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WO2008096792A1 - サーバ装置、情報処理方法、及びプログラム - Google Patents

サーバ装置、情報処理方法、及びプログラム Download PDF

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Publication number
WO2008096792A1
WO2008096792A1 PCT/JP2008/051965 JP2008051965W WO2008096792A1 WO 2008096792 A1 WO2008096792 A1 WO 2008096792A1 JP 2008051965 W JP2008051965 W JP 2008051965W WO 2008096792 A1 WO2008096792 A1 WO 2008096792A1
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WO
WIPO (PCT)
Prior art keywords
judgment
information
authority
request information
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051965
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English (en)
French (fr)
Inventor
Noriaki Shioyama
Yoshiaki Koshoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008557145A priority Critical patent/JP5097134B2/ja
Priority to KR1020097018429A priority patent/KR101110041B1/ko
Publication of WO2008096792A1 publication Critical patent/WO2008096792A1/ja
Priority to US12/536,862 priority patent/US8607312B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4185—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication
    • G05B19/4186—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication by protocol, e.g. MAP, TOP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/0604—
    • H10P72/0612—
    • H10P72/0618—
    • H10P72/3411—
    • H10P95/00—
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31246—Firewall
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36542—Cryptography, encrypt, access, authorize with key, code, password
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Storage Device Security (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • General Factory Administration (AREA)

Abstract

【課題】権限に関する情報を容易に管理することができるようにする。 【解決手段】サーバ装置１０は、処理についての権限に関する権限情報が記憶される権限情報記憶部１１と、被処理基板に対する所定の半導体プロセスを行う製造装置４０あるいはクライアント装置２０から送信された情報であり、所望の処理の実行に関する許否の判断を要求する情報である判断要求情報を受信する判断要求情報受信部１２と、判断要求情報受信部１２が受信した判断要求情報に応じた許否の判断を、権限情報を用いて行う許否判断部１３と、許否判断部１３による判断結果を示す判断結果情報を、判断要求情報を送信した装置に送信する判断結果情報送信部１４と、を備える。
PCT/JP2008/051965 2007-02-07 2008-02-06 サーバ装置、情報処理方法、及びプログラム Ceased WO2008096792A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008557145A JP5097134B2 (ja) 2007-02-07 2008-02-06 サーバ装置、情報処理方法、及びプログラム
KR1020097018429A KR101110041B1 (ko) 2007-02-07 2008-02-06 서버 장치, 정보 처리 방법 및 프로그램
US12/536,862 US8607312B2 (en) 2007-02-07 2009-08-06 Server, information processing method and program

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007027629 2007-02-07
JP2007-027629 2007-02-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/536,862 Continuation US8607312B2 (en) 2007-02-07 2009-08-06 Server, information processing method and program

Publications (1)

Publication Number Publication Date
WO2008096792A1 true WO2008096792A1 (ja) 2008-08-14

Family

ID=39681698

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051965 Ceased WO2008096792A1 (ja) 2007-02-07 2008-02-06 サーバ装置、情報処理方法、及びプログラム

Country Status (5)

Country Link
US (1) US8607312B2 (ja)
JP (1) JP5097134B2 (ja)
KR (1) KR101110041B1 (ja)
TW (1) TW200841208A (ja)
WO (1) WO2008096792A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011081795A (ja) * 2009-10-05 2011-04-21 Fisher-Rosemount Systems Inc プロセス制御環境におけるデータアップロードを管理するための方法および装置
WO2012035965A1 (ja) * 2010-09-17 2012-03-22 株式会社日立国際電気 基板処理システム及び基板処理装置の表示方法
CN104597861A (zh) * 2013-10-31 2015-05-06 村田机械株式会社 设定管理装置、纤维机械、纱线卷绕机及纺纱机
CN113424113A (zh) * 2018-11-30 2021-09-21 伊利诺斯工具制品有限公司 安全系统接口和包括安全系统接口的材料试验系统

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010011657A1 (de) * 2010-03-17 2011-09-22 Siemens Aktiengesellschaft Verfahren und Vorrichtung zum Bereitstellen mindestens eines sicheren kryptographischen Schlüssels
CN102609328B (zh) * 2012-01-29 2015-04-15 华为终端有限公司 系统差分升级方法和装置、移动终端
KR101954707B1 (ko) * 2018-07-25 2019-06-11 김영준 카메라 컨트롤러를 이용한 반도체 공정 유틸리티 모니터링 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186365A (ja) * 1997-12-24 1999-07-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11345751A (ja) * 1998-03-13 1999-12-14 Samsung Electronics Co Ltd 工程条件レシピ変更による半導体の工程不良防止方法
JP2002027567A (ja) * 2000-07-12 2002-01-25 Hitachi Kokusai Electric Inc 半導体製造装置のリモート操作システム、半導体製造装置および遠隔操作装置
JP2002050555A (ja) * 2000-07-31 2002-02-15 Ricoh Co Ltd 半導体製造システム
JP2006073845A (ja) * 2004-09-03 2006-03-16 Hitachi Kokusai Electric Inc 半導体製造システム

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JP3543996B2 (ja) 1994-04-22 2004-07-21 東京エレクトロン株式会社 処理装置
JPH08227835A (ja) * 1995-02-20 1996-09-03 Tokyo Electron Ltd 半導体製造装置の操作システム、液晶ディスプレイ基板製造装置の操作システム、制御装置の操作システム及び制御装置の操作方法
US6356899B1 (en) * 1998-08-29 2002-03-12 International Business Machines Corporation Method for interactively creating an information database including preferred information elements, such as preferred-authority, world wide web pages
JP3497450B2 (ja) 2000-07-06 2004-02-16 東京エレクトロン株式会社 バッチ式熱処理装置及びその制御方法
SE518491C2 (sv) * 2000-10-12 2002-10-15 Abb Ab Datorbaserat system och metod för behörighetskontroll av objekt
CA2798508A1 (en) * 2000-10-18 2002-04-25 Johnson & Johnson Consumer Companies, Inc. Intelligent performance-based product recommendation system
KR100969241B1 (ko) * 2004-02-13 2010-07-09 노키아 코포레이션 네트워크 상의 데이터 관리 방법 및 시스템
JP4384093B2 (ja) * 2004-09-03 2009-12-16 株式会社東芝 プロセス状態管理システム、管理サーバ、プロセス状態管理方法及びプロセス状態管理用プログラム
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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH11186365A (ja) * 1997-12-24 1999-07-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11345751A (ja) * 1998-03-13 1999-12-14 Samsung Electronics Co Ltd 工程条件レシピ変更による半導体の工程不良防止方法
JP2002027567A (ja) * 2000-07-12 2002-01-25 Hitachi Kokusai Electric Inc 半導体製造装置のリモート操作システム、半導体製造装置および遠隔操作装置
JP2002050555A (ja) * 2000-07-31 2002-02-15 Ricoh Co Ltd 半導体製造システム
JP2006073845A (ja) * 2004-09-03 2006-03-16 Hitachi Kokusai Electric Inc 半導体製造システム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011081795A (ja) * 2009-10-05 2011-04-21 Fisher-Rosemount Systems Inc プロセス制御環境におけるデータアップロードを管理するための方法および装置
US9164501B2 (en) 2009-10-05 2015-10-20 Fisher-Rosemount Systems, Inc. Methods and apparatus to manage data uploading in a process control environment
WO2012035965A1 (ja) * 2010-09-17 2012-03-22 株式会社日立国際電気 基板処理システム及び基板処理装置の表示方法
CN104597861A (zh) * 2013-10-31 2015-05-06 村田机械株式会社 设定管理装置、纤维机械、纱线卷绕机及纺纱机
CN113424113A (zh) * 2018-11-30 2021-09-21 伊利诺斯工具制品有限公司 安全系统接口和包括安全系统接口的材料试验系统
US12203900B2 (en) 2018-11-30 2025-01-21 Illinois Tool Works Inc. Safety system interfaces and material testing systems including safety system interfaces

Also Published As

Publication number Publication date
JP5097134B2 (ja) 2012-12-12
KR101110041B1 (ko) 2012-03-13
TWI359368B (ja) 2012-03-01
JPWO2008096792A1 (ja) 2010-05-27
TW200841208A (en) 2008-10-16
KR20090118950A (ko) 2009-11-18
US20090300727A1 (en) 2009-12-03
US8607312B2 (en) 2013-12-10

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