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WO2006038407A3 - 真空成膜装置 - Google Patents

真空成膜装置 Download PDF

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Publication number
WO2006038407A3
WO2006038407A3 PCT/JP2005/016218 JP2005016218W WO2006038407A3 WO 2006038407 A3 WO2006038407 A3 WO 2006038407A3 JP 2005016218 W JP2005016218 W JP 2005016218W WO 2006038407 A3 WO2006038407 A3 WO 2006038407A3
Authority
WO
WIPO (PCT)
Prior art keywords
frame body
forming apparatus
film forming
vacuum film
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/016218
Other languages
English (en)
French (fr)
Other versions
WO2006038407A2 (ja
Inventor
Shirou Takigawa
Keiji Katou
Nobuo Yoneyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinmaywa Industries Ltd
Original Assignee
Shinmaywa Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinmaywa Industries Ltd filed Critical Shinmaywa Industries Ltd
Priority to US11/662,563 priority Critical patent/US20080289957A1/en
Publication of WO2006038407A2 publication Critical patent/WO2006038407A2/ja
Publication of WO2006038407A3 publication Critical patent/WO2006038407A3/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

　円筒部材の一部をターゲットとして使用した上で、この円筒部材を用いてプラズマ重合の機能を付加することを意図した真空成膜装置を提供する。 　真空成膜装置（１００）は、内部空間を有する導電性の真空槽（１３）と、内部空間（１０）に複数の扇型に湾曲された湾曲部材（３１、３２）を並べて配置することにより、略円筒形をなすように構成された枠体（１５）と、枠体（１５）に囲まれた内部に配置され、枠体（１５）の周方向に沿うように磁界を形成する磁界形成装置３３と、を備え、湾曲部材（１５、１６）のうちの少なくとも一つはスパッタリングに使用するターゲットであり、かつターゲットを除いた枠体（１５）の領域が、プラズマ重合に使用される装置である。
PCT/JP2005/016218 2004-09-14 2005-09-05 真空成膜装置 Ceased WO2006038407A2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/662,563 US20080289957A1 (en) 2004-09-14 2005-09-05 Vacuum Film Forming Apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004266878A JP2006083408A (ja) 2004-09-14 2004-09-14 真空成膜装置
JP2004-266878 2004-09-14

Publications (2)

Publication Number Publication Date
WO2006038407A2 WO2006038407A2 (ja) 2006-04-13
WO2006038407A3 true WO2006038407A3 (ja) 2006-06-22

Family

ID=36142931

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/016218 Ceased WO2006038407A2 (ja) 2004-09-14 2005-09-05 真空成膜装置

Country Status (6)

Country Link
US (1) US20080289957A1 (ja)
JP (1) JP2006083408A (ja)
KR (1) KR20070053167A (ja)
CN (1) CN1973059A (ja)
TW (1) TW200609368A (ja)
WO (1) WO2006038407A2 (ja)

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JP2008038192A (ja) * 2006-08-04 2008-02-21 Optorun Co Ltd スパッタ源、スパッタ成膜装置およびスパッタ成膜方法
JP2008231868A (ja) * 2007-03-23 2008-10-02 Ｙｋｋ Ａｐ株式会社 網材および建具
US8277617B2 (en) * 2007-08-14 2012-10-02 Southwest Research Institute Conformal magnetron sputter deposition
US8349156B2 (en) * 2008-05-14 2013-01-08 Applied Materials, Inc. Microwave-assisted rotatable PVD
JP2010144199A (ja) * 2008-12-17 2010-07-01 Canon Anelva Corp 真空容器、真空容器を備える真空処理装置及び真空容器の製造方法
EP2384374B1 (de) 2009-01-30 2014-03-26 Praxair S.T. Technology, Inc. Rohrtarget
US9545360B2 (en) 2009-05-13 2017-01-17 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
EP3222749A1 (en) 2009-05-13 2017-09-27 SiO2 Medical Products, Inc. Outgassing method for inspecting a coated surface
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
EP2306489A1 (en) * 2009-10-02 2011-04-06 Applied Materials, Inc. Method for coating a substrate and coater
US8747631B2 (en) * 2010-03-15 2014-06-10 Southwest Research Institute Apparatus and method utilizing a double glow discharge plasma for sputter cleaning
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
TWI554630B (zh) * 2010-07-02 2016-10-21 應用材料股份有限公司 減少沉積不對稱性的沉積設備及方法
US20120067717A1 (en) * 2010-09-17 2012-03-22 Guardian Industries Corp. Method of co-sputtering alloys and compounds using a dual C-MAG cathode arrangement and corresponding apparatus
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
WO2013071138A1 (en) 2011-11-11 2013-05-16 Sio2 Medical Products, Inc. PASSIVATION, pH PROTECTIVE OR LUBRICITY COATING FOR PHARMACEUTICAL PACKAGE, COATING PROCESS AND APPARATUS
JP2015524022A (ja) * 2012-05-29 2015-08-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板をコーティングするための方法とコーター
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
KR20140053665A (ko) * 2012-10-26 2014-05-08 주식회사 에이스테크놀로지 마그넷 유닛을 이용하는 스퍼터링 장치 및 방법
JP6509734B2 (ja) 2012-11-01 2019-05-08 エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド 皮膜検査方法
EP2920567B1 (en) 2012-11-16 2020-08-19 SiO2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
DE102012111186B4 (de) * 2012-11-20 2017-01-26 Von Ardenne Gmbh Verfahren und Vorrichtung zum Erzeugen einer Magnetron-Entladung
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
AU2013352436B2 (en) 2012-11-30 2018-10-25 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like
US9126273B2 (en) 2012-12-17 2015-09-08 Kennametal Inc Tool for the cutting machining of workpieces and process for coating substrate bodies
EP2961858B1 (en) 2013-03-01 2022-09-07 Si02 Medical Products, Inc. Coated syringe.
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
KR102336796B1 (ko) 2013-03-11 2021-12-10 에스아이오2 메디컬 프로덕츠, 인크. 코팅된 패키징
WO2014144926A1 (en) 2013-03-15 2014-09-18 Sio2 Medical Products, Inc. Coating method
CN103409725A (zh) * 2013-05-22 2013-11-27 东莞宏威数码机械有限公司 旋转异形靶阴极机构及磁控溅射镀膜装置
US11066745B2 (en) 2014-03-28 2021-07-20 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
CN106460148B (zh) * 2014-06-23 2018-12-04 应用材料公司 在通孔或沟槽中沉积层的方法以及由此获得的产品
BR112018003051B1 (pt) 2015-08-18 2022-12-06 Sio2 Medical Products, Inc Tubo de coleta de sangue submetido a vácuo
JP2019519673A (ja) * 2016-04-21 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板をコーティングするための方法、及びコータ
CN106906447A (zh) * 2016-12-27 2017-06-30 王开安 磁控溅射镀膜源及其装置与方法
JP6876594B2 (ja) * 2017-11-13 2021-05-26 キヤノントッキ株式会社 スパッタ装置
JP7328744B2 (ja) * 2018-07-31 2023-08-17 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992001081A1 (en) * 1990-07-06 1992-01-23 The Boc Group, Inc. Method and apparatus for co-sputtering and cross-sputtering homogeneous films
JPH0565636A (ja) * 1991-01-29 1993-03-19 Boc Group Inc:The 円筒マグネトロンシールド構造
JPH0853764A (ja) * 1994-03-23 1996-02-27 Boc Group Inc:The プラズマの均一性を改善するマグネトロンにおけるマルチプル・アノードの使用
JPH1129866A (ja) * 1997-07-11 1999-02-02 Fujitsu Ltd スパッタ装置
JP2003183823A (ja) * 2001-12-17 2003-07-03 Sharp Corp スパッタ装置

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JP2001240960A (ja) * 1999-12-21 2001-09-04 Nippon Sheet Glass Co Ltd 光触媒膜が被覆された物品、その物品の製造方法及びその膜を被覆するために用いるスパッタリングターゲット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992001081A1 (en) * 1990-07-06 1992-01-23 The Boc Group, Inc. Method and apparatus for co-sputtering and cross-sputtering homogeneous films
JPH0565636A (ja) * 1991-01-29 1993-03-19 Boc Group Inc:The 円筒マグネトロンシールド構造
JPH0853764A (ja) * 1994-03-23 1996-02-27 Boc Group Inc:The プラズマの均一性を改善するマグネトロンにおけるマルチプル・アノードの使用
JPH1129866A (ja) * 1997-07-11 1999-02-02 Fujitsu Ltd スパッタ装置
JP2003183823A (ja) * 2001-12-17 2003-07-03 Sharp Corp スパッタ装置

Also Published As

Publication number Publication date
US20080289957A1 (en) 2008-11-27
JP2006083408A (ja) 2006-03-30
CN1973059A (zh) 2007-05-30
TW200609368A (en) 2006-03-16
KR20070053167A (ko) 2007-05-23
WO2006038407A2 (ja) 2006-04-13

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