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WO2005117154B1 - High-density integrated type thin-layer thermoelectric module and hybrid power generating system - Google Patents

High-density integrated type thin-layer thermoelectric module and hybrid power generating system

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Publication number
WO2005117154B1
WO2005117154B1 PCT/JP2005/009864 JP2005009864W WO2005117154B1 WO 2005117154 B1 WO2005117154 B1 WO 2005117154B1 JP 2005009864 W JP2005009864 W JP 2005009864W WO 2005117154 B1 WO2005117154 B1 WO 2005117154B1
Authority
WO
WIPO (PCT)
Prior art keywords
thin layer
thermoelectric
semiconductor element
layer
thermoelectric semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/009864
Other languages
French (fr)
Japanese (ja)
Other versions
WO2005117154A1 (en
Inventor
Kazukiyo Yamada
Kiyoshi Ineizumi
Naohisa Taguchi
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Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Individual filed Critical Individual
Priority to JP2006513983A priority Critical patent/JPWO2005117154A1/en
Publication of WO2005117154A1 publication Critical patent/WO2005117154A1/en
Publication of WO2005117154B1 publication Critical patent/WO2005117154B1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Photovoltaic Devices (AREA)

Abstract

A thin-layer thermoelectric element pair unit is modularized into a high-density integrated type to thereby improve its adaptability to various applications. Many P-type and N-type thin-layer thermoelectric semiconductor element pair units and thin-layer electrodes are formed on a flexible heat-insulating/electricity-insulating sheet, electrodes are formed so as to hold the thermoelectric semiconductor element pair units from the opposite sides and allow the low-temperature side to overlap the high-temperature side in order to improve a thermoelectric effect and to provide a broader contact area between electrodes and thermoelectric semiconductor pair units, and the sheet is bent or coiled to effect three-dimensional working, whereby a high-density integrated type thin-layer thermoelectric module is produced. An air layer or a heat-insulating element layer may be interposed between adjacent thermoelectric element units, or a sheet-form film may be used to seal the surrounding against moisture and stain.

Claims

補正書の請求の範囲 補正書の請求の範囲 [ 2 0 0 5年 1 1月 7日 (0 7 . 1 1 . 0 5 ) 国際事務局受理:出願 当初の請求の範囲 2— 7は補正された;出願当初の請求の範囲 1は取り下げられた。 (1 頁) ]  Claims for the amendments Claims for the amendments [January 7, 2007 (0 7. 1 1. 0 5) Accept the International Bureau: Claim originally filed in the application 2-7 is amended The first claim of the application was withdrawn. (1 page)] (削除) (Delete) 2 - (補正後) 熱絶縁性且つ電気絶縁性で柔軟な薄いシ― の上に 、 縦方向に、 P型熱電 半導体素子の薄層、 N型熱電半導体素子の薄層および各熱電半導体素子を接合する電極の 各薄層を複数列に配置し、 電極のほぼ中央部を横方向の折曲線に沿つてジグザグに折曲げ る こ とによ り 多数の π構造熱電ュニッ トを立体と して Wi m,させて形成し、 立体の横方向前 記折曲線の集まる 2面が夫々低 サイ ド及び高温サイ Kとなる よ う にしたこ と を特徴とす る 度集積型薄層熱電モジ ル  2-(After correction) A thin layer of P-type thermoelectric semiconductor element, a thin layer of N-type thermoelectric semiconductor element and each thermoelectric semiconductor element in the vertical direction on a thermally insulating and electrically insulating flexible thin sheet By arranging each thin layer of the electrodes to be joined in a plurality of rows and bending approximately the central part of the electrodes in a zigzag along a lateral bending line, a large number of π-structured thermoelectric elements can be formed in three dimensions. A degree-integrated thin-layer thermoelectric module is characterized in that it is formed so that two sides of the three-dimensional lateral bending of the surface form a low side and a high temperature, respectively. 3 - (補正後) 熱電半導体素子の薄層に薄層電極を接合する際、 電極は熱電半導体素子の 端面から側面にかけて熱電半導体素子を挟み又は囲むよ う に して、 電極と熱電半導体素子 と の接触面積を広く する こ と によ り 、 電流密度が大き く なる よ う にしたこ と を特徴とする 3-(After correction) When joining a thin layer electrode to a thin layer of a thermoelectric semiconductor element, the electrode sandwiches or surrounds the thermoelectric semiconductor element from the end face to the side face of the thermoelectric semiconductor element, and the electrode and the thermoelectric semiconductor element It is characterized in that the current density is increased by increasing the contact area of the 5 求項 2 の高密度集積型薄層熱電モジュール 5 High density integrated thin layer thermoelectric module according to claim 2 4 - (補正後) 熱電半導体素子の薄層に薄層電極を接合する際、 熱電半導体素子の電極と 接する部分の面を非平面にして 熱電半導体素子の薄層と電極と の接触面積を実質的に広 4-(After correction) When joining a thin layer electrode to a thin layer of a thermoelectric semiconductor element, make the surface of the part in contact with the electrode of the thermoelectric semiconductor element non-planar so that the contact area between the thin layer of the thermoelectric semiconductor element and the electrode is substantially Wide < する こ と によ り 、 電流密度が大き く なるよ う に したこ と を特徴とする請求項 2又は請求 項 3 の高密度集積型薄層熱電モジュ―ル The high density integrated thin-layer thermoelectric module according to claim 2 or claim 3, characterized in that the current density is increased by the step. 5 . (補正後)  5. (After correction) 各熱電半導体素子の薄層は低温サイ と高温サィ ドの中間部に ッ トホ ―ル ス y ッ 卜及 び/またはく びれた形状を持たせて 貫流を小さ くする と と ちに 、 熱電半導体素子の薄層 の抵抗値を調整するこ と を特徴とする SB求項 2ないし請求項 4 の高密度 * 型薄層熱 モ A thin layer of each thermoelectric semiconductor element has a hole shape and / or an intermediate shape in the middle portion between the low temperature side and the high temperature side to reduce the through flow, The high density * type thin layer thermal thin film thermal conductivity according to SB claim 2 to claim 4 characterized by adjusting the resistance value of the thin layer of the element 6 . (補正後 ) 高密度集積型薄層熱電モジ ルを形成する部分間又は全体に 真空 空 気層及び/又は熱絶縁性且つ電気絶縁性の高い層を有する 永項 2 ない s 6. (After correction) No permanent matter 2 having a vacuum air layer and / or a thermally insulating and highly electrically insulating layer between or in the entire part forming the high density integrated thin layer thermoelectric module. し 求項 5 の高密 度集積型薄層熱電モジュ一ノレ  The high density integrated thin layer thermoelectric module according to claim 5 7 . (補正後 ) ソーラーセル発電装置とその背面に取り付けた 1 以上の高密度集積型薄層 熱電モジユールと を含み、 高密度集積型薄層熱電モジュールは言 IJ BD i 永項 2 なレ、し請求項 7 (After correction) The solar cell power generator and one or more high density integrated thin layer thermoelectric modules mounted on the back of the solar cell power generator, the high density integrated thin layer thermoelectric modules Claim 6 の構成であるこ と を特徴とするハィプ y 発電システム A hype y power generation system characterized by having a configuration of 6

条約 19条に基づく説明書 請求の範囲第 2項は、 熱電半導体素子の薄層および各熱電半導体素子を接合する電極の 各薄層を複数列に配置するこ と を明確に した。 引用例 (特開平 8 1 5 3 8 9 8 ) にも多 数枚の絶縁性基板を用いる例があるが、 本願発明は、 1枚のシー トに半導体素子を複数列 配置し、 電極のほぼ中央を折曲げた構造のため、 生産性及び集積密度が優れている。 また 引用例 (特開 2 0 0 4— 1 0 4 0 4 1 ) は、 角棒や丸棒の半導体素子を用いる折り 返し構 造ではあるが、 本願発明は、 シー ト及ぴ薄層電極を折曲げる構造であ り 、 集積密度が優れ ている。 請求の範囲第 3項ない し第 7項では、 削除した請求の範囲第 1項を引用項から除いた。 Article 2 of the Convention Article 19 clarified that thin layers of thermoelectric semiconductor elements and thin layers of electrodes for joining thermoelectric semiconductor elements are arranged in multiple rows. In the cited example (Japanese Patent Application Laid-Open No. Hei 8 15 3 8 9 8), there is an example using a large number of insulating substrates, but in the present invention, a plurality of rows of semiconductor elements are arranged on one sheet and The center-folded structure offers excellent productivity and density. Also, although the cited example (Japanese Patent Application Laid-Open No. 2 0 0 4 0 4 0 4 1) has a folded structure using square bar or round bar semiconductor elements, the present invention uses sheet and thin layer electrodes. It has a folded structure and excellent integration density. Claims 3 and 7 removed the first claim of the deleted claim from the citation.

PCT/JP2005/009864 2004-05-31 2005-05-30 High-density integrated type thin-layer thermoelectric module and hybrid power generating system Ceased WO2005117154A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006513983A JPWO2005117154A1 (en) 2004-05-31 2005-05-30 High density integrated thin layer thermoelectric module and hybrid power generation system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-160886 2004-05-31
JP2004160886 2004-05-31

Publications (2)

Publication Number Publication Date
WO2005117154A1 WO2005117154A1 (en) 2005-12-08
WO2005117154B1 true WO2005117154B1 (en) 2006-02-16

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WO (1) WO2005117154A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7834263B2 (en) 2003-12-02 2010-11-16 Battelle Memorial Institute Thermoelectric power source utilizing ambient energy harvesting for remote sensing and transmitting
US8455751B2 (en) 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
JP2007518252A (en) 2003-12-02 2007-07-05 バッテル メモリアル インスティチュート Thermoelectric device and its use
US7851691B2 (en) 2003-12-02 2010-12-14 Battelle Memorial Institute Thermoelectric devices and applications for the same
JP2007103879A (en) * 2005-10-07 2007-04-19 Univ Kanagawa Thermoelectric element
JP2008130594A (en) * 2006-11-16 2008-06-05 Tokai Rika Co Ltd Thermoelectric conversion device and manufacturing method thereof
US20090084421A1 (en) * 2007-09-28 2009-04-02 Battelle Memorial Institute Thermoelectric devices
AU2009242214A1 (en) * 2008-04-28 2009-11-05 Basf Se Thermomagnetic generator
JP5742613B2 (en) * 2011-09-13 2015-07-01 ダイキン工業株式会社 Flat type thin film thermoelectric module
DE102012105086B4 (en) 2012-06-13 2014-02-13 Karlsruher Institut für Technologie Wound and folded thermoelectric system and method of making the same
JP6358737B2 (en) * 2013-03-22 2018-07-18 独立行政法人国立高等専門学校機構 Hollow tube and power generator
WO2016203939A1 (en) * 2015-06-17 2016-12-22 富士フイルム株式会社 Thermoelectric conversion element and thermoelectric conversion module
WO2018042708A1 (en) * 2016-08-30 2018-03-08 国立大学法人東京工業大学 Thermoelectric conversion device and electronic device
JP6958233B2 (en) * 2017-10-26 2021-11-02 株式会社デンソー Thermoelectric converter and its manufacturing method
US11374533B2 (en) 2018-05-31 2022-06-28 Mitsubishi Electric Corporation Solar power generation paddle, method of manufacturing the same, and space structure
JP7363052B2 (en) * 2019-02-26 2023-10-18 日本ゼオン株式会社 thermoelectric conversion module
JPWO2021149770A1 (en) * 2020-01-24 2021-07-29
US11832518B2 (en) 2021-02-04 2023-11-28 Purdue Research Foundation Woven thermoelectric ribbon
CN114883475B (en) * 2022-03-24 2025-03-25 嘉兴大学 A wearable thermoelectric bracelet and preparation method thereof

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JPH0430586A (en) * 1990-05-28 1992-02-03 Matsushita Electric Ind Co Ltd Thermoelectric device
JPH08153898A (en) * 1994-11-28 1996-06-11 Matsushita Electric Ind Co Ltd Thermoelectric element
JP2001053322A (en) * 1999-05-31 2001-02-23 Sony Corp Power generation equipment and information processing equipment
JP4345279B2 (en) * 2002-09-13 2009-10-14 ソニー株式会社 Method for manufacturing thermoelectric conversion device

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JPWO2005117154A1 (en) 2008-04-03

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