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WO2008078770A1 - Mechanical quantity sensor and method for manufacturing the same - Google Patents

Mechanical quantity sensor and method for manufacturing the same Download PDF

Info

Publication number
WO2008078770A1
WO2008078770A1 PCT/JP2007/074938 JP2007074938W WO2008078770A1 WO 2008078770 A1 WO2008078770 A1 WO 2008078770A1 JP 2007074938 W JP2007074938 W JP 2007074938W WO 2008078770 A1 WO2008078770 A1 WO 2008078770A1
Authority
WO
WIPO (PCT)
Prior art keywords
displacing
quantity sensor
mechanical quantity
manufacturing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/074938
Other languages
French (fr)
Japanese (ja)
Inventor
Akio Morii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to US12/520,343 priority Critical patent/US8216870B2/en
Priority to JP2008551132A priority patent/JP5176965B2/en
Priority to EP07860167.1A priority patent/EP2096407B1/en
Publication of WO2008078770A1 publication Critical patent/WO2008078770A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5769—Manufacturing; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Gyroscopes (AREA)

Abstract

A mechanical quantity sensor comprises: a first structure having a fixed portion with an opening, a displacing portion arranged in the opening and displacing with respect to the fixed portion, and a portion for connecting the fixed portion and the displacing portion; a second structure stacked on the first structure and having a weight portion being bonded to the displacing portion and a base being bonded to the fixed portion; a first base body arranged on the surface opposing the displacing portion, having a first drive electrode composed of a conductive material containing Al and Nd, and being connected to the fixed portion and stacked on the first structure; and a second base body arranged on the surface opposing the weight portion, having a second drive electrode composed of above-mentioned conductive material, and being connected to the base and stacked on the second structure.
PCT/JP2007/074938 2006-12-27 2007-12-26 Mechanical quantity sensor and method for manufacturing the same Ceased WO2008078770A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/520,343 US8216870B2 (en) 2006-12-27 2007-12-26 Mechanical quantity sensor and method of manufacturing the same
JP2008551132A JP5176965B2 (en) 2006-12-27 2007-12-26 Method for manufacturing mechanical quantity sensor
EP07860167.1A EP2096407B1 (en) 2006-12-27 2007-12-26 Angular velocity and/or acceleration sensor and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006352488 2006-12-27
JP2006-352488 2006-12-27

Publications (1)

Publication Number Publication Date
WO2008078770A1 true WO2008078770A1 (en) 2008-07-03

Family

ID=39562560

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074938 Ceased WO2008078770A1 (en) 2006-12-27 2007-12-26 Mechanical quantity sensor and method for manufacturing the same

Country Status (4)

Country Link
US (1) US8216870B2 (en)
EP (1) EP2096407B1 (en)
JP (1) JP5176965B2 (en)
WO (1) WO2008078770A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010060337A (en) * 2008-09-02 2010-03-18 Dainippon Printing Co Ltd Mechanical quantity sensor and method for manufacturing laminated body
JP2010141088A (en) * 2008-12-11 2010-06-24 Dainippon Printing Co Ltd Sealing type device and physical quantity sensor, and manufacturing method of them and internal pressure control method for them

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5724342B2 (en) 2009-12-10 2015-05-27 大日本印刷株式会社 Pattern arrangement method, silicon wafer and semiconductor device manufacturing method
US10761046B2 (en) 2010-11-24 2020-09-01 Sensirion Ag Electrochemical sensors and packaging and related methods
JP5541306B2 (en) 2011-05-27 2014-07-09 株式会社デンソー Mechanical quantity sensor device and manufacturing method thereof
US10108649B2 (en) * 2014-02-25 2018-10-23 Internatonal Business Machines Corporation Early exit from table scans of loosely ordered and/or grouped relations using nearly ordered maps
EP3172560A4 (en) * 2014-07-24 2018-01-24 Spec Sensors LLC Electrochemical sensors and packaging and related methods

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JPH10213441A (en) * 1997-01-29 1998-08-11 Murata Mfg Co Ltd External force detector and its manufacture
US6266862B1 (en) 1997-03-14 2001-07-31 Chicago Bridge & Iron Company Weld seam opening regulator for cylindrical tank building process
JP2002350138A (en) 2001-05-28 2002-12-04 Wacoh Corp Detector of both of acceleration and angular velocity
WO2004003936A1 (en) * 2002-06-28 2004-01-08 Sumitomo Precision Products Co., Ltd. Conductor for movable electric circuit and vibration type gyro
JP2004012326A (en) * 2002-06-07 2004-01-15 Hiroaki Niitsuma Physical quantity detector and method of manufacturing physical quantity detector
JP2004361394A (en) * 2003-05-13 2004-12-24 Seiko Instruments Inc Capacitive dynamical amount sensor
JP2006329885A (en) * 2005-05-27 2006-12-07 Dainippon Printing Co Ltd Angular velocity sensor and manufacturing method thereof
JP2006344573A (en) * 2005-05-13 2006-12-21 Gunma Prefecture Acceleration switch and electronic device

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US5461916A (en) * 1992-08-21 1995-10-31 Nippondenso Co., Ltd. Mechanical force sensing semiconductor device
JPH08304450A (en) 1995-05-12 1996-11-22 Zexel Corp Accelerometer and manufacture of accelrometer
FR2732467B1 (en) * 1995-02-10 1999-09-17 Bosch Gmbh Robert ACCELERATION SENSOR AND METHOD FOR MANUFACTURING SUCH A SENSOR
DE19632060B4 (en) * 1996-08-09 2012-05-03 Robert Bosch Gmbh Method for producing a rotation rate sensor
DE10066435B4 (en) * 1999-07-26 2012-03-08 Denso Corporation Semiconductor sensor for a physical quantity
US6400009B1 (en) * 1999-10-15 2002-06-04 Lucent Technologies Inc. Hermatic firewall for MEMS packaging in flip-chip bonded geometry
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TWI329930B (en) * 2003-05-22 2010-09-01 Seiko Instr Inc Capacitance-type dynamic-quantity sensor and manufacturing method therefor
EP1491901A1 (en) * 2003-06-25 2004-12-29 Matsushita Electric Works, Ltd. Semiconductor acceleration sensor and method of manufacturing the same
JP2005049209A (en) * 2003-07-28 2005-02-24 Matsushita Electric Works Ltd Angular velocity sensor and its manufacturing method
JP2005221450A (en) * 2004-02-09 2005-08-18 Yamaha Corp Physical quantity sensor
US7042076B2 (en) * 2004-03-09 2006-05-09 Northrop Grumman Corporation Vacuum sealed microdevice packaging with getters
JP4989037B2 (en) 2004-04-05 2012-08-01 セイコーインスツル株式会社 Capacitive mechanical quantity sensor and semiconductor device
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JP4445340B2 (en) * 2004-08-02 2010-04-07 セイコーインスツル株式会社 Sealed MEMS and manufacturing method of sealed MEMS
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JP4792143B2 (en) * 2007-02-22 2011-10-12 株式会社デンソー Semiconductor device and manufacturing method thereof
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JP2009008438A (en) * 2007-06-26 2009-01-15 Dainippon Printing Co Ltd Angular velocity sensor and manufacturing method thereof
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Publication number Priority date Publication date Assignee Title
JPH10213441A (en) * 1997-01-29 1998-08-11 Murata Mfg Co Ltd External force detector and its manufacture
US6266862B1 (en) 1997-03-14 2001-07-31 Chicago Bridge & Iron Company Weld seam opening regulator for cylindrical tank building process
JP2002350138A (en) 2001-05-28 2002-12-04 Wacoh Corp Detector of both of acceleration and angular velocity
JP2004012326A (en) * 2002-06-07 2004-01-15 Hiroaki Niitsuma Physical quantity detector and method of manufacturing physical quantity detector
WO2004003936A1 (en) * 2002-06-28 2004-01-08 Sumitomo Precision Products Co., Ltd. Conductor for movable electric circuit and vibration type gyro
JP2004361394A (en) * 2003-05-13 2004-12-24 Seiko Instruments Inc Capacitive dynamical amount sensor
JP2006344573A (en) * 2005-05-13 2006-12-21 Gunma Prefecture Acceleration switch and electronic device
JP2006329885A (en) * 2005-05-27 2006-12-07 Dainippon Printing Co Ltd Angular velocity sensor and manufacturing method thereof

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See also references of EP2096407A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010060337A (en) * 2008-09-02 2010-03-18 Dainippon Printing Co Ltd Mechanical quantity sensor and method for manufacturing laminated body
JP2010141088A (en) * 2008-12-11 2010-06-24 Dainippon Printing Co Ltd Sealing type device and physical quantity sensor, and manufacturing method of them and internal pressure control method for them

Also Published As

Publication number Publication date
US20100083755A1 (en) 2010-04-08
JPWO2008078770A1 (en) 2010-04-30
US8216870B2 (en) 2012-07-10
EP2096407B1 (en) 2016-11-16
EP2096407A4 (en) 2012-02-29
JP5176965B2 (en) 2013-04-03
EP2096407A1 (en) 2009-09-02

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