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WO2006038017A3 - An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz - Google Patents

An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz Download PDF

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Publication number
WO2006038017A3
WO2006038017A3 PCT/GB2005/003855 GB2005003855W WO2006038017A3 WO 2006038017 A3 WO2006038017 A3 WO 2006038017A3 GB 2005003855 W GB2005003855 W GB 2005003855W WO 2006038017 A3 WO2006038017 A3 WO 2006038017A3
Authority
WO
WIPO (PCT)
Prior art keywords
range
laser
irradiance
repetition rate
khz
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB2005/003855
Other languages
French (fr)
Other versions
WO2006038017A2 (en
Inventor
Jozef Wendland
Paul Harrison
Matthew Henry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Powerlase Ltd
Original Assignee
Powerlase Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0422318A external-priority patent/GB0422318D0/en
Priority claimed from GB0511966A external-priority patent/GB0511966D0/en
Application filed by Powerlase Ltd filed Critical Powerlase Ltd
Priority to EP05790890A priority Critical patent/EP1802421A2/en
Priority to JP2007535239A priority patent/JP2008515643A/en
Publication of WO2006038017A2 publication Critical patent/WO2006038017A2/en
Anticipated expiration legal-status Critical
Publication of WO2006038017A3 publication Critical patent/WO2006038017A3/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/002—Drill-bits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to an apparatus and to a method for processing hard materials comprises a laser (10) which generates high repetition rate, high irradiance laser pulses which are scanned onto a material using a scanner (20) for laser milling or laser cutting applications.
PCT/GB2005/003855 2004-10-07 2005-10-07 An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz Ceased WO2006038017A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05790890A EP1802421A2 (en) 2004-10-07 2005-10-07 An apparatus for processing hard material
JP2007535239A JP2008515643A (en) 2004-10-07 2005-10-07 Hard material processing apparatus and processing method using laser having irradiance in the range of 106 to 109 Wcm-2 and repetition rate in the range of 10 to 50 kHz

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0422318A GB0422318D0 (en) 2004-10-07 2004-10-07 An apparatus for processing hard material
GB0422318.6 2004-10-07
GB0511966.4 2005-06-13
GB0511966A GB0511966D0 (en) 2005-06-13 2005-06-13 An apparatus for processing hard material

Publications (2)

Publication Number Publication Date
WO2006038017A2 WO2006038017A2 (en) 2006-04-13
WO2006038017A3 true WO2006038017A3 (en) 2007-06-28

Family

ID=35453350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2005/003855 Ceased WO2006038017A2 (en) 2004-10-07 2005-10-07 An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz

Country Status (3)

Country Link
EP (1) EP1802421A2 (en)
JP (1) JP2008515643A (en)
WO (1) WO2006038017A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006020680A1 (en) * 2006-04-27 2007-10-31 Carl Zeiss Industrielle Messtechnik Gmbh Selective activatable lasers triggering method for e.g. production of liquid crystal display, involves producing trigger signals for triggering lasers when current number of position pulses corresponds to number of pulses
EP2220332B1 (en) 2007-11-05 2016-10-26 Baker Hughes Incorporated Methods and apparatuses for forming cutting elements having a chamfered edge for earth-boring tools
US10016876B2 (en) 2007-11-05 2018-07-10 Baker Hughes, A Ge Company, Llc Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts
EP2289708B1 (en) * 2009-08-26 2011-12-28 Indaffil Holding AG Method for producing a surface structure of a metallic pressed sheet, continuous ribbon or embossing roller
DE102009044316B4 (en) 2009-10-22 2015-04-30 Ewag Ag Method for producing a surface and / or edge on a blank and laser processing device for carrying out the method
JP5397768B2 (en) * 2009-12-10 2014-01-22 三菱マテリアル株式会社 Laser processing apparatus and laser processing method
DE102010011508B4 (en) 2010-03-15 2015-12-10 Ewag Ag Method for producing at least one flute and at least one cutting edge and laser processing device
CN103406670A (en) * 2013-07-02 2013-11-27 浙江工业职业技术学院 Laser cutting system for polycrystalline diamond compact
US9931714B2 (en) 2015-09-11 2018-04-03 Baker Hughes, A Ge Company, Llc Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams
CN111098039B (en) * 2019-12-20 2021-05-28 西安交通大学 Ultraviolet nanosecond laser cutting method of PCD gear cutting tool
US12168281B2 (en) 2022-01-11 2024-12-17 Baker Hughes Oilfield Operations Llc Polycrystalline diamond compact cutting elements, methods of forming same and earth-boring tools

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483038A (en) * 1992-04-23 1996-01-09 Sumitomo Electric Industries, Ltd. Method of working diamond with ultraviolet light
US6054673A (en) * 1997-09-17 2000-04-25 General Electric Company Method and apparatus for laser drilling
US20020104831A1 (en) * 2001-02-08 2002-08-08 The Regents Of The University Of California High precision, rapid laser hole drilling
US6605798B1 (en) * 1998-12-22 2003-08-12 Barry James Cullen Cutting of ultra-hard materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483038A (en) * 1992-04-23 1996-01-09 Sumitomo Electric Industries, Ltd. Method of working diamond with ultraviolet light
US6054673A (en) * 1997-09-17 2000-04-25 General Electric Company Method and apparatus for laser drilling
US6605798B1 (en) * 1998-12-22 2003-08-12 Barry James Cullen Cutting of ultra-hard materials
US20020104831A1 (en) * 2001-02-08 2002-08-08 The Regents Of The University Of California High precision, rapid laser hole drilling

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
M. HENRY ET AL: "laser milling - a practical industrial solution for machining a wide variety of materials", 5TH LASER PRECISION MICROMACHINING CONFERENCE 2005, May 2004 (2004-05-01), XP002359264, Retrieved from the Internet <URL:www.powerlase.com> *

Also Published As

Publication number Publication date
EP1802421A2 (en) 2007-07-04
JP2008515643A (en) 2008-05-15
WO2006038017A2 (en) 2006-04-13

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