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WO2008081878A1 - Flame-retardant highly heat-resistant resin composition - Google Patents

Flame-retardant highly heat-resistant resin composition Download PDF

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Publication number
WO2008081878A1
WO2008081878A1 PCT/JP2007/075143 JP2007075143W WO2008081878A1 WO 2008081878 A1 WO2008081878 A1 WO 2008081878A1 JP 2007075143 W JP2007075143 W JP 2007075143W WO 2008081878 A1 WO2008081878 A1 WO 2008081878A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
flame
resistant resin
highly heat
retardant highly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/075143
Other languages
French (fr)
Japanese (ja)
Inventor
Takaaki Miyoshi
Fumiki Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Chemicals Corp
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Priority to JP2008552154A priority Critical patent/JPWO2008081878A1/en
Publication of WO2008081878A1 publication Critical patent/WO2008081878A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed is a resin composition containing a polyamide, a polyphenylene ether and a phosphazene compound, wherein the polyamide is composed of an aromatic polyamide having a molar ratio (A/B) between the structure (A) and the structure (B) respectively represented by the formulae below within the range from 30/70 to 100/0. Structure (A) Structure (B) (In the formulae, R represents an alkylene group having 6-12 carbon atoms.)
PCT/JP2007/075143 2007-01-02 2007-12-27 Flame-retardant highly heat-resistant resin composition Ceased WO2008081878A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008552154A JPWO2008081878A1 (en) 2007-01-02 2007-12-27 Flame retardant high heat resistant resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88310107P 2007-01-02 2007-01-02
US60/883101 2007-01-02

Publications (1)

Publication Number Publication Date
WO2008081878A1 true WO2008081878A1 (en) 2008-07-10

Family

ID=39588558

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075143 Ceased WO2008081878A1 (en) 2007-01-02 2007-12-27 Flame-retardant highly heat-resistant resin composition

Country Status (2)

Country Link
JP (1) JPWO2008081878A1 (en)
WO (1) WO2008081878A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222572A (en) * 2009-02-24 2010-10-07 Asahi Kasei Chemicals Corp Resin composition and molded body thereof
JP2011093439A (en) * 2009-10-30 2011-05-12 Jtekt Corp Electric power steering device
JP2011162752A (en) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp Electrically conductive masterbatch and manufacturing method therefor, and electrically conductive resin composition and molded product thereof obtained using the electrically conductive masterbatch
JP2011162753A (en) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp Electroconductive resin composition, method for producing the same, and molded product obtained by using the electroconductive resin composition
JP2015030751A (en) * 2013-07-31 2015-02-16 三菱樹脂株式会社 Polyamide-based resin composition, film formed by molding the same, and injection-molded body
CN105017525A (en) * 2015-07-16 2015-11-04 株洲时代新材料科技股份有限公司 Branched modifier and corresponding flame retardant nylon resin
JP2019073657A (en) * 2017-10-18 2019-05-16 上野製薬株式会社 Liquid crystal polyester resin composition
WO2024166903A1 (en) 2023-02-06 2024-08-15 三井化学株式会社 Polyamide resin composition and molded article

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116797A (en) * 1997-10-20 1999-04-27 Unitika Ltd Polyamide resin composition and production thereof
JP2001131409A (en) * 1999-11-09 2001-05-15 Otsuka Chem Co Ltd Flame-retardant aromatic polyamide resin composition
JP2001335699A (en) * 2000-05-30 2001-12-04 Daicel Chem Ind Ltd Flame retardant resin composition
JP2002053751A (en) * 2000-05-29 2002-02-19 Mitsubishi Engineering Plastics Corp Flame retardant resin composition
JP2003176408A (en) * 2001-09-21 2003-06-24 Kuraray Co Ltd Polyamide composition for sealing electric and electronic parts
WO2006043460A1 (en) * 2004-10-18 2006-04-27 Asahi Kasei Chemicals Corporation Flame retardant composition
WO2006112058A1 (en) * 2005-04-13 2006-10-26 Asahi Kasei Chemicals Corporation Polyamide/polyphenylene ether resin composition
JP2008050509A (en) * 2006-08-25 2008-03-06 Asahi Kasei Chemicals Corp Flame retardant polyamide resin composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116797A (en) * 1997-10-20 1999-04-27 Unitika Ltd Polyamide resin composition and production thereof
JP2001131409A (en) * 1999-11-09 2001-05-15 Otsuka Chem Co Ltd Flame-retardant aromatic polyamide resin composition
JP2002053751A (en) * 2000-05-29 2002-02-19 Mitsubishi Engineering Plastics Corp Flame retardant resin composition
JP2001335699A (en) * 2000-05-30 2001-12-04 Daicel Chem Ind Ltd Flame retardant resin composition
JP2003176408A (en) * 2001-09-21 2003-06-24 Kuraray Co Ltd Polyamide composition for sealing electric and electronic parts
WO2006043460A1 (en) * 2004-10-18 2006-04-27 Asahi Kasei Chemicals Corporation Flame retardant composition
WO2006112058A1 (en) * 2005-04-13 2006-10-26 Asahi Kasei Chemicals Corporation Polyamide/polyphenylene ether resin composition
JP2008050509A (en) * 2006-08-25 2008-03-06 Asahi Kasei Chemicals Corp Flame retardant polyamide resin composition

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222572A (en) * 2009-02-24 2010-10-07 Asahi Kasei Chemicals Corp Resin composition and molded body thereof
JP2011093439A (en) * 2009-10-30 2011-05-12 Jtekt Corp Electric power steering device
JP2011162752A (en) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp Electrically conductive masterbatch and manufacturing method therefor, and electrically conductive resin composition and molded product thereof obtained using the electrically conductive masterbatch
JP2011162753A (en) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp Electroconductive resin composition, method for producing the same, and molded product obtained by using the electroconductive resin composition
JP2015030751A (en) * 2013-07-31 2015-02-16 三菱樹脂株式会社 Polyamide-based resin composition, film formed by molding the same, and injection-molded body
CN105017525A (en) * 2015-07-16 2015-11-04 株洲时代新材料科技股份有限公司 Branched modifier and corresponding flame retardant nylon resin
JP2019073657A (en) * 2017-10-18 2019-05-16 上野製薬株式会社 Liquid crystal polyester resin composition
JP7032904B2 (en) 2017-10-18 2022-03-09 上野製薬株式会社 Liquid crystal polyester resin composition
WO2024166903A1 (en) 2023-02-06 2024-08-15 三井化学株式会社 Polyamide resin composition and molded article
KR20250126806A (en) 2023-02-06 2025-08-25 미쯔이가가꾸가부시끼가이샤 Polyamide resin composition and molded article

Also Published As

Publication number Publication date
JPWO2008081878A1 (en) 2010-04-30

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