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WO2007034562A1 - Procédé et appareil pour inspecter une diode électroluminescente - Google Patents

Procédé et appareil pour inspecter une diode électroluminescente Download PDF

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Publication number
WO2007034562A1
WO2007034562A1 PCT/JP2005/017612 JP2005017612W WO2007034562A1 WO 2007034562 A1 WO2007034562 A1 WO 2007034562A1 JP 2005017612 W JP2005017612 W JP 2005017612W WO 2007034562 A1 WO2007034562 A1 WO 2007034562A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting diode
light
light emitting
circulation path
energization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/017612
Other languages
English (en)
Japanese (ja)
Inventor
Shigeki Hara
Yasuhito Kumai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Far East Engineering Co Ltd
JCC Engineering Co Ltd
Original Assignee
Far East Engineering Co Ltd
JCC Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Far East Engineering Co Ltd, JCC Engineering Co Ltd filed Critical Far East Engineering Co Ltd
Priority to PCT/JP2005/017612 priority Critical patent/WO2007034562A1/fr
Publication of WO2007034562A1 publication Critical patent/WO2007034562A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes

Definitions

  • the present invention relates to a light emitting diode detection method and a detection device capable of reliably detecting a light emitting diode element used as an in-vehicle lamp.
  • light-emitting diode lamps have been used for various applications, and are increasingly used under various conditions such as high temperatures as usage environments. For example, when used in automobile stop lamps, etc., it is kept lit at night and used at high temperatures.
  • the inspection of the light-emitting diode element that is generally performed is only a check for disconnection by an energization test and a check for color unevenness and luminance by visual inspection. For this reason, it is not possible to preliminarily select light emitting diode elements that are defective due to thermal strain.
  • an object of the present invention is to propose a light-emitting diode inspection method and inspection apparatus that can select light-emitting diode elements that are defective due to thermal strain as defective products.
  • the light-emitting diode inspection method of the present invention includes:
  • the method includes a collection step of sorting and collecting the light-emitting diode elements that have been tested based on the result of the current test.
  • a heat load is applied to the light emitting diode element in advance before conducting the energization test.
  • a light-emitting diode element that is highly likely to be disconnected due to a temperature change is brought into a disconnected state by applying a thermal load. Therefore, such defective products can be surely eliminated by subsequent energization tests.
  • the method according to the present invention is characterized by having a cooling step of cooling the light-emitting diode element that has been detected after the energization step.
  • the method of the present invention includes an alignment step of aligning the light-emitting diode elements being conveyed so that the lead terminals having the same polarity face the same side prior to the energization step. It is characterized by that.
  • the method of the present invention is characterized in that, in the energization step, a plurality of the light emitting diode elements are individually energized, and an energization test is simultaneously performed on them. In this way, it is possible to efficiently conduct an energization test for a large number of light emitting diode elements.
  • the light-emitting diode inspection device of the present invention includes:
  • a second circulation path that receives n light emitting diode elements arranged at the element delivery position on the first circulation path and transports them at a constant feed pitch in a direction orthogonal to the first circulation path;
  • An energization test is performed by individually energizing n light emitting diode elements heated through the high temperature tank and heating the light emitting diode elements conveyed along the second circulation path at the same time.
  • a cooling unit that cools the light-emitting diode element conveyed along the second circulation path via the energization unit
  • the light emitting diode elements that have returned to the element delivery position after cooling are n in number.
  • a second circulation path that transports n light emitting diodes in a direction orthogonal to the first circulation path is disposed, and the n light emitting diodes are transported n by one along the second circulation path to be heated and heated. Conducting an energization test. Also, inspect at the element delivery position in the second circuit The target light emitting diode element is received, and the detected light emitting diode element is returned to the first circuit from the same element delivery position. Therefore, the light-emitting diode transport path can be made compact and compact, and energization tests of a large number of light-emitting diode elements can be performed efficiently.
  • n element transfer tools for transferring the light-emitting diode elements are arranged at a constant feed pitch along the second circulation path, and each element transfer tool is transported A pair of open and close arms that open and close in the direction, and a pair of lead terminals of the light-emitting diode element are held between these open and close arms with an insulating plate sandwiched between them.
  • the distal end surface of the open / close arm of the element transfer tool is covered with a flexible heat insulating sheet that seals between them. If an element transfer tool having a powerful structure is used, since each element transfer tool is insulated, only the light-emitting diode held by these elements can be heated in a high-temperature furnace.
  • the energization unit includes n pairs of energization contacts, and is held by n element transfer tools conveyed to the energization unit.
  • Each light emitting diode element is individually energized by pressing each contact element from both sides against the root portion of the lead terminal of each light emitting diode element.
  • FIG. 1 is a schematic plan view of a light-emitting diode inspection device to which the present invention is applied.
  • FIG. 2 is a schematic front view of the light-emitting diode inspection device of FIG. 1.
  • FIG. 3 is a schematic left side view of the light-emitting diode inspection device of FIG. 1.
  • FIG. 4 is a schematic right side view of the light-emitting diode inspection device in FIG. 1.
  • FIG. 5 is an explanatory diagram showing a flow of light emitting diode elements in the light emitting diode inspection apparatus of FIG. 1.
  • FIG. 6 is a partial explanatory view showing a configuration of a current-carrying unit of the light-emitting diode inspection device in FIG. 1.
  • FIG. 7 is a partial perspective view of the energization section shown in FIG.
  • the light-emitting diode detection device 1 has a device base 2 assembled in a rectangular parallelepiped shape. Each component is mounted on a base plate 3 that is horizontally mounted on the apparatus base 2, and a control / operation panel 5 is accommodated between the base plate 3 and the apparatus bottom plate 4.
  • a supply-side opening 6 for supplying a light-emitting diode element to be detected, and a double-opening type opening / closing door 7 is attached to the opening 6.
  • On the right side of the front side of the device there is a take-out opening 8 for taking out the light-emitting diode element that has been inspected.
  • an element supply unit 11 that receives light-emitting diode elements to be inspected and delivers them at a constant feed pitch is arranged inside the supply side opening 6, an element supply unit 11 that receives light-emitting diode elements to be inspected and delivers them at a constant feed pitch is arranged inside the supply side opening 6, an element supply unit 11 that receives light-emitting diode elements to be inspected and delivers them at a constant feed pitch is arranged inside the supply side opening 6, an element supply unit 11 that receives light-emitting diode elements to be inspected and delivers them at a constant feed pitch is arranged inside the supply side opening 6, an element supply unit 11 that receives light-emitting diode elements to be inspected and delivers them at a constant feed pitch is arranged inside the supply side opening 6, an element supply unit 11 that receives light-emitting diode elements to be inspected and delivers them at a constant feed pitch is arranged inside the supply side opening 6, an element supply unit 11 that receives light-emitting diode elements to be
  • a circular vertical circulation path 16 is opposed to one straight conveyance path portion 15 in the oval horizontal circulation path 14.
  • a plurality of light emitting diode elements are delivered to the vertical circulation path 16 (second circulation path) from the linear conveyance path portion 15 of the horizontal circulation path 14 at a time. In this example, 32 pieces are delivered. The 32 light-emitting diode elements delivered to the vertical circulation path 16 are transported along the vertical circulation path 16 and returned to the original position facing the linear transport path portion 15 again.
  • a high-temperature sodium carbonate 17 is disposed along the vertical circulation path 16, and the light-emitting diode element is heated to a predetermined temperature while being conveyed through the high-temperature tank 17.
  • a current-carrying part 18 is arranged at the outlet of the high-temperature bath 17, and the 32 light-emitting diode elements reaching here are individually energized at the same time and inspected for disconnection.
  • a cooling unit 19 is disposed at a downstream side of the energization unit 18 in the vertical circulation path 16, and the light emitting die is passed through the cooling unit 19. The Aether element is cooled.
  • the cooled light-emitting diode element returns again to a position facing the linear conveyance path portion 15 of the horizontal circulation path 14, and this force is returned to the linear conveyance path portion 15.
  • the light-emitting diode elements returned to the straight conveyance path portion 15 are conveyed along the horizontal circulation path 14, and are sorted at the downstream position based on the result of the energization test. It is collected in the defective product takeout part 21.
  • FIG. 5 is an explanatory diagram showing the flow of light emitting diodes in the light emitting diode inspection device 1 of this example.
  • the element supply unit 11 of the light-emitting diode inspection apparatus 1 arranges the hopper 22 into which the light-emitting diode 10 to be inspected is inserted and the light-emitting diode element 10 sent out from the hopper 22 into an upright state, and then sends it out by IJ.
  • a transport unit 23 and a pitch conversion unit 24 that feeds the light-emitting diode elements 10 aligned in the established state along a horizontal arc-shaped transport path at a constant feed pitch are provided.
  • the light emitting diodes 10 delivered from the pitch converter 24 at a constant feed pitch are delivered to the polarity aligning unit 12 one by one.
  • the polarity aligning unit 12 includes eight element transfer devices 25 arranged at equiangular intervals in a state of extending radially on the vertical plane immediately above the pitch converting unit 24. These element transfer devices 25 have gripping claws that open and close to the left and right, and rotate along a vertical circular circulation path 26 centered on the horizontal axis. The lowest rotation position in the circular circulation path 26 is the element receiving position.
  • the pair of lead terminals 10a and 10b rotate the light emitting diode element 10 in the established posture sent out from the pitch converter 24. It is gripped and transported in a state aligned in the direction and protruding outward.
  • a polarity detector 27 is disposed at a position rotated 135 degrees from the receiving position, and detects the polarity of the pair of lead terminals 10a and 10b.
  • a polarity reversing section 28 is arranged at a position rotated 45 degrees from here.
  • a lead terminal having a predetermined polarity is positioned on the front side in the transport direction.
  • the ⁇ / S inspection section 29 is placed at a position rotated 45 degrees from here, and the water rotated 45 degrees from here
  • the flat bow I is moved to the transfer position, and the light emitting diode element 10 is transferred to the transfer section 13.
  • the transfer unit 13 includes four element transfer tools 31 arranged radially at an angular interval of 90 degrees, and these element transfer tools 31 are the same as the element transfer tools 25 of the polar alignment unit 12. Rotate along a circular circuit 32 circumscribing these circular circuits 26 on the vertical plane.
  • the element transfer tool 31 has a gripping claw that opens and closes to the left and right. Grip from both sides and receive the side force of the transfer device 25.
  • the element transfer tool 31 delivers the light emitting diode element 10 to the horizontal circulation path 14 at a delivery position where the element transfer tool 31 rotates to the opposite side and assumes a horizontal posture.
  • the horizontal circulation path 14 is a movement path of the element transfer tool 35 attached at a constant pitch to the transport belt 34 laid between the driving side sprocket 32 and the driven side sprocket 33.
  • the element transfer tool 35 has a rear end portion connected to the transport belt 34, and an element gripping claw that can be opened and closed left and right is attached to the front end portion.
  • the element transfer tool 35 is connected to the pair of lead terminals 10a and 10b of the light emitting diode element 10 held by the element transfer tool 31 at the receiving position facing the element transfer tool 31 of the transfer unit 13 in the horizontal circulation path 14.
  • the light emitting diode 10 is received from the element transfer tool 31 by grasping the root portion from both sides.
  • the element transfer device 35 While sequentially receiving the light-emitting diodes 10 at this receiving position, the element transfer device 35 is intermittently fed along the horizontal circulation path 14 toward the linear transport path portion 15 on the opposite side.
  • the conveying operation of the element transfer tool 35 in the horizontal circulation path 14 is temporarily stopped, and 32 light emitting diode elements 10 are -Overall, it is handed over to the vertical circuit 16 side.
  • the side of the vertical circulation path 16 is configured as follows.
  • a horizontal rotary shaft 41 extending in parallel with the straight conveyance path portion 15 at the same height as the horizontal circulation path 14 is spanned between the left and right end plates 42 and 43 in a rotatable state.
  • One shaft end of the horizontal rotation shaft 41 extends from the end plate 43, and a rotation drive source 44 for rotating the horizontal rotation shaft 41 is connected thereto.
  • Disks 45 and 46 are coaxially mounted. Between these disks 45 and 46, a plurality of connecting shafts 47 are horizontally arranged at a fixed angular interval in the same circle around the horizontal rotation shaft 41. It is stretched over.
  • the rear end portions of the 32 element transfer tools 50 are attached to each connecting shaft 47 at a constant pitch along the axial direction.
  • the element transfer tool 50 attached to each connecting shaft 47 that rotates integrally with the horizontal rotation shaft 41 rotates around the horizontal rotation shaft 41 and is gripped by the tip of each of the element transfer tools 50.
  • the light-emitting diode element moves along a circular vertical circuit 16.
  • FIG. 6 is an explanatory view showing the main parts of the element transfer tool 50 and the energization section 18, and FIG. 7 is a perspective view thereof.
  • the element transfer tool 50 includes a support plate 51 whose rear end is connected to a connecting shaft 47, and the support plate 51 has a support pin 52, 53 as a center in the transport direction.
  • a pair of openable and closable arms 54 and 55 that can be opened and closed are attached. Between them, an insulating plate 56 is disposed between the open / close arms 54 and 55 of the 32 element transfer devices 50 arranged in a line.
  • the open / close arms 54 and 55 are urged by spring members (not shown) in a direction in which the front ends abut against each other, and rollers 57 and 58 are provided at rear ends extending rearward from the support pins 52 and 53. It is attached.
  • a rotating cam plate 59 is disposed between the rollers 57 and 58. In a state where both ends in the width direction of the rotating cam plate 59 are in contact with the rollers 57 and 58, as shown in FIG. 6, the tip side portions of the opening and closing arms 54 and 55 are closed.
  • the rotating cam plate 59 is rotated 180 degrees to a position 59A indicated by an imaginary line, the distal end portions of the opening and closing arms 54 and 55 are opened by the spring force.
  • Two L-shaped gripping plate springs 61 and 62 are attached to the inner side surfaces at the distal ends of the opening and closing arms 54 and 55, respectively, with the insulating plate 56 interposed therebetween and facing each other. . Open the left and right gripping leaf springs 61 and 62, position the pair of lead terminals 10a and 10b of the light-emitting diode element 10 on both sides of the insulating plate 56, and close the open / close arms 54 and 55 in this state. The holding leaf springs 61 and 62 are pressed against the insulating plate 56 with the pair of lead terminals 10a and 10b. In this state, the light emitting diode element 10 is held by the element transfer tool 50.
  • the light emitting diode element 10 held by the element transfer tool 50 is circulated in the vertical direction. It is transported in a high temperature furnace 17 arranged along the path 16.
  • the high-temperature furnace 17 in this example has a constant-width circle formed by left and right end plates 42 and 43, and an outer arc plate 63 and an inner arc plate 64 extending between them and extending at an angle of 180 degrees or more.
  • An arcuate duct 65 is provided.
  • the tip surfaces of the open / close arms 54 and 55 of the element transfer device 50 arranged in a row and the tip surfaces of the open and close arms 55 and 54 of the element transfer device 50 in the row of contact are shown in FIG.
  • heat insulating sheets 66 and 67 made of a flexible material that seals between them. These heat insulating sheets 66 and 67 substantially cover the element transfer devices 50 arranged in a radial pattern. Between these heat insulating sheets 64 and 65 and the inner arc plate 62, an arc-shaped inner dart plate is provided. 68 is formed.
  • the high-temperature furnace 17 circulates heated air supplied from a heating air supply source (not shown) via the outer arc-shaped duct 65 and the inner arc-shaped duct 68, and passes through the inner arc-shaped duct 68.
  • the light emitting diode element 10 to be conveyed is heated.
  • the exit end of the arc-shaped duct 68 is located at a position directly above the vertical circulation path 16, and the current-carrying test of the light emitting diode 10 held by the element transfer tool 50 is performed at this position.
  • a current-carrying part 18 is arranged.
  • the configuration of the energization unit 18 will be described with reference to FIGS.
  • the energizing section 18 has a configuration in which 32 pairs of positive side contacts 71 and negative side contacts 72 are arranged in a line in a downward state. The rear ends of each positive side contact 71 and each negative side contact 72 are connected to the positive side and the negative side of the power supply via feeder lines 73 and 74, respectively.
  • the tip portions of the contacts 71 and 72 are provided with claw portions 71a and 72a projecting at right angles in the directions approaching each other, and a pair of lead terminals of the light-emitting diode element 10 held by the element transfer tool 50
  • the base side portions of 10a and 10b can be energized by pressing the insulating plate 56 from both sides.
  • the contacts 71, 72 are attached to the support arms 75, 76, and these support arms 75, 76 are removed from the vertical circulation path 16 of the light emitting diode 10 by the lifting cylinder 77 (see FIG. 4).
  • the raised position (the position of one support arm 75 in FIG. 6) and the lowered position where the claw portions 71a and 72a face each other at the base side of the pair of lead terminals 10a and 10b of the light emitting diode 10 (see FIG.
  • the open / close cylinder 78 allows the claw portions 71a and 72a to move away from each other. These can move between the contact positions pressed against the lead terminals 10a and 10b of the light emitting diode element 10.
  • the cooling unit 19 disposed in the downstream portion of the energization unit 18 in the vertical circulation path 16 is connected to the light emitting diode element 10 sent from the high temperature furnace 17 after the energization test with respect to the blower 81 ( Cool by blowing cooling air as shown in Figure 4.
  • the light-emitting diode element 10 after cooling returns to the delivery position facing the linear conveyance path portion 15 of the horizontal circulation path 14 again. At this delivery position, the detected light emitting diode 10 that has been subjected to the energization test at a high temperature is delivered to the 32 element transfer devices 35 in the empty state waiting in the linear conveyance path portion 15.
  • the element transfer device 35 in the horizontal circulation path 14 is conveyed along the horizontal circulation path 14 again when the delivery operation of the inspected light-emitting diode element 10 is completed.
  • the conveyance along the horizontal circulation path 14 is performed continuously by 32 pitches by intermittent driving, and then the conveyance is temporarily stopped. In this state, the next 32 light emitting diode elements 10 to be inspected are arranged in the straight conveyance path portion 15.
  • These 32 light-emitting diode elements 10 are 32 element transfer devices 50 on the side of the vertical circuit that are waiting at the same position with the light-emitting diode elements 10 delivered and empty. Is handed over to After the receiving operation of the new light emitting diode element 10 to be inspected is completed, the 32 light emitting diode elements 10 are fed along the vertical circulation path 16 by one pitch.
  • the 32 element transfer devices 50 return the inspected light-emitting diode elements 10 to the horizontal circuit 14 and then perform a new inspection object.
  • the repeating operation is repeated.
  • the element transfer tool 50 is stopped, the current-carrying tests on the 32 light-emitting diode elements 10 held by the element transfer tool 50 located in the energization unit 18 are simultaneously performed by individual energization.
  • non-defective products that have passed the energization test are transferred to the non-defective product take-out unit 20 arranged downstream of the delivery position. It is released from the ingredient 35 and collected there. I have not passed the current test
  • the defective product is released from the element transfer device 35 in the defective product taking-out section 21 downstream of the non-defective product taking-out section 20 and collected there.
  • the element transfer device 35 that has been emptied in this way again reaches the receiving position of the light-emitting diode element 10 to be detected, and the side force of the transfer unit 13 also sequentially changes the light-emitting diode element 10 to be detected. receive.
  • the transport cycle is repeated in which the element transfer device 35 is intermittently transported continuously for 32 pitches, and then the transport operation is stopped for a predetermined period.
  • the operations of the supply unit 11, the polarity alignment unit 12 and the transfer unit 13 are controlled so that each new light-emitting diode element 10 to be inspected is an element in the horizontal circulation path 14. Delivered to transfer device 35.
  • the current-carrying test is performed after the light-emitting diode element 10 is heated through the high-temperature bath 17. Therefore, a light emitting diode element that is highly likely to be disconnected due to thermal strain can be assigned as a defective product. Therefore, it is suitable for inspection of light-emitting diode elements used at high temperatures such as in-vehicle lamps.
  • the vertical circulation path 16 that circulates in the vertical direction is arranged so as to intersect the linear conveyance path portion 15 of the horizontal circulation path 14.
  • a plurality of light emitting diode elements 10 are arranged in the straight conveyance path portion 15, they can be collectively delivered to the vertical circulation path 16 and sent to the energization section 18 via the high-temperature tank 17. Therefore, a large number of light emitting diode elements 10 can be sent to the current-carrying portion by a compact transport mechanism, which is advantageous for downsizing and compactness of the apparatus.
  • the tip surfaces of the element transfer tools 50 that circulate along the vertical direction circulation path 16 are covered with heat insulating sheets 66 and 67. Therefore, only the light emitting diode element 10 conveyed in the high temperature bath 17 is heated, and heat does not escape to the element transfer tool 50 side. Therefore, the light emitting diode element can be efficiently heated, and the heat capacity of the high temperature chamber 17 can be reduced.
  • inspection method and inspection apparatus of the present invention are not limited to the inspection of light emitting diode elements of the type described in the embodiments, but are also inspections of light emitting diode elements of surface mount type, snap type, and other types. It can also be applied to.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Selon l'invention, dans un appareil d'inspection de diodes électroluminescentes (1), une pluralité de diodes électroluminescentes (10) sont transportées au travers d'un bac à haute température (17) et chauffées, puis on fait passer un courant au travers de chaque diode électroluminescente (10) au niveau d'une section de conduction (18), ce qui permet ainsi d'effectuer simultanément un test de conduction des diodes électroluminescentes (10). Ensuite, la diode électroluminescente (10) est transportée au travers d'une section de refroidissement (19) ce qui refroidit ainsi la diode électroluminescente (10) inspectée. Sur la base des résultats du test de conduction, les diodes électroluminescentes (10) inspectées sont réparties sur une section à emporter de produits acceptables (20) ou sur une section à emporter de produits à rejeter (21), et recueillies. Lorsque l'appareil d'inspection de diodes électroluminescentes (1) est utilisé, une diode électroluminescente (10) présentant un risque élevé de déconnexion due à une contrainte thermique peut être au préalable retirée en tant que produit à rejeter.
PCT/JP2005/017612 2005-09-26 2005-09-26 Procédé et appareil pour inspecter une diode électroluminescente Ceased WO2007034562A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/017612 WO2007034562A1 (fr) 2005-09-26 2005-09-26 Procédé et appareil pour inspecter une diode électroluminescente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/017612 WO2007034562A1 (fr) 2005-09-26 2005-09-26 Procédé et appareil pour inspecter une diode électroluminescente

Publications (1)

Publication Number Publication Date
WO2007034562A1 true WO2007034562A1 (fr) 2007-03-29

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PCT/JP2005/017612 Ceased WO2007034562A1 (fr) 2005-09-26 2005-09-26 Procédé et appareil pour inspecter une diode électroluminescente

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012078135A (ja) * 2010-09-30 2012-04-19 Sharp Corp 搬送検査装置、テーピング装置、および搬送検査方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122864A (ja) * 1990-09-14 1992-04-23 Fujitsu Miyagi Electron:Kk 半導体試験装置のハンドラー
JPH0888254A (ja) * 1994-09-20 1996-04-02 Hitachi Ltd 発光ダイオード装置の製造方法
JP2000068561A (ja) * 1998-08-19 2000-03-03 Nec Corp 光送信器
JP2000180501A (ja) * 1998-12-11 2000-06-30 Orion Mach Co Ltd 環境試験装置
JP2000304810A (ja) * 1999-04-21 2000-11-02 Kohan Denshi Kogyo Kk 電子部品の極性整列機構
JP2001345481A (ja) * 2000-05-31 2001-12-14 Shibuya Kogyo Co Ltd 光電変換素子の検査方法及び装置
JP2002090415A (ja) * 2000-09-13 2002-03-27 Noozeru Engineering Kk 通電エージング方法および装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122864A (ja) * 1990-09-14 1992-04-23 Fujitsu Miyagi Electron:Kk 半導体試験装置のハンドラー
JPH0888254A (ja) * 1994-09-20 1996-04-02 Hitachi Ltd 発光ダイオード装置の製造方法
JP2000068561A (ja) * 1998-08-19 2000-03-03 Nec Corp 光送信器
JP2000180501A (ja) * 1998-12-11 2000-06-30 Orion Mach Co Ltd 環境試験装置
JP2000304810A (ja) * 1999-04-21 2000-11-02 Kohan Denshi Kogyo Kk 電子部品の極性整列機構
JP2001345481A (ja) * 2000-05-31 2001-12-14 Shibuya Kogyo Co Ltd 光電変換素子の検査方法及び装置
JP2002090415A (ja) * 2000-09-13 2002-03-27 Noozeru Engineering Kk 通電エージング方法および装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012078135A (ja) * 2010-09-30 2012-04-19 Sharp Corp 搬送検査装置、テーピング装置、および搬送検査方法

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