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WO2008090654A1 - ２層フレキシブル基板とその製造方法及び該２層フレキシブル基板より得られたフレキシブルプリント配線基板 - Google Patents

２層フレキシブル基板とその製造方法及び該２層フレキシブル基板より得られたフレキシブルプリント配線基板 Download PDF

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Publication number
WO2008090654A1
WO2008090654A1 PCT/JP2007/070830 JP2007070830W WO2008090654A1 WO 2008090654 A1 WO2008090654 A1 WO 2008090654A1 JP 2007070830 W JP2007070830 W JP 2007070830W WO 2008090654 A1 WO2008090654 A1 WO 2008090654A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
layer
layer flexible
substrate
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/070830
Other languages
English (en)
French (fr)
Inventor
Eiichiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2008554964A priority Critical patent/JP4968266B2/ja
Priority to KR1020097015315A priority patent/KR101088571B1/ko
Priority to TW096147168A priority patent/TWI422300B/zh
Publication of WO2008090654A1 publication Critical patent/WO2008090654A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

【課題】　１５０°C程度、さらには１８０°C程度の高温下に長時間放置しても、絶縁フィルムと銅層との密着強度（以下「ピール強度」と記す場合がある）の低下が少ない２層フレキシブル基板、特にファインパターン形成・ＣＯＦ実装に適した２層フレキシブル基板とその製造方法を提供する。 【解決手段】　本発明に係る２層フレキシブル基板は、絶縁体フィルムの少なくとも片面に、接着剤を介さずに乾式めっき法により直接下地金属層を形成し、該下地金属層上に所望の層厚の銅導体層を形成する２層フレキシブル基板において、前記下地金属層は、窒素原子を０．５～４．８原子％固溶したニッケル－クロムまたはニッケル－クロム－モリブデンを主として含有する結晶質であることを特徴とする。
PCT/JP2007/070830 2007-01-24 2007-10-25 ２層フレキシブル基板とその製造方法及び該２層フレキシブル基板より得られたフレキシブルプリント配線基板 Ceased WO2008090654A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008554964A JP4968266B2 (ja) 2007-01-24 2007-10-25 ２層フレキシブル基板とその製造方法及び該２層フレキシブル基板より得られたフレキシブルプリント配線基板
KR1020097015315A KR101088571B1 (ko) 2007-01-24 2007-10-25 2층 플렉시블 기판과 그 제조 방법 및 이 2층 플렉시블 기판으로부터 얻어진 플렉시블 프린트 배선 기판
TW096147168A TWI422300B (zh) 2007-01-24 2007-12-11 A two-layer flexible substrate and a method for manufacturing the same, and a flexible printed wiring board obtained from the two-layer flexible substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007014358 2007-01-24
JP2007-014358 2007-05-30

Publications (1)

Publication Number Publication Date
WO2008090654A1 true WO2008090654A1 (ja) 2008-07-31

Family

ID=39644232

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/070830 Ceased WO2008090654A1 (ja) 2007-01-24 2007-10-25 ２層フレキシブル基板とその製造方法及び該２層フレキシブル基板より得られたフレキシブルプリント配線基板

Country Status (4)

Country Link
JP (1) JP4968266B2 (ja)
KR (1) KR101088571B1 (ja)
TW (1) TWI422300B (ja)
WO (1) WO2008090654A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253693A (ja) * 2009-04-21 2010-11-11 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板およびその製造方法
JP2011061113A (ja) * 2009-09-14 2011-03-24 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
WO2012117850A1 (ja) 2011-03-01 2012-09-07 Jx日鉱日石金属株式会社 液晶ポリマーフィルムベース銅張積層板及びその製造方法
JP2013229504A (ja) * 2012-04-26 2013-11-07 Sumitomo Metal Mining Co Ltd 金属化樹脂フィルムおよびその製造方法
JP2013229502A (ja) * 2012-04-26 2013-11-07 Sumitomo Metal Mining Co Ltd プリント配線基板およびその製造方法
JP2015081376A (ja) * 2013-10-23 2015-04-27 住友金属鉱山株式会社 ２層フレキシブル配線板およびその製造方法
JP2015082608A (ja) * 2013-10-23 2015-04-27 住友金属鉱山株式会社 ２層フレキシブル配線用基板およびその製造方法
JP2015108187A (ja) * 2013-10-22 2015-06-11 住友金属鉱山株式会社 ２層フレキシブル配線用基板及びそれを用いたフレキシブル配線板
JP2022100710A (ja) * 2020-12-24 2022-07-06 住友金属鉱山株式会社 銅張積層板および銅張積層板の製造方法
CN115152332A (zh) * 2020-02-24 2022-10-04 菲勒斯艾森株式会社 包含三元体系化合物的柔性电路板层叠结构体的制造方法及制造装置
JP2024504553A (ja) * 2021-01-26 2024-02-01 東友ファインケム株式会社 フレキシブル金属積層体およびその製造方法
US11895770B2 (en) 2018-10-05 2024-02-06 Panasonic Intellectual Property Management Co., Ltd. Copper-clad laminate, wiring board, and copper foil provided with resin

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161507A1 (ja) * 2012-04-24 2013-10-31 住友金属鉱山株式会社 ２層フレキシブル配線用基板及びフレキシブル配線板並びにそれらの製造方法
TWI568865B (zh) 2013-10-23 2017-02-01 Sumitomo Metal Mining Co Layer 2 flexible wiring substrate and manufacturing method thereof, and two-layer flexible wiring board and manufacturing method thereof
KR102461189B1 (ko) * 2015-12-07 2022-10-28 에스케이넥실리스 주식회사 연성 동장 적층판 및 이를 이용한 인쇄회로 기판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259596A (ja) * 1992-03-12 1993-10-08 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
JP2001151916A (ja) * 1999-11-30 2001-06-05 Oji Paper Co Ltd フレキシブルプリント配線用フィルム
JP2004031370A (ja) * 2002-06-07 2004-01-29 Matsushita Electric Ind Co Ltd フレキシブルプリント回路基板及びその製造方法
JP2006303206A (ja) * 2005-04-21 2006-11-02 Teijin Ltd フレキシブルプリント回路用基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200704297A (en) * 2005-04-08 2007-01-16 3M Innovative Properties Co Flexible circuit substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259596A (ja) * 1992-03-12 1993-10-08 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
JP2001151916A (ja) * 1999-11-30 2001-06-05 Oji Paper Co Ltd フレキシブルプリント配線用フィルム
JP2004031370A (ja) * 2002-06-07 2004-01-29 Matsushita Electric Ind Co Ltd フレキシブルプリント回路基板及びその製造方法
JP2006303206A (ja) * 2005-04-21 2006-11-02 Teijin Ltd フレキシブルプリント回路用基板

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253693A (ja) * 2009-04-21 2010-11-11 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板およびその製造方法
JP2011061113A (ja) * 2009-09-14 2011-03-24 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
WO2012117850A1 (ja) 2011-03-01 2012-09-07 Jx日鉱日石金属株式会社 液晶ポリマーフィルムベース銅張積層板及びその製造方法
JP2013229504A (ja) * 2012-04-26 2013-11-07 Sumitomo Metal Mining Co Ltd 金属化樹脂フィルムおよびその製造方法
JP2013229502A (ja) * 2012-04-26 2013-11-07 Sumitomo Metal Mining Co Ltd プリント配線基板およびその製造方法
JP2015108187A (ja) * 2013-10-22 2015-06-11 住友金属鉱山株式会社 ２層フレキシブル配線用基板及びそれを用いたフレキシブル配線板
JP2015082608A (ja) * 2013-10-23 2015-04-27 住友金属鉱山株式会社 ２層フレキシブル配線用基板およびその製造方法
JP2015081376A (ja) * 2013-10-23 2015-04-27 住友金属鉱山株式会社 ２層フレキシブル配線板およびその製造方法
US11895770B2 (en) 2018-10-05 2024-02-06 Panasonic Intellectual Property Management Co., Ltd. Copper-clad laminate, wiring board, and copper foil provided with resin
CN115152332A (zh) * 2020-02-24 2022-10-04 菲勒斯艾森株式会社 包含三元体系化合物的柔性电路板层叠结构体的制造方法及制造装置
JP2022100710A (ja) * 2020-12-24 2022-07-06 住友金属鉱山株式会社 銅張積層板および銅張積層板の製造方法
CN114745849A (zh) * 2020-12-24 2022-07-12 住友金属矿山株式会社 覆铜层叠板和覆铜层叠板的制造方法
JP7151758B2 (ja) 2020-12-24 2022-10-12 住友金属鉱山株式会社 銅張積層板および銅張積層板の製造方法
TWI818380B (zh) * 2020-12-24 2023-10-11 日商住友金屬鑛山股份有限公司 覆銅積層板及覆銅積層板之製造方法
JP2024504553A (ja) * 2021-01-26 2024-02-01 東友ファインケム株式会社 フレキシブル金属積層体およびその製造方法

Also Published As

Publication number Publication date
JP4968266B2 (ja) 2012-07-04
TW200838390A (en) 2008-09-16
JPWO2008090654A1 (ja) 2010-05-13
TWI422300B (zh) 2014-01-01
KR101088571B1 (ko) 2011-12-05
KR20090092342A (ko) 2009-08-31

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