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WO2008072302A1 - Dispositif de carte à circuit imprimé d'attaque - Google Patents

Dispositif de carte à circuit imprimé d'attaque Download PDF

Info

Publication number
WO2008072302A1
WO2008072302A1 PCT/JP2006/324657 JP2006324657W WO2008072302A1 WO 2008072302 A1 WO2008072302 A1 WO 2008072302A1 JP 2006324657 W JP2006324657 W JP 2006324657W WO 2008072302 A1 WO2008072302 A1 WO 2008072302A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrode
drive circuit
address
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/324657
Other languages
English (en)
Japanese (ja)
Inventor
Takatoshi Akagi
Hideaki Ouki
Yoshinori Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plasma Display Ltd
Original Assignee
Fujitsu Hitachi Plasma Display Ltd
Hitachi Plasma Display Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Hitachi Plasma Display Ltd, Hitachi Plasma Display Ltd filed Critical Fujitsu Hitachi Plasma Display Ltd
Priority to PCT/JP2006/324657 priority Critical patent/WO2008072302A1/fr
Publication of WO2008072302A1 publication Critical patent/WO2008072302A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Definitions

  • the present invention relates to a substrate device (substrate module) provided in a display device (plasma display device: PDP device) including a plasma display panel (PDP), and more particularly to a display panel (PDP) and a drive control circuit thereof.
  • a substrate device substrate device
  • PDP device plasma display device: PDP device
  • PDP plasma display panel
  • the present invention relates to a drive circuit board device (driver module) that is electrically connected to an IC and is equipped with an IC (semiconductor integrated circuit device).
  • the electrode group of the front glass panel is electrically connected to the circuit part configured in the rear chassis, and the drive circuit (dry circuit) is connected. It has a driver module equipped with IC. In particular, it has an address driver module (abbreviated as ADM) for connecting the address electrode group of the PDP and its drive control circuit section.
  • ADM address driver module
  • a flexible printed circuit board (abbreviated as an FPC board) that is easily bent is used as a board member to connect the address electrode of the PDP on the front side and the address bus of the circuit part on the back side. ) To use! /
  • the ADM is equipped with two or more driver ICs (address driver ICs), and each driver IC force also drives the address electrode group.
  • driver ICs address driver ICs
  • each driver IC force also drives the address electrode group.
  • the drive system for all address electrodes of the PDP has a single scan configuration
  • a total of 15 ADMs will be used.
  • the screen size exceeds 50 inches, etc.
  • the drive system has a double scan configuration (a configuration in which all address electrodes are divided into two systems and driven from the upper and lower drivers), a total of 30 ADMs. Will be used.
  • a display device including the substrate module in particular, a PDP device including an ADM
  • costs related to the substrate member (FPC substrate) and the substrate module (ADM) increase.
  • FPC substrate substrate member
  • ADM substrate module
  • the ADM is a single-sided wiring of the FPC board
  • driver ICs when two or more driver ICs are mounted on one ADM, a configuration in which all the terminals are pulled out in parallel (parallel wiring) There is a need for. Since it is a single-sided wiring, a three-dimensional intersection wiring or the like is impossible. The pitch of wiring and terminals (electrodes) becomes narrow due to the increase in parallel wiring and the number of drives.
  • the present invention has been made in view of the above problems, and the object thereof is mainly a display device including the substrate module, particularly a PDP device including an ADM while maintaining performance while maintaining performance.
  • ADM is to provide a technology that can reduce the cost related to (ADM).
  • the present invention relates to a technology of a display device provided with the substrate module, particularly a PDP device provided with an ADM, characterized by the following configuration. It is a sign.
  • This board module is a drive circuit board device (driver module) that connects the display panel and its drive control circuit section and mounts the IC of the drive circuit, and in particular, the address electrode of the PDP and its address drive control. It is an ADM that is connected to the circuit section (address bus) and has an IC for the address drive circuit.
  • the substrate module (ADM) of the present invention is composed of a plurality of or one substrate member (substrate portion), and at least a part of the substrate portion is less expensive than the FPC substrate (first type substrate).
  • first type substrate use a type 2 substrate that can be wired on both sides.
  • the second type substrate is, for example, FR4 (Flame Retardant type 4: flame retardant glass epoxy laminated substrate).
  • FFC Flexible Multimediality
  • the thickness of the board part (second board part, etc.) connected to the address bus side is made larger than that of the FPC board, and it corresponds to the edge insertion connector instead of the conventional connector.
  • the substrate module is configured using three different types of substrate portions (first to third substrate portions).
  • the connection to the PDP side is configured by an FPC board (first type board) as the first board part.
  • the second type of substrate is used in at least one of the other two substrate portions (second substrate portion, third substrate portion).
  • the connection to the circuit unit side is constituted by a third substrate unit (third type substrate).
  • a second board part for relaying is formed between the first and third board parts.
  • the drive circuit IC is mounted on the first substrate (the first type substrate). Wiring and terminals connected to the IC are formed through the plurality of substrate portions between one end (circuit portion side) of the substrate device and the other end (display panel side).
  • wiring and terminals are configured on both surfaces (front and back two layers) of the second type substrate. All wiring and at least part of the terminals are wired on both sides. Double-sided wiring enables three-dimensional intersection wiring, common wiring, etc. for wiring to the IC, and allows for a sufficient wiring and terminal pitch. That is, the pitch is wider than in the past, or a large number of terminals are provided with high efficiency.
  • the thickness of the second or third substrate portion is made larger than the thickness of the first substrate (first type substrate).
  • the third substrate portion preferably has a double-sided wiring configuration to reduce the number of terminals (pins) of the terminal portion connected to the circuit portion side.
  • the number of terminals can be halved on one side compared to the conventional single-sided wiring configuration by distributing to both sides.
  • the surface of the terminal portion that is connected to the connector on the circuit portion side is preferably two layers on both sides. As a result, there is a margin in the pitch between terminals. Further, due to the margin of the wiring and terminal pitch, for example, inexpensive tin plating can be used without using gold plating.
  • the present board module is composed of two different types of board parts (first and second board parts), and the third board part is eliminated.
  • the configuration is integrated with the second substrate unit. Connection to the PDP side is made by the first substrate section. In the second board part connected to the circuit part side, the second type board is used.
  • the present substrate module is configured by a single substrate portion of a different type, and the first and second substrate portions are eliminated, and the first substrate is eliminated. It is a structure that is integrated with the department.
  • the second type substrate is used as the single substrate portion.
  • the display device has the following configuration, for example.
  • the display device includes a display panel (PDP) including an electrode group including address electrodes, and a circuit unit for driving and controlling the display panel in the chassis on the back side.
  • a plurality of address drive circuit board devices ADMs.
  • the address drive circuit board device electrically connects and wires the address electrode group of the display panel and the address bus (address drive control circuit unit) of the circuit unit in the chassis on the back side of the address electrode group. Equipped with an address drive circuit IC for group drive.
  • the drive circuit board device includes first, second, and third board portions.
  • the first substrate portion is connected to the end portion of the address electrode group on the display panel side and is arranged in a curved manner.
  • the first electrode connected to the end portion of the address electrode group and the second electrode portion are connected.
  • a second electrode connected to the end portion of the substrate portion side, and an IC (first component) is mounted between the first and second electrodes.
  • the second substrate part is provided with a relay wiring connected to the IC, and is arranged substantially in a plane.
  • the third electrode connected to the second electrode and the third substrate part side And a fourth electrode connected to the end of the first electrode.
  • the third board portion is connected to the address bus side and arranged in a substantially planar manner.
  • a fifth electrode connected to the pole and a sixth electrode connected to the address bus side are included.
  • the first substrate unit is configured by a first type substrate (FPC substrate) with single-sided wiring
  • the second substrate unit is configured by a second type substrate (FR4) with double-sided wiring
  • the third substrate section is configured by a third type substrate (FFC) of single-sided wiring or double-sided wiring.
  • the second electrode of the first board part and the third electrode of the second board part are ACF-connected
  • the second The fourth electrode of the first board part and the fifth electrode of the third board part are ACF-connected
  • a relay capacitor is mounted on the second board part, and the second and third board parts
  • the wiring has a data input signal line for the IC, a control signal line, and a power supply Z ground line.
  • the drive circuit board device includes first and second board parts.
  • the first substrate section has the same configuration as the first substrate section (1).
  • the second substrate portion is provided with a relay wiring connected to the IC, connected to the address node side, and arranged in a substantially planar manner.
  • a third electrode connected to the second electrode and And a fourth electrode connected to the end portion on the address bus side.
  • the first substrate portion is constituted by a first type substrate (FPC substrate) of single-sided wiring
  • the second substrate portion is constituted by a second type substrate (FR4) of double-sided wiring.
  • the thickness of the substrate excluding the edge (terminal portion) of the second substrate portion is 200 ⁇ m or less.
  • the fourth electrodes of the second board portion are divided into two groups by double-sided wiring, and are connected to the edge insertion connector on the address node side.
  • the in particular, the fourth electrode of the second substrate portion is tinned.
  • the drive circuit board device includes a single board unit.
  • the board part is connected to the end of the address electrode group on the display panel side, and is provided with a relay wiring connected to the IC, connected to the address bus side, and arranged in a curved manner on a part of the display panel side
  • the wiring has a first electrode connected to the end portion of the address electrode group and a second electrode connected to the end portion on the address bus side, and is between the first and second electrodes.
  • IC and capacitor are mounted.
  • the board portion is composed of a double-sided wiring board (FR4).
  • the substrate portion has a substrate thickness excluding edges of 200 m or less.
  • the second electrodes of the substrate section are divided into two groups by double-sided wiring and are connected to an edge insertion connector on the address bus side.
  • the second electrode of the substrate part is tinned.
  • the cost of the board member can be greatly reduced by reducing the number of expensive FPC boards. Further, the necessity of using the clamp type connector or the like is reduced, a particularly inexpensive edge connector can be used, and the cost including the peripheral members of the board module can be reduced comprehensively.
  • wiring connected to the driver IC can be three-dimensionally crossed wiring, common wiring, and the like. ) Can be spared. Also, the corresponding connector can be reduced in width and pitch can be increased.
  • the wiring and terminal pitch can be afforded in the terminal portion of the substrate, it is effective for countermeasures against the whistling force, and the need for using, for example, gold plating is reduced, and the cost can be reduced.
  • FIG. 1 is a diagram showing a configuration of a PDP device according to an embodiment of the present invention.
  • FIG. 2 is a diagram showing a planar configuration before the installation of the address driver module provided in the PDP device according to the first embodiment of the present invention, (a) is a configuration viewed from the surface side force facing the chassis; ) Is a configuration in which lateral force is also seen.
  • FIG. 3 is a diagram showing a cross-sectional configuration after mounting an address driver module provided in the PDP device according to the first embodiment of the present invention.
  • FIG. 4 is a diagram showing a schematic configuration of wiring connection in the address driver module provided in the PDP device according to the first embodiment of the present invention.
  • FIG. 5 shows an address driver module provided in the PDP device according to the second embodiment of the present invention. It is a figure which shows the plane structure before attachment, (a) is the structure which also looked at back side force, (b) is the structure which also looked at lateral force.
  • FIG. 6 is a diagram showing a cross-sectional configuration after mounting an address driver module provided in the PDP device according to the second embodiment of the present invention.
  • Fig. 7 is a diagram showing a plan configuration before mounting the address driver module provided in the PDP device according to the third embodiment of the present invention, (a) is a configuration viewed from the surface side force facing the chassis, (b) ) Is a configuration in which lateral force is also seen.
  • FIG. 8 is a diagram showing a cross-sectional configuration after mounting an address driver module provided in a PDP device according to a third embodiment of the present invention.
  • FIG. 9 (a) is a diagram showing a configuration example of connection on the address node side in a conventional address driver module, and (b) is an add-on provided in the PDP device of one embodiment of the present invention. It is a figure which shows the structural example of the connection by the side of an address bus in a less driver module.
  • FIG. 10 is a diagram showing a planar configuration before mounting an address driver module provided in a conventional PDP device.
  • FIG. 11 is a diagram showing a cross-sectional configuration after the installation of the address driver module provided in the conventional PDP device, where (a) is a configuration that also shows the rear side force, and (b) is a configuration that is viewed from the side. Best Mode for Carrying Out the Invention
  • FIG. 10 shows a planar configuration of a conventional ADM.
  • a conventional ADM is composed of a single FPC board (polyimide substrate) 900.
  • the first end (941) of the FPC board 900 is connected to the end of the PDP (IO), that is, the end of the address electrode, and the second end (942) is It is connected to the end (connector) of the dress bus board (15).
  • the FPC board 900 has a metal plate (aluminum heat radiating plate) 910 that plays a role of holding and radiating heat to the chassis (20).
  • the metal plate 910 and the like are considered as peripheral members of the ADM.
  • the FPC board 900 is a single-sided copper foil wiring, and is mounted with a driver IC 950 for driving the address electrode group, for example, two driver ICs 950.
  • the driver IC 950 is mounted and mounted by, for example, wire bonding.
  • One driver IC 950 has, for example, a 192-bit output (that is, can drive 192 address electrodes).
  • the number of terminals (pins) in the terminal portion (942) connected to the terminal (connector) on the address bus board (15) side in the FPC board 900 is, for example, 50 on only one side.
  • the connection on the address bus board (15) side is done by crimping using a clamp-type connector, which is a multicore connector (Fig. 9 (a)). Since it is a single-sided wiring of the FPC board 900, three-dimensional crossover (crossing) wiring or the like is impossible, and all wiring connected to the driver IC 950 is parallel wiring. For this reason, the terminal pitch is narrowed particularly at the end (942) on the address bus board (15) side.
  • a gold plating or the like is used when the terminal portion (942) takes a countermeasure against a whistling force against a narrow pitch.
  • the size of the FPC board 900 is, for example, the width (SX) force 102 mm of the terminal portion (941) on the PDP 10 side, and the vertical length (SY) is 59 mm. Further, the size of the metal plate 910 is, for example, the horizontal width is approximately the same as the horizontal width (SX) of the FPC board 900, and the vertical length (H) is 18 mm.
  • FIG. 11 shows a cross-sectional structure of a conventional ADM! /.
  • One end (942) force of the FPC board 900 is connected to the end (connector) of the address bus board (15) (not shown).
  • the other end (941) of the FPC board 900 is connected to the end of the address electrode drawn out to the end of the PDP 10 by, for example, thermocompression bonding, in an arrangement in which the FPC board 900 is bent by about 180 degrees.
  • the back side of the FPC board 900 near the driver IC 950 is pressed by the metal plate 910.
  • the metal plate 910 is fixed by tightening the screws 971 to the boss portions 972 on the chassis 20 side, for example, at the positions of the screw holes 970 at both ends.
  • a space is provided between the driver IC 950 and the chassis 20.
  • a PDP apparatus according to Embodiment 1 of the present invention will be described with reference to FIGS. Implementation form
  • the feature of the first aspect is that the ADM is composed of three types of substrate portions, and the second substrate portion is double-sided wiring by FR4.
  • the PDP device which is the basic configuration of the present embodiment, mainly has a front-side PDP 10 and a rear-side chassis 20 that holds the PDP 10 and is configured with a circuit unit and the like. Configured.
  • the circuit portion mainly includes various drive circuits (drivers), a control circuit board 91, a signal processing circuit board 92, a power supply circuit board 93, and the like.
  • the drive circuit includes an X drive circuit section (X drive circuit board 11 and X drive relay board 12) that drives the X electrode (sustain electrode) of the PDP10, and a Y drive circuit that drives the Y electrode (sustain scan electrode) of the PDP10.
  • the address drive circuit unit includes an address bus board (address drive relay board) 15 and a plurality of ADMs (address driver modules) 100. Circuits such as each driver are mounted on an IC board.
  • the control circuit board 91 controls the whole including each drive circuit and the like.
  • the control circuit board 91 is connected to the X drive circuit board 11, the Y drive circuit board 13, the address node board 15, and the like.
  • the signal processing circuit board 92 processes data information input to the control circuit board 91.
  • the power circuit board 93 supplies power to each part.
  • an X drive relay board 12 is connected to the X drive circuit board 11, and the X drive relay board 12 is connected to the X electrode group through a connection portion such as a flexible cable 81.
  • the X drive circuit board 11 drives the X electrode group in common and performs sustain drive of the X electrode.
  • a scanning drive circuit board 14 is connected to the Y drive circuit board 13, and is connected to the Y electrode group from the scan drive circuit board 14 through a connecting portion such as a flexible cable 82.
  • the Y drive circuit board 13 drives the Y electrode group in common via the scan drive circuit board 14 and performs the sustain drive of the Y electrodes.
  • the scanning drive circuit board 14 individually scans and drives the Y electrode groups.
  • each ADM 100 is connected to the address bus substrate 15 and is connected to the address electrode group through a connection portion such as an FPC substrate in the ADM 100.
  • Ad The Lesbus board 15 relays and distributes the drive control signal from the control circuit board 91 to each ADM 100.
  • Each driver IC mounted on each ADM 100 generates and outputs a signal (drive waveform) for individually driving the address electrode group according to the input of the drive control signal.
  • the driver IC plays a central role as an address drive circuit.
  • a total of eight ADMs 100 are provided in the PDP device.
  • Each ADM 100 has the same configuration.
  • the PDP 10 is mainly configured by combining a front and back substrate structure made of glass and sealing a discharge gas in a space between them.
  • the three-electrode type has an X electrode as a first electrode, a Y electrode as a second electrode, and an address electrode as a third electrode.
  • a display row is composed of a pair of display electrode X electrode and Y electrode, and a display column and cell are formed by the intersection of the display electrode and the address electrode.
  • the cell region is divided by barrier ribs, and phosphors of each color (R, G, B) are formed separately.
  • a set of cells of each color is associated with a pixel.
  • an address electrode group is drawn from one side (the lower side in this example) of the PDP 10 and connected to the address drive circuit side. That is, in this example, all the address electrodes are divided into 8 groups, and each is connected to the corresponding ADM 100 (particularly its driver IC).
  • the AD M101 includes a first substrate 110, a second substrate 120, and a third substrate 130.
  • the first substrate 110 also has an FPC substrate force.
  • the second substrate 120 also has FR4 force.
  • the third substrate 130 is made of FFC (polyester-based substrate).
  • the first substrate 110 and the second substrate 120 are connected to each other (42, 43), and the second substrate 120 and the third substrate 130 are connected to each other (44, 45). Consists of.
  • the first end (41) of the first substrate 110 is connected to the end of the PDP 10, that is, the end of the address electrode.
  • the end (46) of the third substrate 130 is connected to the end (connector) of the address bus board 15.
  • the first board 110 is an FPC board with a single-sided copper foil wiring, and a driver IC (adder) that is the first component. Less driver IC) 50 is mounted. Depending on the width of the FPC board, two driver ICs 50 are mounted on one ADM100.
  • the driver IC 50 is, for example, a bare chip, and is mounted and mounted on the first substrate 110 by batch bonding.
  • the second substrate 120 is a double-sided wiring FR4, on which a surface mount capacitor (SMD capacitor) 60, which is a second component, is mounted.
  • the second substrate 120 functions as a relay between the first substrate 110 and the third substrate 130.
  • the SMD capacitor 60 functions as a power supply filter.
  • Two SMD capacitors 60 are mounted corresponding to the two driver ICs 50.
  • the second substrate 120 has a screw hole 71 for screwing, for example, for connection with the chassis 20.
  • the third substrate 130 is a straight single-sided FFC, and is connected to an end (connector) on the address bus substrate 15 side.
  • the electrode at the end (sixth electrode 46) has, for example, a pitch of 0.5 mm, 50 terminals on one side, and uses a 50-core connector for connection.
  • gold plating is used for the terminal portion (46).
  • the wiring (electrode) between the address bus substrate 15 side in the ADM 101 of the first embodiment and the address electrode side of the PDP 10 is referred to as follows.
  • the end connected to one PDP 10 side is referred to as a first electrode 41
  • the end connected to the other second substrate 120 side is referred to as a second electrode 42.
  • an end portion connected to one first substrate 110 side is referred to as a third electrode 43
  • an end portion connected to the other third substrate 130 side is referred to as a fourth electrode 44.
  • the end connected to one second substrate 120 side is referred to as a fifth electrode 45
  • the end connected to the other address bus substrate 15 side is referred to as a sixth electrode 46.
  • each substrate portion is, for example, as follows.
  • the first substrate 110 has a horizontal width (SX1) of 94 mm and a vertical length (SY1) of 40 mm.
  • the second substrate 120 has a lateral width (SX2) force of 0 mm and a vertical length (SY2) of 20 mm.
  • the vertical length (SY3) of the third substrate 130 is 25 mm.
  • the second substrate (FR4) 120 of the first embodiment has a thickness (dl) of, for example, lmm so that the second substrate (FR4) 120 is relatively hard and does not bend so much, and the second substrate 140 of the second embodiment 140 to be described later. It is larger than the thickness (d2).
  • the lower side portion of the chassis 20 has a bent shape corresponding to the connection of the ADM 101.
  • the first board 110 is connected to the PDP 10 side, and the third board 130 is connected to the address bus board 15 side.
  • the first substrate 110 is arranged such that the side connected to the PDP 10 is curved by 180 degrees.
  • the second substrate 120 is fixed to the lower side of the chassis 20 by screwing with a screw 201 or the like.
  • a region including the vicinity of the driver IC 50 of the first substrate 110 and a part of the second substrate 120 are fixed by a pressing member (thermal conductive metal plate or the like) 200.
  • the holding member 200 is a heat conductive metal plate or the like.
  • the shape of the pressing member 200 is an example.
  • a heat radiation sheet (thermally conductive member) 210 is disposed before and after the driver IC 50 of the first substrate 110.
  • the pressing member 200 sandwiches the vicinity of the driver IC 50 and the heat radiating sheet 210 with the chassis 20 surface, and a part of the pressing member 200 is fixed together with the second substrate 210 by screwing the screws 201.
  • the holding member 200 has a role of fixing and heat dissipation, but may be omitted.
  • the heat generated during use of the device is transferred to the outside through the heat dissipation sheet 202, the holding member 200, the chassis 20, the screw 201, and the like.
  • the wiring from the sixth electrode 46 to the fifth electrode 65 has, for example, a plurality of data input signals (D), three control signals (C), and three power supply ZGND lines (PG).
  • the wiring is double-sided.
  • the fourth electrode 44 and the fifth electrode 45 are bonded and electrically connected in an ACF connection, that is, in a direction perpendicular to the substrate.
  • 4th electrode 44 to 4th The wiring on the three electrodes 43 is branched into two similar wirings by double-sided wiring corresponding to the two driver ICs 50 (50-1, 50-2) of the first substrate 110.
  • the number of third electrodes 43 is double that of the fourth electrodes 44.
  • the first substrate 110 serving as an output to the address electrode it is a single-sided wiring.
  • the second electrode 42 and the third electrode 43 are ACF-connected.
  • the wiring is connected from the second electrode 42 to the terminal part of the driver IC50.
  • the terminal force of the driver IC 50 is also connected to the first electrode 41 by wiring. That is, the first electrode 41 corresponds to the drive output (0 # 1, 0 # 2) to the address electrode of the driver IC50.
  • the drive output (0 # 1, 0 # 2) of each driver IC50 is, for example, 192 bits. Each bit output is connected to the end of the address electrode.
  • the second substrate (FR4) 120 can be double-sided wiring, it is possible to share the common part of the signal wirings of the two driver ICs 50 by using two layers of front and back wiring. For example, by using the above-mentioned two-layer wiring for 10 common parts, the number of conventional wirings' terminals, for example, 50 can be reduced to 40. Correspondingly, the number of wires on the third substrate 130 is also reduced.
  • the FPC board is reduced and the second board part 120 (FR4) and the third board part 130 (FFC), which are inexpensive members, are used.
  • the strike can be greatly reduced. This can reduce the overall cost of the PDP device.
  • the second embodiment is characterized in that the ADM is composed of two types of substrate parts, and the second substrate part is a double-sided wiring by FR4.
  • the configuration of the ADM 102 of the second embodiment is such that the third substrate 130 of the first embodiment is eliminated and the second substrate 120 has the function.
  • the ADM 102 includes a first substrate 110 and a second substrate 140.
  • the first substrate 110 has the same configuration as that of the first embodiment, including the driver IC50.
  • the second substrate 140 corresponds to the one in which the second substrate 120 and the third substrate 130 of Embodiment 1 are integrated into one, and is composed of FR4 cables with double-sided wiring.
  • the second substrate 140 also performs signal wiring and connection to the address bus substrate 15 side, which was performed on the third substrate 130 of the first embodiment.
  • the ADM 102 connects the ends (42, 43) of the first substrate 110 and the second substrate 140 to each other by ACF (FIG. 5).
  • the other end (47) of the second substrate 140 is connected to an end (connector) on the address bus substrate 15 side.
  • the terminal portion of the second substrate 140 is referred to as the third electrode 43 on the side connected to the first substrate 110 side, and the fourth electrode 47 on the side connected to the address bus substrate 15 side.
  • the pitch is 0.5 mm
  • the number of terminals on one side is 25, and 50 on both sides.
  • a double-sided connection type connector is used (FIG. 9 (b)).
  • the terminal portion (47) uses, for example, gold plating or tin plating. Since the terminal part (47) of the second substrate 140 has a double-sided configuration, the number of terminals that can be provided is doubled compared to the 50 terminals only on one side of the conventional configuration (terminal part (942) in FIG. 10). (Simply up to 100 terminals).
  • the pitch can be approximately doubled by dividing the both sides.
  • the number of terminals at the end (47) can be reduced by using a common wiring by double-sided wiring (for example, 20 on one side and 40 on both sides).
  • each substrate portion is, for example, as follows.
  • the first substrate 110 is the same as that in the first embodiment.
  • the longer width (SX21) of second substrate 140 is 90 mm, and the vertical length is 20 mm of the length (SY21) of the portion corresponding to second substrate 120 of the first embodiment.
  • the length of the third substrate 1 30 corresponding part (SY22) is 15 mm.
  • the first substrate 110 is fixed to the lower side portion of the chassis 20 near the dry IC 50 by fixing the screws 201 or the like.
  • the heat radiation sheet 202 is arranged before and after the driver IC 50 and is sandwiched and fixed by the pressing member 200.
  • the shape of the pressing member 200 is just an example.
  • Substrate member thickness (d2) excluding the edge portion of second substrate 140 in the second embodiment is 200 m or less.
  • the second substrate (FR4) 140 of the second embodiment has a thickness (d2) of, for example, 0.1 mm (100 / zm) so as to bend more than the second substrate 120 of the first embodiment.
  • the thickness of this FR4 (for example, 0.1 mm) is thinner than the conventional FR4 product.
  • the plate thickness of the substrate portion it is generally considered that a plate thickness of about 100 to 150 / zm is appropriate for bending and bending a thin substrate.
  • the thickness is about 20 / zm on both sides. Therefore, in the present embodiment, the plate thickness is set to 200 m or less in consideration of such margins.
  • the address nose board 15 and the ADM100 in two layers on the front and back sides using FR4 double-sided wiring. Therefore, when multiple driver ICs 50 are mounted, Wiring such as power supply and GND can be shared (common wiring), and the width of the connector on the address bus board 15 side can be reduced and the pitch can be increased. This is effective as a countermeasure against the whistling force, and it is also possible to use only tin plating without using expensive gold plating. Cost can be reduced by reducing the number of terminals (number of connector cores) of the terminal section (47) on the address bus board 15 side.
  • FR4 second board part 120 which is a member thicker than the FPC board (first board part 110), FF C (first board part)
  • FF C first board part
  • Embodiment 3 of the present invention will be described with reference to FIGS.
  • the feature of the third embodiment is that the ADM is composed of one type of substrate portion, and the substrate portion is a double-sided wiring by FR4.
  • the configuration of the ADM 103 of the third embodiment is such that the first substrate 110 and the third substrate 130 of the first embodiment are abolished and the function is provided to the second substrate 120.
  • the ADM 103 includes a substrate 150.
  • the substrate 150 corresponds to a combination of the first substrate 110, the second substrate 120, and the third substrate 130 of the first embodiment, and the second substrate 120 of the first embodiment and the second substrate 120 of the second embodiment.
  • the second board 140 Like the second board 140, it consists of FR4 cables with double-sided wiring.
  • the board 150 includes the driver IC 50 and the SMD capacitor 60, connection to the PDP 10 side, relay wiring to the driver IC 50, signal wiring and connection to the address bus board 15 side, and the first embodiment. Have all the roles shown in 2. Therefore, in the third embodiment, only one type / one substrate 150 is configured as the substrate member. The thickness of the substrate 150 is larger than that of the FPC substrate. Further, the board 150 has a screw hole 72 for connection to the chassis 20 side, for example, corresponding to the position of the driver IC 50.
  • the side of the terminal portion of the substrate 150 that is connected to the PDP 10 is the first electrode 41, and the side that is connected to the end portion (connector) of the address bus substrate 15 is the second electrode 48.
  • the pitch is 0.5 mm
  • the number of terminals on one side is 25, and the number is 50 on both sides.
  • a double-sided connection type connector is used (FIG. 9 (b)).
  • the terminal portion (48) uses, for example, gold plating or tin plating.
  • the size of the substrate 150 is, for example, as follows.
  • the width (SX1) force on the PDP10 connection side of the substrate 150 is S94mm, and the middle width (SX12) that is slightly narrower is 90mm.
  • the vertical length of the substrate 150 is such that the length (SY11) corresponding to the first substrate 110 and the second substrate 120 in the first embodiment is 80 mm, and the length corresponding to the third substrate 130 in the first embodiment. (SY12) is 15mm.
  • the substrate 150 is fixed to the lower side of the chassis 20 by screwing the screw 201 or the like in the vicinity of the dry IC 50 of the substrate 150.
  • the heat release sheet 202 is arranged before and after the driver IC 50 and is sandwiched and fixed by the pressing member 200.
  • the substrate 150 is disposed substantially straight except for a portion that is curved on the connection side of the PDP 10.
  • the substrate member plate thickness (d3) excluding the edge portion of the substrate 150 in the third embodiment is 200 ⁇ m or less.
  • Embodiment 3 the same effect as in Embodiment 2 can be obtained by the configuration integrated into one substrate part (substrate 150), and the effect that the member cost can be further reduced by eliminating the FPC substrate is obtained. It is done.
  • FIG. 9 a configuration example of connector connection on the input terminal side (address bus board connection side) of the ADM in the conventional configuration and the present embodiment (2, 3) will be described in comparison.
  • it is effective to apply a connector configuration as shown in FIG. 9 (b).
  • FIG. 9A shows the connection of ADM 900 by a single-side connection type clamp-type connector (connector with flip 910) as a conventional configuration example.
  • the vicinity of connector terminal 912 of connector 910 with flip is shown in cross section.
  • the terminal (electrode) 901 on the connection side of the address bus board (15) of the ADM900 is inserted into the flip (movable lid) 912 of the connector 910 with flip, and the flip 912 is closed. It is made to the state that was made.
  • Terminal 90 1 is a connection on one side only.
  • FIG. 9B shows a cross section of connection of the ADM 100 by the edge insertion connector (edge connector) 300 in the present embodiment.
  • edge connector edge connector
  • the terminal 40 has a double-sided configuration.
  • the edge connector 300 (connector terminal 301) has a double-sided double-sided surface connecting the terminal 40.
  • the above configuration can be similarly applied to a driver module other than ADM 100 and a substrate module of a display device other than a PDP device.
  • the present invention can be used for a display device such as a PDP device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne une technique dans laquelle, dans un afficheur possédant un module à carte, en particulier dans un dispositif de type panneau PDP possédant un module ADM, le coût associé au module à carte (ADM) peut être réduit tout en en conservant les performances. Le dispositif de panneau PDP comprend le panneau PDP incluant des électrodes d'adressage, des sections de circuits dans un châssis à l'arrière de celui-ci, ainsi que les modules ADM permettant de relier et de câbler électriquement un groupe d'électrodes d'adressage et des bus d'adressage des sections de circuits afin de placer sur ceux-ci des circuits intégrés pour les circuits d'attaque d'adresses. Selon une première conception, le module ADM comprend une première section de carte (une carte de type FPC à câblage simple face), une seconde section de carte (une carte FR (4) à câblage double face) et une troisième section de carte (FFC).
PCT/JP2006/324657 2006-12-11 2006-12-11 Dispositif de carte à circuit imprimé d'attaque Ceased WO2008072302A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/324657 WO2008072302A1 (fr) 2006-12-11 2006-12-11 Dispositif de carte à circuit imprimé d'attaque

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/324657 WO2008072302A1 (fr) 2006-12-11 2006-12-11 Dispositif de carte à circuit imprimé d'attaque

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WO2008072302A1 true WO2008072302A1 (fr) 2008-06-19

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0792480A (ja) * 1993-09-22 1995-04-07 Sharp Corp 表示装置
JP2001013883A (ja) * 1999-06-30 2001-01-19 Fujitsu Ltd ドライバｉｃ実装モジュール及びそれを使用した平板型表示装置
JP2002134567A (ja) * 2000-10-19 2002-05-10 Advanced Display Inc チップキャリアフィルムおよびその製造方法ならびにこのチップキャリアフィルムを使用した液晶表示装置
JP2003115568A (ja) * 2001-07-30 2003-04-18 Fujitsu Hitachi Plasma Display Ltd Ｉｃチップの実装構造及びディスプレイ装置
JP2005099308A (ja) * 2003-09-24 2005-04-14 Seiko Epson Corp 電気光学装置、電子機器及び電気光学装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0792480A (ja) * 1993-09-22 1995-04-07 Sharp Corp 表示装置
JP2001013883A (ja) * 1999-06-30 2001-01-19 Fujitsu Ltd ドライバｉｃ実装モジュール及びそれを使用した平板型表示装置
JP2002134567A (ja) * 2000-10-19 2002-05-10 Advanced Display Inc チップキャリアフィルムおよびその製造方法ならびにこのチップキャリアフィルムを使用した液晶表示装置
JP2003115568A (ja) * 2001-07-30 2003-04-18 Fujitsu Hitachi Plasma Display Ltd Ｉｃチップの実装構造及びディスプレイ装置
JP2005099308A (ja) * 2003-09-24 2005-04-14 Seiko Epson Corp 電気光学装置、電子機器及び電気光学装置の製造方法

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