WO2007111102A1 - Liquid crystal display device and method for manufacturing liquid crystal display device - Google Patents
Liquid crystal display device and method for manufacturing liquid crystal display device Download PDFInfo
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- WO2007111102A1 WO2007111102A1 PCT/JP2007/054447 JP2007054447W WO2007111102A1 WO 2007111102 A1 WO2007111102 A1 WO 2007111102A1 JP 2007054447 W JP2007054447 W JP 2007054447W WO 2007111102 A1 WO2007111102 A1 WO 2007111102A1
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- liquid crystal
- display device
- crystal display
- planar pattern
- spacer particles
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13392—Gaskets; Spacers; Sealing of cells spacers dispersed on the cell substrate, e.g. spherical particles, microfibres
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
Definitions
- Liquid crystal display device and method of manufacturing liquid crystal display device are Liquid crystal display device and method of manufacturing liquid crystal display device
- the present invention relates to a liquid crystal display device and a manufacturing method thereof, and more particularly to a liquid crystal display device and a manufacturing method of a liquid crystal display device in which a spacing between transparent substrates is maintained by spacer particles.
- a liquid crystal display device includes a liquid crystal panel in which liquid crystal is sandwiched between a glass substrate on which a TFT (Thin Film Transistor) is formed and a glass substrate on which RGB colors are distributed to form a color filter.
- the thickness of the liquid crystal layer that is, the cell gap
- the cell gap is required to have a uniform value in order to prevent uneven display of the liquid crystal panel.
- spherical spacer particles are arranged between glass substrates and the distance between them is kept constant. Is manufactured.
- Patent Document 1 Japanese Patent Laid-Open No. 2005-10412
- the present invention has been completed based on the above-described circumstances, and an object thereof is to provide a liquid crystal display device in which spacer particles are arranged at desired locations.
- the liquid crystal display device of the present invention comprises a pair of transparent substrates, a liquid crystal sealed between the transparent substrates, and the transparent substrates in a predetermined manner. It is characterized by having a planar pattern formed by unevenness on the surface of the light-shielding region of the transparent substrate, and having a planar pattern in contact with the spacer particles.
- a planar pattern having irregularities is formed on the surface of the light shielding region of at least one of the transparent substrates, and the one transparent substrate is formed on the one transparent substrate.
- spacer particles are applied together with ink toward an area including the planar pattern, the ink is dried to adhere the spacer particles to the planar pattern, and the pair of transparent substrates is attached to the pair of transparent substrates. It is characterized in that the spacer particles are overlapped with a predetermined interval by sandwiching the spacer particles, and the liquid crystal is sealed in a gap between the pair of transparent substrates.
- the spacer particles are sprayed together with the ink by a coating device such as an ink jet device and coated on the transparent substrate, and then the ink is dried to be disposed on the transparent substrate. Then, when ink containing spacer particles is applied to the flat pattern of the light shielding area, if at least a part of the ink droplets adheres to the flat pattern, the ink droplets are caused by the surface tension of the irregularities of the flat pattern. Accordingly, the spacer particles in the droplet are also attracted to the plane pattern and attached to the plane pattern, so that the spacer particles can be set in the light shielding region.
- a coating device such as an ink jet device
- the spacer particles can be disposed at a desired location.
- FIG. 1 is an enlarged plan view of a glass substrate (TFT substrate) of Embodiment 1.
- FIG. 2 is a cross-sectional view taken along the line XX ′ in FIG.
- FIG. 3 is a partially enlarged view showing the placement region in FIG. 2 in an enlarged manner.
- FIG. 4 is an enlarged perspective view of a dummy electrode.
- FIG. 5 is an enlarged cross-sectional view of a mounting area according to the second embodiment.
- FIG. 6 is an enlarged cross-sectional view of a mounting area according to the third embodiment.
- FIG. 7 is an enlarged plan view of a placement area according to the fourth embodiment.
- FIG. 8 is an enlarged plan view of a placement area according to the fifth embodiment.
- FIG. 9 is an enlarged plan view of a placement area according to the sixth embodiment.
- FIG. 10 is an enlarged plan view of a placement area according to the seventh embodiment.
- FIG. 11 is an enlarged plan view of the eighth embodiment.
- FIG. 12 is an enlarged cross-sectional view of a mounting area according to the ninth embodiment.
- FIG. 13 is an enlarged plan view showing a placement area according to the tenth embodiment.
- Source wiring electrode wire
- Embodiment 1 of the present invention will be described with reference to FIGS.
- the liquid crystal panel 10 (liquid crystal display device) of the present embodiment includes a pair of glass substrates 20 and 20 and a liquid crystal 15 filled between the glass substrates 20 and 20, and the glass substrates 20 and 20 face each other.
- the liquid crystal 15 is sandwiched by sealing the outer periphery of the surface side with a sealing agent (not shown).
- a gate wiring 21 and a source wiring 22 that are orthogonal to each other are formed on one glass substrate (TFT substrate) 20A among the glass substrates 20, and both the wirings are connected to each other.
- Many connected switching elements (eg TFT) 25 are provided (only one location is shown in FIG. 1).
- the other glass substrate (CF substrate) 20B facing the TFT substrate 20A is provided with R, G, B dyes 26 regularly, and between adjacent dyes 26 and between the dyes. Light is not leaking around the area where 26 is placed! / A black filter is used to form a BM (black 'matrix) part 27 and form a color filter! RU
- the liquid crystal panel 10 is manufactured by adhering the spacer particles 16 to the light-shielding region of the TFT substrate 20A and then sandwiching the spacer particles 16 with the CF substrate 20B.
- the two glass substrates 20A and 20B are overlapped (laminated) with a gap. Then, the liquid crystal 15 is sealed in a gap (cell gap) secured between the glass substrates 20A and 20B.
- the spacer particles 16 are spherical bodies made of synthetic resin, and the surfaces thereof are coated with an adhesive material.
- the spacer particles 16 are contained in the ink by an ink jet coating apparatus (not shown). It is applied to the application area containing the top pattern 53 above.
- the spacer particles 16 are arranged in a placement region 50 provided in a light shielding region on the gate wiring 21.
- the mounting area 50 includes a plurality of parallel lines extending in the horizontal direction of FIG. 1 (the direction of the gate wiring 21) (in this embodiment, the number is three, but the number may be larger or smaller).
- the planar pattern 53 has a rectangular shape with the long side in the horizontal direction (the length direction of the gate wiring 21) as a whole, and a plurality of concave portions 53b having a fixed size are arranged vertically and horizontally. Yes.
- the plurality of recesses 53b may be staggered or randomly arranged.
- the spacer particles 16 are arranged in contact with the surface of the protrusion 53a between the lattices (concave portions 53b) or the surface of the protrusion 53a around the lattice (concave portion 53b).
- the placement region 50 is disposed above the gate wiring 21, is formed simultaneously with the source wiring 22, and uses a dummy electrode 51 that is not involved in a circuit for liquid crystal display. Formed.
- the dummy electrode 51 is a TaZTaN film that forms the source electrode of the transistor 25.
- the film is formed simultaneously with sputtering.
- the TaZTaN film is appropriately removed at predetermined locations by a photolithographic process to form irregularities, and is formed into a lattice-like planar pattern 53 as shown in FIG.
- This flat pattern 53 restricts the ink droplets applied in the placement area 50 from being dispersed, adsorbs the ink droplets, and consequently the spacer particles 16 contained in the ink.
- the droplet holding means has a function of collecting the droplets.
- the insulating film 52 is formed on the upper surface of the dummy electrode 51, whereby the placement region 50 having the lattice-shaped uneven planar pattern 53 is formed on the liquid crystal sealing surface side of the TFT substrate 20A.
- the light-shielding region refers to a region that does not participate in image display of the liquid crystal display device. Specifically, the region on the gate wiring 21 and the source wiring 22 and the region of the BM unit 27 are defined. Say.
- the liquid crystal panel 10 of the present embodiment is provided with a polarizing plate and a knock light device.
- An anisotropic conductive film (ACF) -SOF is connected to the gate wiring 21 and the source wiring 22 of the TFT substrate 20A.
- a printed circuit board (with an external control circuit) is connected via (System On Film). As a result, an image is displayed on the liquid crystal panel 10.
- Ink containing the spacer particles 16 is ejected toward the placement area 50 by the ink jet coating apparatus. Then, ink droplets adhere to the placement area 50. As the ink dries, the ink droplet diameter gradually decreases. At this time, if ink droplets adhere to the grid-like planar pattern 53 of the placement area 50, the droplets adhere so as to stick due to the surface tension of the wall surface of the planar pattern 53.
- the spacer particles 16 contained in the droplet gradually approach the wall surface of the flat pattern 53, and after the ink is dried, the spacer particles 16 are in contact with the wall surface of the flat pattern 53. Will adhere in a state.
- Such surface tension is caused by the intersection of a horizontal wall with many walls and a vertical wall. Since the surface area is relatively larger and the force acts more strongly, the spacer particles 16 are likely to adhere to the intersecting portions of the lattice-shaped wall surfaces.
- the ink droplets adheres to the planar pattern 53 of the placement region when the spacer particles 16 are applied, the surface tension of the planar pattern 53 is increased. Therefore, the ink droplets are attracted, and the spacer particles 16 in the droplets are also attracted to the planar pattern 53, so that the spacer particles 16 can be arranged at desired locations in the light shielding area. It becomes.
- the surface area of the portion where the wall surfaces intersect with each other increases, so the surface direct force increases and the spacer particles are attracted reliably. Therefore, the spacer particles can be reliably disposed at a desired location.
- Embodiment 2 of the present invention will be described with reference to FIG.
- This embodiment is different from the first embodiment in that a protrusion 53Aa and a recess 53Ab are formed on the gate wiring 21 instead of the unevenness formed on the dummy electrode 51.
- Other similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.
- the TaNZTaZTaN film of the gate wiring 21 is appropriately removed by a photolithographic process to form unevenness, and an insulating film 52 is formed on the upper surface thereof, thereby forming a lattice-shaped unevenness.
- the placement region 50A having the planar pattern 53A is formed. The placement region 50A thus formed also allows the spacer particles 16 to be disposed at a desired location as in the first embodiment. .
- FIG. 6 shows Embodiment 3 of the present invention.
- the spacer particles 16 are arranged on the CF substrate 20B instead of the TFT substrate 20A, and the mounting region 50B is formed on the BM portion 27, which is different from the first and second embodiments. To do.
- Other similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.
- the surface portion of the BM portion is partially removed by the photolithographic process to form the unevenness, and the placement region 50B (uneven surface pattern 50B) is formed. Is done.
- the spacer particles 16 can be disposed at desired locations as in the first and second embodiments.
- FIG. 7 shows Embodiment 4 of the present invention.
- the concave / convex planar pattern 53C (mounting region 50C) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Cb has an elongated shape parallel to the long side.
- FIG. 8 shows Embodiment 5 of the present invention.
- the concave / convex planar pattern 53D (mounting region 50D) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Db has an elongated shape parallel to the short side.
- FIG. 9 shows Embodiment 6 of the present invention.
- the concave / convex planar pattern 53E (mounting region 50E) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Eb has a generally rectangular shape in which the four corners are notched into a tapered shape at an angle of 45 °. .
- the plurality of recesses 53Eb are arranged vertically and horizontally.
- FIG. 10 shows Embodiment 7 of the present invention.
- the concave / convex planar pattern 53F (mounting region 50F) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Fb has a substantially rectangular shape with four corners projecting inwardly into a square.
- the plurality of recesses 53Fb are aligned in the vertical and horizontal directions.
- FIG. 11 shows Embodiment 8 of the present invention.
- the concave / convex planar pattern 53G (mounting region 50G) of the present embodiment is formed by the concave / convex provided on the surface on the side where the liquid crystal 15 is sealed in the auxiliary capacitance electrode line 54 of the auxiliary capacitance (storage capacitance or additional capacitance).
- the planar pattern 53G is a form in which two concave portions 53Gb are arranged in the length direction of the auxiliary capacitance electrode line 54, and has a horizontally long rectangular shape as a whole. In addition, you may replace this uneven
- a plurality of recesses 53b can be arranged vertically, horizontally, staggered, or randomly.
- FIG. 12 shows Embodiment 9 of the present invention.
- FIG. 5 shows a modification of the second embodiment.
- the concave portions 53Aa are arranged in two rows, whereas the concave and convex planar pattern 53H (mounting region 50H) of the present embodiment
- the parts 53Hb are arranged in a line.
- FIG. 13 shows Embodiment 10 of the present invention.
- a color filter is configured by dividing a plurality of pixels 26 by a grid-like black region 27 (black 'matrix), and the pigment 26 on the CF substrate 20B side is seen in plan view on the TFT substrate 20A.
- An electrode wire 60 is provided so as to cross the line.
- the uneven planar pattern 531 (mounting region 50) of the present embodiment is formed by unevenness provided on the surface of the electrode line 60 on the side where the liquid crystal 15 is sealed.
- the concave / convex planar pattern 531 has the same configuration as the concave / convex planar pattern 53 of the first embodiment, but instead, the concave / convex planar pattern 531 may have the form of the fourth to ninth embodiments.
- the unevenness was formed using the photo's lithographic process.
- the irregularities may be formed by laser processing.
- the dummy electrode 51, the gate wiring 21, the BM part 27, and the storage wiring 54 are used to form irregularities.
- the present invention is not limited to this, and the source wiring 22 (forming the circuit) and the ITO electrode are etched.
- the mounting region 50 may be formed by forming irregularities by using the above method.
- the spacer particles are applied to one of the TFT substrate and the CF substrate, but may be applied to both the TFT substrate and the CF substrate.
- the spacer particles arranged on the TFT substrate and the spacer particles arranged on the CF substrate may be arranged so as not to interfere with each other.
- the shape of the planar pattern 53 formed in the placement area is a lattice shape.
- the shape is not limited to this, and for example, all or one part around the arc-shaped planar pattern 53 or the light shielding area.
- a frame-like shape surrounding the portion may be used. Further, it may have a shape in which lattice-shaped, frame-shaped, or arc-shaped projections are mixed.
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Abstract
Description
明 細 書 Specification
液晶表示装置及び液晶表示装置の製造方法 Liquid crystal display device and method of manufacturing liquid crystal display device
技術分野 Technical field
[0001] 本発明は、液晶表示装置及びその製造方法に関し、特にスぺーサ粒子によって透 明基板同士の間隔を保持する液晶表示装置及び液晶表示装置の製造方法に関す るものである。 TECHNICAL FIELD [0001] The present invention relates to a liquid crystal display device and a manufacturing method thereof, and more particularly to a liquid crystal display device and a manufacturing method of a liquid crystal display device in which a spacing between transparent substrates is maintained by spacer particles.
背景技術 Background art
[0002] 液晶表示装置は、 TFT (Thin Film Transistor)が形成されたガラス基板と、 RGBの 各色が分布されてカラーフィルターを構成するガラス基板との間に液晶を挟持してな る液晶パネルを備える。このような液晶パネルにおいて、液晶層の厚みいわゆるセル ギャップは、液晶パネルの表示むら等を防ぐためにもその値が均一であることが要求 される。そして、このセルギャップを均一にする手段として、例えば特許文献 1に記載 のもののように、球状のスぺーサ粒子をガラス基板同士の間に配してその間隔を一 定に保持する構成のものが製造されて 、る。 A liquid crystal display device includes a liquid crystal panel in which liquid crystal is sandwiched between a glass substrate on which a TFT (Thin Film Transistor) is formed and a glass substrate on which RGB colors are distributed to form a color filter. Prepare. In such a liquid crystal panel, the thickness of the liquid crystal layer, that is, the cell gap, is required to have a uniform value in order to prevent uneven display of the liquid crystal panel. As a means for making this cell gap uniform, for example, as described in Patent Document 1, spherical spacer particles are arranged between glass substrates and the distance between them is kept constant. Is manufactured.
特許文献 1 :特開 2005— 10412公報 Patent Document 1: Japanese Patent Laid-Open No. 2005-10412
発明の開示 Disclosure of the invention
[0003] (発明が解決しょうとする課題) [0003] (Problems to be solved by the invention)
し力しながら、このような球状のスぺーサ粒子が、液晶表示装置の表示領域に混入 してしまうと、表示領域の液晶分子の配列が乱れて表示品質に支障をきたす怖れが ある。このため、スぺーサ粒子は、できる限り画像表示に関与しない遮光領域に配設 することが望まれるが、球状のスぺーサ粒子を遮光領域等の所望の箇所に配設する ことは困難であった。 However, if such spherical spacer particles are mixed into the display area of the liquid crystal display device, the alignment of the liquid crystal molecules in the display area may be disturbed, which may impair the display quality. For this reason, it is desirable to arrange the spacer particles in a light shielding region that is not involved in image display as much as possible, but it is difficult to arrange the spherical spacer particles in a desired location such as a light shielding region. there were.
[0004] 本発明は上記のような事情に基づいて完成されたものであって、スぺーサ粒子を所 望の箇所に配設した液晶表示装置を提供することを目的とする。 [0004] The present invention has been completed based on the above-described circumstances, and an object thereof is to provide a liquid crystal display device in which spacer particles are arranged at desired locations.
[0005] (課題を解決するための手段) [0005] (Means for solving the problem)
上記の目的を達成するための手段として、本発明の液晶表示装置は、一対の透明 基板と、前記透明基板同士の間に封止された液晶と、前記透明基板同士を所定の 間隔に保持するスぺーサ粒子とを有し、前記透明基板の遮光領域の表面に凹凸に よって形成され上記スぺーサ粒子が接する平面模様を備えるところに特徴を有する。 As means for achieving the above object, the liquid crystal display device of the present invention comprises a pair of transparent substrates, a liquid crystal sealed between the transparent substrates, and the transparent substrates in a predetermined manner. It is characterized by having a planar pattern formed by unevenness on the surface of the light-shielding region of the transparent substrate, and having a planar pattern in contact with the spacer particles.
[0006] また、本発明の液晶表示装置の製造方法は、一対の透明基板のうち少なくとも一 方の透明基板の遮光領域の表面に、凹凸を有する平面模様を形成し、前記一方の 透明基板に対し、前記平面模様を含む領域に向けてインクとともにスぺーサ粒子を 塗布し、前記インクを乾燥させて前記スぺーサ粒子を前記平面模様に付着させ、前 記一対の透明基板を、前記スぺーサ粒子を挟むことにより所定の間隔を空けて重ね 合わせ、前記重ね合わせた一対の透明基板の隙間に液晶を封入するところに特徴 を有する。 [0006] Further, in the method for manufacturing a liquid crystal display device of the present invention, a planar pattern having irregularities is formed on the surface of the light shielding region of at least one of the transparent substrates, and the one transparent substrate is formed on the one transparent substrate. On the other hand, spacer particles are applied together with ink toward an area including the planar pattern, the ink is dried to adhere the spacer particles to the planar pattern, and the pair of transparent substrates is attached to the pair of transparent substrates. It is characterized in that the spacer particles are overlapped with a predetermined interval by sandwiching the spacer particles, and the liquid crystal is sealed in a gap between the pair of transparent substrates.
[0007] 本発明によると以下の効果が発現される。 [0007] According to the present invention, the following effects are exhibited.
スぺーサ粒子は、インクジェット装置等の塗布装置によって、インクと共に噴射され て透明基板上に塗布された後、インクを乾燥させることで透明基板上に配設される。 そして、遮光領域の平面模様に向カゝつてスぺーサ粒子を含むインクを塗布すると、 平面模様に少なくともインクの液滴の一部分が付着すれば、平面模様の凹凸の表面 張力によってインクの液滴が引き寄せられ、それに伴ない液滴内のスぺーサ粒子も 平面模様に引き寄せられて平面模様に付着するので、スぺーサ粒子を遮光領域に 酉己設することができる。 The spacer particles are sprayed together with the ink by a coating device such as an ink jet device and coated on the transparent substrate, and then the ink is dried to be disposed on the transparent substrate. Then, when ink containing spacer particles is applied to the flat pattern of the light shielding area, if at least a part of the ink droplets adheres to the flat pattern, the ink droplets are caused by the surface tension of the irregularities of the flat pattern. Accordingly, the spacer particles in the droplet are also attracted to the plane pattern and attached to the plane pattern, so that the spacer particles can be set in the light shielding region.
従って、スぺーサ粒子を所望の箇所に配設することが可能となる。 Accordingly, the spacer particles can be disposed at a desired location.
図面の簡単な説明 Brief Description of Drawings
[0008] [図 1]図 1は実施形態 1のガラス基板 (TFT基板)の拡大平面図である。 FIG. 1 is an enlarged plan view of a glass substrate (TFT substrate) of Embodiment 1.
[図 2]図 2は図 1の X— X'の断面図である。 FIG. 2 is a cross-sectional view taken along the line XX ′ in FIG.
[図 3]図 3は図 2における載置領域を拡大してあらわした部分拡大図である。 [FIG. 3] FIG. 3 is a partially enlarged view showing the placement region in FIG. 2 in an enlarged manner.
[図 4]図 4はダミー電極の拡大斜視図である。 FIG. 4 is an enlarged perspective view of a dummy electrode.
[図 5]図 5は実施形態 2に係る載置領域の拡大断面図である。 FIG. 5 is an enlarged cross-sectional view of a mounting area according to the second embodiment.
[図 6]図 6は実施形態 3に係る載置領域の拡大断面図である。 FIG. 6 is an enlarged cross-sectional view of a mounting area according to the third embodiment.
[図 7]図 7は実施形態 4に係る載置領域の拡大平面図である。 FIG. 7 is an enlarged plan view of a placement area according to the fourth embodiment.
[図 8]図 8は実施形態 5に係る載置領域の拡大平面図である。 FIG. 8 is an enlarged plan view of a placement area according to the fifth embodiment.
[図 9]図 9は実施形態 6に係る載置領域の拡大平面図である。 [図 10]図 10は実施形態 7に係る載置領域の拡大平面図である。 FIG. 9 is an enlarged plan view of a placement area according to the sixth embodiment. FIG. 10 is an enlarged plan view of a placement area according to the seventh embodiment.
[図 11]図 11は実施形態 8の拡大平面図である。 FIG. 11 is an enlarged plan view of the eighth embodiment.
[図 12]図 12は実施形態 9に係る載置領域の拡大断面図である。 FIG. 12 is an enlarged cross-sectional view of a mounting area according to the ninth embodiment.
[図 13]図 13は実施形態 10に係る載置領域をあらわす拡大平面図である。 FIG. 13 is an enlarged plan view showing a placement area according to the tenth embodiment.
符号の説明 Explanation of symbols
[0009] 10...液晶表示装置 [0009] 10 ... Liquid crystal display device
15…液晶 15 ... LCD
16…スぺーサ粒子 16 Spacer particles
20...透明基板 20 ... Transparent substrate
20A—TFT基板 (透明基板) 20A—TFT substrate (transparent substrate)
20B...CF基板 (透明基板) 20B ... CF substrate (transparent substrate)
21…ゲート配線 (電極線) 21 ... Gate wiring (electrode wire)
22…ソース配線(電極線) 22 ... Source wiring (electrode wire)
25…トランジスタ 25 ... transistor
26...色素 26 ... Dye
27... BM部(黒色領域) 27 ... BM part (black area)
53…平面模様 53… Plane pattern
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
[0010] <実施形態 1 > [0010] <Embodiment 1>
本発明の実施形態 1を図 1ないし図 4によって説明する。 Embodiment 1 of the present invention will be described with reference to FIGS.
本実施形態の液晶パネル 10 (液晶表示装置)は、一対のガラス基板 20, 20と、両 ガラス基板 20, 20の間に充填される液晶 15とを備え、ガラス基板 20, 20同士の対 向面側の外周を図示しないシール剤によって封止されることで液晶 15を挟持してい る。 The liquid crystal panel 10 (liquid crystal display device) of the present embodiment includes a pair of glass substrates 20 and 20 and a liquid crystal 15 filled between the glass substrates 20 and 20, and the glass substrates 20 and 20 face each other. The liquid crystal 15 is sandwiched by sealing the outer periphery of the surface side with a sealing agent (not shown).
[0011] ガラス基板 20のうち一方のガラス基板 (TFT基板) 20Aには、図 1に示すように、互 いに直交するゲート配線 21とソース配線 22とが形成されると共に、双方の配線に接 続されたスイッチング素子 (例えば TFT) 25が多数(図 1には 1箇所のみ記載)設けら れている。 [0012] また、 TFT基板 20Aに対向する他方のガラス基板 (CF基板) 20Bには、 R, G, Bの 色素 26が規則的に配設されると共に、隣接する色素 26同士の間及び色素 26を配 設した領域の周囲には光が漏れな!/、ように黒色榭脂等で BM (ブラック 'マトリックス) 部 27が配設されて、カラーフィルターが形成されて!、る。 As shown in FIG. 1, a gate wiring 21 and a source wiring 22 that are orthogonal to each other are formed on one glass substrate (TFT substrate) 20A among the glass substrates 20, and both the wirings are connected to each other. Many connected switching elements (eg TFT) 25 are provided (only one location is shown in FIG. 1). [0012] Further, the other glass substrate (CF substrate) 20B facing the TFT substrate 20A is provided with R, G, B dyes 26 regularly, and between adjacent dyes 26 and between the dyes. Light is not leaking around the area where 26 is placed! / A black filter is used to form a BM (black 'matrix) part 27 and form a color filter! RU
[0013] 液晶パネル 10の製造は、 TFT基板 20Aの遮光領域にスぺーサ粒子 16を接着し た後、このスぺーサ粒子 16を CF基板 20Bとの間で挟むことにより、所定の間隔を空 けて両ガラス基板 20A, 20Bを重ね合わせ (貼り合わせ)る。そして、この両ガラス基 板 20A, 20Bの間に確保された隙間(セルギャップ)に液晶 15を封入する、という手 順で行われる。 [0013] The liquid crystal panel 10 is manufactured by adhering the spacer particles 16 to the light-shielding region of the TFT substrate 20A and then sandwiching the spacer particles 16 with the CF substrate 20B. The two glass substrates 20A and 20B are overlapped (laminated) with a gap. Then, the liquid crystal 15 is sealed in a gap (cell gap) secured between the glass substrates 20A and 20B.
このスぺーサ粒子 16は合成樹脂製の球状体であり、その表面は粘着材でコ一ティ ングがなされており、図示しないインクジェット塗布装置によりインク内に含有させた状 態で、 TFT基板 21上の平面模様 53を含む塗布領域に塗布される。 The spacer particles 16 are spherical bodies made of synthetic resin, and the surfaces thereof are coated with an adhesive material. The spacer particles 16 are contained in the ink by an ink jet coating apparatus (not shown). It is applied to the application area containing the top pattern 53 above.
[0014] さて、本実施形態において、スぺーサ粒子 16はゲート配線 21上の遮光領域に設 けられた載置領域 50に配されて 、る。 In the present embodiment, the spacer particles 16 are arranged in a placement region 50 provided in a light shielding region on the gate wiring 21.
この載置領域 50は、図 1の水平方向(ゲート配線 21方向)に沿って延びる平行な 複数本 (本実施形態では 3本であるが、本数はこれより多くても、少なくても良い)の 突部 53aと垂直方向(ソース配線 22方向)に沿って延びる平行な複数本 (本実施形 態では 11本である力 本数はこれより多くても、少なくても良い)の突部 53aとが交差 するようにして形成された格子状の平面模様 53からなる。平面模様 53は、全体とし て横方向(ゲート配線 21の長さ方向)を長辺とする長方形をなし、一定の大きさの方 形をなす複数の凹部 53bが縦横に整列して配置されている。尚、複数の凹部 53bは 、千鳥配置やランダムな配置であってもよい。上記スぺーサ粒子 16は、この格子(凹 部 53b)の間の突部 53aの表面、或いは格子(凹部 53b)の周囲の突部 53aの表面に 接触した状態で配される。 The mounting area 50 includes a plurality of parallel lines extending in the horizontal direction of FIG. 1 (the direction of the gate wiring 21) (in this embodiment, the number is three, but the number may be larger or smaller). A plurality of parallel projections 53a extending along the vertical direction (source wiring 22 direction) (the number of forces, which is 11 in this embodiment, may be larger or smaller) and 53a It consists of a grid-like planar pattern 53 formed so that the two intersect. The planar pattern 53 has a rectangular shape with the long side in the horizontal direction (the length direction of the gate wiring 21) as a whole, and a plurality of concave portions 53b having a fixed size are arranged vertically and horizontally. Yes. The plurality of recesses 53b may be staggered or randomly arranged. The spacer particles 16 are arranged in contact with the surface of the protrusion 53a between the lattices (concave portions 53b) or the surface of the protrusion 53a around the lattice (concave portion 53b).
[0015] 本実施形態では、載置領域 50は、ゲート配線 21の上方に配設されており、ソース 配線 22と同時に形成され、液晶表示のための回路に関与しないダミー電極 51を利 用して形成される。 In the present embodiment, the placement region 50 is disposed above the gate wiring 21, is formed simultaneously with the source wiring 22, and uses a dummy electrode 51 that is not involved in a circuit for liquid crystal display. Formed.
より詳細には、ダミー電極 51はトランジスタ 25のソース電極を形成する TaZTaN膜 のスパッタリング時に同時に成膜される。そして、この TaZTaN膜がフォト'リソグラフ イエ程によって所定箇所が適宜除去されて凹凸が形成され、図 4に示すような格子 状の平面模様 53に形成される。この平面模様 53は、載置領域 50の塗着されたイン クの液滴が離散することを規制して、インクの液滴を吸着し、ひいてはインクに含有さ れているスぺーサ粒子 16を集合させる機能を備える滴液保持手段となっている。 そして、ダミー電極 51の上面に絶縁膜 52が形成されることで、 TFT基板 20Aの液 晶封止面側に格子状の凹凸平面模様 53を備えた載置領域 50が形成される。 More specifically, the dummy electrode 51 is a TaZTaN film that forms the source electrode of the transistor 25. The film is formed simultaneously with sputtering. Then, the TaZTaN film is appropriately removed at predetermined locations by a photolithographic process to form irregularities, and is formed into a lattice-like planar pattern 53 as shown in FIG. This flat pattern 53 restricts the ink droplets applied in the placement area 50 from being dispersed, adsorbs the ink droplets, and consequently the spacer particles 16 contained in the ink. The droplet holding means has a function of collecting the droplets. Then, the insulating film 52 is formed on the upper surface of the dummy electrode 51, whereby the placement region 50 having the lattice-shaped uneven planar pattern 53 is formed on the liquid crystal sealing surface side of the TFT substrate 20A.
[0016] 尚、本実施形態において、遮光領域とは液晶表示装置の画像表示に関与しない 領域をいい、具体的にはゲート配線 21、ソース配線 22上の領域や、 BM部 27の領 域をいう。 In the present embodiment, the light-shielding region refers to a region that does not participate in image display of the liquid crystal display device. Specifically, the region on the gate wiring 21 and the source wiring 22 and the region of the BM unit 27 are defined. Say.
また、本実施形態の液晶パネル 10は、図示はしないが、偏光板、ノ ックライト装置 が配され、 TFT基板 20Aのゲート配線 21やソース配線 22に対して異方性導電膜( ACF) - SOF (System On Film)を介して(外部制御回路が設けられた)プリント 基板が接続される。これにより液晶パネル 10には画像の表示がされるようになつてい る。 In addition, although not shown, the liquid crystal panel 10 of the present embodiment is provided with a polarizing plate and a knock light device. An anisotropic conductive film (ACF) -SOF is connected to the gate wiring 21 and the source wiring 22 of the TFT substrate 20A. A printed circuit board (with an external control circuit) is connected via (System On Film). As a result, an image is displayed on the liquid crystal panel 10.
[0017] 続いて、本実施形態の作用について説明する。 [0017] Next, the operation of the present embodiment will be described.
インクジェット塗布装置にてスぺーサ粒子 16を含むインクを載置領域 50に向けて 噴射する。すると、載置領域 50にインクの液滴が付着する。そして、インクが乾燥する に連れインクの液滴径が次第に小さくなつていく。このとき、載置領域 50の格子状の 平面模様 53にインクの液滴が付着していると、平面模様 53の壁面の表面張力によ つて液滴が張り付くように付着する。 Ink containing the spacer particles 16 is ejected toward the placement area 50 by the ink jet coating apparatus. Then, ink droplets adhere to the placement area 50. As the ink dries, the ink droplet diameter gradually decreases. At this time, if ink droplets adhere to the grid-like planar pattern 53 of the placement area 50, the droplets adhere so as to stick due to the surface tension of the wall surface of the planar pattern 53.
[0018] そして、この状態でインクの乾燥が進むと、インクには壁面の表面張力が作用して いるので、インクの液滴径が小さくなるに連れ、液滴全体が平面模様 53の壁面に近 づいていく。 [0018] Then, when the drying of the ink proceeds in this state, since the surface tension of the wall surface acts on the ink, as the droplet diameter of the ink becomes smaller, the entire droplet drops on the wall surface of the flat pattern 53. Approaching.
[0019] これにより、液滴内に含まれるスぺーサ粒子 16も次第に平面模様 53の壁面に近づ いていき、インクの乾燥後にはスぺーサ粒子 16は平面模様 53の壁面に接触した状 態で付着することになる。 As a result, the spacer particles 16 contained in the droplet gradually approach the wall surface of the flat pattern 53, and after the ink is dried, the spacer particles 16 are in contact with the wall surface of the flat pattern 53. Will adhere in a state.
このような表面張力は、壁面の多い水平方向の壁面と垂直方向の壁面とが交差す る箇所の方が相対的に表面積が大きくなつて、その力が強く作用するので、格子状 模様の壁面の交差する箇所にスぺーサ粒子 16が付着し易くなる。 Such surface tension is caused by the intersection of a horizontal wall with many walls and a vertical wall. Since the surface area is relatively larger and the force acts more strongly, the spacer particles 16 are likely to adhere to the intersecting portions of the lattice-shaped wall surfaces.
[0020] また、仮に、インクジェット塗布装置によって、スぺーサ粒子 16自体力 載置領域 5 0とずれた位置に着弾した場合でも、スぺーサ粒子 16を含むインクの液滴の一部分 が平面模様 53にかかっていると、その箇所の表面張力によって、液滴が引張られ、 それに伴ない液滴内のスぺーサ粒子 16も平面模様 53側に引き寄せられて、乾燥時 には平面模様 53の壁面に付着することになる。 [0020] Further, even if the spacer particle 16 itself is landed at a position shifted from the placement region 50 by the ink jet coating apparatus, a part of the ink droplet containing the spacer particle 16 has a planar pattern. 53, the droplet is pulled by the surface tension at that location, and the spacer particles 16 in the droplet are also attracted to the flat pattern 53 side. It will adhere to the wall.
[0021] このように、本実施形態によれば、スぺーサ粒子 16の塗布時に載置領域の平面模 様 53に少なくともインクの液滴の一部分が付着すれば、平面模様 53の表面張力に よってインクの液滴が引き寄せられ、それに伴ない液滴内のスぺーサ粒子 16も平面 模様 53に引き寄せられるので、遮光領域の所望の箇所にスぺーサ粒子 16を配設す ることが可能となる。 As described above, according to the present embodiment, if at least a part of the ink droplets adheres to the planar pattern 53 of the placement region when the spacer particles 16 are applied, the surface tension of the planar pattern 53 is increased. Therefore, the ink droplets are attracted, and the spacer particles 16 in the droplets are also attracted to the planar pattern 53, so that the spacer particles 16 can be arranged at desired locations in the light shielding area. It becomes.
[0022] また、本実施形態のように、格子状の平面模様 53であれば、壁面が互いに交差す る箇所の表面積が増えるので表面直力が大きくなつて確実にスぺーサ粒子を引き寄 せることができるので、確実にスぺーサ粒子を所望の箇所に配設することが可能とな る。 [0022] Also, in the case of the lattice-like planar pattern 53 as in the present embodiment, the surface area of the portion where the wall surfaces intersect with each other increases, so the surface direct force increases and the spacer particles are attracted reliably. Therefore, the spacer particles can be reliably disposed at a desired location.
[0023] <実施形態 2> <Embodiment 2>
次に、本発明の実施形態 2を図 5によって説明する。 Next, Embodiment 2 of the present invention will be described with reference to FIG.
本実施形態は、ダミー電極 51に形成した凹凸に代えて、ゲート配線 21に突部 53A aと凹部 53Abを形成した点が上記実施形態 1と相違する。他の同様の構成について は同様の符号を付して、重複する説明は割愛する。 This embodiment is different from the first embodiment in that a protrusion 53Aa and a recess 53Ab are formed on the gate wiring 21 instead of the unevenness formed on the dummy electrode 51. Other similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.
本実施形態では、ゲート配線 21の形成時にフォト'リソグラフイエ程によって、ゲート 配線 21の TaNZTaZTaN膜を適宜除去して凹凸を形成し、その上面に絶縁膜 52 を形成することで、格子状の凹凸平面模様 53Aを備えた載置領域 50Aが形成される このように形成した載置領域 50Aによっても、上記実施形態 1同様スぺーサ粒子 1 6を所望の箇所に配設することが可能となる。 In the present embodiment, when the gate wiring 21 is formed, the TaNZTaZTaN film of the gate wiring 21 is appropriately removed by a photolithographic process to form unevenness, and an insulating film 52 is formed on the upper surface thereof, thereby forming a lattice-shaped unevenness. The placement region 50A having the planar pattern 53A is formed. The placement region 50A thus formed also allows the spacer particles 16 to be disposed at a desired location as in the first embodiment. .
[0024] <実施形態 3> 図6は本発明の実施形態3を示す。 <Embodiment 3> FIG. 6 shows Embodiment 3 of the present invention.
本実施形態は、スぺーサ粒子 16を TFT基板 20Aに代えて CF基板 20Bに配設す ると共に、載置領域 50Bを BM部 27に形成した点が上記実施形態 1及び実施形態 2 と相違する。他の同様の構成については同様の符号を付して、重複する説明は割愛 する。 In this embodiment, the spacer particles 16 are arranged on the CF substrate 20B instead of the TFT substrate 20A, and the mounting region 50B is formed on the BM portion 27, which is different from the first and second embodiments. To do. Other similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.
本実施形態では、 BM部 27の形成時にフォト'リソグラフイエ程によって BM部の表 層部分を一部除去することにより、凹凸を形成して、載置領域 50B (凹凸の平面模様 50B)が形成される。 In the present embodiment, when the BM portion 27 is formed, the surface portion of the BM portion is partially removed by the photolithographic process to form the unevenness, and the placement region 50B (uneven surface pattern 50B) is formed. Is done.
このように形成した載置領域 50Bによっても、上記実施形態 1及び 2同様スぺーサ 粒子 16を所望の箇所に配設することができる。 Also with the mounting region 50B formed in this way, the spacer particles 16 can be disposed at desired locations as in the first and second embodiments.
[0025] <実施形態 4> <Embodiment 4>
図7は本発明の実施形態4を示す。 FIG. 7 shows Embodiment 4 of the present invention.
本実施形態の凹凸平面模様 53C (載置領域 50C)は、全体として横長の方形をな し、凹部 53Cbは、長辺と平行な細長い形状をなしている。 The concave / convex planar pattern 53C (mounting region 50C) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Cb has an elongated shape parallel to the long side.
[0026] <実施形態 5 > <Embodiment 5>
図8は本発明の実施形態5を示す。 FIG. 8 shows Embodiment 5 of the present invention.
本実施形態の凹凸平面模様 53D (載置領域 50D)は、全体として横長の方形をな し、凹部 53Dbは、短辺と平行な細長い形状をなしている。 The concave / convex planar pattern 53D (mounting region 50D) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Db has an elongated shape parallel to the short side.
[0027] <実施形態 6 > <Embodiment 6>
図9は本発明の実施形態6を示す。 FIG. 9 shows Embodiment 6 of the present invention.
本実施形態の凹凸平面模様 53E (載置領域 50E)は、全体として横長の方形をな し、凹部 53Ebは、四隅が 45° の角度でテーパ状に切欠された形態の概ね長方形 をなしている。複数の凹部 53Ebは、縦横に整列して配置されている。 The concave / convex planar pattern 53E (mounting region 50E) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Eb has a generally rectangular shape in which the four corners are notched into a tapered shape at an angle of 45 °. . The plurality of recesses 53Eb are arranged vertically and horizontally.
[0028] <実施形態 7> <Embodiment 7>
図 10は本発明の実施形態 7を示す。 FIG. 10 shows Embodiment 7 of the present invention.
本実施形態の凹凸平面模様 53F (載置領域 50F)は、全体として横長の方形をな し、凹部 53Fbは、四隅が内側へ方形に突出した形態の概ね長方形をなしている。複 数の凹部 53Fbは、縦横に整列して配置されている。 [0029] <実施形態 8 > The concave / convex planar pattern 53F (mounting region 50F) of the present embodiment has a horizontally long rectangular shape as a whole, and the concave portion 53Fb has a substantially rectangular shape with four corners projecting inwardly into a square. The plurality of recesses 53Fb are aligned in the vertical and horizontal directions. <Embodiment 8>
図 11は本発明の実施形態 8を示す。 FIG. 11 shows Embodiment 8 of the present invention.
本実施形態の凹凸平面模様 53G (載置領域 50G)は、補助容量 (蓄積容量又は付 加容量)の補助容量電極線 54における液晶 15を封止する側の面上に設けた凹凸に よって形成されている。平面模様 53Gは、補助容量電極線 54の長さ方向に 2つの凹 部 53Gbを並べた形態であって、全体として横長の方形をなしている。尚、この凹凸 平面模様 53Gは、実施形態 4〜7の形態のものに替えてもよい。また、補助容量電極 線 54上の平面模様 53Gとしては、複数の凹部 53bを縦横に整列配置、千鳥配置、ラ ンダム配置させることができる。 The concave / convex planar pattern 53G (mounting region 50G) of the present embodiment is formed by the concave / convex provided on the surface on the side where the liquid crystal 15 is sealed in the auxiliary capacitance electrode line 54 of the auxiliary capacitance (storage capacitance or additional capacitance). Has been. The planar pattern 53G is a form in which two concave portions 53Gb are arranged in the length direction of the auxiliary capacitance electrode line 54, and has a horizontally long rectangular shape as a whole. In addition, you may replace this uneven | corrugated planar pattern 53G with the form of Embodiment 4-7. In addition, as the planar pattern 53G on the auxiliary capacitance electrode line 54, a plurality of recesses 53b can be arranged vertically, horizontally, staggered, or randomly.
[0030] <実施形態 9 > <Embodiment 9>
図 12は本発明の実施形態 9を示す。 FIG. 12 shows Embodiment 9 of the present invention.
図 5に示す実施形態 2の変形例であって、実施形態 2では凹部 53Aaが 2列に並ん で配置されていたのに対し、本実施形態の凹凸平面模様 53H (載置領域 50H)の凹 部 53Hbは、 1列に並んでいる。 FIG. 5 shows a modification of the second embodiment. In the second embodiment, the concave portions 53Aa are arranged in two rows, whereas the concave and convex planar pattern 53H (mounting region 50H) of the present embodiment The parts 53Hb are arranged in a line.
[0031] <実施形態 10 > <Embodiment 10>
図 13は本発明の実施形態 10を示す。 FIG. 13 shows Embodiment 10 of the present invention.
CF基板 20Bには、格子状の黒色領域 27 (ブラック 'マトリックス)によって複数の色 素 26を区画することによってカラーフィルターが構成され、 TFT基板 20Aには、 CF 基板 20B側の色素 26を平面視において横切るように配置された電極線 60が設けら れている。本実施形態の凹凸平面模様 531 (載置領域 50)は、この電極線 60におけ る液晶 15を封止する側の面上に設けた凹凸によって形成されている。尚、この凹凸 平面模様 531は、上記実施形態 1の凹凸平面模様 53と同じ構成となっているが、こ れに替えて、実施形態 4〜9の形態のものとしてもよい。 On the CF substrate 20B, a color filter is configured by dividing a plurality of pixels 26 by a grid-like black region 27 (black 'matrix), and the pigment 26 on the CF substrate 20B side is seen in plan view on the TFT substrate 20A. An electrode wire 60 is provided so as to cross the line. The uneven planar pattern 531 (mounting region 50) of the present embodiment is formed by unevenness provided on the surface of the electrode line 60 on the side where the liquid crystal 15 is sealed. The concave / convex planar pattern 531 has the same configuration as the concave / convex planar pattern 53 of the first embodiment, but instead, the concave / convex planar pattern 531 may have the form of the fourth to ninth embodiments.
[0032] <他の実施形態 > [0032] <Other Embodiments>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく 、例えば次のような実施形態も本発明の技術的範囲に含まれ、さらに、下記以外にも 要旨を逸脱しない範囲内で種々変更して実施することができる。 The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and are within the scope not departing from the gist other than the following. Various modifications can be made.
(1)上記実施形態ではフォト'リソグラフイエ程を用いて凹凸を形成したが、これに 限らず例えば、レーザー処理によって凹凸を形成してもよい。 (1) In the above embodiment, the unevenness was formed using the photo's lithographic process. For example, the irregularities may be formed by laser processing.
(2)上記実施形態ではダミー電極 51、ゲート配線 21、 BM部 27、蓄積配線 54を用 いて凹凸を形成したが、これに限らず、(回路を構成する)ソース配線 22、 ITO電極 にエッチング等で凹凸を形成して載置領域 50を形成するものであってもよい。 (2) In the above embodiment, the dummy electrode 51, the gate wiring 21, the BM part 27, and the storage wiring 54 are used to form irregularities. However, the present invention is not limited to this, and the source wiring 22 (forming the circuit) and the ITO electrode are etched. For example, the mounting region 50 may be formed by forming irregularities by using the above method.
(3)上記実施形態ではスぺーサ粒子を TFT基板と CF基板の ヽずれか一方に塗布 したが、 TFT基板と CF基板との双方に塗布するものであってもよい。この場合、 TFT 基板上に配設したスぺーサ粒子と CF基板上に配設したスぺーサ粒子とが重なりあつ て干渉しな 、ように配設したものであってもよ 、。 (3) In the above embodiment, the spacer particles are applied to one of the TFT substrate and the CF substrate, but may be applied to both the TFT substrate and the CF substrate. In this case, the spacer particles arranged on the TFT substrate and the spacer particles arranged on the CF substrate may be arranged so as not to interfere with each other.
(4)上記実施形態では、載置領域に形成した平面模様 53の形状が格子状のもの であったが、これに限らず、例えば円弧状の平面模様 53や遮光領域の周囲の全部 或いは一部を取り囲むような枠状のものであってもよい。また、格子状や枠状、円弧 状の突部が混合するような形状のものであってもよい。 (4) In the above embodiment, the shape of the planar pattern 53 formed in the placement area is a lattice shape. However, the shape is not limited to this, and for example, all or one part around the arc-shaped planar pattern 53 or the light shielding area. A frame-like shape surrounding the portion may be used. Further, it may have a shape in which lattice-shaped, frame-shaped, or arc-shaped projections are mixed.
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-086605 | 2006-03-27 | ||
| JP2006086605 | 2006-03-27 |
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| Publication Number | Publication Date |
|---|---|
| WO2007111102A1 true WO2007111102A1 (en) | 2007-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/054447 Ceased WO2007111102A1 (en) | 2006-03-27 | 2007-03-07 | Liquid crystal display device and method for manufacturing liquid crystal display device |
Country Status (1)
| Country | Link |
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| WO (1) | WO2007111102A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000235188A (en) * | 1999-02-17 | 2000-08-29 | Hitachi Ltd | Liquid crystal display |
| JP2004145102A (en) * | 2002-10-25 | 2004-05-20 | Seiko Epson Corp | Liquid crystal device, manufacturing method of liquid crystal device, electronic equipment |
| JP2005004094A (en) * | 2003-06-13 | 2005-01-06 | Sekisui Chem Co Ltd | Manufacturing method of liquid crystal display device |
| WO2006048973A1 (en) * | 2004-11-02 | 2006-05-11 | Sharp Kabushiki Kaisha | Liquid crystal display device board |
-
2007
- 2007-03-07 WO PCT/JP2007/054447 patent/WO2007111102A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000235188A (en) * | 1999-02-17 | 2000-08-29 | Hitachi Ltd | Liquid crystal display |
| JP2004145102A (en) * | 2002-10-25 | 2004-05-20 | Seiko Epson Corp | Liquid crystal device, manufacturing method of liquid crystal device, electronic equipment |
| JP2005004094A (en) * | 2003-06-13 | 2005-01-06 | Sekisui Chem Co Ltd | Manufacturing method of liquid crystal display device |
| WO2006048973A1 (en) * | 2004-11-02 | 2006-05-11 | Sharp Kabushiki Kaisha | Liquid crystal display device board |
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