 200 is operably coupled to drive assembly/actuator 250 that can move the rod-like transmitter 201 between a retracted position and a processing position.
  • the rod-like transmitter 201 When the rod-like transmitter 201 is in the retracted position, the rod-like transmitter 201 is located outside of the process bowl 203 so that a wafer 50 can be placed on the rotatable support 10 without obstruction. More specifically, the drive assembly 250 withdraws the rod-like transmitter 201 through an opening in a side wall of the process bowl 203.
  • the rod-like transmitter 201 When in the processing position, the rod-like transmitter 201 is positioned directly above the top surface 51 of a wafer 50 on the rotatable support 10. The rod-like transmitter 201 is in the processing position in FIG. 2.
  • the transducer 203 of the top transducer assemblies 200 is acoustically coupled to the transmitter 201. This can be done through a direct bonding or an indirect bonding that utilizes intermediary transmission layers.
  • the transducer 203 is operably coupled to a source of an electrical energy signal.
  • the transducer 203 can be a piezoelectric ceramic or crystal, as is well known in the art.
  • the rotatable support 10 is located within the process bowl 203.
  • the rotatable support 10 supports a wafer 50 (shown in FIG.l) in a substantially horizontal orientation in the gaseous atmosphere of the process bowl 203, which surrounds the periphery of the wafer 50.
  • the rotatable support 10 is operably connected to the motor assembly 11.
  • the motor assembly rotates the wafer about the central axis.
  • the motor assembly 11 can be a direct drive motor or a bearing with offset belt/pulley drive.
  • the rotatable support 10 supports the wafer 50 (shown in FIG.l) at an elevation and position between the elongate rod-like transmitter 201 of the top transducer assembly 200 and the top surface 26 of the dispenser 14.
  • the transmitter 201 of the top transducer assembly 200 extends in a substantially parallel orientation over the top surface 51 of the wafer 50 in a close spaced relation. This close spaced relationship is such that when liquid is applied to the top surface 51 from the top dispenser 13, a meniscus of liquid is formed between a portion of the transmitter 201 and the top surface 51 of the wafer 50.
  • the dispenser 14 is used for applying various fluids to the bottom surface 56 of the substrate 50.
  • the invention is not so limited however, and the dispenser 14 could be used to apply fluid to any surface of the substrate 50.
  • the top surface 26 of the dispenser 14 is a substantially dome-shaped surface and comprises a plurality of holes 22a-c, 32a-c, 42a-c, 52a-c (shown in FIG.3). As will be discussed in further detail below, each of the holes 22a-c, 32a-c, 42a-c, 52a-c is connected to a conduit that is adapted to eject fluid from the dispenser 14 and onto the surface of the wafer 50.
  • the cleaning system 1000 further comprises a sensor 8.
  • the sensor 8 is provided for determining the presence of a substrate on the support 10.
  • the sensor is operably and communicably coupled to the controller 12.
  • the convex curved shape of the top surface 26 allows for fluid and contaminants that may fall onto the dispenser 14 to more easily flow off of the top surface 26 and away from the substrate being processed than would a planar surface.
  • the dispenser 14 has a height of about 1.3 inches and a diameter of about 5.5 inches.
  • the dispenser 14 can be made of Teflon, PTFE, PFA and/or other inert non-contaminating materials. The invention is not so limited however, and the specific dimensions and materials of the dispenser 14 will vary according to the process requirements.
  • the dispenser 14 further comprises a plurality of holes 22a-c, 32a-c, 42a-c, 52a-c for ejecting fluid onto the surface of a substrate to be processed.
  • the holes 22a-c, 32a-c, 42a-c, 52a-c have a diameter that is between .05 inches and .09 inches.
  • the invention is not so limited and the exact size and shape of the holes 22a-c, 32a-c, 42a-c, 52a-c can vary. The exact shape and size of the holes 22a-c, 32a-c, 42a-c, 52a-c will be dictated by the process requirements.
  • the holes 22a-c, 32a-c, 42a-c, 52a-c are positioned on the top surface 26 so as to form a matrix of four rows by three columns. Each row is referred to as an array, hi the illustrated embodiment, each array comprises three of the holes 22a-c, 32a-c, 42a-c, 52a-c.
  • the first and second arrays of holes 22a-c, 32a-c are on one side of the longitudinal center-line A-A, while the third and fourth arrays of holes 42a-c, 52a-c are on the other side of the longitudinal center-line A-A.
  • each array can be adapted to dispense a different type of fluid.
  • the first column of holes 22a, 32a, 42a, 52a is on the back end 3 of the dispenser 14 (to the right of the transverse center-line B-B), while the second and third columns of holes 22b-c, 32b-c, 42b-c, 52b-c, are on the front end 1 of the dispenser 14 (to the left side of the transverse center-line B-B).
  • FIG. 6 a cross-sectional side view of dispenser 14 along axis C-C of FIG. 5 is illustrated. Also illustrated, for purposes of discussion, is the horizontal plane E.
  • the horizontal plane E is substantially parallel to the bottom surface 56 of a wafer 50 positioned on the rotatable support to be processed (shown in FIG. 13).
  • the holes 22a-c, 32a-c, 42a-c, 52a-c are the openings of the conduits 23a-c, 33a-c, 43a-c, 53a-c in the top surface 26 of the body 30 of the dispenser 14. For ease of discussion, only one array of the conduits 53a-c is shown in this cross-sectional view.
  • the body of the dispenser 14 is illustrated as a solid structure with the headers formed as cylindrical cavities within the body 30, the invention is not so limited.
  • the body 30 may be a shell-like structure wherein the headers 24, 34, 44, 54 are separate tubular components and all fluid passageways are formed by flexible fluid conduit.
  • the headers 24, 34, 44, 54 can be located exterior to the body 30, if desired.
  • the first column of conduits 23a, 33a, 43a, 53a is at a first angle ⁇ a relative to the horizontal plane E.
  • the second column of conduits 23b, 33b, 43b, 53b is at a second angle ⁇ b relative to the horizontal plane E.
  • the third column of conduits 23c, 33c, 43c, 53c is at a third angle Gc relative to the horizontal plane E.
  • the first and second angles ⁇ a and ⁇ b are preferably between 35° to 45°, more preferably between 40° and 45°, and most preferably equal to 40°.
  • the third angle ⁇ c is preferably between 30° to 35°, more preferably between 33° and 35°, and most preferably equal to 33°.
  • FIG 7 a cross-sectional side view of the dispenser 14 is shown along axis D-D of FIG. 5.
  • This side view is shown to illustrate the details of the sensor hole 28.
  • the sensor hole 28 provides a cavity for holding the sensor 8 (shown in FIG.2).
  • the sensor hole 28 extends from the top surface 26 of dispenser 14 to the bottom surface 27 of dispenser 14.
  • the upper portion 48 of sensor hole 28 is wider than the lower portion 58 of sensor hole 27.
  • the sensor 8 rests in the upper portion 48 of the sensor hole 28, while the lower portion 58 is used for the electrical connections and other components that connect the sensor 8 to the controller 12 (shown in FIG.l). When fully assembled, the sensor 8 rests in the sensor hole 28 which is hermetically sealed so that fluid does not enter the sensor hole 28.
  • the seal is accomplished using any conventional means known in the art including using gaskets, o- rings, and the like.
  • the upper portion 48 of the sensor hole 28 has a diameter that is between .39 inches and .41 inches.
  • the lower portion 58 of the sensor hole 28 has a diameter that is about .125 inches.
  • the sensor hole 28 extends through the body 30 at an angle of about 28 degrees relative to a horizontal plane. The invention is not so limited, however, and the exact shape and size of the sensor hole 28 are determined according to the type and size of sensor 8 to be used.
  • the dispenser 14 comprises four bolt holes 41 for bolts that may be used for securing together the components of dispenser 14 and for mounting the dispenser 14 in the cleaning system 1000.
  • the dispenser 14 comprises four fluid inlet passageways 25, 35, 45, 55.
  • the fluid inlet passageways 25, 35, 45, 55 are passageways that extend into the headers 24, 34, 44, 54, respectively.
  • the fluid inlet passageways 25, 35, 45, 55 are each fluidly coupled to its own liquid reservoir 15A-D (shown in FIG. 1). Alternatively, all four fluid inlet passageways 25, 35, 45, 55 may be connected with one liquid reservoir.
  • FIGS. 9-12 a schematical view of the dispenser 14 is illustrated so that the positioning of each array of the conduits 23a-c, 33a-c, 43a-c, 53a-c relative to a vertical plane F can be described.
  • the vertical plane F is a plane that intersects the longitudinal center-line A-A of the dispenser 14 (shown in FIG. 5). All of the conduits 23a-c, 33a-c, 43a-c, 53a-c in the four arrays are angled towards the longitudinal center-line A-A so that the fluid dispensed through the holes 22a-c, 32a-c, 42a-c, 52a-c will strike a surface of the wafer 50 directly above the longitudinal center-line A-A.
  • the first array of conduits 23a-c are connected to the first header 24.
  • the first conduit 23a of the first header 24 is at an angle ⁇ a relative to the vertical plane F.
  • the second conduit 23b of the first header 24 is at an angle ⁇ b relative to the vertical plane F.
  • the third conduit 23c of the first header 24 is at an angle ⁇ c relative to the vertical plane F.
  • ⁇ a is about 15.5°
  • ⁇ b is about 18°
  • ⁇ c is about 12.5°.
  • the invention is not so limited however, and the angles of the conduits 23a-c is dependent upon the positioning of the wafer 50 relative to the dispenser 14 and the position of the holes 22a-c on the dispenser 14. The angle should be one that results in the ejected fluid initially contacting the wafer 50 along a line where the vertical plane F would intersect the surface 56 of the wafer 50.
  • the second array of conduits 33a-c are shown connected to a second header 34.
  • the first conduit 33a of the second header 34 is at an angle ⁇ a relative to the vertical plane F.
  • the second conduit 33b of the second header 34 is at an angle ⁇ b relative to the vertical plane F.
  • the third conduit 33c of the second header 34 is at an angle ⁇ c relative to the vertical plane F.
  • ⁇ a is about 5.3°
  • ⁇ b is about 6.2°
  • ⁇ c is about 4.3°.
  • positioning of the conduits 33a-c is not limited to any particular angle, so long as the ejected fluid initially contacts the wafer 50 at a predetermined point intersected by the vertical plane F.
  • the third array of the conduits 43a-c is shown connected to the third header 44. Because dispenser 14 is symmetrical about its longitudinal center-line A- A, the angles of the conduits 43a-c connected to the third header 44 are a mirror of the conduits 33a-c connected to the second header 34 as discussed above with respect to FIG.10.
  • the first conduit 43a is at an angle - ⁇ a
  • the second conduit 43b is at an angle - ⁇ b
  • the third conduit 43c is at an angle - ⁇ c.
  • FIG. 12 is an illustration of the fourth array of the conduits 53a-c connected to the fourth header 54.
  • the conduits 53a-c that are connected to the fourth header 54 are a mirror image and angled to the same degree (towards the center-line) as the conduits 23a-c connected to the first header 24, discussed above with respect to FIG. 9.
  • the first conduit 53a is at an angle - ⁇ a
  • the second conduit 53b is at an angle - ⁇ b
  • the third conduit 53c is at an angle - ⁇ c.
  • FIG. 13 a schematic illustrating a liquid ejection profile according to one embodiment of the present invention is shown.
  • the dispenser 14 is illustrated positioned below the wafer 50.
  • the wafer 50 is positioned substantially horizontal and parallel with the dispenser 14.
  • the wafer 50 has a transverse center-line, a longitudinal center-line, and a rotational center-point C where the two center-lines intersect.
  • the rotational center-point C of the wafer is the actual center-point, in alternative embodiments, the rotational center-point C does not have to be the actual center-point of the wafer.
  • the rotational center-point of the wafer 50 is offset from the center axis point (at the apex) of the body 30 of the dispenser 14.
  • the longitudinal centerline of the wafer 50 and the longitudinal centerline of the dispenser 14 are aligned. Fluid is ejected through the conduits 23a-c, 33a-c, 43a-c, 53a-c and out of the holes 22a-c, 32a-c, 42a-c, 52a-c. The ejected fluid strikes the bottom surface 56 of the wafer 50 at the predetermined points a, b, c. Point a is the rotational center point of the wafer 50. In the illustrated embodiment, point b is equal to 1/3 the radius of the wafer 50. Point c is equal to 2/3 the radius of the wafer 50.
  • the dispenser 14 comprises four separate arrays of the conduits 23a-c, 33a-c, 43a-c, 53a-c , thus each array may be used to dispense a different fluid from the other. As such, after a first fluid is dispensed, a second, third and fourth fluids may be dispensed in turn onto the surface of the wafer 50. Alternatively, four fluids can be dispensed at the same time onto the surface of the wafer 50.
  • each fluid inlet passageway 25, 35, 45, 55 is connected to a separate liquid reservoir 15A-D so that a different fluid can be introduced into each header 24, 34, 44, 54.
  • liquid reservoir 15A could be filled with deionized water (“DIW”)
  • liquid reservoir 15B could be filled with standard clean 1 (“SCl")
  • liquid reservoir 15C could be filled with standard clean 2 (“SC2”)
  • liquid reservoir 15D could be filled with ozonated deionized water (“DIO 3 ").
  • the conduits 23a-c which are connected to the liquid reservoir 15A via the fluid inlet passageway 25 and the first header 24 (shown in FIG. 9), would eject DIW onto the bottom surface 56 of the wafer 50.
  • the conduits 33a-c which are connected to the liquid reservoir 15B via the fluid passageway 35 and the second header 34 (shown in FIG. 10) would eject SCl .
  • the conduits 43a-c which are connected to the liquid reservoir 15C via the fluid passageway 45 and third header 44 (shown in FIG.l 1), would eject SC2.
  • the conduits 53a-c which are connected to the liquid reservoir 15D via the fluid inlet passageway 55 and the fourth header 54 (shown in FIG.12) would eject DIO 3 .
  • four fluids are ejected via single head unit, i.e. dispenser 14.
  • the fluid flow rate can be about 1800 ml/min., however the flow rate will vary according to the process requirements.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne un distributeur de fluide destiné à être utilisé dans le traitement de substrats. Le distributeur comporte un corps en forme de dôme doté d'une surface supérieure convexe et d'un nombre de conduits disposés pour amener du fluide sur la surface d'un substrat en des points prédéterminés.
PCT/US2007/074133 2006-07-21 2007-07-23 Appareil pour amener un fluide sur un substrat et système et procédé incorporant ce dernier Ceased WO2008011630A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US83263106P 2006-07-21 2006-07-21
US60/832,631 2006-07-21
TW096126671 2007-07-20
TW096126671A TWI352628B (en) 2006-07-21 2007-07-20 Nozzle for use in the megasonic cleaning of substr

Publications (2)

Publication Number Publication Date
WO2008011630A2 true WO2008011630A2 (fr) 2008-01-24
WO2008011630A3 WO2008011630A3 (fr) 2008-10-09

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Publication number Priority date Publication date Assignee Title
JP3563605B2 (ja) * 1998-03-16 2004-09-08 東京エレクトロン株式会社 処理装置
US6684890B2 (en) * 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US6848455B1 (en) * 2002-04-22 2005-02-01 Novellus Systems, Inc. Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species

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