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WO2008040761A3 - Procede d'electroformage et piece ou couche obtenue par ce procede - Google Patents

Procede d'electroformage et piece ou couche obtenue par ce procede Download PDF

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Publication number
WO2008040761A3
WO2008040761A3 PCT/EP2007/060506 EP2007060506W WO2008040761A3 WO 2008040761 A3 WO2008040761 A3 WO 2008040761A3 EP 2007060506 W EP2007060506 W EP 2007060506W WO 2008040761 A3 WO2008040761 A3 WO 2008040761A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer obtained
electroforming
gold
electroforming method
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/060506
Other languages
English (en)
Other versions
WO2008040761A2 (fr
Inventor
Joachim Grupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swatch Group Research and Development SA
Original Assignee
Swatch Group Research and Development SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swatch Group Research and Development SA filed Critical Swatch Group Research and Development SA
Priority to US12/444,046 priority Critical patent/US20100024930A1/en
Priority to JP2009530878A priority patent/JP2010506040A/ja
Priority to KR1020097008807A priority patent/KR101326883B1/ko
Priority to EP07820883A priority patent/EP2079859A2/fr
Publication of WO2008040761A2 publication Critical patent/WO2008040761A2/fr
Publication of WO2008040761A3 publication Critical patent/WO2008040761A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Adornments (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une pièce électroformée en alliage d'or, caractérisée en ce que l'alliage d'or est composé de 88 à 94% en poids d'or, x% de cuivre et/ou d'argent en poids, et 2x% de zinc en poids, x étant compris entre 2 et 4.
PCT/EP2007/060506 2006-10-03 2007-10-03 Procede d'electroformage et piece ou couche obtenue par ce procede Ceased WO2008040761A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/444,046 US20100024930A1 (en) 2006-10-03 2007-10-03 Electroforming method and part or layer obtained via the method
JP2009530878A JP2010506040A (ja) 2006-10-03 2007-10-03 電気鋳造方法とこの方法によって得られた部品または層
KR1020097008807A KR101326883B1 (ko) 2006-10-03 2007-10-03 전기주조 방법 및 상기 방법을 이용하여 수득한 부품 또는 막
EP07820883A EP2079859A2 (fr) 2006-10-03 2007-10-03 Procede d'electroformage et piece ou couche obtenue par ce procede

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1583/06 2006-10-03
CH01583/06A CH714243B1 (fr) 2006-10-03 2006-10-03 Procédé d'électroformage et pièce ou couche obtenue par ce procédé.

Publications (2)

Publication Number Publication Date
WO2008040761A2 WO2008040761A2 (fr) 2008-04-10
WO2008040761A3 true WO2008040761A3 (fr) 2008-11-06

Family

ID=38799403

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/060506 Ceased WO2008040761A2 (fr) 2006-10-03 2007-10-03 Procede d'electroformage et piece ou couche obtenue par ce procede

Country Status (7)

Country Link
US (1) US20100024930A1 (fr)
EP (1) EP2079859A2 (fr)
JP (1) JP2010506040A (fr)
KR (1) KR101326883B1 (fr)
CN (1) CN101611176A (fr)
CH (1) CH714243B1 (fr)
WO (1) WO2008040761A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2505691B1 (fr) * 2011-03-31 2014-03-12 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N
CN102539217A (zh) * 2011-12-26 2012-07-04 昆山全亚冠环保科技有限公司 一种银金合金金相腐蚀剂以及金相显示方法
CN112725653A (zh) * 2020-12-21 2021-04-30 有研亿金新材料有限公司 一种新型高塑性金基电刷材料及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724687A (en) * 1952-05-08 1955-11-22 Spreter Victor Baths for the deposit of gold alloys by electroplating
JPH01247540A (ja) * 1988-03-29 1989-10-03 Seiko Instr Inc 硬質金合金外装部品の製造方法
EP0480876A2 (fr) * 1990-10-08 1992-04-15 Metaux Precieux Sa Metalor Dépôt electrolytique sous forme d'un alliage d'or contenant du cuivre et du zinc ainsi que son procédé de production

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596454A (en) * 1949-09-10 1952-05-13 Metals & Controls Corp Gold alloys
US2660554A (en) * 1950-11-10 1953-11-24 Barnet D Ostrow Bright gold and gold alloy plating baths
US2976180A (en) * 1957-12-17 1961-03-21 Hughes Aircraft Co Method of silver plating by chemical reduction
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
DE2244434C3 (de) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
CH622829A5 (fr) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
JPS5662984A (en) * 1979-10-25 1981-05-29 Seiko Epson Corp Gold plating constitution of external parts for watch
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
DE3633529A1 (de) * 1986-10-02 1988-05-19 Lpw Chemie Gmbh Verfahren zum galvanischen abscheiden niedrigkaraetiger gold/kupfer/zink-legierungen
EP0304315B1 (fr) * 1987-08-21 1993-03-03 Engelhard Limited Bain de déposition électrolytique d'un alliage or-cuivre-zinc
DE3929569C1 (fr) * 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
US5244593A (en) * 1992-01-10 1993-09-14 The Procter & Gamble Company Colorless detergent compositions with enhanced stability
US5256275A (en) * 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys
US5340529A (en) * 1993-07-01 1994-08-23 Dewitt Troy C Gold jewelry alloy
ATE220736T1 (de) * 1995-11-03 2002-08-15 Enthone Omi Inc Elektroplattierungsverfahren, zusammensetzungen und überzügen
JP3933930B2 (ja) * 1999-06-17 2007-06-20 デグサ ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング 光沢のある金層および金合金層を電着するための酸性浴および電着用光沢剤
JP4023138B2 (ja) * 2001-02-07 2007-12-19 日立金属株式会社 鉄基希土類合金粉末および鉄基希土類合金粉末を含むコンパウンドならびにそれを用いた永久磁石
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
EP1548525B2 (fr) * 2003-12-23 2017-08-16 Rolex Sa Elément en céramique pour boîte de montre et procédé de fabrication de cet élément
JP4566667B2 (ja) * 2004-01-16 2010-10-20 キヤノン株式会社 めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724687A (en) * 1952-05-08 1955-11-22 Spreter Victor Baths for the deposit of gold alloys by electroplating
JPH01247540A (ja) * 1988-03-29 1989-10-03 Seiko Instr Inc 硬質金合金外装部品の製造方法
EP0480876A2 (fr) * 1990-10-08 1992-04-15 Metaux Precieux Sa Metalor Dépôt electrolytique sous forme d'un alliage d'or contenant du cuivre et du zinc ainsi que son procédé de production

Also Published As

Publication number Publication date
JP2010506040A (ja) 2010-02-25
CH714243B1 (fr) 2019-04-15
CN101611176A (zh) 2009-12-23
KR20090069324A (ko) 2009-06-30
EP2079859A2 (fr) 2009-07-22
US20100024930A1 (en) 2010-02-04
KR101326883B1 (ko) 2013-11-11
WO2008040761A2 (fr) 2008-04-10

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