WO2006110662A3 - Compact pressure-sensing device - Google Patents
Compact pressure-sensing device Download PDFInfo
- Publication number
- WO2006110662A3 WO2006110662A3 PCT/US2006/013332 US2006013332W WO2006110662A3 WO 2006110662 A3 WO2006110662 A3 WO 2006110662A3 US 2006013332 W US2006013332 W US 2006013332W WO 2006110662 A3 WO2006110662 A3 WO 2006110662A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensing device
- piezo
- sensing elements
- substrate
- resistive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
- G01L23/08—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically
- G01L23/18—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically by resistance strain gauges
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
- F02B77/00—Component parts, details or accessories, not otherwise provided for
- F02B77/08—Safety, indicating, or supervising devices
- F02B77/085—Safety, indicating, or supervising devices with sensors measuring combustion processes, e.g. knocking, pressure, ionization, combustion flame
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M15/00—Testing of engines
- G01M15/04—Testing internal-combustion engines
- G01M15/08—Testing internal-combustion engines by monitoring pressure in cylinders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02D—CONTROLLING COMBUSTION ENGINES
- F02D35/00—Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for
- F02D35/02—Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions
- F02D35/023—Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions by determining the cylinder pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02D—CONTROLLING COMBUSTION ENGINES
- F02D35/00—Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for
- F02D35/02—Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions
- F02D35/025—Controlling engines, dependent on conditions exterior or interior to engines, not otherwise provided for on interior conditions by determining temperatures inside the cylinder, e.g. combustion temperatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2205/00—Application of thermometers in motors, e.g. of a vehicle
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49007—Indicating transducer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Fluid Pressure (AREA)
- Micromachines (AREA)
Abstract
The invention is a compact sensing device that is capable of measuring the conditions (e,g, pressure, temperature) inside a cylinder of an internal combustion engine. The invention is also a cost-effective method of fabricating the sensing device. The sensing device includes a substrate, a beam, and piezo-resistive sensing elements. The beam, which is formed on the substrate, is capable of deflecting according to different pressures applied to different beam surfaces. The piezo-resistive sensing elements are coupled to the beam and detect beam deflection. The piezo-resistive sensing elements generate an electrical signal corresponding to the beam deflection.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US66974605P | 2005-04-08 | 2005-04-08 | |
| US60/669,746 | 2005-04-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2006110662A2 WO2006110662A2 (en) | 2006-10-19 |
| WO2006110662A3 true WO2006110662A3 (en) | 2009-04-23 |
Family
ID=37087599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2006/013332 Ceased WO2006110662A2 (en) | 2005-04-08 | 2006-04-10 | Compact pressure-sensing device |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7543502B2 (en) |
| WO (1) | WO2006110662A2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006110662A2 (en) * | 2005-04-08 | 2006-10-19 | Analatom, Inc. | Compact pressure-sensing device |
| EP2015046A1 (en) * | 2007-06-06 | 2009-01-14 | Infineon Technologies SensoNor AS | Vacuum Sensor |
| US20100065930A1 (en) * | 2008-09-18 | 2010-03-18 | Rohm Co., Ltd. | Method of etching sacrificial layer, method of manufacturing MEMS device, MEMS device and MEMS sensor |
| US8806925B2 (en) | 2011-11-23 | 2014-08-19 | S3C, Inc. | Mechanical packaging technique of attaching MEMS and flex circuit |
| EP2783395A4 (en) * | 2011-11-23 | 2015-09-02 | S3C Inc | Mechanical packaging technique of attaching mems and flex circuit |
| US9429479B2 (en) * | 2012-07-18 | 2016-08-30 | Millar Instruments | Methods, devices, and systems which determine a parameter value of an object or an environment from a voltage reading associated with a common mode signal of a balanced circuit |
| KR20170016459A (en) * | 2014-06-17 | 2017-02-13 | 스카니아 씨브이 악티에볼라그 | Internal combustion engine and method for detecting operating conditions of an internal combustion engine |
| US12253391B2 (en) | 2018-05-24 | 2025-03-18 | The Research Foundation For The State University Of New York | Multielectrode capacitive sensor without pull-in risk |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4975390A (en) * | 1986-12-18 | 1990-12-04 | Nippondenso Co. Ltd. | Method of fabricating a semiconductor pressure sensor |
| US5883420A (en) * | 1995-12-20 | 1999-03-16 | Motorola, Inc. | Sensor device having a pathway and a sealed cavity |
| US6388279B1 (en) * | 1997-06-11 | 2002-05-14 | Denso Corporation | Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof |
| US7197939B2 (en) * | 2004-02-09 | 2007-04-03 | Denso Corporation | Pressure sensor |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1078217A (en) * | 1976-03-31 | 1980-05-27 | Robert C. Whitehead (Jr.) | Force transducing cantilever beam and pressure transducer incorporating it |
| US4993143A (en) * | 1989-03-06 | 1991-02-19 | Delco Electronics Corporation | Method of making a semiconductive structure useful as a pressure sensor |
| US5189777A (en) * | 1990-12-07 | 1993-03-02 | Wisconsin Alumni Research Foundation | Method of producing micromachined differential pressure transducers |
| US5442962A (en) * | 1993-08-20 | 1995-08-22 | Setra Systems, Inc. | Capacitive pressure sensor having a pedestal supported electrode |
| US5520054A (en) * | 1994-03-29 | 1996-05-28 | Rosemount Inc. | Increased wall thickness for robust bond for micromachined sensor |
| US5410916A (en) * | 1994-06-24 | 1995-05-02 | Honeywell Inc. | Flowthrough pressure sensor |
| US5663508A (en) * | 1995-08-07 | 1997-09-02 | Delco Electronics Corporation | Silicon flow sensor |
| JP3107516B2 (en) * | 1996-05-01 | 2000-11-13 | 株式会社日立製作所 | Composite sensor |
| US5744726A (en) * | 1997-02-25 | 1998-04-28 | Honeywell Inc. | Pressure sensor with reduced dead space achieved through an insert member with a surface groove |
| WO1998041911A1 (en) * | 1997-03-20 | 1998-09-24 | Hedrick Geoffrey S M | Altitude alert system for aircraft operating in reduced vertical separation minimum airspace and method therefor |
| DE19810286A1 (en) * | 1998-03-10 | 1999-09-23 | Siemens Ag | Micro-sensor |
| US6006607A (en) * | 1998-08-31 | 1999-12-28 | Maxim Integrated Products, Inc. | Piezoresistive pressure sensor with sculpted diaphragm |
| US6229190B1 (en) * | 1998-12-18 | 2001-05-08 | Maxim Integrated Products, Inc. | Compensated semiconductor pressure sensor |
| US6631648B2 (en) * | 2001-08-28 | 2003-10-14 | Wisconsin Alumni Research Foundation | Microfluidic flow sensing method and apparatus |
| WO2006110662A2 (en) * | 2005-04-08 | 2006-10-19 | Analatom, Inc. | Compact pressure-sensing device |
| US7644625B2 (en) * | 2007-12-14 | 2010-01-12 | Honeywell International Inc. | Differential pressure sense die based on silicon piezoresistive technology |
-
2006
- 2006-04-10 WO PCT/US2006/013332 patent/WO2006110662A2/en not_active Ceased
- 2006-04-10 US US11/401,692 patent/US7543502B2/en active Active
-
2009
- 2009-06-03 US US12/477,829 patent/US8397579B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4975390A (en) * | 1986-12-18 | 1990-12-04 | Nippondenso Co. Ltd. | Method of fabricating a semiconductor pressure sensor |
| US5883420A (en) * | 1995-12-20 | 1999-03-16 | Motorola, Inc. | Sensor device having a pathway and a sealed cavity |
| US6388279B1 (en) * | 1997-06-11 | 2002-05-14 | Denso Corporation | Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof |
| US7197939B2 (en) * | 2004-02-09 | 2007-04-03 | Denso Corporation | Pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| US7543502B2 (en) | 2009-06-09 |
| US8397579B2 (en) | 2013-03-19 |
| US20070016384A1 (en) | 2007-01-18 |
| WO2006110662A2 (en) | 2006-10-19 |
| US20110001396A1 (en) | 2011-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| NENP | Non-entry into the national phase |
Ref country code: RU |
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| 122 | Ep: pct application non-entry in european phase |
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