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WO2006110662A3 - Compact pressure-sensing device - Google Patents

Compact pressure-sensing device Download PDF

Info

Publication number
WO2006110662A3
WO2006110662A3 PCT/US2006/013332 US2006013332W WO2006110662A3 WO 2006110662 A3 WO2006110662 A3 WO 2006110662A3 US 2006013332 W US2006013332 W US 2006013332W WO 2006110662 A3 WO2006110662 A3 WO 2006110662A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensing device
piezo
sensing elements
substrate
resistive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/013332
Other languages
French (fr)
Other versions
WO2006110662A2 (en
Inventor
Trevor Niblock
Edward Niblock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANALATOM Inc
Original Assignee
ANALATOM Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANALATOM Inc filed Critical ANALATOM Inc
Publication of WO2006110662A2 publication Critical patent/WO2006110662A2/en
Anticipated expiration legal-status Critical
Publication of WO2006110662A3 publication Critical patent/WO2006110662A3/en
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L23/00Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
    • G01L23/08Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically
    • G01L23/18Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically by resistance strain gauges
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02BINTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
    • F02B77/00Component parts, details or accessories, not otherwise provided for
    • F02B77/08Safety, indicating, or supervising devices
    • F02B77/085Safety, indicating, or supervising devices with sensors measuring combustion processes, e.g. knocking, pressure, ionization, combustion flame
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M15/00Testing of engines
    • G01M15/04Testing internal-combustion engines
    • G01M15/08Testing internal-combustion engines by monitoring pressure in cylinders
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02DCONTROLLING COMBUSTION ENGINES
    • F02D35/00Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for
    • F02D35/02Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions
    • F02D35/023Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions by determining the cylinder pressure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02DCONTROLLING COMBUSTION ENGINES
    • F02D35/00Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for
    • F02D35/02Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions
    • F02D35/025Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions by determining temperatures inside the cylinder, e.g. combustion temperatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2205/00Application of thermometers in motors, e.g. of a vehicle
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49007Indicating transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)

Abstract

The invention is a compact sensing device that is capable of measuring the conditions (e,g, pressure, temperature) inside a cylinder of an internal combustion engine. The invention is also a cost-effective method of fabricating the sensing device. The sensing device includes a substrate, a beam, and piezo-resistive sensing elements. The beam, which is formed on the substrate, is capable of deflecting according to different pressures applied to different beam surfaces. The piezo-resistive sensing elements are coupled to the beam and detect beam deflection. The piezo-resistive sensing elements generate an electrical signal corresponding to the beam deflection.
PCT/US2006/013332 2005-04-08 2006-04-10 Compact pressure-sensing device Ceased WO2006110662A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66974605P 2005-04-08 2005-04-08
US60/669,746 2005-04-08

Publications (2)

Publication Number Publication Date
WO2006110662A2 WO2006110662A2 (en) 2006-10-19
WO2006110662A3 true WO2006110662A3 (en) 2009-04-23

Family

ID=37087599

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/013332 Ceased WO2006110662A2 (en) 2005-04-08 2006-04-10 Compact pressure-sensing device

Country Status (2)

Country Link
US (2) US7543502B2 (en)
WO (1) WO2006110662A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006110662A2 (en) * 2005-04-08 2006-10-19 Analatom, Inc. Compact pressure-sensing device
EP2015046A1 (en) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Vacuum Sensor
US20100065930A1 (en) * 2008-09-18 2010-03-18 Rohm Co., Ltd. Method of etching sacrificial layer, method of manufacturing MEMS device, MEMS device and MEMS sensor
US8806925B2 (en) 2011-11-23 2014-08-19 S3C, Inc. Mechanical packaging technique of attaching MEMS and flex circuit
EP2783395A4 (en) * 2011-11-23 2015-09-02 S3C Inc Mechanical packaging technique of attaching mems and flex circuit
US9429479B2 (en) * 2012-07-18 2016-08-30 Millar Instruments Methods, devices, and systems which determine a parameter value of an object or an environment from a voltage reading associated with a common mode signal of a balanced circuit
KR20170016459A (en) * 2014-06-17 2017-02-13 스카니아 씨브이 악티에볼라그 Internal combustion engine and method for detecting operating conditions of an internal combustion engine
US12253391B2 (en) 2018-05-24 2025-03-18 The Research Foundation For The State University Of New York Multielectrode capacitive sensor without pull-in risk

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975390A (en) * 1986-12-18 1990-12-04 Nippondenso Co. Ltd. Method of fabricating a semiconductor pressure sensor
US5883420A (en) * 1995-12-20 1999-03-16 Motorola, Inc. Sensor device having a pathway and a sealed cavity
US6388279B1 (en) * 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
US7197939B2 (en) * 2004-02-09 2007-04-03 Denso Corporation Pressure sensor

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1078217A (en) * 1976-03-31 1980-05-27 Robert C. Whitehead (Jr.) Force transducing cantilever beam and pressure transducer incorporating it
US4993143A (en) * 1989-03-06 1991-02-19 Delco Electronics Corporation Method of making a semiconductive structure useful as a pressure sensor
US5189777A (en) * 1990-12-07 1993-03-02 Wisconsin Alumni Research Foundation Method of producing micromachined differential pressure transducers
US5442962A (en) * 1993-08-20 1995-08-22 Setra Systems, Inc. Capacitive pressure sensor having a pedestal supported electrode
US5520054A (en) * 1994-03-29 1996-05-28 Rosemount Inc. Increased wall thickness for robust bond for micromachined sensor
US5410916A (en) * 1994-06-24 1995-05-02 Honeywell Inc. Flowthrough pressure sensor
US5663508A (en) * 1995-08-07 1997-09-02 Delco Electronics Corporation Silicon flow sensor
JP3107516B2 (en) * 1996-05-01 2000-11-13 株式会社日立製作所 Composite sensor
US5744726A (en) * 1997-02-25 1998-04-28 Honeywell Inc. Pressure sensor with reduced dead space achieved through an insert member with a surface groove
WO1998041911A1 (en) * 1997-03-20 1998-09-24 Hedrick Geoffrey S M Altitude alert system for aircraft operating in reduced vertical separation minimum airspace and method therefor
DE19810286A1 (en) * 1998-03-10 1999-09-23 Siemens Ag Micro-sensor
US6006607A (en) * 1998-08-31 1999-12-28 Maxim Integrated Products, Inc. Piezoresistive pressure sensor with sculpted diaphragm
US6229190B1 (en) * 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
US6631648B2 (en) * 2001-08-28 2003-10-14 Wisconsin Alumni Research Foundation Microfluidic flow sensing method and apparatus
WO2006110662A2 (en) * 2005-04-08 2006-10-19 Analatom, Inc. Compact pressure-sensing device
US7644625B2 (en) * 2007-12-14 2010-01-12 Honeywell International Inc. Differential pressure sense die based on silicon piezoresistive technology

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975390A (en) * 1986-12-18 1990-12-04 Nippondenso Co. Ltd. Method of fabricating a semiconductor pressure sensor
US5883420A (en) * 1995-12-20 1999-03-16 Motorola, Inc. Sensor device having a pathway and a sealed cavity
US6388279B1 (en) * 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
US7197939B2 (en) * 2004-02-09 2007-04-03 Denso Corporation Pressure sensor

Also Published As

Publication number Publication date
US7543502B2 (en) 2009-06-09
US8397579B2 (en) 2013-03-19
US20070016384A1 (en) 2007-01-18
WO2006110662A2 (en) 2006-10-19
US20110001396A1 (en) 2011-01-06

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