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WO2008002970A3 - Silsesquioxane resin systems with base additives bearing electron-attracting functionalities - Google Patents

Silsesquioxane resin systems with base additives bearing electron-attracting functionalities Download PDF

Info

Publication number
WO2008002970A3
WO2008002970A3 PCT/US2007/072222 US2007072222W WO2008002970A3 WO 2008002970 A3 WO2008002970 A3 WO 2008002970A3 US 2007072222 W US2007072222 W US 2007072222W WO 2008002970 A3 WO2008002970 A3 WO 2008002970A3
Authority
WO
WIPO (PCT)
Prior art keywords
functionalities
attracting
resin systems
silsesquioxane resin
silsesquioxane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/072222
Other languages
French (fr)
Other versions
WO2008002970A2 (en
Inventor
Sanlin Hu
Eric Scott Moyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Dow Silicones Corp
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Dow Corning Corp filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2009518532A priority Critical patent/JP5085649B2/en
Priority to US12/304,263 priority patent/US8524439B2/en
Publication of WO2008002970A2 publication Critical patent/WO2008002970A2/en
Publication of WO2008002970A3 publication Critical patent/WO2008002970A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1545—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

A silsesquioxane-based composition that contains (a) silsesquioxane resins that contain HSiO3/2 units and RSiO3/2 units wherein; R is an acid dissociable group, and (b) 7-diethylamino-4-methylcoumarin. The silsesquioxane-based compositions are useful as positive resist compositions in forming patterned features on substrate, particularly useful for multi-layer layer (i.e. bilayer) 193 nm & 157 nm photolithographic applications.
PCT/US2007/072222 2006-06-28 2007-06-27 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities Ceased WO2008002970A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009518532A JP5085649B2 (en) 2006-06-28 2007-06-27 Silsesquioxane resin system containing basic additives with electron withdrawing groups
US12/304,263 US8524439B2 (en) 2006-06-28 2007-06-27 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80609106P 2006-06-28 2006-06-28
US60/806,091 2006-06-28

Publications (2)

Publication Number Publication Date
WO2008002970A2 WO2008002970A2 (en) 2008-01-03
WO2008002970A3 true WO2008002970A3 (en) 2008-04-10

Family

ID=38846501

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/072222 Ceased WO2008002970A2 (en) 2006-06-28 2007-06-27 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities

Country Status (5)

Country Link
US (1) US8524439B2 (en)
JP (1) JP5085649B2 (en)
KR (1) KR101216060B1 (en)
TW (1) TWI435894B (en)
WO (1) WO2008002970A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101293937B1 (en) * 2006-06-28 2013-08-09 다우 코닝 코포레이션 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities
JP4890153B2 (en) * 2006-08-11 2012-03-07 東京応化工業株式会社 Resist composition and resist pattern forming method
CN101970209A (en) * 2008-01-31 2011-02-09 昭和电工株式会社 Process for forming concavo-convex patterns, and process for manufacturing magnetic recording media using the same
EP2250215B1 (en) * 2008-03-05 2020-03-25 Dow Silicones Corporation Silsesquioxane resins
CN102439069B (en) * 2009-07-23 2014-11-05 道康宁公司 Methods and materials for reverse patterning
WO2011011140A2 (en) * 2009-07-23 2011-01-27 Dow Corning Corporation Method and materials for double patterning
JP5610567B2 (en) * 2010-02-23 2014-10-22 昭和電工株式会社 Resist sensitivity improvement method
KR102217399B1 (en) * 2016-05-03 2021-02-24 다우 실리콘즈 코포레이션 Silsesquioxane resin and silyl-anhydride composition
WO2017192345A1 (en) * 2016-05-03 2017-11-09 Dow Corning Corporation Silsesquioxane resin and oxaamine composition
WO2017218286A1 (en) 2016-06-16 2017-12-21 Dow Corning Corporation Silicon-rich silsesquioxane resins

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WO2005007747A2 (en) * 2003-07-03 2005-01-27 Dow Corning Corporation Photosensitive silsesquioxane resin
WO2005040918A2 (en) * 2003-10-24 2005-05-06 International Business Machines Corporation Low-activation energy silicon-containing resist system

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US20040137241A1 (en) * 2003-01-08 2004-07-15 International Business Machines Corporation Patternable low dielectric constsnt materials and their use in ULSI interconnection
WO2005007747A2 (en) * 2003-07-03 2005-01-27 Dow Corning Corporation Photosensitive silsesquioxane resin
WO2005040918A2 (en) * 2003-10-24 2005-05-06 International Business Machines Corporation Low-activation energy silicon-containing resist system

Also Published As

Publication number Publication date
WO2008002970A2 (en) 2008-01-03
US20090312467A1 (en) 2009-12-17
KR20090038424A (en) 2009-04-20
TW200811224A (en) 2008-03-01
KR101216060B1 (en) 2012-12-28
JP5085649B2 (en) 2012-11-28
US8524439B2 (en) 2013-09-03
JP2009542859A (en) 2009-12-03
TWI435894B (en) 2014-05-01

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