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WO2008090719A1 - 潜在性硬化剤 - Google Patents

潜在性硬化剤 Download PDF

Info

Publication number
WO2008090719A1
WO2008090719A1 PCT/JP2007/075136 JP2007075136W WO2008090719A1 WO 2008090719 A1 WO2008090719 A1 WO 2008090719A1 JP 2007075136 W JP2007075136 W JP 2007075136W WO 2008090719 A1 WO2008090719 A1 WO 2008090719A1
Authority
WO
WIPO (PCT)
Prior art keywords
curing agent
latent curing
aluminum
aluminum chelate
chelate type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/075136
Other languages
English (en)
French (fr)
Inventor
Katsuhiko Komuro
Masahiko Ito
Daisuke Masuko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to JP2008538061A priority Critical patent/JPWO2008090719A1/ja
Priority to CN2007800503600A priority patent/CN101595152B/zh
Priority to US12/223,869 priority patent/US8147720B2/en
Priority to TW097101484A priority patent/TW200846384A/zh
Publication of WO2008090719A1 publication Critical patent/WO2008090719A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　比較的低温で短時間の条件で熱硬化性エポキシ樹脂を硬化させることが可能なアルミニウムキレート系潜在性硬化剤を提供する。また、アルミニウムキレート系潜在性硬化剤の硬化条件を比較的容易にコントロール可能なその製造方法を提供する。 　アルミニウムキレート系潜在性硬化剤は、アルミニウムキレート剤に、シルセスキオキサン型オキセタン誘導体を、脂環式エポキシ化合物の存在下で反応させて潜在化させたものである。
PCT/JP2007/075136 2007-01-24 2007-12-27 潜在性硬化剤 Ceased WO2008090719A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008538061A JPWO2008090719A1 (ja) 2007-01-24 2007-12-27 潜在性硬化剤
CN2007800503600A CN101595152B (zh) 2007-01-24 2007-12-27 潜固化剂
US12/223,869 US8147720B2 (en) 2007-01-24 2007-12-27 Latent curing agent
TW097101484A TW200846384A (en) 2007-01-24 2008-01-15 Latent curing agent

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007014187 2007-01-24
JP2007-014187 2007-01-24

Publications (1)

Publication Number Publication Date
WO2008090719A1 true WO2008090719A1 (ja) 2008-07-31

Family

ID=39644294

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075136 Ceased WO2008090719A1 (ja) 2007-01-24 2007-12-27 潜在性硬化剤

Country Status (6)

Country Link
US (1) US8147720B2 (ja)
JP (1) JPWO2008090719A1 (ja)
KR (1) KR101039546B1 (ja)
CN (1) CN101595152B (ja)
TW (1) TW200846384A (ja)
WO (1) WO2008090719A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008179701A (ja) * 2007-01-24 2008-08-07 Sony Chemical & Information Device Corp 潜在性硬化剤
WO2009093364A1 (ja) * 2008-01-25 2009-07-30 Sony Chemical & Information Device Corporation 熱硬化型エポキシ樹脂組成物
JP2009298824A (ja) * 2008-06-10 2009-12-24 Nippon Kayaku Co Ltd 感光性化合物、それを含む組成物及びその硬化物
JP2010209359A (ja) * 2010-06-28 2010-09-24 Sony Chemical & Information Device Corp アルミニウムキレート系潜在性硬化剤
WO2016043066A1 (ja) * 2014-09-16 2016-03-24 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
CN107592877A (zh) * 2015-03-24 2018-01-16 株式会社Lg化学 粘合剂组合物
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
JP2022034224A (ja) * 2020-08-18 2022-03-03 旭化成株式会社 マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136486B2 (en) * 2011-12-26 2015-09-15 Toagosei Co., Ltd. Composition for organic semiconductor insulating films, and organic semiconductor insulating film
WO2015152047A1 (ja) * 2014-04-01 2015-10-08 旭硝子株式会社 防曇剤組成物並びに防曇性物品及びその製造方法
JP7275469B2 (ja) * 2018-01-12 2023-05-18 味の素株式会社 被覆粒子
KR102236549B1 (ko) * 2019-11-26 2021-04-07 한국과학기술연구원 건식 표면 처리 공정을 통해 보존 안정성이 향상된 잠재성 경화제, 이를 포함하는 일액형 에폭시 접착제 및 이의 제조방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564625A (en) * 1979-06-25 1981-01-19 Toshiba Corp Epoxy resin composition
JP2003013036A (ja) * 2001-06-27 2003-01-15 Sony Chem Corp 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
JP2006131849A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd 二液型硬化性組成物
JP2006131848A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd ポリオルガノシロキサン及びその製造方法、並びにポリオルガノシロキサンを含有する硬化性組成物
WO2006132133A1 (ja) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation 潜在性硬化剤
JP2007211056A (ja) * 2006-02-07 2007-08-23 Sony Chemical & Information Device Corp 潜在性硬化剤

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817536B2 (ja) 1979-06-21 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JP2001137690A (ja) 1999-11-16 2001-05-22 Nitto Denko Corp 粉末状マイクロカプセルの製造方法およびそれにより得られる粉末状マイクロカプセル
JP3565797B2 (ja) 2001-06-06 2004-09-15 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3802373B2 (ja) 2001-06-06 2006-07-26 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
EP1557438A4 (en) * 2002-10-25 2007-05-30 Asahi Kasei Chemicals Corp HARDENER OF CAPSULE TYPE AND COMPOSITION
CN101128502B (zh) 2005-02-23 2010-12-01 旭化成电子材料株式会社 环氧树脂用潜在性固化剂和环氧树脂组合物
US7557230B2 (en) * 2005-06-06 2009-07-07 Sony Corporation Latent curing agent

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564625A (en) * 1979-06-25 1981-01-19 Toshiba Corp Epoxy resin composition
JP2003013036A (ja) * 2001-06-27 2003-01-15 Sony Chem Corp 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
JP2006131849A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd 二液型硬化性組成物
JP2006131848A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd ポリオルガノシロキサン及びその製造方法、並びにポリオルガノシロキサンを含有する硬化性組成物
WO2006132133A1 (ja) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation 潜在性硬化剤
JP2007211056A (ja) * 2006-02-07 2007-08-23 Sony Chemical & Information Device Corp 潜在性硬化剤

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008179701A (ja) * 2007-01-24 2008-08-07 Sony Chemical & Information Device Corp 潜在性硬化剤
WO2009093364A1 (ja) * 2008-01-25 2009-07-30 Sony Chemical & Information Device Corporation 熱硬化型エポキシ樹脂組成物
JP2009197206A (ja) * 2008-01-25 2009-09-03 Sony Chemical & Information Device Corp 熱硬化型エポキシ樹脂組成物
US8349973B2 (en) 2008-01-25 2013-01-08 Sony Chemical & Information Device Corporation Thermosetting epoxy resin composition
JP2009298824A (ja) * 2008-06-10 2009-12-24 Nippon Kayaku Co Ltd 感光性化合物、それを含む組成物及びその硬化物
CN102471495A (zh) * 2010-06-28 2012-05-23 索尼化学&信息部件株式会社 螯合铝系潜伏性固化剂
WO2012002177A1 (ja) * 2010-06-28 2012-01-05 ソニーケミカル＆インフォメーションデバイス株式会社 アルミニウムキレート系潜在性硬化剤
JP2010209359A (ja) * 2010-06-28 2010-09-24 Sony Chemical & Information Device Corp アルミニウムキレート系潜在性硬化剤
CN102471495B (zh) * 2010-06-28 2013-10-23 迪睿合电子材料有限公司 螯合铝系潜伏性固化剂
US8835572B2 (en) 2010-06-28 2014-09-16 Dexerials Corporation Aluminum chelate latent curing agent
WO2016043066A1 (ja) * 2014-09-16 2016-03-24 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
CN107592877A (zh) * 2015-03-24 2018-01-16 株式会社Lg化学 粘合剂组合物
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
JP2022034224A (ja) * 2020-08-18 2022-03-03 旭化成株式会社 マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物
JP7643845B2 (ja) 2020-08-18 2025-03-11 旭化成株式会社 マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物

Also Published As

Publication number Publication date
TWI369371B (ja) 2012-08-01
CN101595152B (zh) 2012-06-27
JPWO2008090719A1 (ja) 2010-05-13
CN101595152A (zh) 2009-12-02
KR101039546B1 (ko) 2011-06-09
TW200846384A (en) 2008-12-01
KR20090033182A (ko) 2009-04-01
US8147720B2 (en) 2012-04-03
US20090152504A1 (en) 2009-06-18

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