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WO2006074393A1 - Appareil de gestion thermique, systemes et procedes - Google Patents

Appareil de gestion thermique, systemes et procedes Download PDF

Info

Publication number
WO2006074393A1
WO2006074393A1 PCT/US2006/000498 US2006000498W WO2006074393A1 WO 2006074393 A1 WO2006074393 A1 WO 2006074393A1 US 2006000498 W US2006000498 W US 2006000498W WO 2006074393 A1 WO2006074393 A1 WO 2006074393A1
Authority
WO
WIPO (PCT)
Prior art keywords
coolant
flow rate
heat exchange
exchange element
electronic devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/000498
Other languages
English (en)
Inventor
Bruce H. Storm
James J. Freeman
Juan-Carlos Jakaboski
Yogendra Joshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Halliburton Energy Services Inc
Original Assignee
Halliburton Energy Services Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Halliburton Energy Services Inc filed Critical Halliburton Energy Services Inc
Priority to EP06717670A priority Critical patent/EP1856373A1/fr
Publication of WO2006074393A1 publication Critical patent/WO2006074393A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E21B47/0175—Cooling arrangements

Definitions

  • thermal management generally, including apparatus, systems, and methods used to manage electronic device thermal conditions.
  • Electronic devices may be designed to operate at a variety of temperatures, including up to about 200 C or greater, which is approximately the same as the ambient temperature experienced by various downhole drilling components.
  • the variety of such components available to designers may be somewhat limited, however, and those that are available can be relatively expensive and difficult to obtain.
  • managing thermal conditions associated with such components used in the downhole environment can be difficult, since operations can continue for days at a time. For a variety of reasons, then, there is a need to provide enhanced thermal management apparatus, systems, and methods for electronic devices used in downhole environments.
  • FIG. 3 illustrates several systems according to various embodiments of the invention
  • FIG. 4 is a flow chart illustrating several methods according to various embodiments of the invention.
  • FIG. 5 is a block diagram of an article according to various embodiments of the invention.
  • an element that serves as both a chassis and a heat exchanger may be thermally coupled to a plurality of electronic devices using a corresponding plurality of receiving sections (e.g., machined recesses tailored to receive the individual devices).
  • the chassis heat exchange element may include a conduit thermally coupled to the chassis heat exchange element.
  • a flow rate regulator may be used adjust the flow rate of a coolant (e.g., water, oil, etc.) circulated in the conduit.
  • thermally conductive, flow disruptive elements may be included in the conduit, hi some embodiments, the chassis heat exchange element may be used in conjunction with downhole drilling and logging operations.
  • a “chassis heat exchange element” may mean any substantially rigid structure that serves both as a chassis and as a heat exchange device in direct thermal communication with at least one electronic device from which heat is to be removed.
  • Direct thermal communication means that relatively thin thermally conductive materials (e.g., epoxy, grease, polymer, etc., comprising a total layer thickness of less than about 5 mm) may be interposed between the electronic device and the chassis heat exchange element (e.g., between the device and a receiving section). In some cases, the electronic device may be placed in direct contact with the chassis heat exchange element.
  • FIG. 1 is a block diagram of several apparatus 100 according to various embodiments of the invention.
  • an apparatus 100 may include a chassis heat exchange element 104.
  • FIG. 2 illustrates a chassis heat exchange element 204 according to various embodiments of the invention.
  • the chassis heat exchange element 104 shown in FIG. 1 may be similar to or identical to the chassis heat exchange element 204 shown in FIG. 2.
  • the chassis heat exchange elements 104, 204 may include a plurality of receiving sections 208 thermally coupled to a corresponding plurality of electronic devices 212.
  • various relatively thin (e.g., less than about 5 mm total thickness) layers of thermal epoxies, grease, polymers, etc. may be interposed between the electronic devices 212 and the chassis heat exchange elements 104, 204, perhaps disposed within the receiving sections 208.
  • the apparatus 100 may comprise a feedback and control system 130 (e.g., comprising the flow rate regulator 120, 220; the processor 124; and thermocouples 128) to monitor the temperature of one or more of the plurality of electronic devices 212 and/or the coolant 122, 222, and to adjust the flow rate of the coolant 122, 222 in accordance with the sensed temperature.
  • the flow rate of the coolant 122, 222 may be adjustable, including a set of states such as OFF, ON (at a preselected rate), ON (at a rate selected from a continuous range of rates), and ON (at a rate selected from a range of discrete rates), among others.
  • the flow rate of the coolant 122, 222 may be adjusted to comprise a preselected flow rate, perhaps a fixed flow rate, and/or an optimal flow rate determined by simulation and/or experiment. In such cases, a designer may choose not to use any feedback and control system 130.
  • coolant 122, 222 may be used within the thermal conduit 116, 216 of the apparatus 100.
  • the coolant 122, 222 may comprise water, such as distilled or de-ionized water.
  • the coolant 122, 222 may comprise non-hydrocarbon-based fluids, hi some embodiments, the coolant 122, 222 may comprise hydrocarbon-based fluids, such as oils, including poly(alpha-olefin) oils and other synthetic lubricants.
  • the apparatus 100 may include additional elements.
  • the thermal conduit 116, 216 may be placed in fluid communication with a heat exchanger 140, perhaps immersed in a material 144, such as a phase-change material, including a eutectic phase-change material, a solid, a liquid, or a gas.
  • a material 144 such as a phase-change material, including a eutectic phase-change material, a solid, a liquid, or a gas.
  • the heat exchanger 140 and/or material 144 may be contained in a heat sink 146, which may in turn include a canister.
  • the heat exchanger 140, material 144, and/or heat sink 146 may be thermally coupled to the chassis heat exchange element 104.
  • the apparatus 100 may be housed in a flask 148, such as an insulated and/or evacuated flask. Other embodiments may be realized.
  • the apparatus 100 may include a fluid expansion compensator 152 in fluid communication with the fluid conduit 116, 216.
  • the fluid expansion compensator 152 may be used to maintain the pressure of the coolant 122, 222 at substantially the same value.
  • Actuation of the fluid expansion compensator 152 may occur in a mechanical fashion (e.g., the fluid expansion compensator may include a piston and a spring to adjust a volume responsive to the pressure of the coolant), or in an electrical one, such as by moving a piston to adjust a volume coupled to the coolant 222 in accordance with a sensed pressure of the coolant 222, as monitored by the processor 124.
  • a solenoid or other electrically-movable device may be mechanically coupled to the fluid expansion compensator 152 and activated by the processor 124.
  • the thermally conductive layer 260 may in turn be coupled, mechanically and/or thermally to side rails 261 that can be attached to the circuit boards 254 and/or the chassis thermal exchange elements 104, 204, if desired.
  • multiple receiving sections 208 may be used to receive the plurality of electronic devices 212 attached to the circuit boards 254.
  • an antenna 262 may be coupled to one or more of the plurality of electronic devices 212.
  • FIG. 3 illustrates several systems 364 according to various embodiments of the invention, which may comprise portions of a bottom hole assembly 320 as part of a downhole drilling operation. Such systems 364 may be used in drilling and logging operations.
  • a system 364 may form a portion of a drilling rig 302 located at the surface 304 of a well 306.
  • the drilling rig 302 may provide support for a drill string 308.
  • the drill string 308 may operate to penetrate a rotary table 310 for drilling a borehole 312 through subsurface formations 314.
  • the drill string 308 may include a Kelly 316, a drill pipe 318, and a bottom hole assembly 320, perhaps located at the lower portion of the drill pipe 318.
  • the bottom hole assembly 320 may include drill collars 322, perhaps coupled to a downhole tool 324 and/or a drill bit 326.
  • the drill bit 326 may operate to create a borehole 312 by penetrating the surface 304 and subsurface formations 314.
  • the downhole tool 324 may comprise any of a number of different types of tools including MWD (measurement while drilling) tools, LWD (logging while drilling) tools, and others.
  • the drill string 308 (perhaps including the Kelly 316, the drill pipe 318, and the bottom hole assembly 320) may be rotated by the rotary table 310.
  • the bottom hole assembly 320 may also be rotated by a motor (e.g., a mud motor) that is located downhole.
  • the drill collars 322 may be used to add weight to the drill bit 326.
  • the drill collars 322 also may stiffen the bottom hole assembly 320 to allow the bottom hole assembly 320 to transfer the added weight to the drill bit 326, and in turn, assist the drill bit 326 in penetrating the surface 304 and subsurface formations 314.
  • a mud pump 332 may pump drilling fluid (sometimes known by those of skill in the art as "drilling mud") from a mud pit 334 through a hose 336 into the drill pipe 318 and down to the drill bit 326.
  • the drilling fluid can flow out from the drill bit 326 and be returned to the surface 304 through an annular area 340 between the drill pipe 318 and the sides of the borehole 312.
  • the drilling fluid may then be returned to the mud pit 334, where such fluid is filtered.
  • the drilling fluid can be used to cool the drill bit 326, as well as to provide lubrication for the drill bit 326 during drilling operations.
  • the drilling fluid may be used to remove subsurface formation 314 cuttings created by operating the drill bit 326.
  • the system 364 may include a bottom hole assembly 320, as well as one or more apparatus 300, similar to or identical to the apparatus 100 described above and illustrated in FIG. 1.
  • the system 364 may include a collar 322 to couple to a drill bit 326 and to house one or more chassis heat exchange elements (included in the apparatus 300).
  • a system 364 may include a tool body 370 to couple to a logging cable 374.
  • the tool body 370 may house an apparatus 300, including one or more chassis heat exchange elements.
  • the logging cable 374 may comprise a wireline (multiple power and communication lines), a mono-cable (a single conductor), and a slick-line (no conductors for power or communications).
  • a variety of mechanisms can be used to cool the apparatus 300 when it is brought to the surface 306 after operation in the borehole 312. In some cases, it is desirable to remove and replace the apparatus 300 entirely.
  • a charging pump 378 is used.
  • the charge pump 378 may be used to circulate the coolant 122, 222 in the conduit 116, 216 of the apparatus 100, 300 (see FIGs. 1 and 2). For rapid turnaround, the coolant 122, 222 may be chilled while it is circulated. This can occur either by replacing the coolant 122, 222 with new coolant, or simply chilling the existing coolant and circulating it within the conduit until the temperature of the circulated coolant remains at a selected temperature.
  • a system 364 may include a charging pump 378 capable of being removably fluidly coupled to the thermal conduit 116, 216 in the apparatus 100, 300 (see FIGs. l and 2).
  • the apparatus 100 chassis heat exchange elements 104, 204, thermal conduits 116, 216, flow rate regulators 120, 220, coolant 122, 222, processor 124, thermocouples 128, feedback and control system 130, fluid expansion compensator 152, receiving sections 208, electronic devices 212, pump and valve 232, thermally conductive flow disruptive elements 236, heat exchanger 140, material 144, flask 148, circuit boards 254, first and second sides 256, 258, thermally conductive layer 260, side rails 261, antenna 262, drilling rig 302, surface 304, well 306, drill string 308, rotary table 310, borehole 312, subsurface formations 314, Kelly 316, drill pipe 318, bottom hole assembly 320, drill collars 322, downhole tool 324, drill bit 326, mud pump 332, mud pit 334, hose 336, annular area 340, system 364, tool body 370, logging cable 374, and charging pump 378 may all be characterized as "modules" herein.
  • Such modules may include hardware circuitry, and/or one or more processors and/or memory circuits, software program modules, including objects and collections of objects, and/or firmware, and combinations thereof, as desired by the architect of the apparatus 100, 300 and systems 364, and as appropriate for particular implementations of various embodiments of the invention.
  • modules may be included in a system operation software simulation package, such as an electrical signal simulation package, a power usage and distribution simulation package, a power/heat dissipation simulation package, a signal transmission-reception simulation package, and/or a combination of software and hardware used to simulate the operation of various potential embodiments.
  • apparatus and systems of various embodiments can be used in applications other than for logging, drilling, and downhole operations, and thus, various embodiments are not to be so limited.
  • the illustrations of apparatus 100, 300 and systems 364 are intended to provide a general understanding of the structure of various embodiments, and they are not intended to serve as a complete description of all the elements and features of apparatus and systems that might make use of the structures described herein.
  • Applications that may include the novel apparatus and systems of various embodiments include electronic circuitry used in high-speed computers, communication and signal processing circuitry, modems, processor modules, embedded processors, data switches, and application-specific modules, including multilayer, multi-chip modules. Such apparatus and systems may further be included as sub-components within a variety of electronic systems, such as televisions, cellular telephones, personal computers, spaceflight computers, personal digital assistants (PDAs), workstations, radios, video players, vehicles, and others.
  • PDAs personal digital assistants
  • FIG. 4 is a flow chart illustrating several methods according to various embodiments of the invention.
  • a method 411 may (optionally) begin with inserting an apparatus (e.g., similar to or identical to apparatus 100, 300 shown in FIGs. 1 and 3), including one or more chassis heat exchange elements, into a borehole at block 421.
  • the method 411 may continue at block 425 with circulating a coolant through a thermal conduit thermally coupled to the chassis heat exchange element(s) (including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices, as noted above).
  • the method 411 may continue with sensing a temperature of one or more of the plurality of electronic devices (and/or the coolant) at block 429.
  • the method 411 may also include indicating the temperature at block 431, either to a processor included in the plurality of electronic devices, or in a variety of other ways, such as by operating an alarm.
  • the method 411 may include adjusting a flow rate of the coolant in accordance with the sensed temperature at block 441.
  • the method 411 may further include, for example, increasing the flow rate in accordance with sensing an increased temperature associated with one or more of the plurality of electronic devices, as well as decreasing the flow rate of the coolant in accordance with sensing a decreased temperature associated with one or more of the plurality of electronic devices at block 445.
  • the flow rate may even be adjusted to a substantially constant flow rate, if desired.
  • the method 411 may also include determining an optimal flow rate (e.g., a rate determined to provide a maximum operational time downhole) associated with the coolant at block 445.
  • the method 411 may include replacing a first heat sink, perhaps including a heat exchanger (e.g., similar to or identical to the heat sink 146 and heat exchanger 140), thermally coupled to one or more chassis heat exchange elements in the apparatus, with a second heat sink (to be thermally coupled to the chassis heat exchange element) at block 463.
  • the second heat sink may have a temperature substantially less than the temperature of the first heat sink.
  • the chassis heat exchange element may be removably attached to circuit boards holding the electronic devices being cooled, or not.
  • the method 411 may include removably coupling a charging pump to the thermal conduit included in the chassis heat exchange element at block 467, and circulating a second coolant through the thermal conduit (wherein the second coolant has a second temperature substantially less than a first temperature of the original, or first coolant).
  • the second coolant has a second temperature substantially less than a first temperature of the original, or first coolant.
  • Information including parameters, commands, operands, and other data, including data in various formats (e.g., time division, multiple access) and of various types (e.g., binary, alphanumeric, audio, video), can be sent and received in the form of one or more carrier waves.
  • data e.g., time division, multiple access
  • various types e.g., binary, alphanumeric, audio, video
  • FIG. 5 is a block diagram of an article 585 according to various embodiments of the invention, such as a computer, a memory system, a magnetic or optical disk, some other storage device, and/or any type of electronic device or system.
  • the article 585 may comprise a processor 587 coupled to a machine- accessible medium such as a memory 589 (e.g., a memory including an electrical, optical, or electromagnetic conductor) having associated information 591 (e.g., computer program instructions, and/or other data), which when accessed, results in a machine (e.g., the processor 587) performing such actions as (simulating) circulating a coolant through a thermal conduit thermally coupled to a chassis heat exchange element including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices, (simulating) sensing a temperature of at least one of the plurality of electronic devices, and (simulating) adjusting a flow rate of the coolant in accordance with the temperature.
  • a memory 589
  • actions may include indicating the temperature, determining an optimal flow rate associated with the coolant, and perhaps increasing the flow rate in accordance with sensing an increased temperature associated with one or more of the plurality of electronic devices, or decreasing the flow rate of the coolant in accordance with sensing a decreased temperature associated with one or more of the plurality of electronic devices.
  • the flow rate of the coolant may even be adjusted to a substantially constant flow rate.
  • actions may include adjusting a volume of the coolant to maintain a substantially constant coolant pressure.
  • inventive subject matter may be referred to herein, individually and/or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
  • inventive subject matter may be referred to herein, individually and/or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
  • inventive subject matter merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un appareil et un système ainsi qu'un procédé et un article qui peuvent fonctionner de manière à faire circuler un fluide de refroidissement dans une conduite couplée thermiquement à un élément échangeur de chaleur à châssis, qui comprend une pluralité de parties réceptrices couplées thermiquement à une pluralité correspondante de dispositifs électroniques. La température d'un ou plusieurs dispositifs électroniques peut être détectée, et un débit d'écoulement du fluide de refroidissement peut être ajusté en fonction de la température détectée. La conduite thermique peut comprendre des éléments thermoconducteurs d'interruption de flux. L'élément échangeur de chaleur à châssis peut fonctionner dans un environnent de fond de puits, y compris lors des opérations de diagraphie et de forage.
PCT/US2006/000498 2005-01-06 2006-01-06 Appareil de gestion thermique, systemes et procedes Ceased WO2006074393A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06717670A EP1856373A1 (fr) 2005-01-06 2006-01-06 Appareil de gestion thermique, systemes et procedes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/030,263 2005-01-06
US11/030,263 US20060144619A1 (en) 2005-01-06 2005-01-06 Thermal management apparatus, systems, and methods

Publications (1)

Publication Number Publication Date
WO2006074393A1 true WO2006074393A1 (fr) 2006-07-13

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EP (1) EP1856373A1 (fr)
WO (1) WO2006074393A1 (fr)

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