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WO2006125375A1 - Lampe a groupe de diodes electroluminescentes - Google Patents

Lampe a groupe de diodes electroluminescentes Download PDF

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Publication number
WO2006125375A1
WO2006125375A1 PCT/CN2006/001023 CN2006001023W WO2006125375A1 WO 2006125375 A1 WO2006125375 A1 WO 2006125375A1 CN 2006001023 W CN2006001023 W CN 2006001023W WO 2006125375 A1 WO2006125375 A1 WO 2006125375A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
light
light emitting
diode
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2006/001023
Other languages
English (en)
Chinese (zh)
Inventor
Jen-Shyan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US11/921,177 priority Critical patent/US7722217B2/en
Priority to CA2610026A priority patent/CA2610026C/fr
Priority to EP06741911A priority patent/EP1933085A4/fr
Priority to JP2008512672A priority patent/JP4805347B2/ja
Publication of WO2006125375A1 publication Critical patent/WO2006125375A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a light-emitting diode cluster lamp, and in particular, the light-emitting diode cluster lamp of the present invention is a high-intensity lighting device. Background technique
  • LEDs light emitting diodes
  • shock resistance shock resistance
  • fast response fast response
  • mass production the current lighting products using light-emitting diodes as a light source are becoming more and more widespread.
  • the existing high-power LEDs have a problem of excessive temperature after a period of continuous illumination, so that the luminous efficiency of the LED itself is lowered, and the brightness cannot be improved. Therefore, various products that use high-power LEDs require a good heat dissipation mechanism.
  • Figure 1A shows an external view of a conventional illuminator incorporating an integrated heat sink.
  • Figure 1B shows a side view of the illuminator of the prior integrated heat sink.
  • the control circuit 24 is used to control the LEDs 22.
  • the heat conducting plate 26 under the control circuit 24 is used to help the LEDs 22 and the control circuit 24 to dissipate heat.
  • a plurality of heat radiating fins 28 are provided around the heat conducting plate 26.
  • a disadvantage of the illuminator shown in Figures 1A and 1B is that the control circuit 24 is too close to the LEDs 12. When the light-emitting diodes 22 generate thermal energy, it is extremely easy to affect or even destroy the operation of the control circuit 24.
  • the present invention provides a light-emitting diode cluster bulb which, in addition to effectively solving the heat dissipation problems of the prior art, also provides a high-intensity illuminating effect. Summary of the invention
  • the invention provides an LED cluster bulb.
  • the LED cluster bulb according to the present invention comprises a plurality of Light-emitting diode packages, a control circuit module
  • the plurality of diode bulb assemblies include a heat conducting/dissipating module and an emitting diode module.
  • the heat conducting/dissipating module includes a heat conducting device and at least one heat sink fin. Heat-dissipating fin.
  • the heat conducting device has a flat portion.
  • the at least one heat sink fin is provided.
  • the LED module is disposed on the flat portion of the heat conducting device and is smoothly and tightly engaged with the flat portion.
  • the LED module packages a plurality of LEDs or laser diodes together, so each diode bulb assembly provides a luminous effect equivalent to a point source.
  • the control circuit module is configured to control the diode bulb assembly.
  • the housing fits to accommodate the diode bulb assembly and the control circuit module.
  • the control circuit module controls the light emitting diode modules to selectively illuminate the light emitting diode modules when the light emitting diode cluster bulb is connected to a power source. And the heat generated by one of the light emitting diode modules when the light emitting diode module is emitted is guided by the heat conducting device corresponding to the light emitting diode module from the flat portion of the light emitting diode module to the at least one heat dissipating fin, thereby At least one heat sink fin dissipates heat.
  • the LED cluster bulb provided by the present invention integrates the heat conduction/heat dissipation module and the LED module.
  • the heat dissipation/heat dissipation module can directly dissipate the heat generated by the LED module to the surrounding air by using the heat dissipation fins, thereby greatly improving the heat dissipation efficiency. Therefore, the diode bulb according to the present invention is more suitable for use in an illumination device requiring a high efficiency light emitting diode compared to the prior art.
  • the LED cluster bulb of the present invention integrates a plurality of diode bulb assemblies corresponding to point sources to provide high intensity illumination.
  • the LED cluster bulb of the present invention can be widely integrated into a diode lamp in an existing lighting device, and the casing can be designed to match the size of an existing cylindrical battery or square battery. Therefore, the diode bulb according to the present invention is quite easy to integrate with an existing power supply unit.
  • Fig. 1A shows an external view of a conventional illuminator incorporating a heat sink.
  • Figure 1B shows a side view of a conventional illuminator incorporating a heat sink.
  • Figure 2 shows an external view of a light-emitting diode cluster bulb in accordance with the present invention.
  • Fig. 3 is a cross-sectional view taken along line L-L of Fig. 2 showing a light-emitting diode cluster bulb according to the present invention.
  • Figure 4 shows an exploded perspective view of a light emitting diode cluster bulb in accordance with the present invention.
  • FIG. 5A and 5B illustrate various embodiments of a light emitting diode cluster bulb in accordance with the present invention.
  • Figure 6 illustrates the heat conduction and heat dissipation mechanisms in a heat conduction/heat dissipation module in a light emitting diode cluster bulb in accordance with the present invention.
  • LED cluster bulb 122 Thermal / thermal module
  • Diode bulb assembly 124 LED module
  • Control circuit module 1222 Heat transfer unit
  • FIG. 2 is a perspective view of a light-emitting diode cluster bulb in accordance with the present invention.
  • Fig. 3 is a sectional view taken along line L-L of Fig. 1.
  • the LED cluster bulb 1 according to the present invention includes a plurality of light-emitting diode packages 12, a control circuit module 14, and a casing 16.
  • the plurality of diode bulbs are arranged in an Array form.
  • the plurality of diode bulb assemblies 12 includes a heat conducting/dissipating module 122 and an emitting diode module 124.
  • the heat conduction/heat dissipation module 122 includes a heat conducting device 1222 and at least one heat-dissipating fin 1224.
  • the at least one heat dissipation fin 1224 is disposed around a heat conducting device 1222.
  • the heat conducting device 1222 has a flat portion.
  • the LED module 124 is disposed on the flat portion of the heat conducting device 1222 and is evenly and tightly engaged with the flat portion.
  • the LED module 124 encloses a plurality of LEDs or laser diodes together, so that each diode bulb assembly provides illumination equivalent to a point source.
  • the control circuit module 14 is used to control the diode bulb assemblies 12.
  • the housing 16 cooperates to accommodate the diode bulb assembly 12 and the control circuit module 14.
  • the control circuit module 14 controls the LED modules 124 to selectively illuminate the LED modules 124. And the heat generated by one of the LED modules 124 in the light-emitting diode module is guided by the flat portion of the heat-conducting device 12 22 corresponding to the LED module 1 24 from itself.
  • the heat sink fins 1224 are further radiated by the at least one heat sink fin 1224.
  • control circuit module 14 since there is a distance between the control circuit module 14 and the LED modules 124 in accordance with the present invention, the control circuit module 14 can be prevented from being directly affected by the thermal energy generated by the LED modules 124.
  • FIG 4 shows an exploded perspective view of the LED cluster bulb of Figure 2 in accordance with the present invention. According to this figure, the connection between modules can be seen in more detail.
  • the LED cluster bulb of the present invention may also be arranged in a plurality of light emitting diodes in the form of a column.
  • Figures 5A and 5B illustrate other embodiments of LED cluster bulbs in accordance with the present invention.
  • the heat conducting device is a heat pipe, a heat column or a column formed of a material having a high thermal conductivity. See Figure 6.
  • Figure 6 shows the heat transfer and heat dissipation mechanisms in the heat transfer/heat dissipation module 122.
  • the heat transfer device 1222 in the heat/heat dissipation module 122 internally includes a capillary structure 12A and a working fluid 12B. When the LED module 124 generates heat, the working fluid 12B in the heat conducting device 1222 that is closer to the LED module 124 is evaporated from the liquid into a gas.
  • the vaporized working fluid 12B transfers heat to the other end of the heat conducting device 1222, and the working fluid 12B cooled by the heat radiating fins 1224 is again condensed into a liquid.
  • the capillary tissue 12A is used to transfer the working fluid 12B that is recondensed into a liquid back to the end of the heat conducting device 1222 that is closer to the LED module 124.
  • the heat conduction and heat dissipation effects can be achieved by the circulation method as shown in Fig. 5.
  • the power source connected to the LED cluster bulb can be a DC power source or an AC power source.
  • the control circuit module further includes an AC toto-DC converter that converts the AC power to DC power for use by the LED cluster bulb.
  • each of the light emitting diode modules of the light emitting diode cluster bulb of the present invention comprises a substrate made of a semiconductor material or a ceramic material, a two electrode (Electrode), and a light emitting module.
  • the light emitting module and the electrode system are respectively disposed on the substrate.
  • the light emitting modules are respectively connected to the control circuit module through the two electrodes.
  • each of the light emitting diode modules includes a light emitting module and two electrodes, and the light emitting module and the two electrodes are directly disposed on a flat portion of the heat conducting device corresponding to the light emitting diode module. And an insulator exists between the two electrodes and the heat conducting device.
  • the light emitting module includes at least one light emitting diode (LED) or a laser diode.
  • the light emitting diode in the light emitting module may be a white light diode or a white light diode composed of a blue light diode and a phosphor.
  • the light emitting module may also include at least one red light diode, at least one blue light diode, and at least one green light diode; the control circuit module selectively illuminates the red light diode, the blue light diode, and the green light diode to make the different colors
  • the light-emitting diodes form light of various colors in different light-emitting ratios.
  • each of the LED assemblies encapsulates a plurality of LEDs together, the volume of the illumination module relative to the concave mirror or the entire diode bulb cooperating with the illumination module is relatively small, and therefore each A light-emitting diode assembly provides illumination equivalent to a point source.
  • the LED cluster bulb provided by the invention can be arranged in a matrix or a row to form high-intensity and high-brightness illumination.
  • the LED cluster bulb provided by the present invention integrates the heat conduction/heat dissipation module and the LED module.
  • the heat-dissipating/heat-dissipating module can directly dissipate the heat generated by the light-emitting diode module into the surrounding air by the heat-dissipating fins, thereby greatly improving the heat-dissipating efficiency.
  • the problem of the efficiency of the LED due to overheating is solved. Therefore, the luminous efficiency of the light-emitting diode cluster bulb according to the present invention is also improved as compared with the prior art.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne une lampe à groupe de diodes électroluminescentes qui comprend une pluralité de groupes de diodes électroluminescentes, un module de circuit de commande et un boîtier. Chacun des groupes de diodes électroluminescentes comprend un module de dissipation/conduction de la chaleur et un module de diode électroluminescente. Le module de circuit de commande sert à commander les paquets de diodes électroluminescentes. Le boîtier peut correspondre aux groupes de diodes électroluminescentes ainsi qu'au module de circuit de commande et les contenir. Lorsque la lampe à groupe de diodes électroluminescentes est reliée à une source électrique, le module de circuit de commande peut commander les modules de diodes électroluminescentes de manière sélective pour émettre la lumière. De la chaleur sera générée par chaque module de diodes électroluminescentes lors de l'émission de lumière à partir du module de diodes électroluminescentes. La chaleur générée sera conduite et dissipée par le module de diode électroluminescente via le module de dissipation/conduction de chaleur correspondant.
PCT/CN2006/001023 2005-05-25 2006-05-18 Lampe a groupe de diodes electroluminescentes Ceased WO2006125375A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US11/921,177 US7722217B2 (en) 2005-05-25 2006-05-18 Light-emitting diode cluster lamp
CA2610026A CA2610026C (fr) 2005-05-25 2006-05-18 Lampe a groupe de diodes electroluminescentes
EP06741911A EP1933085A4 (fr) 2005-05-25 2006-05-18 Lampe a groupe de diodes electroluminescentes
JP2008512672A JP4805347B2 (ja) 2005-05-25 2006-05-18 発光ダイオード・クラスタ・ランプ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200510073867.0 2005-05-25
CN2005100738670A CN1869504B (zh) 2005-05-25 2005-05-25 发光二极管群集灯泡

Publications (1)

Publication Number Publication Date
WO2006125375A1 true WO2006125375A1 (fr) 2006-11-30

Family

ID=37443236

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2006/001023 Ceased WO2006125375A1 (fr) 2005-05-25 2006-05-18 Lampe a groupe de diodes electroluminescentes

Country Status (7)

Country Link
US (2) US7722217B2 (fr)
EP (1) EP1933085A4 (fr)
JP (1) JP4805347B2 (fr)
KR (1) KR20080025692A (fr)
CN (1) CN1869504B (fr)
CA (1) CA2610026C (fr)
WO (1) WO2006125375A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090249625A1 (en) * 2008-04-02 2009-10-08 Advanced Optoelectronic Technology, Inc. Method for jointing a semiconductor element and a heat pipe
JP2010009814A (ja) * 2008-06-25 2010-01-14 Eye Lighting Syst Corp Ｌｅｄ照明器具

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602005024315D1 (de) 2005-03-31 2010-12-02 Neobulb Technologies Inc Hochleistungs-led-beleuchtungseinrichtung mit hohem thermischen diffusionsvermögen
CN100565950C (zh) * 2005-10-20 2009-12-02 昭和电工株式会社 发光装置安装基片、发光装置安装组件和平面光源装置
US20090225541A1 (en) * 2005-10-20 2009-09-10 Showa Denko K.K. Luminous device mounting substrate, luminous device mounting package, and planar light source device
US8235562B2 (en) * 2007-04-27 2012-08-07 Neobulb Technologies, Inc. Light-emitting diode illumination apparatus
CN101430081B (zh) * 2007-11-06 2011-11-09 金松山 栅栏型led照明灯具
CN101532646B (zh) * 2008-03-14 2012-06-13 富准精密工业(深圳)有限公司 照明装置
CN101539275A (zh) * 2008-03-19 2009-09-23 富准精密工业(深圳)有限公司 照明装置及其光引擎
CN101566316B (zh) * 2008-04-23 2012-03-14 富准精密工业(深圳)有限公司 发光二极管灯具
KR100982046B1 (ko) * 2008-05-14 2010-09-14 유트로닉스주식회사 Ｌｅｄ 어레이 모듈의 방열 구조
US7740380B2 (en) * 2008-10-29 2010-06-22 Thrailkill John E Solid state lighting apparatus utilizing axial thermal dissipation
TW201022582A (en) * 2008-12-12 2010-06-16 Foxconn Tech Co Ltd Illuminating apparatus and light engine thereof
EA200970511A1 (ru) * 2009-01-06 2010-12-30 Необульб Текнолоджиз, Инк. Устройство для преобразования энергии и оборудование для преобразования энергии
TWM362362U (en) * 2009-03-06 2009-08-01 Acpa Energy Conversion Devices Co Ltd Heat conduction structure for heating element
US8188685B1 (en) 2009-06-10 2012-05-29 Johnston John F Light-generating system
TW201109581A (en) * 2009-09-07 2011-03-16 Thermoshuttle Co Ltd LED road light module
US20110090669A1 (en) * 2009-10-20 2011-04-21 Tsung-Ting Sun Led lighting device and light source module for the same
DE102009044388A1 (de) 2009-11-02 2011-05-05 Semperlux Aktiengesellschaft - Lichttechnische Werke - Außenleuchte und Hochdrucklampenersatz
JP2012015082A (ja) * 2010-07-05 2012-01-19 Neobulb Technologies Inc 発光ダイオード照明プラットホーム
EP2405194A1 (fr) * 2010-07-05 2012-01-11 NeoBulb Technologies, Inc. Plateforme d'éclairage doté de diodes électroluminescentes
KR20120080022A (ko) * 2011-01-06 2012-07-16 삼성엘이디 주식회사 조명 장치
KR101282128B1 (ko) * 2011-11-30 2013-07-04 주식회사 삼진엘앤디 리플렉터를 포함한 ｌｅｄ 램프
KR101286301B1 (ko) 2012-02-01 2013-07-19 주식회사 제코스 소켓 타입의 엘이디 램프
USD715479S1 (en) 2012-10-26 2014-10-14 John F. JOHNSTON Light-generating system
JP5673705B2 (ja) * 2013-02-27 2015-02-18 三菱電機株式会社 照明装置
JP6340753B2 (ja) * 2013-03-18 2018-06-13 三菱電機株式会社 発光装置
KR101478989B1 (ko) * 2013-06-19 2015-01-05 (주)퓨쳐 라이팅 엘이디 등기구
KR101474994B1 (ko) * 2013-09-09 2014-12-22 (주) 로하스티엠월드 Led 조명등기구
JP6539033B2 (ja) * 2014-02-04 2019-07-03 株式会社ルイファン・ジャパン 発光体
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
CN106287571A (zh) * 2015-05-30 2017-01-04 广州市夜太阳舞台灯光音响设备有限公司 光学透镜组件及具有该光学透镜组的灯具
CN106287400A (zh) * 2015-05-30 2017-01-04 广州市夜太阳舞台灯光音响设备有限公司 多个灯泡集成光斑的灯具

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040120152A1 (en) * 2002-12-11 2004-06-24 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
CN2644878Y (zh) * 2003-08-14 2004-09-29 葛世潮 发光二极管灯
JP2005093097A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd 照明装置
CN1605795A (zh) * 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置
CN1680749A (zh) * 2004-04-08 2005-10-12 吴裕朝 发光二极管装置、发光二极管散热系统及含其的照明装置
US20060092639A1 (en) * 2004-10-29 2006-05-04 Goldeneye, Inc. High brightness light emitting diode light source

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243441A (ja) * 1992-03-03 1993-09-21 Ito Gijutsu Kenkiyuushitsu:Kk 放熱装置
US20050279949A1 (en) * 1999-05-17 2005-12-22 Applera Corporation Temperature control for light-emitting diode stabilization
JP2002163907A (ja) * 2000-11-24 2002-06-07 Moriyama Sangyo Kk 照明システム及び照明ユニット
EP2241803B1 (fr) * 2001-05-26 2018-11-07 GE Lighting Solutions, LLC Lampe DEL de grande puissance pour un éclairage à spot
JP3668438B2 (ja) * 2001-06-07 2005-07-06 シャープ株式会社 チップ発光ダイオード
DE10216085A1 (de) * 2002-04-11 2003-11-06 Sill Franz Gmbh Farbwechselstrahler
US7048412B2 (en) * 2002-06-10 2006-05-23 Lumileds Lighting U.S., Llc Axial LED source
AU2003298561A1 (en) * 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
JP4123105B2 (ja) * 2003-05-26 2008-07-23 松下電工株式会社 発光装置
JP2004354852A (ja) * 2003-05-30 2004-12-16 Natsume Kk 外部制御式管状発光具および電光表示装置
JP2005044699A (ja) * 2003-07-24 2005-02-17 Koito Mfg Co Ltd 車両用灯具及び光源モジュール
US7204607B2 (en) * 2003-09-16 2007-04-17 Matsushita Electric Industrial Co., Ltd. LED lamp
US7198386B2 (en) * 2003-09-17 2007-04-03 Integrated Illumination Systems, Inc. Versatile thermally advanced LED fixture
TWI257465B (en) * 2004-10-11 2006-07-01 Neobulb Technologies Inc Lighting device with high heat dissipation efficiency
ES2331077T3 (es) * 2005-01-11 2009-12-21 Neobulb Technologies, Inc. Dispositivo de iluminacion con medios de disipacion del calor.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040120152A1 (en) * 2002-12-11 2004-06-24 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
CN2644878Y (zh) * 2003-08-14 2004-09-29 葛世潮 发光二极管灯
JP2005093097A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd 照明装置
CN1680749A (zh) * 2004-04-08 2005-10-12 吴裕朝 发光二极管装置、发光二极管散热系统及含其的照明装置
CN1605795A (zh) * 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置
US20060092639A1 (en) * 2004-10-29 2006-05-04 Goldeneye, Inc. High brightness light emitting diode light source

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1933085A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090249625A1 (en) * 2008-04-02 2009-10-08 Advanced Optoelectronic Technology, Inc. Method for jointing a semiconductor element and a heat pipe
JP2010009814A (ja) * 2008-06-25 2010-01-14 Eye Lighting Syst Corp Ｌｅｄ照明器具

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JP2008542982A (ja) 2008-11-27
EP1933085A4 (fr) 2011-01-19
US20100194282A1 (en) 2010-08-05
US8070318B2 (en) 2011-12-06
CA2610026C (fr) 2011-11-01
JP4805347B2 (ja) 2011-11-02
US7722217B2 (en) 2010-05-25
EP1933085A1 (fr) 2008-06-18
KR20080025692A (ko) 2008-03-21
CN1869504B (zh) 2010-04-07
CN1869504A (zh) 2006-11-29
US20080247162A1 (en) 2008-10-09
CA2610026A1 (fr) 2006-11-30

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