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WO2007111327A1 - Substrat a transmission optique, son procede de fabrication et dispositif a transmission optique. - Google Patents

Substrat a transmission optique, son procede de fabrication et dispositif a transmission optique. Download PDF

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Publication number
WO2007111327A1
WO2007111327A1 PCT/JP2007/056317 JP2007056317W WO2007111327A1 WO 2007111327 A1 WO2007111327 A1 WO 2007111327A1 JP 2007056317 W JP2007056317 W JP 2007056317W WO 2007111327 A1 WO2007111327 A1 WO 2007111327A1
Authority
WO
WIPO (PCT)
Prior art keywords
refractive index
optical transmission
optical
substrate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/056317
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English (en)
Japanese (ja)
Inventor
Takahiro Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2008507504A priority Critical patent/JP5244585B2/ja
Publication of WO2007111327A1 publication Critical patent/WO2007111327A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Definitions

  • the present invention relates to a through hole in which an optical transmission body that optically connects a front surface and a back surface of a substrate is formed in a substrate for an opto-electric hybrid circuit constituting an electric signal wiring and an optical signal wiring in an electronic device.
  • the present invention relates to an optical transmission board having the same, a manufacturing method thereof, and an optical transmission apparatus.
  • the operating speed of the semiconductor device and the number of signal input / output terminals tend to increase in the future.
  • the number of signal lines on the circuit board on which the semiconductor device is mounted has also increased significantly.
  • the wiring density tends to increase.
  • an optical transmission technology that converts an electric signal input / output to / from a semiconductor device into an optical signal and transmits the optical signal through an optical wiring such as an optical waveguide formed on a circuit board is studied. Being sung.
  • signal light is transmitted using a through hole provided between the front and back surfaces of the circuit board, which is formed only by the optical waveguides formed on the front and back surfaces of the circuit board.
  • a route is also proposed.
  • Such a transmission path is formed by, for example, filling a hole penetrating the circuit board perpendicularly to the optical waveguide with transparent resin.
  • an optical transmission board that enables three-dimensional transmission of an optical signal can be configured as in the conventional electric wiring board. Since an optical transmission board is usually in a form in which electrical wiring is also mixed, it is more commonly referred to as an opto-electric hybrid circuit board.
  • FIG. 7 is a schematic view showing a typical example of a conventional opto-electric hybrid circuit board having a through hole for an optical path (for example, disclosed in Patent Document 1).
  • Figure 7 (a) is an overall cross-sectional view of the optical transmission board.
  • FIG. 7 (b) is an enlarged cross-sectional view of the optical path through hole.
  • surface light emitting / receiving elements 103a and 103b are mounted on one surface of the substrate 102, and an optical waveguide 104 is formed on the other surface of the substrate.
  • an optical waveguide 104 is formed on the other surface of the substrate.
  • 45 degree micromirrors 105a and 105b are formed on the two end faces of the optical waveguide 104.
  • the surface light emitting / receiving elements 103a and 103b and the optical waveguide 104 are optically coupled by optical path through holes 101a and 101b penetrating the substrate 102, respectively.
  • the optical path through-holes 101a and 101b are formed of a clad portion 111 made of a conductor layer formed on the inner wall by a plating process, and a transparent resin or filler filled in the internal space.
  • An aerodynamic core 112 is formed.
  • the signal light incident on the through hole for the optical path is totally reflected and propagated at the interface between the cladding part 111 and the core part 112, so that the surface light emitting and receiving elements 103a and 103b and the optical waveguide are transmitted. It has been proposed that each of the 104 is optically connected.
  • FIG. 8 is a schematic cross-sectional view showing another representative example of a conventional opto-electric hybrid circuit board having a through hole for an optical path (for example, disclosed in Patent Document 2).
  • a planar light emitting element 203A is mounted on a substrate 202A, and an optical path through hole 201A is formed in a direction opposite to the light emitting point.
  • Another substrate 202B is disposed below the optical path through-hole 201A at a predetermined interval (electrically connected via the solder connection portion 205C).
  • An optical waveguide 204B is formed on the surface of another substrate 202B. Further, the end face of the optical waveguide 204B is located immediately below the lower end opening of the optical path through hole 201A and serves as an optical path conversion mirror 205B.
  • a similar optical path configuration is proposed even for light receiving elements that receive signal light.
  • a micro lens 206A is disposed at the end of the gap 208A between the opening of the optical path through hole 201A and the surface light emitting element 203A.
  • the micro lens 206 A has a function of condensing the signal light, and can reduce a transmission loss of the signal light. It is proposed that the microlens 206A is formed by adhering and fixing an optical lens or by dripping an optical lens resin and curing it to a hemisphere by surface tension.
  • Patent Document 1 Japanese Patent Laid-Open No. 2000-81524
  • Patent Document 2 JP 2002-329891 A
  • the surface-emitting light-emitting / receiving element 103b is a light-emitting element, for example, a general surface-emitting laser (VCSE L)
  • VCSE L general surface-emitting laser
  • the half-value full angle greater than 10 degrees shown in the embodiment of Patent Document 1 The light is emitted toward the optical path through hole 101b through the air layer with a spread of 0 to 30 degrees.
  • the core portion of the optical path through-hole 101b is made of transparent resin, the light propagates at a slightly smaller angle by the relative refractive index difference with air, and when the core portion is air, the angle It propagates while totally reflecting the core part.
  • the light reaches the lower cladding of the optical waveguide 104, it diffuses again and reaches the core of the 45 ° micro mirror 105b.
  • the 45 degree micromirror 105b is totally reflected while maintaining its angle, so that much of the reflected light is emitted to the upper and lower cladding layers.
  • the conventional example of FIG. 7 is a configuration in which the diameter of the core portion of the through hole for the optical path is smaller than the diameter of the light receiving surface of the surface light emitting / receiving element, and the combination is effective, and in other combinations Increases the attenuation of the signal light. Therefore, there is a problem in that the combination or dimension of the through hole for an optical path and the surface light emitting / receiving element becomes large.
  • the emitted light from the lower end opening of the optical path through-hole 201A made of a resin composition diffuses in the propagation direction, and the bead is increased as the propagation distance increases.
  • the diameter is increased. This is difficult to avoid because the refractive index of the resin composition is usually about 1.4 to 1.6, which is higher than the refractive index 1 of the air.
  • the diffused light is incident on the optical waveguide 204B with a predetermined interval as shown in FIG. 8, as long as the cross-sectional size of the optical waveguide is not considerably increased with respect to the widened beam diameter, only one of them is required. Only the part enters the optical waveguide. If the cross-sectional size of the optical waveguide is increased, the propagation mode increases. However, since the mode dispersion increases, the transmission band of the optical waveguide is limited.
  • Patent Document 2 by forming the microlens 206A, compared to the case without the microlens 206A, the emitted light having the opening force at the lower end of the optical path through-hole 201A is concentrated on the optical waveguide 204B. It has been proposed that it can be illuminated and that higher coupling efficiency can be expected. However, for this purpose, it is necessary to align the through hole 201A for the optical path with the optical waveguide 204B with a sufficiently high accuracy. In general, circuit boards are a few tens of millimeters to several centimeters square, and light-emitting elements that are several millimeters square at most are orders of magnitude larger than light-receiving elements. Fluctuation is large.
  • the optical waveguide 204B is a multimode optical waveguide having a cross-section of 30 to: LOO / z m square
  • the positioning and joining accuracy between the emitted light and the optical waveguide is required to be m level.
  • the microlens 206A of Patent Document 2 is an optical signal transmission optical path 210A formed by an optical path through hole 201A filled with a resin composition and an air gap 208A.
  • the periphery of the microlens 206A is joined to the edge of the solder resist layer 209A (step 2 in Patent Document 2).
  • the optical lens when providing at the end of the gap 208A, the optical lens must be attached with an adhesive (Patent Document 2, Paragraph 0139).
  • the microlens 206A is an optical path penetration filled with a rosin composition. It may be inside the optical signal transmission optical path 210A formed by the through-hole 201A and the air gap 208A. However, the inside of the optical signal transmission optical path 210A in Patent Document 2 is an end portion of the resin composition filled in the optical path through hole 201A (Patent Document 2, paragraph 007 3). In any embodiment, this resin composition is completely filled between the openings at both ends. Therefore, although not shown in Patent Document 2, the microphone lens 206A provided at the end of the resin composition protrudes outward from the opening surface of the optical path through-hole 201A, that is, the surface of the substrate 202A. Become.
  • the lens resin is dropped into the opening of the optical path through-hole 201A filled with the resin composition and cured into a hemisphere by surface tension (Patent Document). Offer 2 paragraph 0140). Therefore, it is very difficult to ensure positioning accuracy so that the optical axis of the microlens coincides with the optical axis of the optical signal transmission optical path when the lens grease is dropped.
  • Patent Document 2 discloses providing a microlens having a condensing function in order to reduce optical transmission loss.
  • the installation location is the end of the optical path for transmitting optical signals.
  • the method of providing the optical axis of the microlens and the optical axis of the signal light with high accuracy is not presented. Not enough.
  • the optical path through hole proposed in the conventional technology penetrates the substrate through the optical coupling between the light emitting element and the light receiving element that penetrate the substrate and the optical waveguide. After that, there is a problem of optical transmission loss due to the spread of the outgoing light beam, a problem that high-precision positioning with an optical waveguide on another substrate is difficult even if the light is collected using a lens, and the lens itself. If high-precision positioning is difficult, the problem is fully resolved! , Absent. As a result, a high amount of coupled light could not be obtained, and accurate and highly efficient optical signal transmission could not be realized.
  • the present invention solves the above-mentioned problem by combining an optical waveguide formed on one main surface of a substrate and a light emitting element or a light receiving element mounted at a position penetrating the substrate, or
  • the purpose is to improve the optical coupling efficiency in the coupling between the optical waveguides provided on the two opposing principal surfaces of the substrate. Also, this improves the optical coupling efficiency
  • the present invention provides the following configurations in order to achieve the above object.
  • An optical transmission board is a board in which a through hole is provided as an optical path of signal light between two main surfaces, and an optical transmission body provided between both ends of the through hole. Comprising at least one high refractive index portion having a refractive index of at least one and a at least one low refractive index portion having a second refractive index smaller than the first refractive index, and the high refractive index portion and the low refractive index portion.
  • An optical transmission that condenses the signal light by forming a joint surface with the refractive index portion in the vicinity of at least one opening and making the low refractive index portion side concave in the optical axis direction of the signal light. With body.
  • the optical transmission board may form the joint surfaces in the vicinity of the openings at both ends by disposing the high refractive index portions at both ends of the low refractive index portion, respectively. It is a thing.
  • the optical transmission board may form the joint surface in the vicinity of each of the opening portions by disposing the low refractive index portions at both ends of the high refractive index portion, respectively. It is a thing.
  • the optical transmission board has a condensing point near the opening of the through hole forming the joint surface when the propagation direction of the signal light is changed by the joint surface. The position is outside the hole.
  • the thermal expansion coefficient of the optical transmission body is in the range of 80 to 120% of the thermal expansion coefficient of the board.
  • the optical transmission board includes an optical waveguide provided on the main surface including at least the opening on the signal light emission side and optically coupled to the optical transmission body. In addition, it has.
  • a multilayer optical transmission board according to the present invention is obtained by laminating a plurality of the above optical transmission boards.
  • An optical transmission device provides the optical transmission board of any one of the above! /, And the optical transmission board. And an optical semiconductor device provided on at least one of the main surfaces and optically coupled to the optical transmission body.
  • the second refractive index is obtained by filling a transparent resin in a molten state in a through-hole of the board and forming a recess by curing shrinkage.
  • Providing the low refractive index portion having the first refractive index by filling the through hole with a transparent resin in a molten state so as to be in contact with the concave portion of the low refractive index portion, and curing the transparent resin.
  • a composite optical transmission board according to the present invention is a first board which is the optical transmission board according to any one of claims 1 to 5, and a first board arranged in parallel with the first board. And an optical waveguide provided on a main surface of the second substrate facing the first substrate and optically coupled to the optical transmission body in the first substrate.
  • the optical transmission board of the present invention has an optical transmission body in which at least one high refractive index portion and at least one low refractive index portion are formed in a through-hole penetrating the substrate.
  • a joint surface of a high refractive index portion and a low refractive index portion is formed in the vicinity of at least one of the through holes, and the joint surface is low in the optical axis direction of the signal light.
  • This is a refractive index interface that is concave on the refractive index side.
  • This refractive index interface plays the same role as the lens surface. That is, the signal light propagating through the optical transmission body receives a condensing action so as to approach the optical axis at the refractive index interface.
  • the signal light incident on the optical transmission body from the opening in the vicinity of the joint surface is propagated through the optical transmission body with its spreading angle reduced. Further, the signal light that also emits the optical transmission force at the opening in the vicinity of the joint surface has its spreading angle reduced and also emits the optical transmission strength.
  • the thickness of the substrate is reduced.
  • the required distance between the light emitting / receiving element and the substrate surface can be secured, and at the same time, the signal light can be condensed in the optical axis direction in the optical coupling between the light emitting / receiving element and the optical path conversion mirror.
  • the amount of light that enters and propagates into the optical waveguide formed on the substrate and the amount of light that propagates through the optical waveguide on the substrate and then enters the light receiving element are naturally increased. This facilitates signal light processing and enables highly efficient optical signal transmission.
  • the operation of the opto-electric hybrid circuit including the optical circuit is stabilized, and the long life can be realized by reducing the extra energy consumption.
  • the optical transmission body of the optical transmission substrate of the present invention is provided between the openings at both ends of the substrate, the refractive index interface is always located inside the through hole. Therefore, it is easy to make the optical axis of the refractive index interface as the lens surface coincide with the axial direction of the through hole. This is because there is no displacement in the direction parallel to the substrate.
  • Patent Document 2 since the lens is provided outside the opening at both ends of the optical path through hole filled with the resin composition, the axial direction of the optical path through hole and the optical axis of the lens must be matched. Is extremely difficult.
  • Patent Document 2 it is assumed that the lens is formed by adhesion or dripping hardening of a resin material. However, such a forming method tends to cause a positional shift in a direction parallel to the substrate.
  • the optical transmission board of the present invention has joint surfaces formed near both ends of the optical transmission body, the signal is transmitted both immediately after entering the optical transmission body and immediately before exiting from the optical transmission body. Since the light is focused, the coupling loss can be further reduced.
  • the optical transmission board of the present invention maintains the integrity of the optical transmission body and the substrate against temperature fluctuations by making the thermal expansion coefficient of the optical transmission body and the thermal expansion coefficient of the substrate substantially coincide. be able to.
  • the optical transmission board of the present invention when the optical waveguide is provided on the main surface including the opening on the signal light emission side, as described in Patent Document 2 described above, the optical transmission board is provided on another board. Compared with the case where an optical waveguide is provided, the positioning accuracy in the optical coupling with the signal light incident side can be easily ensured. In particular, since the optical waveguide is processed using a photomask process capable of forming a pattern with high accuracy on the order of m, it can be formed with sufficiently high positional accuracy with respect to the through hole for the optical path.
  • the multilayer optical transmission board of the present invention can improve the optical transmission efficiency between two main surfaces even if it is a thick multilayer board by laminating a plurality of the optical transmission boards of the present invention.
  • the optical transmission device of the present invention mounts the optical element on the optical transmission substrate of the present invention, so that the emitted light from the light emitting element and the incident light to the Z or light receiving element pass through the optical transmission body.
  • the light transmission efficiency can be increased by reducing the divergence angle.
  • a transparent resin having a low refractive index is filled in a through-hole in a molten state, and a recess is formed by curing shrinkage to provide a low refractive index portion. . Since this concave portion is naturally formed by the surface tension between the transparent resin and the inner wall of the through hole, the center of the concave portion can be positioned on the axis of the through hole without performing artificial processing. Further, a high refractive index transparent resin is filled in the through-hole in a molten state so as to be in contact with the concave portion of the low refractive index portion, and is cured to provide the high refractive index portion.
  • the axial direction of the through hole and the optical axis direction of the optical transmission body naturally coincide with each other. Therefore, unlike the case where the lens is formed by dripping and curing the resin on the outside of the optical path through-hole as disclosed in Patent Document 2 described above, it is not necessary to position the lens in a direction parallel to the substrate.
  • the optical transmission board having the optical transmission body described above is used as a first board, a second board is arranged in parallel with the first board, An optical waveguide is provided on one main surface of the substrate.
  • the composite optical transmission board of the present invention has an optical waveguide provided on the second substrate in the same manner as in Patent Document 2, but in Patent Document 2, the optical axis of the lens and the axis of the through hole are connected to each other on the first board. While it is difficult to match, the present invention makes it possible to easily match the optical axis of the refractive index interface, which is the lens surface, with the axis of the through hole in the first substrate. Therefore, the optical transmission efficiency can be improved even in the composite optical transmission substrate having two substrates, and an opto-electric wiring mixed circuit substrate applied to various applications can be configured.
  • FIG. 1 is a partial cross-sectional view showing a schematic configuration of a first embodiment of an optical transmission board according to the present invention.
  • the thick line schematically shows the signal light 7 and the broken line schematically shows the optical axis A.
  • Through holes 2c are provided perpendicular to these main surfaces.
  • the through hole 2c serves as an optical path for signal light that couples the two main surfaces by forming the optical transmission body 1 in the internal space.
  • the axial direction of the through hole 2c is the direction of the optical axis A of the optical transmission body 1.
  • Both end openings 2d 1 and 2d2 of the through-hole 2c are located on each main surface, and the optical transmission body 1 is formed by filling a predetermined grease between these both end openings.
  • the optical transmission body 1 includes high refractive index portions lal and la2 having a first refractive index nl, and a low refractive index portion lb having a second refractive index n2 smaller than the first refractive index nl.
  • the high refractive index portion and the low refractive index portion are each made of a transparent resin having an appropriate refractive index.
  • the comparison of the refractive indexes of the high refractive index portion and the low refractive index portion can be performed, for example, by measuring the refractive index distribution by the refractive near field (RNF) method. Specifically, in the case of FIG.
  • RMF refractive near field
  • the optical transmission body 1 is cut so as to include the central axis of the cylindrical optical transmission body 1, and the optical transmission body 1 is further divided into the high refractive index portions lal, la2, and the low refractive index.
  • the refractive index distribution can be measured by cutting into index parts lb and measuring them using, for example, OWA-9500 manufactured by Optoscience.
  • a low refractive index portion lb is disposed in the middle along the axial direction of the through hole 2c, and two high refractive index portions lal and la2 are disposed at both ends thereof.
  • the end portions of the high refractive index portions lal and la2 form flat surfaces located at both end openings 2dl and 2d2 of the through hole 2c, respectively.
  • the joint surface lcl between the high refractive index portion lal and the low refractive index portion lb and the joint surface lc2 between the high refractive index portion la2 and the low refractive index portion lb inside the optical transmission body 1 are respectively open at both ends. 2d2 and a curved surface having a concave shape on the low refractive index portion lb side in the direction of the optical axis A of the signal light.
  • the high refractive index portion lal, la2 side is a convex curved surface.
  • the curved surface means a surface that is at least partially curved.
  • the low refractive index portion lb side is concave when the optical transmission body is cut so as to include the central axis of the columnar optical transmission body 1 and the high refractive index portion lal and the low refractive index portion in the cross section.
  • the boundary line with lb as a whole (for example, when observed at a scale where the width of the optical transmission body 1 is within the field of view of a scanning electron microscope, an optical microscope, etc.), the boundary line has a low refractive index. It means that it is protruding to the club side.
  • the joint surfaces lcl and lc2 are refractive index interfaces and have the same function as the lens surface. These joint surfaces Since lcl and lc2 are always located inside the through hole 2c, it is easy to align the optical axis A of the lens surface with the axial direction of the through hole 2c. On the other hand, in Patent Document 2 described above, positioning is difficult because lenses are provided outside the openings at both ends of the through hole for an optical path filled with the resin composition.
  • Each layer of electrode 8 and solder resist 9 is formed on one main surface 2a of substrate 2 (this surface is referred to as “surface” for convenience of description).
  • the light transmission element or the light receiving element 3 (hereinafter referred to as “optical element”) is provided on the surface of the substrate 2 so that the optical transmission substrate functions as an optical transmission device.
  • the photoelement 3 is arranged at a predetermined interval immediately above the opening 2dl of the through hole 2c, and its light emitting point or light receiving point is located on the optical axis A of the optical transmission body 1.
  • the terminal of the optical element 3 is bonded to the electrode 8 by a conductive bonding material 5 such as a stud bump, a solder ball, or a conductive grease, and mounted on the substrate 2. Thereby, the photoelectric conversion operation of the optical element 3 becomes possible.
  • a gap 6 exists between the optical element 3 and the high refractive index portion lal.
  • the gap 6 is air in the example of FIG. 1, but may be filled with an appropriate transparent resin.
  • the refractive index is naturally smaller than that of the high refractive index portion lal.
  • the gap 6 is filled with transparent resin, it is preferable that the refractive index be sufficiently smaller than the high refractive index portion lal.
  • an optical waveguide 4 is provided on the other main surface 2b of the substrate 2 (for convenience of explanation, this surface is referred to as a “back surface”).
  • the optical waveguide 4 is composed of a layered lower clad 4b, a rectangular core 4a, and a layered upper clad 4c in the order of the substrate 2 side force, and its end face is approximately 45 degrees with respect to the axial direction of the optical waveguide 4.
  • the optical path conversion mirror 4d processed is formed.
  • the optical path conversion mirror 4d is located immediately below the opening 2d2 of the through hole 2c, and is disposed so that the core 4a is located on the optical axis A of the optical transmission body 1.
  • Optical transmission in the optical transmission board or optical transmission apparatus of FIG. 1 configured as described above is performed as follows.
  • the optical element 3 is a light emitting element (for example, a surface emitting laser (VCSEL))
  • the signal light 7 emitted from the light emitting point spreads radially at the gap 6 while being high in the opening 2dl of the through hole 2c. Incident to the refractive index part lal. At that time, the signal light 7 is bent so as to approach the optical axis A according to the relative refractive index difference between the air or resin present in the gap 6 and the high refractive index portion lal. Fold and narrow the spread angle.
  • VCSEL surface emitting laser
  • the signal light 7 passes through the joint surface lcl between the high refractive index portion lal and the low refractive index portion lb and is incident on the low refractive index portion lb.
  • the joint surface lcl has a substantially arc shape in cross section, that is, a three-dimensional curved surface. Therefore, the light incident on the side of the high refractive index portion lal and the low refractive index portion lb is refracted and spreads closer to the optical axis A according to the curved surface shape of the joint surface lcl and the relative refractive index difference. The corner narrows.
  • the external force of the optical transmission body 1 also has an effect of narrowing the divergence angle of the signal light when entering the high refractive index portion inside the optical transmission body 1 and also entering the low refractive index portion. In this case, it will be referred to as “light collection”.
  • the signal light 7 propagated through the low-refractive-index part lb is incident on the other high-refractive-index part la2, according to the curved surface shape of the joint surface lc2 and the relative refractive index difference as in the first case. Condensed with respect to optical axis A.
  • the signal light 7 enters the lower clad 4b of the optical waveguide 4 from the high refractive index portion la2 at the opening 2d2 of the through hole 2c. Also at this time, the light is further condensed with respect to the optical axis A according to the relative refractive index difference with the lower clad 4b of the optical waveguide, passes through the lower clad 4b, and enters the core 4a. Thereafter, the signal light 7 is reflected by the optical path conversion mirror 4d and the optical path is converted by approximately 90 degrees, and propagates in the axial direction of the core 4a of the optical waveguide 4.
  • the signal light 7 emitted from the light emitting element mounted on the surface of the substrate 2 propagates while condensing in the optical transmission body 1 formed between the openings at both ends of the substrate 2, and then finally Then, it reaches the optical waveguide 4 formed on the back surface of the substrate 2 and further propagates after the optical path change.
  • the spread of the light emitted from the light emitting element 3 and the light emitted from the light transmitter 1 are corrected by the condensing action at the joint surfaces lcl and lc2 and the openings 2dl and 2d2 at both ends of the light guide 1 inside. , Transmission loss is reduced.
  • the position in the vicinity of the opening at both ends of the through-hole 2c in which the joint surfaces lcl and lc2 are respectively provided means that the propagation direction of the signal light is changed by the joint surfaces lcl and lc2, and the condensing point passes through. Position it so that it is outside the hole 2c.
  • an optical transmission body provided with only one of the high refractive index portions lal and la2 in the form of Fig. 1 may be used.
  • Side light without high refractive index The end of the transmission body is a low refractive index portion up to the through hole opening surface. Therefore, there is only one joint surface between the high refractive index portion and the low refractive index portion. In this case, the above-described light condensing action can be obtained at the opening surface of the through hole on the side where the high refractive index portion is provided and one joint surface.
  • FIG. 2 (a) to 2 (e) are partial cross-sectional views showing an example of the method of manufacturing the optical transmission board of the present invention shown in FIG. 1 in the order of steps.
  • an electrode layer 8 and a solder resist layer 9 are formed on the surface 2a of the substrate 2 by a known photolithography process or etching process according to the circuit and the mounting structure. Note that an electrode layer and a solder resist layer may also be formed on the back surface 2b at locations other than the optical waveguide provided in a later step.
  • the substrate 2 is not limited to a printed wiring board, but may be a ceramic wiring board using alumina or the like for an insulating layer inside the board, or a board in which electric wiring is formed on silicon or glass. It can be a general-purpose glass epoxy wiring board.
  • a through hole 2c that penetrates the substrate 2 is provided at a position facing a light emitting point or a light receiving point of an optical element to be installed in a later step.
  • a drill or laser is used to process the through hole 2c. Its diameter is usually 100 to 200 m in diameter.
  • the surface 2a of the substrate 2 is arranged vertically upward, and the low refractive index transparent resin lb ′ having the second refractive index n2 is attached to a syringe or the like.
  • the low refractive index transparent resin lb ′ having the second refractive index n2 is attached to a syringe or the like.
  • Low refractive index transparent resin lb includes polysilane (refractive index of about 1.6), acrylic (refractive index of about 1.5), epoxy (refractive index of about 1.5), which are provided as optical waveguide materials. ) (Both at 850 nm wavelength) can be used, and a relatively low refractive index material used for the cladding is preferred.
  • the viscosity at the time of dropping these transparent resin materials is preferably 1000 to 2000 (mP's). If the viscosity is in this range, it does not flow out of the through hole 2c or penetrate into the through hole 2c, and does not penetrate into the through hole 2c without any gaps and reaches the opening 2d2 on the back side. .
  • an end surface which is on the same plane as the back surface 2b of the substrate 2 is formed of a low refractive index transparent resin lb ′.
  • the end of the thin plate-shaped tool is pressed against the surface 2a of the substrate 2 and moved in parallel with the substrate surface, whereby the low refraction raised on the surface 2a.
  • an end surface which is on the same plane as the surface 2a of the substrate 2 is formed by the low refractive index transparent resin lb ′.
  • the entire substrate 2 is heated from the state of FIG. 2 (c) to cure the low refractive index transparent resin.
  • High refractive index transparent resin includes polysilane (refractive index of about 1.6), acrylic (refractive index of about 1.5), and epoxy (refractive index of about 1.5) provided as materials for optical waveguides ( In any case, a resin material having a wavelength of 850 nm can be used, and a material having a relatively high refractive index used for the core is preferable.
  • the viscosity at the time of dropping is preferably about the same as that of the above-mentioned low refractive index transparent resin.
  • the entire substrate 2 is heated to cure the high refractive index transparent resin. Force that can form a concave curved surface again due to shrinkage during curing By repeating this process many times, a flat end face can be finally formed.
  • the two end surfaces of the finally obtained high refractive index transparent resin are on the same plane as the front surface 2a and the back surface 2b of the substrate 2, respectively.
  • the high refractive index portions la 1 and la 2 and the joint surfaces lcl and lc 2 are formed.
  • the end surface of the high refractive index transparent resin may be raised from the front surface 2a and the back surface 2b of the substrate 2.
  • the high refractive index transparent resin becomes a lens, the light collecting effect becomes higher.
  • the thermal expansion coefficient of the optical transmission body is preferably in the range of 80 to 120% of the thermal expansion coefficient of the substrate.
  • Low refractive index transparent resin and high refractive index transparent A material satisfying such a thermal expansion coefficient is selected as the resin.
  • the substrate is an epoxy substrate (for example, a glass epoxy substrate).
  • the optical waveguide 4 is formed on the back surface 2 b of the substrate 2.
  • the order of forming the optical waveguide 4 is as shown in the following steps fl to f4, which is a known technique.
  • Step f 1 Apply the clad material by spin coating and heat cure to form the lower clad layer 4b.
  • Step f2 After applying the core material in the same manner, only the pattern to be the core is cured by UV exposure through a photomask, and development with an organic solvent is performed to remove the non-exposed portion.
  • the core layer 4a is formed.
  • the cross-sectional shape of the core layer 4a is a rectangle of 50-: L 00 m square.
  • Step f3 Apply the clad material again and heat cure to form the upper and side cladding layers 4c.
  • Step f4 Finally, the end of the optical waveguide 4 is cut off using a dicing blade with an end face angle of 90 degrees, and an optical path change function having an optical path conversion function with an angle of 45 degrees with respect to the optical axis A is obtained. A replacement mirror 4d is formed.
  • FIG. 3 is a partial cross-sectional view showing a schematic configuration of the second embodiment of the optical transmission board according to the present invention.
  • a through hole 2c is formed in the substrate 2
  • the layers of the electrode 8 and the solder resist 9 are provided on the front surface 2a
  • the optical waveguide is formed on the back surface 2b.
  • Road 4 is provided.
  • the optical device 3 functions as an optical transmission device by being placed at a position facing the opening 2dl of the through hole 2c on the surface 2a.
  • the difference from the form of FIG. 1 is the structure of the optical transmission body 10 formed in the through hole 2c.
  • the optical transmission body 10 includes a high refractive index portion 10a having a first refractive index nl and low refractive index portions 10b1 and 10b2 having a second refractive index n2 smaller than the first refractive index nl.
  • the high refractive index portion and the low refractive index portion are each made of a transparent resin having an appropriate refractive index.
  • the high refractive index portion 10a is disposed in the middle portion along the axial direction of the through hole 2c, and two low refractive index portions 10b 1 and 10b2 are disposed at both ends thereof. Low bending
  • the end portions of the folding portions 10bl and 10b2 form flat surfaces located at both end openings 2dl and 2d2 of the through hole 2c, respectively.
  • the joint surface 10cl between the low refractive index portion lObl and the high refractive index portion 10a and the joint surface 10c2 between the low refractive index portion 10b2 and the high refractive index portion 10a inside the optical transmission body 10 are respectively open at both ends.
  • dl and 2d2 are formed in the vicinity of the low refractive index portions lObl and 10b2 in the direction of the optical axis A of the signal light.
  • the high refractive index portion 10a side is a convex curved surface.
  • the joint surfaces 10cl and 10c2 are refractive index interfaces, and have the same action as the lens surface in the same manner as in the form of FIG. Also in the embodiment of FIG. 3, since these joint surfaces 10cl and 10c2 are always located inside the through hole 2c, it is easy to make the optical axis A of the lens surface coincide with the axial direction of the through hole 2c.
  • a method of manufacturing the optical transmission body 10 in the form of FIG. 3 is, for example, as follows. First, a high refractive index transparent resin that has been pre-cured into a biconvex cylindrical shape is prepared in advance, inserted into the through-hole 2c in the substrate 2, and then heat-cured again to form the high refractive index portion 10a. Form. Alternatively, an appropriate amount of transparent resin having a high refractive index is dropped into and penetrated through the through-hole 2c, and then a high-refractive-index portion 10a is formed by pressing a mold on both end faces and curing by heating. After the formation of the high refractive index portion 10a, the low refractive index transparent resin is dropped and cured in the same manner as in the process of FIG. 2 (e) in the manufacturing method of FIG. , 10b2 is formed.
  • Another method for manufacturing the optical transmission body 10 in the form of FIG. 3 is as follows. First, one micro ball made of a high refractive index resin having a first refractive index nl and having a diameter that can be fitted and slid into the through hole 2c is inserted into the through hole 2c, and then the same. A suitable amount of high refractive index transparent resin having a refractive index of nl is dropped and infiltrated, and another micro ball made of high refractive index resin is inserted. Thereafter, the high refractive index portion 10a is formed by heat curing. After forming the high refractive index portion 10a, a low refractive index transparent resin is dropped and cured in the same manner as in the step of FIG. 2 (e) in the manufacturing method of the embodiment shown in FIG. 10b2 is formed.
  • Optical transmission in the optical transmission board or optical transmission apparatus of Fig. 3 configured as described above is performed as follows.
  • the thick line schematically shows the signal light 7
  • the broken line schematically shows the optical axis A.
  • the optical element 3 is a light emitting element (for example, a surface emitting laser (VCSEL))
  • the signal light 7 emitted from the light emitting point spreads radially in the gap 6 and is reduced in the light transmission body 1 at the opening 2dl of the through hole 2c.
  • the refractive index part lObl Incident to the refractive index part lObl.
  • the signal light 7 is refracted so as to approach the optical axis A according to the relative refractive index difference between the air or resin existing in the gap 6 and the low refractive index portion lObl, and the divergence angle is narrowed.
  • the material should have a refractive index smaller than the low refractive index part lObl.
  • the joint surface lOcl has a substantially arc shape in cross section, that is, a three-dimensional curved surface. Therefore, the light incident on the low refractive index portion 10b 1 side force also on the high refractive index portion 10a side is refracted and spreads closer to the optical axis A according to the curved surface shape of the joint surface lOcl and the relative refractive index difference. The corner narrows.
  • the signal light 7 propagated through the high refractive index portion 10a is incident on the other low refractive index portion 10b2, but according to the curved surface shape of the joint surface 10c2 and the relative refractive index difference as in the first case. Condensed with respect to optical axis A.
  • the light enters the lower cladding 4b of the optical waveguide 4 from the low refractive index portion 10b2 at the opening 2d2 of the through hole 2c.
  • the light is further condensed with respect to the optical axis A according to the relative refractive index difference with the lower clad 4b of the optical waveguide, passes through the lower clad 4b, and enters the core 4a.
  • the light is reflected by the optical path conversion mirror 4d and the optical path is converted by approximately 90 degrees, and propagates in the axial direction of the core 4a of the optical waveguide 4.
  • the position in the vicinity of the opening at both ends of the through hole 2c in which the joint surfaces 10cl and 10c2 are provided, respectively, means that the propagation direction of the signal light is changed by the joint surfaces 10cl and 10c2, and the condensing point is Position it so that it is outside the through hole 2c.
  • an optical transmission body in which only one of the low refractive index portions 10bl and 10b2 in the form of Fig. 3 is provided. If the low refractive index portion is not provided, the side is the high refractive index portion up to the through hole opening surface. Therefore, the contact between the high refractive index part and the low refractive index part. There will be only one face. In this case, the above-described light condensing action can be obtained on the through hole opening surface on the side where the low refractive index portion is provided and one joint surface.
  • FIG. 4 is a partial cross-sectional view showing a schematic configuration of a variation of the optical transmission board shown in FIG. 1.
  • the structure of the optical transmission body 1 formed in the through hole 2c of the board 2 is the same as that of FIG. It is the same as the transmission board, and high refractive index portions lal and la2 are provided at both ends with the low refractive index portion lb in between. 1 is that optical waveguides 4 and 40 are formed on the two principal surfaces 2a and 2b of the substrate 2, respectively.
  • the optical path conversion mirror 4d2 at the end of the optical waveguide 4 is disposed at a position facing the opening 2d2, and the optical path conversion mirror 4dl at the end of the optical waveguide 40 is disposed at a position facing the opening 2dl.
  • Optical transmission in the optical transmission board configured as shown in Fig. 4 is performed as follows.
  • the bold line shows the signal light 7 and the broken line shows the optical axis A schematically.
  • the signal light propagating through the optical waveguide 40 is subjected to 90 ° optical path conversion by the optical path converting mirror 4dl provided on the end face. Thereafter, the signal light propagates while spreading and enters the high refractive index portion lal of the optical transmission body 1 at the opening 2dl. After that, the light is condensed at the refractive index interface between the high refractive index portion lal and the low refractive index portion lb, and at the refractive index interface between the low refractive index portion lb and the high refractive index portion la2, as in the form of FIG. Further, the light enters the lower clad 4b of the optical waveguide 4 at the opening 2d2, and propagates through the core 4a after optical path conversion by the optical path conversion mirror 4d2 provided at the end.
  • FIG. 5 is a partial cross-sectional view showing a schematic configuration of an optical transmission device to which a modification of the optical transmission board shown in FIG. 1 is applied.
  • the structure of the optical transmission body 1 formed in the through hole 2c of the substrate 2 is the same as that of the optical transmission substrate in FIG. 1, and the high refractive index portions lal and la2 are provided at both ends with the low refractive index portion lb in between.
  • ing. 1 is that optical elements 3 and 30, electrodes 8 and 80, and solder resists 9 and 90 are respectively installed on two main surfaces 2 a and 2 b of the substrate 2.
  • the photoelement 3 is arranged immediately above the opening 2dl as in the configuration of FIG.
  • the optical element 30 is disposed immediately below the opening 2d2, and the light emitting point or the light receiving point is disposed on the optical axis A of the optical transmission body 1.
  • the terminal of the optical element 30 is stud bump Nano, cardboard or conductive Bonded to the electrode 80 by a conductive bonding material 50 such as resin. As a result, the photoelectric conversion operation of the optical element 30 becomes possible.
  • Optical transmission in the optical transmission board or the optical transmission apparatus configured as shown in Fig. 5 is performed as follows.
  • the thick line schematically shows the signal light 7
  • the broken line schematically shows the optical axis A.
  • the optical element 3 is a light emitting element (for example, a surface emitting laser (VCSEL))
  • the signal light 7 emitted from the light emitting point spreads radially at the gap 6 while being high in the opening 2dl of the through hole 2c. Incident to the refractive index part lal.
  • the signal light 7 is condensed with respect to the optical axis A in accordance with the relative refractive index difference between the air or grease present in the gap 6 and the high refractive index portion lal.
  • the light passes through the joint surface lcl between the high refractive index portion lal and the low refractive index portion lb and enters the low refractive index portion lb.
  • the joint surface lcl has a substantially arc shape in cross section, that is, a three-dimensional curved surface. Therefore, the light incident on the low refractive index portion lb side with the high refractive index portion lal side force is further condensed with respect to the optical axis according to the curved surface shape of the joint surface lcl and the relative refractive index difference.
  • the signal light 7 propagated through the low-refractive-index part lb is incident on the other high-refractive-index part la2, as in the first case, according to the curved surface shape of the joint surface lc2 and the relative refractive index difference. Concentrated with respect to the optical axis.
  • the light enters the gap 60 from the high refractive index portion la2 at the opening 2d2 of the through hole 2c. At this time, the light is further condensed with respect to the optical axis in accordance with the relative refractive index difference with respect to the gap 60, and is incident on the light receiving point of the optical element 30 which is a light receiving element.
  • a multilayer optical transmission board may be configured by stacking a plurality of optical transmission boards shown in the above embodiments.
  • the optical waveguide is generally provided on the main surface of the substrate facing the outside.
  • FIG. 6 is a partial cross-sectional view showing a schematic configuration of an example of a composite optical transmission board to which the optical transmission board shown in FIG. 1 is applied.
  • the composite optical transmission board of the present invention also has the power of two or more optical transmission boards arranged at a predetermined interval from each other.
  • at least two adjacent optical transmission boards among those boards take the form shown in FIG. [0070]
  • the first substrate 2 is almost the same as the optical transmission substrate of FIG. 1, and the structure of the optical transmission body 1 in the through hole 2c is the same as that of FIG.
  • High refractive index parts lal and la2 are provided at both ends with the index part lb in between.
  • On one main surface 2a of the first substrate 2 an optical element 3, an electrode 8, and a solder resist 9 are arranged on one main surface 2a of the first substrate 2, an optical element 3, an electrode 8, and a solder resist 9 are arranged.
  • the optical element 3 is disposed immediately above the opening of the through hole 2c.
  • the second substrate 20 is arranged in parallel to the first substrate 2 with a predetermined interval, and one main surface 20a of the second substrate is the main surface of the first substrate 2. Facing face 2b.
  • the first board is a daughter board
  • the second board is a motherboard
  • the electrical wiring on both boards is electrically connected, for example, via an appropriate solder connection portion (not shown).
  • the first board may be a mother board and the second board may be a daughter board.
  • An optical waveguide 4 and an optical path conversion mirror 4d are provided on the main surface 20a of the second substrate.
  • the optical waveguide 4 includes a layered lower clad 4b, a rectangular core 4a, and a layered upper clad 4c in order from the substrate 20 side, and the axis of the optical waveguide 4 faces the end face of the optical waveguide 4.
  • An optical path conversion mirror 4d processed at approximately 45 degrees with respect to the direction is arranged.
  • the optical path conversion mirror 4d is arranged so as to be positioned on the optical axis A of the optical transmission body 1 just below the opening of the through hole 2c.
  • Optical transmission in the composite optical transmission board or optical transmission apparatus configured as shown in Fig. 6 is performed as follows.
  • the thick line schematically shows the signal light 7
  • the broken line schematically shows the optical axis A.
  • the optical element 3 is a light emitting element (for example, a surface emitting laser (VCSEL))
  • the signal light 7 emitted from the light emitting point spreads radially in the gap 6 and is highly refracted by the optical transmission body 1 at the opening of the through hole 2c. Incident on the rate part lal.
  • the signal light 7 is condensed with respect to the optical axis A in accordance with the relative refractive index difference between the air or grease present in the gap 6 and the high refractive index portion lal.
  • the joint surface lcl has a substantially arc shape in cross section, that is, a three-dimensional curved surface. Therefore, the light incident on the low refractive index portion lb side with the high refractive index portion lal side force is further condensed with respect to the optical axis according to the curved surface shape of the joint surface lcl and the relative refractive index difference.
  • the signal light 7 propagated through the low-refractive-index part lb is incident on the other high-refractive-index part la2, according to the curved surface shape of the joint surface lc2 and the relative refractive index difference as in the first case. Concentrated with respect to the optical axis.
  • the light enters the gap 60 from the high refractive index portion la2 at the opening of the through hole 2c.
  • the light is further condensed with respect to the optical axis in accordance with the relative refractive index difference with respect to the gap 60, reflected by the optical path conversion mirror 4d, and the optical path is converted by about 90 degrees, and the optical path 4 is shifted in the axial direction of the core 4a. Propagate.
  • the composite optical transmission substrate shown in FIG. 6 is manufactured as follows.
  • the optical waveguide 4 is formed on one main surface 20a of the second substrate 20 (for example, a mother board).
  • the optical transmission body 1 is produced on the first substrate 2 (for example, a daughter board). Note that the first step and the second step are independent of each other because they can be performed independently.
  • the optical element 3 is mounted on the first substrate 2.
  • the first substrate is mounted on the second substrate.
  • the same material as the optical transmission body 1 shown in FIG. 1 is formed on the first substrate 2, but as another embodiment, shown in FIG.
  • the optical transmission body 10 may be formed.
  • an optical waveguide 40 instead of mounting the optical element 3 on the main surface la of the first substrate 2, an optical waveguide 40 may be formed as in the embodiment shown in FIG.
  • FIG. 1 is a cross-sectional view showing a first embodiment of an optical transmission board according to the present invention.
  • FIG. 2 is a cross-sectional view showing each step of the method for manufacturing an optical transmission board according to the present invention.
  • FIG. 3 is a cross-sectional view showing a second embodiment of an optical transmission board according to the present invention.
  • FIG. 4 is a cross-sectional view showing an application example of the first embodiment of the optical transmission board according to the present invention.
  • FIG. 5 is a cross-sectional view showing another application example of the first embodiment of the optical transmission board according to the present invention.
  • FIG. 6 is a cross-sectional view showing an embodiment of a composite optical transmission board according to the present invention.
  • FIG. 7 is a view showing an example of a conventional optical transmission board, where (a) is a cross-sectional view and (b) is a cross-sectional view of an optical path through hole.
  • FIG. 8 is a cross-sectional view showing an example of a conventional optical transmission board.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Dans un substrat de circuit de mélange photo-électrique, on peut améliorer l'efficacité du couplage entre un élément optique et un guide d'onde optique à l'aide d'un trou traversant fait dans le substrat et de la transmission d'un signal optique à la fois précise et très efficace. Un substrat à transmission optique comprend un substrat (2) présentant un trou traversant (2c) servant de chemin optique pour un signal lumineux entre deux surfaces principales (2a, 2b), et un corps à transmission optique (1) placé entre les deux ouvertures d'extrémité (2d1, 2d2) du trou traversant. Le corps à transmission optique comporte au moins une partie (1a1, 1a2) de réfraction élevée ayant un premier indice de réfraction et au moins une partie (1b) de réfraction faible ayant un second indice de réfraction, plus faible que le premier indice de réfraction. Des surfaces de jonction (1c1, 1c2) entre la partie de réfraction élevée et la partie de réfraction faible sont formées au voisinage d'au moins l'une des ouvertures et un signal lumineux est recueilli en donnant une forme concave à la partie de réfraction faible, dans la direction de l'axe optique du signal lumineux.
PCT/JP2007/056317 2006-03-27 2007-03-27 Substrat a transmission optique, son procede de fabrication et dispositif a transmission optique. Ceased WO2007111327A1 (fr)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012103720A (ja) * 2008-04-26 2012-05-31 Gwangju Inst Of Science & Technology 光配線構造物およびその製造方法
JP2013105025A (ja) * 2011-11-14 2013-05-30 Panasonic Corp 光電気配線基板及び電子部品の実装体
JP2017001349A (ja) * 2015-06-15 2017-01-05 株式会社リコー プラスチック光学素子及びその製造方法
JP2018159855A (ja) * 2017-03-23 2018-10-11 京セラ株式会社 電子装置
NL2029423A (en) * 2020-11-19 2022-06-28 Intel Corp High bandwidth optical interconnection architectures

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010038857A1 (fr) 2008-10-02 2010-04-08 ソニー株式会社 Appareil et procédé de traitement d’images

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052666A1 (fr) * 2003-11-27 2005-06-09 Ibiden Co., Ltd. Carte pour puces a circuits integres, substrat pour carte mere, dispositif pour communications optiques, procede de fabrication de substrat pour puces a circuits integres, et procede de fabrication de substrat pour carte mere
JP2005157115A (ja) * 2003-11-27 2005-06-16 Ibiden Co Ltd Ｉｃチップ実装用基板、マザーボード用基板、光通信用デバイス、ｉｃチップ実装用基板の製造方法、および、マザーボード用基板の製造方法
JP2006038958A (ja) * 2004-07-22 2006-02-09 Sharp Corp 集光素子、その製造方法、光電気配線基板およびその製造方法
JP2006178001A (ja) * 2004-12-20 2006-07-06 Ibiden Co Ltd 光路変換部材、多層プリント配線板および光通信用デバイス

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052666A1 (fr) * 2003-11-27 2005-06-09 Ibiden Co., Ltd. Carte pour puces a circuits integres, substrat pour carte mere, dispositif pour communications optiques, procede de fabrication de substrat pour puces a circuits integres, et procede de fabrication de substrat pour carte mere
JP2005157115A (ja) * 2003-11-27 2005-06-16 Ibiden Co Ltd Ｉｃチップ実装用基板、マザーボード用基板、光通信用デバイス、ｉｃチップ実装用基板の製造方法、および、マザーボード用基板の製造方法
JP2006038958A (ja) * 2004-07-22 2006-02-09 Sharp Corp 集光素子、その製造方法、光電気配線基板およびその製造方法
JP2006178001A (ja) * 2004-12-20 2006-07-06 Ibiden Co Ltd 光路変換部材、多層プリント配線板および光通信用デバイス

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012103720A (ja) * 2008-04-26 2012-05-31 Gwangju Inst Of Science & Technology 光配線構造物およびその製造方法
JP2013105025A (ja) * 2011-11-14 2013-05-30 Panasonic Corp 光電気配線基板及び電子部品の実装体
JP2017001349A (ja) * 2015-06-15 2017-01-05 株式会社リコー プラスチック光学素子及びその製造方法
JP2018159855A (ja) * 2017-03-23 2018-10-11 京セラ株式会社 電子装置
NL2029423A (en) * 2020-11-19 2022-06-28 Intel Corp High bandwidth optical interconnection architectures
JP2023550873A (ja) * 2020-11-19 2023-12-06 インテル・コーポレーション 高帯域幅光学インターコネクトアーキテクチャ
EP4248249A4 (fr) * 2020-11-19 2024-10-30 INTEL Corporation Architectures d'interconnexion optique à large bande passante
US12517314B2 (en) 2020-11-19 2026-01-06 Intel Corporation High bandwidth optical interconnection architectures

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