WO2006035360A3 - Procede de formation d'un revetement sur un substrat, et revetement forme par ce procede - Google Patents
Procede de formation d'un revetement sur un substrat, et revetement forme par ce procede Download PDFInfo
- Publication number
- WO2006035360A3 WO2006035360A3 PCT/IB2005/053090 IB2005053090W WO2006035360A3 WO 2006035360 A3 WO2006035360 A3 WO 2006035360A3 IB 2005053090 W IB2005053090 W IB 2005053090W WO 2006035360 A3 WO2006035360 A3 WO 2006035360A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- protective coating
- coating
- filler component
- forming
- porous matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3435—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising a nitride, oxynitride, boronitride or carbonitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/425—Coatings comprising at least one inhomogeneous layer consisting of a porous layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/44—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the composition of the continuous phase
- C03C2217/45—Inorganic continuous phases
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
- C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
- C03C2217/475—Inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/113—Deposition methods from solutions or suspensions by sol-gel processes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/116—Deposition methods from solutions or suspensions by spin-coating, centrifugation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05798271A EP1797016A2 (fr) | 2004-09-30 | 2005-09-20 | Procede de formation d'un revetement sur un substrat, et revetement forme par ce procede |
| JP2007534130A JP2008514415A (ja) | 2004-09-30 | 2005-09-20 | 基材上にコーティングを形成する方法、及び、こうして形成されたコーティング |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04104791 | 2004-09-30 | ||
| EP04104791.1 | 2004-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2006035360A2 WO2006035360A2 (fr) | 2006-04-06 |
| WO2006035360A3 true WO2006035360A3 (fr) | 2006-08-03 |
Family
ID=36119265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IB2005/053090 Ceased WO2006035360A2 (fr) | 2004-09-30 | 2005-09-20 | Procede de formation d'un revetement sur un substrat, et revetement forme par ce procede |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1797016A2 (fr) |
| JP (1) | JP2008514415A (fr) |
| CN (1) | CN101031519A (fr) |
| TW (1) | TW200626519A (fr) |
| WO (1) | WO2006035360A2 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014529185A (ja) * | 2011-08-02 | 2014-10-30 | ダウ グローバル テクノロジーズ エルエルシー | 湿気からの保護を得るために複雑な表面上にコンフォーマルに被覆された結晶特性を有する薄いバリア膜を用いた光電子デバイス |
| CN107188616B (zh) * | 2017-05-23 | 2019-08-23 | 佛山欧神诺陶瓷有限公司 | 一种裂纹砖及其制备方法 |
| CN112517352B (zh) * | 2020-10-13 | 2022-07-22 | 江苏大学 | 一种纳米颗粒负载多孔超宽光谱吸收涂层及制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5665422A (en) * | 1991-03-19 | 1997-09-09 | Hitachi, Ltd. | Process for formation of an ultra fine particle film |
| US5711987A (en) * | 1996-10-04 | 1998-01-27 | Dow Corning Corporation | Electronic coatings |
| US6198155B1 (en) * | 1998-06-10 | 2001-03-06 | U.S. Philips Corporation | Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device |
| WO2004031445A1 (fr) * | 2002-10-03 | 2004-04-15 | Alberta Research Council Inc. | Revetement protecteur ceramique |
-
2005
- 2005-09-20 JP JP2007534130A patent/JP2008514415A/ja not_active Withdrawn
- 2005-09-20 CN CN200580033058.5A patent/CN101031519A/zh active Pending
- 2005-09-20 WO PCT/IB2005/053090 patent/WO2006035360A2/fr not_active Ceased
- 2005-09-20 EP EP05798271A patent/EP1797016A2/fr not_active Withdrawn
- 2005-09-27 TW TW094133543A patent/TW200626519A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5665422A (en) * | 1991-03-19 | 1997-09-09 | Hitachi, Ltd. | Process for formation of an ultra fine particle film |
| US5711987A (en) * | 1996-10-04 | 1998-01-27 | Dow Corning Corporation | Electronic coatings |
| US6198155B1 (en) * | 1998-06-10 | 2001-03-06 | U.S. Philips Corporation | Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device |
| WO2004031445A1 (fr) * | 2002-10-03 | 2004-04-15 | Alberta Research Council Inc. | Revetement protecteur ceramique |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200626519A (en) | 2006-08-01 |
| CN101031519A (zh) | 2007-09-05 |
| EP1797016A2 (fr) | 2007-06-20 |
| JP2008514415A (ja) | 2008-05-08 |
| WO2006035360A2 (fr) | 2006-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE112005000839B4 (de) | Verkapselung für ein organisches elektronisches Bauteil sowie Verwendung | |
| WO2008090614A1 (fr) | Pré-imprégné, carte de circuits imprimés, carte de circuits multicouche et procédé de fabrication d'une carte de circuits imprimés | |
| EP1669418A4 (fr) | Poudre d'oxyde de magnesium spherique revetue et son procede de production, et composition de resine contenant ladite poudre | |
| WO2005069734A3 (fr) | Encre liquide fixee a chaud | |
| WO2005007724A8 (fr) | Composition de resine pour cartes imprimees, preimpregne, lamine, et carte imprimee obtenue | |
| WO2003071596A3 (fr) | Composant electronique dote d'une couche adhesive et procede de fabrication associe | |
| TW200643106A (en) | Thermally conductive silicone rubber composition | |
| WO2006021415A3 (fr) | Composant en verre de silice revetu et son procede de production | |
| US10800930B2 (en) | Conformal coating composition containing metal nanoparticles to prevent sulfur related corrosion | |
| TW200514828A (en) | Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic part | |
| WO2008027856A3 (fr) | Revêtements multi-phases pour inhiber la croissance de barbes d'étain et leurs procédés de fabrication et d'utilisation | |
| SG158878A1 (en) | Epoxy resin composition, method of rendering the same latent, and semiconductor device | |
| DE60017631D1 (de) | Wärmehärtende Epoxydpulverbeschichtungen die verbesserte Entgasungseigenschaften aufweisen | |
| WO2006035360A3 (fr) | Procede de formation d'un revetement sur un substrat, et revetement forme par ce procede | |
| EP1476002A3 (fr) | Méthode de fabrication d'un substrate pour dispositif électroluminescent organique | |
| WO2008105258A1 (fr) | Bouchon de fermeture étanche à l'air et boîtier de stockage de composant électronique accompagné de son procédé de fabrication | |
| TW200501853A (en) | Printed circuit boards and method for fabricating the same | |
| WO2008142882A1 (fr) | Composition de résine pour un traitement de matériau poreux et procédé de fabrication d'un matériau poreux façonné | |
| US7432334B2 (en) | Silicone-modified single-component casting compound | |
| US7811860B2 (en) | Method for producing a device and device | |
| JP7219372B2 (ja) | コーティング剤作製キット、コーティング剤、電子基板及び電子部品モジュールの製造方法 | |
| KR101916512B1 (ko) | 세라믹 에나멜 조성물, 이를 포함하는 자동차 강화유리 및 이의 제조방법 | |
| JP2006156249A (ja) | 透明導電体 | |
| JP2009152430A (ja) | チップ状電子部品 | |
| JPH08109315A (ja) | 樹脂組成物、その樹脂組成物で被覆された電子部品、およびその樹脂組成物で被覆された圧電セラミック部品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2005798271 Country of ref document: EP |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 200580033058.5 Country of ref document: CN |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2007534130 Country of ref document: JP |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWP | Wipo information: published in national office |
Ref document number: 2005798271 Country of ref document: EP |