WO2005001544A1 - 光学ユニット、結像光学系、結像光学系の収差調整方法、投影光学系、投影光学系の製造方法、露光装置、および露光方法 - Google Patents
光学ユニット、結像光学系、結像光学系の収差調整方法、投影光学系、投影光学系の製造方法、露光装置、および露光方法 Download PDFInfo
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- WO2005001544A1 WO2005001544A1 PCT/JP2004/008733 JP2004008733W WO2005001544A1 WO 2005001544 A1 WO2005001544 A1 WO 2005001544A1 JP 2004008733 W JP2004008733 W JP 2004008733W WO 2005001544 A1 WO2005001544 A1 WO 2005001544A1
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- optical system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Definitions
- the present invention relates to an imaging optical system, a method for adjusting aberrations of the imaging optical system, an exposure apparatus, and an exposure method, and is particularly used when a semiconductor element, a liquid crystal display element, and the like are manufactured by a photolithographic process.
- the present invention relates to a projection optical system suitable for an exposure apparatus.
- a pattern image of a mask or a reticle is transferred to a wafer (or a glass plate) coated with a photoresist or the like via a projection optical system. Etc.) are used.
- the resolving power (resolution) required of the projection optical system of the projection exposure apparatus further increases.
- the resolution of the projection optical system is represented by k′ ⁇ & is a process coefficient.
- the image-side numerical aperture NA is defined as the refractive index of a medium (usually, gas such as air) between the projection optical system and the photosensitive substrate (such as a wafer), and the maximum incident angle on the photosensitive substrate.
- ⁇ is represented by n-sin ⁇ .
- an object of the present invention is to make it possible to switch between a dry type and a liquid immersion type by a simple replacement operation of a slight optical member without substantially deteriorating the aberration state. Further, the present invention uses an imaging optical system that can be switched between a dry type and a liquid immersion type without substantially deteriorating the aberration state, and provides high-resolution and good exposure as necessary. It is an object of the present invention to provide an exposure apparatus and an exposure method capable of performing an exposure. Another object of the present invention is to provide an optical unit capable of switching a projection optical system between a dry type and an immersion type.
- an imaging optical system is an immersion type imaging optical system having an immersion liquid layer in contact with an image plane
- a boundary surface between the immersion layer and the first medium layer, a boundary interface between the first medium layer and the second medium layer, and a boundary surface between the second medium layer and the third medium layer are each planar. It is characterized by being formed in a shape.
- the imaging optical system according to the second aspect of the present invention comprises an optical system having a predetermined refractive power closest to an image plane and an optical surface having a predetermined refractive power.
- the imaging optical system includes a lens disposed closest to an image plane or an object plane, and a lens arranged closest to the image plane or the object plane.
- the at least three medium layers are each non-refractive power
- All the boundary surfaces in the at least three medium layers are formed in a planar shape.
- a method for adjusting an imaging optical system according to a fourth aspect of the present invention is a method for adjusting an imaging optical system that forms an image of an object
- An image-side medium changing step of changing the medium of the image-side medium layer which is a medium layer between the most image-side optical surface closest to the image side and the image surface of the imaging optical system, between gas and liquid;
- a thickness along the optical axis of a first medium layer which is disposed between the optical surface having a predetermined refractive power closest to the image plane and the image-side medium layer and has a first medium force;
- the medium in the image-side space is changed by changing the thickness along the optical axis of the third medium layer disposed between the second medium layer and having a different refractive index from the first medium and the second medium.
- an aberration correcting step of correcting spherical aberration generated in the imaging optical system due to the above.
- a method of adjusting an imaging optical system according to a fifth aspect of the present invention is a method of adjusting an imaging optical system that forms an image of an object.
- An image-side medium changing step of changing the medium of the image-side medium layer which is a medium layer between the most image-side optical surface closest to the image side and the image surface of the imaging optical system, between gas and liquid;
- the optical surface and the image-side medium layer having a predetermined refractive power disposed closest to the image surface A first medium layer composed of a first medium disposed between the first medium layer and a second medium force disposed between the optical surface and the first medium layer and having a refractive index different from that of the first medium layer.
- the radius of curvature of the boundary surface between any two adjacent ones of the image-side medium layer, the first medium layer, the second medium layer, and the third medium layer is R, and the imaging optics
- the maximum image height of the system is Ym and the radius of curvature of the optical surface having the predetermined refractive power is Rp,
- an exposure apparatus includes an illumination system for illuminating a mask, and an image of a pattern formed on the mask on the image plane.
- An imaging optical system according to any one of the first to third aspects for forming on a set photosensitive substrate is provided.
- an exposure apparatus comprises a projection optical system for projecting and exposing a mask pattern onto a photosensitive substrate.
- An imaging optical system whose aberration is adjusted by the method is provided.
- an exposure apparatus is directed to an adjustment method according to the fifth aspect, wherein the exposure apparatus is a projection optical system for projecting and exposing a mask pattern onto a photosensitive substrate. Is provided with an imaging optical system adjusted by the following.
- an exposure method illuminates a mask and forms the mask on the mask via the imaging optical system according to the first to third aspects.
- the obtained pattern is projected and exposed on a photosensitive substrate set on the image plane.
- an exposure method employs an imaging optical system whose aberration has been adjusted by the aberration adjustment method of the fourth aspect to form an image on a mask.
- the image of the pattern is projected and exposed on a photosensitive substrate.
- an exposure method employs an imaging optical system adjusted by the adjustment method according to the fifth aspect, which is formed on a mask.
- the image of the pattern is projected and exposed on a photosensitive substrate.
- the optical unit according to the twelfth aspect of the present invention is configured to be attachable to a dry-type imaging optical system that forms an image of an object via a gas,
- the optical members are disposed interchangeably with an optical member disposed on the image side of the optical surface having a predetermined refractive power disposed closest to the image among the optical surfaces having the predetermined refractive power.
- a second optical member which is provided exchangeably with the optical member in the dry-type imaging optical system and is formed of a second medium having a different refractive index from the first optical member; At least one of the thickness of the optical member along the optical axis and the refractive index of the first medium and the thickness of the second optical member along the optical axis and the refractive index of the second medium. At least one of them is characterized in that it is determined so as to correct spherical aberration caused by changing the type of medium on the image side of the imaging optical system from gas to liquid.
- an optical unit configured to be attachable to a dry-type imaging optical system that forms an image of an object via a gas
- An immersion changing optical unit for changing the image of the object into an immersion type imaging optical system that forms an image via a liquid
- the optical members are disposed interchangeably with an optical member disposed on the image side of the optical surface having a predetermined refractive power disposed closest to the image among the optical surfaces having the predetermined refractive power.
- a second optical member which is provided exchangeably with the optical member in the dry-type imaging optical system and is formed of a second medium having a different refractive index from the first optical member; Curvature of two optical surfaces of the optical member and two optical surfaces of the second optical member When the radius is R, the maximum image height of the imaging optical system is Ym, and the radius of curvature of the optical surface having the predetermined refractive power is Rp,
- an optical unit includes a dry-type imaging optical system that forms an image of an object via a gas, An immersion changing optical unit for changing to an immersion type imaging optical system formed through
- At least one of the optical members having a predetermined refractive power disposed on the image side of the optical surface having the predetermined refractive power and being disposed on the image side of the optical surface having the refractive power in the dry imaging optical system is at least 1 With two optical members,
- the type of medium on the image side of the imaging optical system is changed from gas to liquid.
- the deterioration of the imaging characteristics of the imaging optical system, which occurs due to the above, is reduced.
- a projection optical system includes a plurality of optical elements, and uses an exposure light having a wavelength of 200 nm to 300 nm to form an image on a first surface. Is formed on the second surface,
- a first optical element disposed near the second surface and having a refractive power on the second surface side of approximately 0;
- a second optical element which is arranged closest to the second surface side and has a refractive power of almost 0;
- the optical elements of the plurality of optical elements are formed of a first glass material, and one of the first optical element and the second optical element is formed of the first glass material,
- the other of the first optical element and the second optical element is lower than the first glass material.
- the second surface is telecentric.
- a projection optical system includes a plurality of optical elements, and uses an exposure light having a wavelength of 200 nm to 300 nm to form an image on a first surface. Is formed on the second surface,
- a boundary lens that is disposed near the second surface, and has a refractive power of approximately 0 on the second surface side, and a flat plate that is inserted near the second surface.
- All of the plurality of optical elements except the flat plate are formed of a first glass material, the flat plate is formed of a second glass material having a lower refractive index than the first glass material, the boundary lens and the second surface
- the liquid interposed in the optical path between the liquid and the gas is exchanged for a gas, by adjusting the thickness of the boundary lens and the distance between the boundary lens and the flat plate, the liquid and the gas are separated. Maintain the same optical characteristics before and after replacement,
- the second surface is telecentric.
- a projection optical system includes a plurality of optical elements, and uses an exposure light having a wavelength of 200 nm to 300 nm to form an image on a first surface. Is formed on the second surface,
- the optical elements are formed of a first glass material, are disposed near the second surface, and are formed of a second glass material having a lower refractive index than the first glass material. At least one optical element whose refractive power on the second surface side is substantially zero is provided, and the second surface side is telecentric.
- a method for manufacturing a projection optical system uses an exposure light having a plurality of optical elements and having a wavelength of 200 nm to 300 nm. Projection light that forms an image of the first surface on the second surface under a telecentric light flux on the second surface A method of manufacturing a science,
- a second thickness adjustment step for adjusting the thickness of the second optical element disposed closest to the second surface.
- the optical characteristics after a medium having a refractive index of 1.1 or more is interposed in an optical path between the second optical element and the second surface.
- the thickness of the first optical element and the thickness of the second optical element are adjusted so as to maintain almost the same optical characteristics as before the interposition of the optical element.
- a method for manufacturing a projection optical system uses a plurality of optical elements, exposure light having a wavelength of 200 nm to 300 nm, and A method of manufacturing a projection optical system for forming an image of a first surface on a second surface under a telecentric light flux,
- the flat plate is inserted in the inserting step, and the boundary is set in the thickness adjusting step.
- the thickness of the field lens By adjusting the thickness of the field lens and adjusting the distance between the plane plate and the boundary lens in the distance adjustment step, the liquid interposed in the optical path between the boundary lens and the second surface can be reduced. Maintain almost the same optical characteristics before and after changing to gas,
- All of the plurality of optical elements except the flat plate are formed of a first glass material.
- an exposure apparatus is an exposure apparatus that transfers a mask pattern onto a photosensitive substrate
- a projection optical system for forming an image of the mask pattern on the photosensitive substrate
- an exposure apparatus is an exposure apparatus that transfers a mask pattern onto a photosensitive substrate
- An eighteenth or a first one for forming an image of the pattern of the mask on the photosensitive substrate is an eighteenth or a first one for forming an image of the pattern of the mask on the photosensitive substrate.
- a projection optical system manufactured by the method for manufacturing a projection optical system according to the ninth aspect is a projection optical system manufactured by the method for manufacturing a projection optical system according to the ninth aspect
- an exposure method is an exposure method for transferring a predetermined pattern onto a photosensitive substrate
- an exposure method is an exposure method for transferring a predetermined pattern onto a photosensitive substrate
- An eighteenth or nineteenth aspect for forming the image of the predetermined pattern on the photosensitive substrate Projection projected by using a projection optical system manufactured by a method of manufacturing a projection optical system.
- the present invention it is possible to switch between the dry type and the liquid immersion type by a simple exchange operation of a few optical members without substantially deteriorating the aberration state.
- the depth of focus and resolution of the imaging optical system can be improved.
- the imaging optical system switched to the liquid immersion type is used for the exposure apparatus and the exposure method, it is possible to reduce the resist reflectance.
- the exposure apparatus and exposure method of the present invention use an imaging optical system that can switch between a dry type and an immersion type without substantially deteriorating the aberration state, and As a result, good exposure can be performed at a high resolution, and the ability to manufacture fine microdevices can be achieved.
- FIG. 1 is a diagram schematically showing a configuration of a main part of an image side of a dry-type imaging optical system and a spherical aberration diagram.
- FIG. 2 is a diagram schematically showing a configuration of a main part on an image side and a spherical aberration diagram when the dry imaging optical system shown in FIG. 1 is simply switched to an immersion type.
- FIG. 3 is a schematic diagram of a configuration of a main part on an image side and a spherical aberration diagram when the thickness of a parallel plane plate and a gas layer is changed when the dry imaging optical system shown in FIG. 1 is switched to an immersion type.
- FIG. 3 is a schematic diagram of a configuration of a main part on an image side and a spherical aberration diagram when the thickness of a parallel plane plate and a gas layer is changed when the dry imaging optical system shown in FIG. 1 is switched to an immersion type.
- FIG. 4 A schematic view of a configuration of a main part on an image side and a spherical aberration diagram when a thickness of a parallel plane plate, a gas layer, and a plano-convex lens is changed when the dry imaging optical system shown in FIG. 1 is switched to an immersion type.
- FIG. 4 A schematic view of a configuration of a main part on an image side and a spherical aberration diagram when a thickness of a parallel plane plate, a gas layer, and a plano-convex lens is changed when the dry imaging optical system shown in FIG. 1 is switched to an immersion type.
- FIG. 5 is a diagram schematically showing a configuration of a main part on an image side of an optical system optically equivalent to the liquid immersion type imaging optical system shown in FIG. 4.
- FIG. 6 is a diagram schematically showing a configuration of an exposure apparatus including an imaging optical system according to a first embodiment of the present invention.
- FIG. 7 schematically shows a lens configuration of a projection optical system of the present embodiment set to an immersion type.
- FIG. 8 is a diagram schematically showing a configuration of a main part on the image side of the immersion type projection optical system shown in FIG.
- FIG. 9 is a view corresponding to FIG. 8, and schematically showing a configuration of an image side main part of the dry projection optical system of the present embodiment.
- Garden 10 is a diagram showing lateral aberration in the immersion type projection optical system of the present embodiment.
- FIG. 11 is a diagram showing lateral aberration in the dry projection optical system of the present embodiment.
- FIG. 12 is a flowchart showing an example of a method for manufacturing the liquid immersion projection optical system of the present embodiment.
- FIG. 13 is a view schematically showing a configuration of a main part of a wavefront aberration measuring device used when manufacturing the liquid immersion type projection optical system of the present embodiment.
- Garden 14 is a diagram showing a lens configuration of a projection optical system according to a second embodiment.
- FIG. 15 is a diagram showing a partial lens configuration of a projection optical system according to a second embodiment.
- FIG. 16 is a diagram showing a lens configuration of a projection optical system according to a third embodiment.
- Garden 17 is a diagram showing a partial lens configuration of a projection optical system according to a third embodiment.
- Garden 18 is a diagram showing a lens configuration of a projection optical system according to a fourth embodiment.
- Garden 19 is a diagram showing a partial lens configuration of a projection optical system according to a fourth embodiment.
- Garden 20 is a flowchart for explaining a method of manufacturing a projection optical system according to the fifth embodiment.
- Garden 21 is a diagram showing a partial lens configuration of a projection optical system manufactured by the method for manufacturing a projection optical system according to the fifth embodiment.
- Garden 22 is a diagram showing a partial lens configuration of a projection optical system manufactured by the method for manufacturing a projection optical system according to the fifth embodiment.
- FIG. 24 is a diagram showing a schematic configuration of an exposure apparatus according to a sixth embodiment.
- Garden 25 is a lateral aberration diagram showing lateral aberrations in the meridional direction and the sagittal direction of the dry projection optical system according to Example 1.
- FIG. 6 is a lateral aberration diagram showing a lateral aberration in FIG.
- FIG. 27 is a lateral aberration diagram showing lateral aberrations in the tangential direction and the sagittal direction of the dry projection optical system according to Example 2.
- FIG. 28 is a lateral aberration diagram showing lateral aberrations of a liquid immersion type projection optical system according to Example 2 in the tangential direction and the sagittal direction.
- FIG. 29 is a lateral aberration diagram showing lateral aberrations in the tangential direction and the sagittal direction of the dry projection optical system according to Example 3.
- FIG. 30 is a lateral aberration diagram showing lateral aberrations of the liquid immersion type projection optical system according to Example 3 in the tangential direction and the sagittal direction.
- FIG. 31 is a flowchart of a method for obtaining a semiconductor device as a micro device.
- FIG. 32 is a flowchart of a method for obtaining a liquid crystal display element as a micro device.
- FIG. 1 is a diagram schematically showing a main configuration of an image side of a dry-type imaging optical system and a spherical aberration diagram.
- the dry imaging optical system shown in FIG. 1 has, in order from the image plane I side, a refractive index different from that of the parallel plane gas layer 1, the parallel plane plate 2, the parallel plane gas layer 3, and the parallel plane plate 2.
- a plano-convex lens 4 having a flat surface facing the image plane I and a convex surface A facing the object plane.
- the spherical aberration is corrected well.
- the vertical axis represents the image-side numerical aperture NA.
- FIG. 2 is a diagram schematically showing a configuration of a main part on the image side and a spherical aberration diagram when the dry imaging optical system shown in FIG. 1 is simply switched to an immersion type.
- the optical system shown in FIG. 2 is an immersion type imaging optical system obtained by filling the optical path between the image plane I of the dry type imaging optical system shown in FIG. 1 and the parallel plane plate 2 with the immersion liquid. is there. Therefore, the immersion imaging optical system shown in FIG. 2 includes, in order from the image plane I side, a parallel plane immersion layer 5, a parallel plane plate 2, a parallel plane gas layer 3, and a plano-convex lens 4. Contains.
- the focal position shifts, and spherical aberration occurs at the shifted focal position.
- FIG. 3 shows a plane parallel plate and a parallel plate when the dry imaging optical system shown in FIG. 1 is switched to an immersion type.
- FIG. 4 is a diagram schematically showing a configuration of a main part on the image side and a spherical aberration diagram when the thickness of a gas layer and a gas layer are changed.
- the parallel plane plate 2 of the dry imaging optical system shown in FIG. 1 is replaced with a parallel plane plate 2a having a different thickness, and the optical path between the image plane I and the parallel plane plate 2a is changed.
- This is an immersion type imaging optical system obtained by filling with an immersion liquid.
- the liquid immersion type imaging optical system shown in FIG. 3 includes, in order from the image plane I side, a parallel plane immersion layer 5, a parallel plane plate 2a, a parallel plane gas layer 3a, and a plano-convex lens. Contains 4. In this case, since only the thicknesses of the parallel plane plate 2a and the parallel plane gas layer 3a are adjusted, the positional shift of the focal position does not occur, but the spherical aberration cannot be satisfactorily corrected. Some spherical aberration remains.
- FIG. 4 shows an image-side essential portion configuration and a spherical surface when the thicknesses of the parallel plane plate, the gas layer, and the plano-convex lens are changed when the dry imaging optical system shown in FIG. 1 is switched to the liquid immersion type. It is a figure which shows an aberration figure schematically.
- the optical system shown in FIG. 4 replaces the plane-parallel plate 2 and plano-convex lens 4 of the dry imaging optical system shown in FIG. 1 with a plane-parallel plate 2b and plano-convex lens 4a having different thicknesses, respectively.
- This is an immersion type imaging optical system obtained by filling the optical path between I and the parallel plane plate 2b with immersion liquid.
- the liquid immersion type imaging optical system shown in FIG. 4 includes, in order from the image plane I side, a parallel-plane immersion layer 5, a parallel-plane plate 2b, a parallel-plane gas layer 3b, and a plano-convex lens. Contains 4a.
- a parallel-plane immersion layer 5 a parallel-plane plate 2b, a parallel-plane gas layer 3b, and a plano-convex lens.
- FIG. 5 is a view schematically showing a configuration of an image side main part of an optical system optically equivalent to the liquid immersion type imaging optical system shown in FIG.
- the plano-convex lens 4a in the immersion imaging optical system shown in FIG. 4 is divided into a plano-convex lens 4b and a plane-parallel plate 4c, and the gas layer 3b is divided into two parallel planes. Gas layer 3c and 3d. Therefore, the immersion type imaging optical system shown in FIG. 5 has, in order from the image plane I side, a parallel plane immersion layer 5, a parallel plane plate 4c, a parallel plane gas layer 3c, a parallel plane plate 2b, and a parallel plane plate. It includes a planar gas layer 3d and a plano-convex lens 4b.
- plano-convex lens 4b and the parallel plane plate 4c are formed of the same optical material.
- the plane-parallel plate 2b is made of an optical material having a different refractive index from the plano-convex lens 4b and the plane-parallel plate 4c.
- the plano-convex lens 4a is divided into a plano-convex lens 4b and a parallel plane plate 4c, but the combined thickness is the same as in FIG. This is the same as the liquid immersion type imaging optical system shown in FIG.
- the optical system of FIG. 4 is an immersion type imaging optical system having the immersion liquid layer 5 (image side medium layer) in contact with the image plane I, and is closest to the image plane I.
- the parallel plane plate 2b (first optical member) and the parallel plane plate 2b (first optical member) are arranged between the optical surface having the predetermined refractive power, that is, the convex surface A of the plano-convex lens 4a and the immersion layer 5 in order from the immersion layer 5 side. It has a planar gas layer 3b and a plano-convex lens 4a (second optical member).
- the plane-parallel plate 2b is a first medium layer made of a first optical material (solid) as a first medium
- the gas layer 3b is a second medium having a refractive index different from that of the first medium.
- the plano-convex lens 4a is a third medium layer made of a second optical material (solid) as a third medium having a different refractive index from the first medium and the second medium. .
- the thickness of the parallel plane plate 2b as the first medium layer along the optical axis, the thickness of the gas layer 3b as the second medium layer along the optical axis, and the third medium layer By changing (adjusting) the thickness of the plano-convex lens 4a along the optical axis, the refractive index of the medium between the imaging optical system and the image plane I is changed.
- the spherical aberration generated in the imaging optical system can be corrected without affecting other aberrations of the imaging optical system.
- the parallel plane plate 2b and the plano-convex lens 4a are replaced with the parallel plane plate and the plano-convex lens having appropriate thicknesses.
- the parallel plane plate 2b and the plano-convex lens 4a are replaced with the parallel plane plate and the plano-convex lens having appropriate thicknesses.
- the interface between the parallel plane plate 2b as the medium layer and the gas layer 3b as the second medium layer and the interface between the gas layer 3b as the second medium layer and the plano-convex lens 4a as the third medium layer are respectively It is formed flat.
- other embodiments are possible, without being limited to this. That is, according to another aspect of the present invention, four medium layers having different refractive indices are provided between the optical surface A having a predetermined refractive power and the image surface I disposed closest to the image surface I.
- the present invention can be applied to an image forming optical system having an extremely small curvature at a boundary surface between two arbitrary medium layers adjacent to each other among the four medium layers.
- R is the radius of curvature of the boundary surface between any two adjacent medium layers of the four medium layers
- Ym is the maximum image height of the imaging optical system
- the optical system has a predetermined refractive power.
- Rp the radius of curvature of the optical surface A
- four medium layers having different refractive indices correspond to the immersion layer 5, the parallel plane plate 2b, the gas layer 3b, and the plano-convex lens 4a.
- the planar optical surface of the plane-parallel plate 2b or the plano-convex lens 4a may be an optical surface having a small curvature that satisfies the conditional expression 1.
- the spherical aberration is changed without affecting other aberrations of the imaging optical system by changing the thickness along the optical axis. Can be corrected.
- a lens a plano-convex lens 4a in FIG. 4 and an image plane (object plane) I which are arranged closest to the image plane (or object plane) I
- An image forming optical system having at least three medium layers (in FIG. 4, an immersion layer 5, a parallel plane plate 2b, and a gas layer 3b) having different refractive indices between at least three medium layers.
- Each of the layers has no refractive power, and all interfaces in at least three medium layers are suitable for optical systems that are formed in a planar shape.
- the invention can be applied.
- at least three medium layers at least one of the thickness and the refractive index along the optical axis is changed to reduce spherical aberration without affecting other aberrations of the imaging optical system. Can be corrected.
- the refractive index difference between two arbitrary media having different refractive indexes is 0.01 or more.
- the imaging optical system is almost telecentric on the image plane side.
- FIG. 6 is a diagram schematically showing a configuration of an exposure apparatus provided with an imaging optical system according to the first embodiment of the present invention.
- the present invention is applied to the projection optical system PL of the exposure apparatus.
- the Z axis is parallel to the optical axis AX of the projection optical system PL
- the Y axis is parallel to the plane of FIG. 6 in the plane perpendicular to the optical axis AX
- the X axis is perpendicular to the plane of FIG.
- Each is set.
- the illustrated exposure apparatus includes an ArF excimer laser light source (oscillation center wavelengths 193 and 306 nm) as the light source 100 for supplying illumination light in the ultraviolet region.
- the light emitted from the light source 100 uniformly illuminates the reticle R on which the predetermined pattern is formed, via the illumination optical system IL.
- the optical path between the light source 100 and the illumination optical system IL is sealed by a casing (not shown).
- the space from the light source 100 to the optical member closest to the reticle in the illumination optical system IL absorbs the exposure light.
- the gas is replaced by an inert gas such as helium gas or nitrogen, which is a gas with a low rate, or it is replaced by an inert gas, or is maintained under a substantially vacuum state.
- Reticle R is held in parallel with XY plane on reticle stage RS via reticle holder RH.
- a pattern to be transferred is formed on the reticle R, and a rectangular (slit-shaped) pattern region having a long side along the X direction and a short side along the Y direction in the entire pattern region. Is illuminated.
- the reticle stage RS can be moved two-dimensionally along the reticle plane (that is, the XY plane) by the action of a drive system (not shown), and its position coordinates are determined by an interferometer RIF using a reticle moving mirror RM. It is configured to be measured and position controlled.
- the light from the pattern formed on reticle R forms a reticle pattern image on wafer W, which is a photosensitive substrate, via projection optical system PL.
- the wafer W is held on the wafer stage WS in parallel with the XY plane via a wafer table (wafer holder) WT.
- a rectangular stationary exposure having a long side along the X direction and a short side along the Y direction on the wafer W so as to optically correspond to a rectangular illumination area on the reticle R.
- a pattern image is formed in the area (that is, the effective exposure area).
- the wafer stage WS can be moved two-dimensionally along the wafer surface (ie, the XY plane) by the action of a drive system (not shown), and its position coordinates are determined by using a wafer moving mirror WM.
- the meter is configured to be measured and position controlled by the WIF.
- the optical member (specifically, lens L1) disposed closest to the reticle and the optical member (specifically, lens L1) disposed closest to the wafer specifically, Is configured so that the inside of the projection optical system PL is kept airtight with the parallel plane plate P3 or P2a), and the gas inside the projection optical system PL is replaced with nitrogen.
- the force S on which the reticle R and the reticle stage RS are arranged, the reticle R and the reticle stage RS, and the like are hermetically enclosed.
- a casing (not shown) is filled with nitrogen.
- the wafer W and the wafer stage WS are arranged.
- a casing (not shown) that hermetically surrounds the wafer W and the wafer stage WS is provided. ) Is filled with nitrogen.
- an atmosphere is formed over the entire optical path from the light source 100 to the wafer W so that the exposure light is hardly absorbed.
- the illumination area on reticle R and the effective exposure area on wafer W defined by projection optical system PL are rectangular with short sides along the Y direction. Therefore, while controlling the position of the reticle R and the wafer W using a drive system and interferometers (RIF, WIF), etc., the rectangular exposure area and the illumination area are short-sided in the Y direction.
- the effective The reticle pattern is scanned and exposed to a shot area having a width equal to the long side of the exposure area and a length corresponding to the scanning amount (movement amount) of the wafer w.
- FIG. 7 is a diagram schematically showing a lens configuration of a projection optical system according to the present embodiment set to an immersion type.
- FIG. 8 is a view schematically showing a configuration of a main part on the image side of the liquid immersion type projection optical system shown in FIG.
- the immersion projection optical system according to the present embodiment includes, in order from the reticle side, a parallel flat plate P1, a plano-concave lens L1 having an aspherical concave surface facing the wafer side, and a reticle.
- Negative meniscus lens L2 with a concave surface facing the reticle side
- positive meniscus lens L3 with an aspherical concave surface facing the reticle side
- positive meniscus lens L4 with a concave surface facing the reticle side
- a flat surface with the flat surface facing the reticle side.
- the optical path between the parallel plane plate P3 and the wafer W is filled with an immersion liquid made of pure water.
- the height of the aspheric surface in the direction perpendicular to the optical axis is y
- the distance along the optical axis from the tangent plane at the vertex of the aspheric surface to a position on the aspheric surface at height y (Sag amount) is z
- the vertex radius of curvature is r
- the cone coefficient is ⁇ :
- the nth order aspherical coefficient is C.
- n it is represented by the following equation (a).
- equation (a) an asterisk is marked on the right side of the surface number for a lens surface formed in an aspherical shape.
- z (yVr) / + (l + ⁇ ) ⁇ y 2 / r 2 ⁇ 1/2]
- the optical members (lens components and the plane-parallel plate) constituting the immersion projection optical system are formed of quartz (Si ⁇ ) or fluorite (CaF 2). concrete
- a positive meniscus lens L24, a plano-convex lens L25, and a plane-parallel plate P3 are formed of fluorite, and other optical members are formed of quartz.
- the center wavelength of oscillation of the ArF excimer laser beam, which is the exposure light, is 193.306 nm.
- the refractive index of quartz (relative refractive index to nitrogen) with respect to this center wavelength is 1.5603261.
- the index (relative refractive index to nitrogen) is 1.50154848.
- pure water having a refractive index of 1.43664 (relative refractive index to nitrogen) with respect to exposure light is used as an immersion liquid interposed between the parallel plane plate P3 and the wafer W.
- Table (1) lists values of specifications of the immersion type projection optical system that is effective in the present embodiment.
- e is the center wavelength of the exposure light
- ⁇ is the projection magnification
- ⁇ is the number of apertures on the image side (wafer side)
- Ym is the maximum image height
- LX is along the X direction of the effective exposure area.
- LY represents the dimension along the Y direction (dimension on the short side) of the effective exposure area.
- the surface number is the order of the surface from the reticle side
- r is the radius of curvature of each surface (vertical radius of curvature: mm for an aspheric surface)
- d is the axial spacing of each surface, that is, the surface spacing (mm).
- a parallel plane pure water layer having a thickness of 1. Omm and a fluorite are arranged in order from the wafer W side. 20.
- Omm parallel plane nitrogen layer (gas layer), quartz formed 5.3034 mm parallel plane plate P2, thickness 1.4973 mm And a 19.7001 mm thick plano-convex lens L25 formed by fluorite.
- a dry projection optical system is obtained by replacing the plano-convex lens L25 and the parallel plane plate P3 of the immersion type projection optical system with a plano-convex lens L25a and replacing the parallel plane plate P2 with a parallel plane plate P2a.
- FIG. 9 is a diagram corresponding to FIG. 8, and is a diagram schematically illustrating a configuration of a main part on the image side of the dry projection optical system according to the present embodiment. Comparing Fig. 8 and Fig. 9, cutting from immersion type to dry type At the time of replacement, a plano-convex lens L25 with a thickness of 19.7001 mm formed of fluorite and a parallel flat plate P3 with a thickness of 20. Changed to 995mm plano-convex lens L25a. Also, the 5.3034 mm-thick parallel flat plate P2 formed of quartz is changed to a 4. Omm-thick parallel flat plate P2a also formed of quartz.
- the configuration from the reticle R to the convex surface on the reticle side of the plano-convex lens L25 or L25a is common to the liquid immersion type and the dry type.
- Table (2) lists the values of the specifications of the dry projection optical system that is effective in the present embodiment. However, in Table (2), the display of common parts with the immersion projection optical system is omitted.
- FIG. 10 is a diagram showing lateral aberration in the liquid immersion type projection optical system of the present embodiment.
- FIG. 11 is a diagram showing lateral aberrations in the dry projection optical system according to the present embodiment.
- Y indicates the image height.
- various aberrations including spherical aberration are favorably corrected in both the immersion type and the dry type, and when switching from the immersion type to the dry type, the spherical shape is used. It can be seen that the fluctuation of various aberrations including aberration is small.
- switching from the dry type to the liquid immersion type is also possible in the same manner as the force which explains the present invention by taking the example of switching from the liquid immersion type to the dry type. That is, by changing the plano-convex lens L25a to the plano-convex lens L25 and the parallel plane plate P3 and changing the parallel plane plate P2a to the parallel plane plate P2, it is possible to switch from the dry type to the liquid immersion type. it can.
- the projection optical system PL is almost telecentric on both the reticle side and the wafer side, both in the immersion type and in the dry type.
- the plano-convex lens L25a is replaced with the plano-convex lens L25 and the parallel plane plate P3, and the parallel plane plate P2a and the parallel plane plate P2
- the exposure apparatus of the present embodiment uses the projection optical system PL that can be switched between the dry type and the liquid immersion type without substantially deteriorating the aberration state, and achieves high resolution as needed. Good exposure can be performed.
- the dry projection optical system shown in Table (2) is manufactured (Step 101).
- JP-A-2002-258131 and corresponding European Patent Publication No. 1359608 can be referred to.
- plano-convex lens L25a and the parallel plane plate P2a in the dry projection optical system are removed from the dry projection optical system, and the plano-convex lens L25, the parallel plane plate P3, and the parallel plane plate P2 are projected instead. Incorporate into optical system (step 102).
- the aberration of the projection optical system in which the plano-convex lens L25, the parallel plane plate P3, and the parallel plane plate P2 are incorporated is measured by using the wavefront aberration measuring apparatus shown in FIG. 13 (Step 103).
- FIG. 13 is a diagram schematically showing the configuration of a Fizeau interferometer type wavefront aberration measuring device for measuring the wavefront aberration of projection optical system PL.
- a laser beam having substantially the same wavelength as the exposure light is incident on a projection optical system PL as a test optical system via a half prism 60 and a Fizeau surface 61a of a Fizeau lens 61.
- the light reflected by the Fizeau surface 61a becomes so-called reference light, and reaches the image sensor 62 such as a CCD via the Fizeau lens 61 and the half prism 60.
- the light transmitted through the Fizeau surface 61 a becomes so-called measurement light, is emitted through the projection optical system 6, passes through the correction glass 64, and enters the reflective spherical surface 63.
- the correction glass 64 is formed of an optical material such as synthetic quartz or fluorite having a high transmittance with respect to the wavelength of the measurement light.
- the correction glass 64 is formed in a parallel plate shape for the following two reasons. First, even if the correction glass 64 is arranged in a laterally shifted state in the plane orthogonal to the optical axis of the projection optical system, the amount of aberration generated in the correction glass 64 does not change due to the amount of lateral shift of the correction glass 64. It is. Second, the arrangement along the optical axis This is because the aberration generated in the correction glass 64 does not change depending on the position.
- the substrate to be exposed is separated from the projection optical system by an interval of about several mm, and Exposure transfer is performed in a state where the liquid is supplied to the substrate.
- the liquid is pure water
- the refractive index of pure water and the refractive index of the correction glass 64 formed of fluorite are substantially the same for light having a wavelength of 193 nm.
- the thickness of the correction glass 64 is about several millimeters, and is optimized in consideration of the difference between the refractive index of the correction glass 64 and the refractive index of the liquid.
- the position of the correction glass 64 is not limited as long as it is between the projection optical system PL and the reflection member 63. However, on the image plane of the projection optical system PL, there is a possibility that the optical intensity of the measurement light is increased and the correction glass 64 may be optically damaged. Is preferably arranged.
- the measurement light reflected by the reflection spherical surface 63 reaches the CCD 62 via the correction glass 64, the projection optical system PL, the Fizenz lens 61, and the half prism 60. In this way, the wavefront aberration remaining in the projection optical system PL is measured based on the interference between the reference light and the measurement light.
- the aberration can be generated by the correction glass 64 to measure the aberration state in the liquid immersion state.
- step 104 based on the measurement result of the wavefront aberration obtained in step 103, the position of a part of the lens in the projection optical system in the optical axis direction, the attitude with respect to the optical axis, or the position of the mask in the optical axis direction is determined. Then, the aberration of the projection optical system PL is adjusted (step 104). By repeating these operations of steps 103 and 104 until the aberration of the projection optical system is corrected, it is possible to manufacture a projection optical system in which the aberration is corrected in the immersion state.
- FIG. 14 is a diagram illustrating a lens configuration of a projection optical system according to a second embodiment of the present invention.
- the projection optical system PL1 includes a plurality of optical elements L1 and L24, and the mask Ml located on the first surface is exposed using exposure light having a wavelength of 200 nm to 300 nm. A turn image is formed on the wafer W1 located on the second surface.
- the projection optical system PL1 is configured so that the image side (that is, the wafer W1 side) is telecentric.
- the projection optical system PL1 includes a parallel plane plate Ll, a negative meniscus lens L2 having an aspherical concave surface facing the image side, and an image in the order in which the exposure light passes from the object side (ie, the mask Ml side).
- the lenses L1 and L23 are formed of quartz glass (synthetic quartz) as a first glass material, and the lens L24 is formed of fluorite as a second glass material having a lower refractive index than the first glass material. ing. That is, 80% or more of the optical elements constituting the projection optical system PL1 are formed of quartz glass, and at least one of the optical elements constituting the projection optical system PL1 is fluorescent. It is formed by stone. It is sufficient that the refractive power of the image-side surface of the plane-parallel plate L23 disposed near the wafer W1 is 0, and the refractive power of the image-side surface of the plane-parallel plate L23 is almost 0.
- FIG. 15 (a) shows a positive meniscus lens L22, a parallel plane plate L23, a parallel plane plate L24 and a positive meniscus lens L22 included in a dry projection optical system PL1 in which gas is interposed between the parallel plane plate L24 and the wafer W1.
- FIG. 3 is a view showing a schematic configuration of a wafer W1. In the dry projection optical system P L1 shown in FIG. 15A, the spherical aberration is satisfactorily corrected.
- FIG. 15 (b) shows that the liquid (medium) E1 having a refractive index of 1.1 or more is interposed in the optical path between the plane-parallel plate L23 and the wafer W1 by retracting the plane-parallel plate L24.
- FIG. 3 is a diagram showing a schematic configuration of a positive meniscus lens L22, a parallel plane plate L23, and a wafer Wl included in an immersion type projection optical system PL1.
- the immersion type projection optical system PL1 shown in Fig. 15 (b) the distance between the positive meniscus lens L22 and the parallel plane plate L23 and the thickness of the parallel plane plate L23 are increased compared to the case of the dry type. I have.
- the thickness of the parallel plane plate L24 is set to 0 by retracting the parallel plane plate L24 from the optical path of the exposure light. That is, the thickness of the parallel plane plate L24 is reduced as compared with the case of the dry mold.
- the spherical aberration is favorably corrected by adjusting the distance between the positive meniscus lens L22 and the parallel plane plate L23 and the thickness of the parallel plane plate L23.
- the optical characteristics of the dry projection optical system PL1 shown in FIG. 15A and the optical characteristics of the liquid immersion projection optical system PL1 shown in FIG. 15B are maintained substantially the same.
- the thickness of the plane parallel plate L23 is increased and the thickness of the plane parallel plate L24 is reduced (in this embodiment, the plane By retracting the face plate L24, the thickness of the parallel flat plate L24 is reduced to 0), and by adjusting the distance between the parallel flat plate L23 and the parallel flat plate L24, the distance between the projection optical system PL1 and the wafer W1 is reduced.
- Even when gas is switched to liquid it is possible to maintain the optical characteristics of the projection optical system PL1 almost the same before and after the switching without deteriorating the spherical aberration of the projection optical system PL1.
- the depth of focus and the resolution can be improved.
- the projection optical system P L1 according to this embodiment when used for an exposure apparatus, the reflectance of the resist can be reduced. Further, when the projection optical system PL1 switched to the dry type is used for the exposure apparatus, exposure can be performed with a high throughput.
- a plane-parallel plate L23 is provided as the first optical element.
- a lens having a refractive power on the side of the wafer Wl of approximately 0 may be provided as the first optical element.
- a parallel plane plate L23 formed of quartz glass as a first optical element and a parallel plane plate L24 formed of fluorite as a second optical element are provided.
- a first optical element formed of stone and a second optical element formed of quartz glass may be provided.
- the liquid immersion type projection optical system PL1 shown in FIG. 15 (b) can be replaced with a dry type projection optical system PL1 shown in FIG. 15 (a).
- the parallel plane plate (plane plate) L24 is inserted closest to or near the wafer W1, and gas is interposed between the parallel plane plate L24 and the wafer W1. Further, the thickness of the parallel flat plate L23 is reduced, and the distance between the parallel flat plate L23 and the parallel flat plate L24 is adjusted. In this case, too, by reducing the thickness of the parallel flat plate L23 and adjusting the distance between the parallel flat plate L23 and the parallel flat plate L24, the optics before and after the exchange from the immersion type to the dry type projection optical system can be obtained. The characteristics can be kept almost the same.
- FIG. 16 is a diagram illustrating a lens configuration of a projection optical system according to a third embodiment of the present invention.
- the projection optical system PL2 includes a plurality of optical elements L31 to L57, and uses the exposure light having a wavelength of 200 nm to 300 nm to form a pattern image of the mask M2 located on the first surface. It is formed on the wafer W2 located on the second surface.
- the projection optical system PL2 is configured so that the image side (that is, the wafer W2 side) is telecentric.
- the projection optical system PL2 that works in the third embodiment includes a plane-parallel plate L31 and an aspherical concave surface formed on the image side in the order in which light rays pass from the object side (ie, the mask M2 side).
- Bi-concave lens L32 positive meniscus lens L33 with a convex surface facing the object side
- negative meniscus lens L34 with a concave surface facing the object side
- positive meniscus lens L35 with a concave surface facing the object side
- bi-convex lens L36 object Positive meniscus lens L37 with convex surface facing the positive side
- positive meniscus lens L38 with convex surface facing the object side
- positive meniscus lens L39 with convex surface facing the object side
- negative meniscus lens L40 with convex surface facing the object side
- object side The negative meniscus lens L41 with the convex surface formed as an aspheric surface on the side
- the biconcave lens L42 with the concave surface formed as an asp
- the lenses L31, L53 and L57 are formed of quartz glass (synthetic quartz) as the first glass material, and the lenses L54 and L56 are formed of fluorite as the second glass material having a lower refractive index than the first glass material.
- 80% or more of the plurality of optical elements constituting the projection optical system PL2 are formed of quartz glass, and at least one of the plurality of optical elements constituting the projection optical system PL2 is fluorescent. It is formed by stone.
- the refractive power of the image-side surface of the parallel plane plate L56 disposed near the wafer W2 is 0, but the refractive power of the image-side surface of the parallel plane plate L56 may be almost 0. .
- the refractive power of the parallel plane plate L57 disposed closest to the wafer W2 is 0.
- the refractive power of the parallel plane plate L57 may be almost 0.
- FIG. 17 (a) shows a plano-convex lens L55, a parallel flat plate L56, a parallel flat plate L57, and a ⁇ included in a dry projection optical system PL2 in which gas is interposed between the parallel flat plate L57 and the wafer W2. It is a figure which shows the schematic structure of wafer W2. In the dry projection optical system PL2 shown in FIG. 17A, the spherical aberration is well corrected.
- FIG. 17 (b) shows a liquid immersion type projection optical system PL2 in which a liquid (medium) E2 having a refractive index of 1.1 or more is interposed in the optical path between the parallel plane plate L57 and the wafer W2.
- FIG. 4 is a diagram showing a schematic configuration of a plano-convex lens L55, a parallel plane plate L56, a parallel plane plate L57, and a wafer W2 included in the present embodiment.
- the thickness of the parallel plane plate L56 is reduced as compared with the case of the dry type.
- the thickness of the parallel plane plate L57 is increased compared to the case of the dry type.
- the thickness of the parallel flat plate L56 is reduced and the thickness of the The difference is well corrected. That is, the optical characteristics of the dry projection optical system PL2 shown in FIG. 17A and the optical characteristics of the liquid immersion projection optical system PL2 shown in FIG. 17B are maintained substantially the same.
- the thickness of the parallel plane plate L56 is reduced and the thickness of the parallel plane plate L57 is increased, so that the projection optical system PL2 and the wafer Even when the medium is switched between W2 and W2, the optical characteristics of the projection optical system PL2 before and after the switching can be maintained substantially the same without deteriorating the spherical aberration of the projection optical system PL2.
- the depth of focus and the resolution can be improved.
- the reflectance of the resist can be reduced.
- the projection optical system PL2 switched to the dry type is used for the exposure apparatus, exposure can be performed with high throughput.
- the optical element disposed closest to the wafer W2 is the plane-parallel plate L57 made of quartz glass. Even when the projection optical system PL2 is replaced with an immersion type projection optical system PL, the parallel flat plate L57 can be prevented from being eroded by the liquid E2.
- the plane-parallel plate L56 is provided as the first optical element, but a lens having a refractive power on the wafer W2 side of substantially zero is provided as the first optical element. It may be.
- the projection optical system PL2 includes a parallel flat plate L56 formed of fluorite as the first optical element and a parallel flat plate L57 formed of quartz glass as the second optical element. And a second optical element formed of fluorite.
- the immersion type projection optical system PL2 shown in Fig. 17 (b) can be replaced with a dry type projection optical system PL2 shown in Fig. 17 (a).
- the thickness of the parallel flat plate L56 is increased, the thickness of the parallel flat plate L57 is reduced, and gas is interposed between the parallel flat plate L57 and the wafer W2.
- the optical characteristics before and after the exchange from the immersion type to the dry type projection optical system are almost the same. Can be maintained.
- a projection optical system PL3 according to the fourth embodiment includes a plurality of optical elements L61 to L86, and uses a pattern image of a mask M3 located on the first surface using exposure light having a wavelength of 200 nm to 300 nm. Is formed on the wafer W3 located on the second surface.
- the projection optical system PL3 is configured so that the image side (ie, the wafer W3 side) is telecentric.
- the projection optical system PL3 which works in the fourth embodiment, includes a plane-parallel plate L61 and an aspherical concave surface formed on the image side in the order that light beams pass from the object side (ie, the mask M3 side).
- Bi-concave lens L62 positive meniscus lens L63 with a convex surface facing the object side
- negative meniscus lens L64 with a concave surface facing the object side
- positive meniscus lens L65 with a concave surface facing the object side
- bi-convex lens L66 object Positive meniscus lens L67 with a convex surface facing the object side
- positive meniscus lens L68 with a convex surface facing the object side
- positive meniscus lens L69 with a convex surface facing the object side
- negative meniscus lens L70 with a convex surface facing the object side
- a negative meniscus lens L71 with the convex surface formed as an aspheric surface facing the lens
- a biconcave lens L72 with a conca
- the lens L61 and the lens L85 are formed of quartz glass (synthetic quartz) as the first glass material, and the lens L86 is formed of fluorite as the second glass material having a lower refractive index than the first glass material.
- I have. That is, 80% or more of the plurality of optical elements constituting the projection optical system PL3 are formed of quartz glass, and at least one of the plurality of optical elements constituting the projection optical system PL3 is fluorescent. It is formed by stone.
- the refractive power of the image-side surface of the placed plano-convex lens L85 is 0.
- the refractive power of the image-side surface of the plano-convex lens L85 may be almost 0.
- the refractive power of the parallel plane plate L86 disposed closest to the wafer W3 is 0.
- the refractive power of the parallel plane plate L86 may be almost 0.
- FIG. 19 (a) shows a schematic configuration of a plano-convex lens L85, a parallel plane plate L86, and a wafer W3 included in a dry projection optical system PL3 in which gas is interposed between a parallel plane plate L86 and a wafer W3.
- FIG. 19A the dry projection optical system PL3 shown in FIG. 19A, the spherical aberration is well corrected.
- FIG. 19 (b) shows a case where the parallel plane plate L86 formed of fluorite is replaced with a parallel plane plate L86 'formed of quartz glass, and the optical path between the parallel plane plate L86' and the wafer W3 is changed.
- FIG. 13 is a diagram showing a schematic configuration of a plano-convex lens L85, a parallel plane plate L86 ′, and a wafer W3 included in a liquid immersion type projection optical system PL3 in which a liquid (medium) E3 having a refractive index of 1.1 or more is interposed.
- a liquid (medium) E3 having a refractive index of 1.1 or more is interposed.
- the thickness of the parallel plane plate L86 ′ is reduced as compared with the parallel plane plate L86 provided in the dry projection optical system PL3.
- the distance between the plano-convex lens L85 and the plane-parallel plate L86 ' is increased compared to the distance between the plano-convex lens L85 and the plane-parallel plate L86 of the dry projection optical system PL3.
- the thickness of the parallel plane plate L86 ′ is increased, and the distance between the plano-convex lens L85 and the parallel plane plate L86 ′ is adjusted. Spherical aberration is well corrected. That is, the optical characteristics of the dry projection optical system PL3 shown in FIG. 19 (a) and the optical characteristics of the liquid immersion projection optical system PL3 shown in FIG. 19 (b) are maintained substantially the same.
- the parallel flat plate L86 formed of fluorite is replaced with a parallel flat plate L86 'formed of quartz glass, and the plano-convex lens L85 is replaced.
- the gas between the projection optical system PL3 and the wafer W3 is switched to liquid by adjusting the distance between the projection optical system PL3 and the wafer W3, the projection before and after the switching is performed without worsening the spherical aberration of the projection optical system PL3.
- the ability to maintain the optical characteristics of the optical system PL3 almost the same.
- the depth of focus and the resolution can be improved.
- the projection optical system P When L3 is used for the exposure apparatus, the reflectance of the resist can be reduced. Further, when the projection optical system PL3 switched to the dry type is used for the exposure apparatus, exposure can be performed with a high throughput.
- the projection optical system PL3 of the fourth embodiment when the projection optical system PL3 is replaced with an immersion projection optical system PL3, the projection optical system PL3 is formed by the fluorite most disposed on the wafer W3 side. Since the parallel flat plate L86 'is replaced with the parallel flat plate L86' formed of quartz glass, the parallel flat plate L86 'can be prevented from being eroded by the liquid E3.
- a plano-convex lens L85 is provided as the first optical element.
- an optical element whose refractive power on the wafer W3 side is almost zero, for example, A parallel plane plate may be provided.
- the dry projection optical system PL3 includes a plano-convex lens L85 formed of quartz glass as the first optical element and a parallel flat plate L86 formed of fluorite as the second optical element.
- a first optical element made of stone and a second optical element made of quartz glass may be provided.
- the first optical element constituted by the lens or the parallel plane plate having the refractive power on the second surface side of substantially 0 is used.
- the optical characteristics of the projection optical system before and after the switching can be maintained substantially the same. Further, when the optical element formed of the second glass material having a lower refractive index than the first glass material is arranged at a position where the energy of the exposure light is concentrated, damage to the optical element due to strong energy and the projection optical system It is possible to prevent the optical characteristics from being deteriorated.
- the second optical element is formed of the second glass material having a lower refractive index than that of the first glass material. Even when switching between the optical element disposed on the surface and the second surface with a gaseous liquid, by increasing the thickness of the first optical element and decreasing the thickness of the second optical element, Before switching The optical characteristics of the later projection optical system can be kept substantially the same. Further, when the second optical element is arranged at a position where the energy of the exposure light is concentrated, it is possible to prevent the damage of the second optical element and the deterioration of the optical characteristics of the projection optical system due to the strong energy.
- the second modification is performed by increasing the thickness of the first optical element and decreasing the thickness of the second optical element.
- the optical characteristics after the medium having a refractive index of 1.1 or more in the optical path between the optical element and the second surface can be maintained almost the same as the optical characteristics before the medium.
- the projection optical systems according to the second to fourth embodiments include the boundary lens formed of the first glass material whose refractive power on the second surface side is almost 0, and A flat plate made of a second glass material having a refractive index lower than that of the first glass material, which is substantially zero, is inserted near the second surface. Therefore, even when the liquid interposed in the optical path between the boundary lens and the second surface is exchanged for a gas, the thickness of the boundary lens and the distance between the boundary lens and the inserted flat plate are adjusted. By the modification, the optical characteristics of the projection optical system before and after the exchange of the liquid and the gas can be maintained substantially the same.
- the projection optical systems according to the second to fourth embodiments have a plurality of optical elements, and 80% or more of the plurality of optical elements are formed of the first glass material. And at least one optical element formed of a second glass material having a lower refractive index than the first glass material and having a refractive power on the second surface side of almost zero. Therefore, when the optical element made of the second glass material is placed at a position where the energy of the exposure light is concentrated, it is necessary to prevent damage to the optical element due to strong energy and deterioration of the optical characteristics of the projection optical system. I can do it.
- FIG. 20 is a flowchart illustrating a method of manufacturing a projection optical system according to the fifth embodiment.
- 80% or more of the plurality of optical elements constituting the projection optical system are formed of synthetic quartz (first glass material) (step S200).
- a plano-convex lens (first optical element) made of synthetic quartz and having a refracting power of 0 on the image plane (second plane) side is prepared (Step S201).
- the plano-convex lens prepared in step S201 has almost no refractive power. It should just be 0.
- the plano-convex lens prepared in step S201 is arranged near the image plane (step S202).
- a parallel flat plate (second optical element) made of fluorite (second glass material) having a lower refractive index than synthetic quartz and having a refractive power of 0 is prepared (step S203).
- the parallel plane plate prepared in step S203 only needs to have a refractive power of almost 0.
- the parallel flat plate prepared in step S203 is arranged closest to the image plane (step S204).
- FIG. 21 (a) shows a schematic configuration of the plano-convex lens L90 arranged in step S202 and the parallel plane plate L91 arranged in step S204 of the projection optical system manufactured in step S200 and step S204.
- FIG. 21A the plano-convex lens L90 is arranged near the image plane W, and the parallel plane plate L91 is arranged closest to the image plane W.
- the projection optical system manufactured in this embodiment uses exposure light having a wavelength of 200 nm and 300 nm, and the image plane W side is used. Then, an image of an object (not shown) (first surface) is formed on the image plane W under a telecentric light flux.
- the thickness of the plano-convex lens L90 arranged near the image plane W in step S202 is adjusted (step S205). Specifically, the adjustment is performed by increasing the thickness of the plano-convex lens.
- the thickness of the parallel plane plate L91 disposed closest to the image plane W is adjusted (step S206). Specifically, the adjustment is performed by reducing the thickness of the parallel plane plate L91.
- FIG. 21 (b) shows a plano-convex lens L90 of which thickness has been adjusted in step S205 and a thickness adjusted in step S207 of the projection optical system manufactured in steps S200 to S206. It is a figure showing the schematic structure of parallel plane plate L91 which was shown.
- a medium E10 such as pure water having a refractive index of 1.1 or more is interposed in the optical path between the parallel plane plate L91 and the image plane W
- a plano-convex lens By making an adjustment to increase the thickness of L90 and making an adjustment to reduce the thickness of the parallel plane plate L91 in step S206, the optical characteristics after the medium E10 are interposed are almost the same as the optical characteristics before the interposition. Can be maintained.
- the plano-convex lens L90 In a simple method of increasing the thickness of the parallel plane plate L91 and decreasing the thickness of the parallel plane plate L91, the optical characteristics after the medium E10 is interposed in the optical path between the parallel plane plate L91 and the image plane are interposed. It is possible to maintain almost the same optical characteristics as before. Further, the dry projection optical system can be easily replaced with an immersion projection optical system while maintaining the optical characteristics of the projection optical system.
- the plano-convex lens L90 is provided as the first optical element.
- a parallel plane plate may be prepared.
- the parallel plane plate L91 formed of fluorite contacts the medium E10.
- the parallel flat plate L91 disposed closest to the image plane W side in step S204 is retracted from the optical path of the exposure light. (Evacuation process).
- the thickness of the parallel flat plate L91 is reduced to zero by retracting the parallel flat plate L91.
- step S202 the thickness of the plano-convex lens L90 arranged near the image plane W is adjusted. Specifically, the adjustment is performed by increasing the thickness of the plano-convex lens.
- FIG. 22 is a view showing a schematic configuration of a plano-convex lens L90 in which the parallel plane plate L91 is retracted from the projection optical system manufactured in the steps S200 to S204 and the thickness is adjusted.
- a medium E10 such as pure water having a refractive index of 1.1 or more is interposed in the optical path between the plano-convex lens L90 and the image plane W
- the parallel plane plate L91 is retracted, and the plano-convex lens is removed.
- the optical characteristics after the medium E10 is interposed can be maintained substantially the same as the optical characteristics before the interposition.
- a projection optical system optimal for a dry mold is manufactured, pure water is placed between the projection optical system and the image plane while maintaining the optical characteristics of the dry mold.
- the optimal projection optical system for the immersion type using the medium E10, etc., but after manufacturing the optimal projection optical system for the immersion type, maintain the optical characteristics of the immersion type.
- a medium having a refractive index of 1.1 or more interposed between the projection optical system and the image plane may be exchanged for a gas to produce a projection optical system optimal for a dry mold.
- the manufactured immersion When the projection optical system of the mold has a parallel flat plate L91 formed of fluorite, the thickness of the plano-convex lens 90 formed of quartz glass is reduced, and the parallel flat plate L91 formed of fluorite is reduced. Make adjustments to increase the thickness.
- the manufactured immersion type projection optical system does not include the parallel flat plate L91 formed of fluorite, the parallel flat plate L91 formed of fluorite is prepared and inserted into the projection optical system. I do. Next, adjustment for reducing the thickness of the plano-convex lens 90 formed of quartz glass is performed.
- FIG. 23 is a flowchart showing a method of manufacturing a projection optical system according to the sixth embodiment.
- a plurality of optical elements all of which are made of synthetic quartz (first glass material), and uses exposure light with a wavelength of 200 nm and 300 nm, and a telecentric light flux on the image surface (second surface) side.
- step S300 when a liquid is interposed between the projection optical system and the image plane, the spherical aberration is satisfactorily corrected.
- a flat plate made of fluorite (second glass material) having a lower refractive index than synthetic quartz and having a refractive power of SO is prepared (step S 301).
- the flat plate prepared in step S301 should have almost zero refractive power.
- the flat plate prepared in step S301 is inserted near the image plane of the projection optical system prepared in step S300 (step S302).
- the thickness of the boundary lens provided in the projection optical system prepared in step S300 and disposed closest to the image plane is adjusted (step S303).
- the boundary lens is made of quartz glass, and the power S, which is the refractive power So of the image-side surface, and the refractive power of the image-side surface of the boundary lens should be almost zero.
- the adjustment of the thickness of the boundary lens in step S303 is specifically performed by reducing the thickness of the boundary lens.
- the distance between the plane plate and the boundary lens inserted in step S302 is adjusted (step S304).
- a flat plate is inserted in step S302, and adjustment for reducing the thickness of the boundary lens is performed in step S303.
- step S304 a simple method of adjusting the distance between the plane plate and the boundary lens in step S304 is used to interpose in the optical path between the boundary lens and the image plane in step S304. Even when the liquid is exchanged for a gas, the optical characteristics before and after the exchange can be maintained substantially the same. Further, the immersion type projection optical system can be easily replaced with a dry type projection optical system while maintaining the optical characteristics of the projection optical system.
- the thickness of the boundary lens is adjusted in step S302, and the distance between the plane plate and the boundary lens is adjusted in step S303.
- the thickness of the boundary lens may be adjusted by adjusting the distance from the lens. Alternatively, the adjustment of the thickness of the boundary lens and the adjustment of the distance between the flat plate and the boundary lens may be performed alternately.
- the thickness of the boundary lens provided in the liquid immersion type projection optical system is adjusted to exchange the dry type projection optical system.
- the projection optical system may be replaced with a dry projection optical system. That is, in step S301, a flat plate and a replacement boundary lens are prepared (replacement boundary lens preparation step).
- the replacement boundary lens is formed of quartz glass, and the refractive power of the surface on the image side is almost 0, which is smaller than the thickness of the boundary lens provided in the immersion type projection optical system.
- step S303 the boundary lens provided in the immersion type projection optical system is replaced with the replacement boundary lens prepared in the replacement boundary lens preparation step.
- the simplest method of adjusting the thicknesses of the first optical element and the second optical element is most effective.
- the optical characteristics after the interposition of a medium with a refractive index of 1.1 or more in the optical path between the second optical element and the second surface arranged on the two surfaces are maintained almost the same as the optical characteristics before the interposition can do.
- the second optical element made of the second glass material is arranged at a position where the energy of the exposure light is concentrated, damage to the optical element due to strong energy and deterioration of the optical characteristics of the manufactured projection optical system are prevented. Can be prevented.
- the thickness of the first optical element is increased and the thickness of the second optical element is reduced (second optical element). (Including retracting the element from the optical path of the exposure light to reduce the thickness of the second optical element to 0) Accordingly, the optical characteristics after the medium having a refractive index of 1.1 or more in the optical path between the second optical element and the second surface can be maintained substantially the same as the optical characteristics before the medium.
- the flat plate is inserted in the inserting step, and the thickness of the boundary lens is reduced in the thickness adjusting step.
- Adjustment and adjustment of the distance between the plane plate and the boundary lens in the distance adjustment step are performed by a simple method, before and after the liquid interposed in the optical path between the boundary lens and the second surface is exchanged with gas. Optical characteristics can be kept almost the same.
- FIG. 24 is a diagram showing a schematic configuration of a step-and-scan projection exposure apparatus according to a seventh embodiment of the present invention.
- an XYZ orthogonal coordinate system shown in FIG. 24 is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system.
- the XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the wafer W, and the Z axis is set in a direction orthogonal to the wafer W.
- the XY plane is actually set as a plane parallel to the horizontal plane, and the Z axis is set vertically upward.
- the projection exposure apparatus includes a KrF excimer laser light source as an exposure light source, as shown in FIG. 24, and includes an optical integrator (homogenizer), a field stop, a condenser lens, An illumination optical system 1 is provided.
- Exposure light (exposure beam) IL composed of ultraviolet pulse light having a wavelength of 248 nm emitted from the light source passes through the illumination optical system 1 and illuminates the pattern provided on the reticle (mask) R.
- the light passing through the reticle R is applied to the second embodiment, the projection optical system PL1, the third embodiment, and the projection optical system PL2, and the fourth embodiment is applied to the projection optical system PL2.
- the optical system PL3 is provided by the projection optical system manufactured by the method for manufacturing a projection optical system according to the fifth embodiment or the projection optical system manufactured by the method for manufacturing a projection optical system according to the sixth embodiment.
- the projection optical system PL Through the projection optical system PL, the exposure area on the wafer W coated with the photoresist is subjected to reduced projection exposure at a predetermined projection magnification (for example, 1/4, 1/5, etc.).
- Reticle R is held on reticle stage RST.
- a mechanism for finely moving the reticle R in the direction, the Y direction, and the rotation direction is incorporated.
- the position of the reticle stage RST in the X direction, the Y direction, and the rotation direction is measured and controlled in real time by a reticle laser interferometer (not shown).
- the wafer W is fixed on the Z stage 9 via a wafer holder (not shown).
- the Z stage 9 is fixed on an XY stage 10 that moves along an XY plane substantially parallel to the image plane of the projection optical system PL, and focuses on the wafer W (position in the Z direction) and Control the tilt angle.
- the position of the Z stage 9 in the X direction, the Y direction, and the rotation direction is measured and controlled in real time by a wafer laser interferometer 13 using a movable mirror 12 located on the Z stage 9.
- the XY stage 10 is mounted on a base 11, and controls the X direction, the Y direction, and the rotation direction of the wafer W.
- the main control system 14 provided in the projection exposure apparatus adjusts the positions of the reticle R in the X direction, the Y direction, and the rotation direction based on the measurement values measured by the reticle laser interferometer. That is, the main control system 14 transmits a control signal to a mechanism incorporated in the reticle stage RST, and adjusts the position of the reticle R by slightly moving the reticle stage RST.
- the main control system 14 adjusts the focus position (the position in the Z direction) of the wafer W by aligning the surface on the wafer W with the image plane of the projection optical system PL by the autofocus method and the autoleveling method. Adjust the tilt angle. That is, the main control system 14 transmits a control signal to the wafer stage drive system 15 and drives the Z stage 9 by the wafer stage drive system 15 to adjust the focus position and the tilt angle of the wafer W. Further, the main control system 14 adjusts the position of the wafer W in the X direction, the Y direction, and the rotation direction based on the measurement value measured by the wafer laser interferometer 13. That is, the main control system 14 transmits a control signal to the wafer stage drive system 15 and drives the XY stage 10 by the wafer stage drive system 15 to adjust the position of the wafer W in the X, Y, and rotation directions. Do
- the main control system 14 transmits a control signal to the mechanism incorporated in the reticle stage RST, and also transmits a control signal to the wafer stage drive system 15 to adjust the projection magnification of the projection optical system PL.
- Drive reticle stage RST and XY stage 10 at the appropriate speed ratio.
- the main control system 14 transmits a control signal to the wafer stage drive system 15 and drives the XY stage 10 by the wafer stage drive system 15 to move another shot area on the wafer W to the exposure position. In this way, the operation of scanning and exposing the pattern image of the reticle R onto the wafer W by the step-and-scan method is repeated.
- the projection exposure apparatus is configured to be replaceable with an immersion type exposure apparatus in order to substantially shorten the exposure wavelength and improve the resolution.
- a predetermined medium 7 is filled between the surface of the wafer W and the projection optical system PL, as shown in FIG.
- the adjustment of the optical elements constituting the projection optical system PL including the lens barrel 3 accommodating a plurality of optical elements formed of stone is performed. That is, the projection optical system PL is adjusted from the dry projection optical system PL to the immersion projection optical system PL.
- the projection optical system according to the first to fourth embodiments or the projection optical system according to the fourth and sixth embodiments is used.
- the same adjustment as the adjustment of the thickness and the like of the optical element constituting the projection optical system manufactured by the system manufacturing method is performed.
- the surface on the reticle R side of the optical element 4 closest to the wafer W is configured to have a positive refractive power.
- the liquid 7 pure water (deionized water) which can be easily obtained in large quantities at a semiconductor manufacturing plant or the like is used.
- the projection optical system according to any one of the second to fourth embodiments or the projection optical system of the fifth or sixth embodiment Since a projection optical system manufactured by the method for manufacturing a projection optical system is provided, a dry-type exposure apparatus and a projection optical system PL that interpose a gas between the projection optical system PL and the wafer W as necessary are used.
- An immersion type exposure apparatus in which a liquid is interposed between the exposure apparatus and the wafer W can be selectively used. Therefore, when the projection optical system PL is switched to the liquid immersion type, the pattern image of the reticle R can be satisfactorily exposed on the wafer W with high resolution even if the pattern of the reticle R is fine.
- the pattern image of the reticle R can be satisfactorily exposed onto the wafer W with high throughput.
- the optical element 4 and the optical element 4 that are arranged closest to the wafer W side of the projection optical system PL Even when exposure is performed with a medium 7 having a refractive index of 1.1 or more interposed between the wafer W and the wafer W, the optical characteristics in that case and the gas between the optical element 4 and the wafer W The optical characteristics can be maintained substantially the same as in the state where the reticle R is interposed, and the pattern image of the reticle R can be favorably exposed onto the wafer W.
- the liquid a liquid which is transparent to the exposure optical system and has a refractive index as high as possible and which is stable with respect to the photoresist applied to the surface of the projection optical system PL or the wafer W should be used.
- the reticle (mask) is illuminated by the illumination device (illumination step), and the transfer pattern formed on the mask is exposed on the photosensitive substrate using the projection optical system.
- a micro device semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.
- FIG. 1 An example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer or the like as a photosensitive substrate using the exposure apparatus of the present embodiment is shown in FIG. This will be described with reference to a flowchart.
- a metal film is deposited on one lot of wafers.
- a photoresist is applied on the metal film on the one lot wafer.
- an image of the pattern on the mask is sequentially exposed and transferred to each shot area on the one lot of wafers via the projection optical system.
- the photoresist on the one lot wafer is developed, and in step 405, the pattern on the mask is etched on the one lot wafer using the resist pattern as a mask. Is formed in each shot area on each wafer.
- Step 401-Step 405 a metal is deposited on the wafer, and a resist is formed on the metal film. Prior to these steps, a silicon oxide film is formed on the wafer, and then a resist is applied on the silicon oxide film, and the exposure, Needless to say, each step such as development and etching may be performed.
- a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate).
- a predetermined pattern circuit pattern, electrode pattern, etc.
- a plate glass substrate
- a so-called optical lithography process of transferring and exposing a mask pattern onto a photosensitive substrate (a glass substrate coated with a resist) using the exposure apparatus of the present embodiment is performed.
- a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate.
- the exposed substrate is subjected to various processes such as a developing process, an etching process, and a resist stripping process, so that a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming process 502. .
- a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or R, G,
- a color filter is formed by arranging a plurality of sets of filters of three stripes B in the horizontal scanning line direction.
- a cell assembling step 503 is performed.
- a liquid crystal panel liquid crystal cell
- a liquid crystal is assembled using the substrate having the predetermined pattern obtained in the pattern forming step 501, the color filter obtained in the color filter forming step 502, and the like.
- a liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step 501 and the color filter obtained in the color filter forming step 502, and a liquid crystal panel ( Liquid crystal cell).
- a liquid crystal display device having an extremely fine circuit pattern can be obtained with high throughput.
- the present invention is applied to the projection optical system mounted on the exposure apparatus.
- the present invention is not limited to this, and may be applied to other general imaging optical systems.
- the present invention can also be applied.
- a KrF or ArF excimer laser light source is used.
- the present invention is not limited to this, and another appropriate light source that supplies light having a predetermined wavelength may be used.
- the “and” scanning type exposure apparatus performs the step of scanning and exposing the mask pattern on each exposure region of the substrate while relatively moving the mask and the substrate with respect to the projection optical system.
- the present invention is applied to the present invention.
- the pattern of the mask is collectively transferred to the substrate while the mask and the substrate are stationary, and the substrate is sequentially moved stepwise to apply the mask pattern to each exposure area.
- Step of Sequential Exposure The present invention can also be applied to an exposure apparatus of the 'and' repeat type.
- the lens configuration of the projection optical system according to the first embodiment is the same as the lens configuration of the projection optical system PL1 according to the second embodiment shown in FIG. 14, the description of the projection optical system according to the first embodiment will be made.
- the reference numerals used in the description of the projection optical system PL1 working in the second embodiment are used.
- the surface number of the first column is the order of the surface along the ray traveling direction from the object side
- the second column is the radius of curvature (mm) of each surface
- the third column is the The on-axis spacing of each surface, that is, the surface spacing (mm)
- the fourth column indicates the glass material of the optical member.
- Table 4 shows the aspheric coefficient of the lens having the aspheric lens surface used in the projection optical system PL1 according to the first embodiment.
- the aspherical surface numbers in the first column correspond to the surface numbers in the optical member specifications in Table 3.
- the second column is Curvature of aspheric surface (1 / mm)
- third column conical coefficient K and 12th-order aspherical coefficient
- fourth column fourth-order A and 14th-order aspherical coefficient
- fifth column 6th-order B
- the 16th-order G aspherical coefficients the 6th power ram shows the 8th-order C and 18th-order aspherical coefficients
- the 7th column shows the 10th-order D aspherical coefficients.
- Example 1 the height of the aspheric surface in the direction perpendicular to the optical axis AX1 is y, and the projection optics from the tangent plane at the vertex of the aspheric surface to the position on the aspheric surface at the height y
- the distance (sag amount) along the optical axis of the system PL1 is z
- the vertex radius of curvature is r
- the cone coefficient is K
- the m-th order aspheric coefficient is Cm
- Exposure area Maximum image height 13.7mm
- Quartz glass refractive index 1. 50839
- FIG. 25 is a lateral aberration diagram showing lateral aberration of the dry projection optical system PL1 in the meridional direction and the sagittal direction.
- Y indicates the image height
- the solid line indicates the lateral aberration at a wavelength of 248.4000 nm.
- aberrations are corrected in a well-balanced manner.
- the parallel plane plate L24 is retracted, and the distance between the image side surface of the positive meniscus lens L22 and the object side surface of the parallel plane plate L23, the thickness of the parallel plane plate L23 is changed, and the wafer W1 Table 5 shows the optical member specifications of the liquid immersion type projection optical system PL1 with pure water interposed between them.
- the surface numbers 1-144 are the same as the optical member specifications of the surface numbers 1-144 shown in Table 3, the display is omitted.
- FIG. 26 is a lateral aberration diagram showing lateral aberrations of the liquid immersion type projection optical system PL1 in the meridional direction and the sagittal direction.
- Y indicates the image height
- the solid line indicates the lateral aberration at a wavelength of 248.4000 nm.
- the aberration is corrected in a well-balanced manner.
- the parallel plane plate L24 is retracted, and the distance between the image side surface of the positive meniscus lens L22 and the object side surface of the parallel plane plate L23 and the thickness of the parallel plane plate L23 are changed.
- the optical characteristics of the dry projection optical system PL1 and the optical characteristics of the immersion projection optical system PL1 are maintained substantially the same.
- the lens configuration of the projection optical system according to the second embodiment is the same as the lens configuration of the projection optical system PL2 according to the third embodiment shown in FIG.
- the same reference numerals as those used in the description of the projection optical system PL2 according to the third embodiment are used.
- the specifications of the projection optical system PL2 according to the second embodiment are shown. In these specifications, NA indicates the number of openings. In these specifications, the refractive indexes of quartz glass, fluorite, and pure water indicate relative refractive indices to the atmosphere in the projection optical system PL2.
- Table 6 shows optical member specifications of the projection optical system PL2 that are useful in the second embodiment.
- Table 7 shows the aspheric coefficient of the lens having the aspheric lens surface used in the projection optical system PL2 according to the second embodiment.
- the definition of each column of the optical member specifications shown in Table 6 and the definition of the aspheric coefficient shown in Table 7 are the same as Tables 3 and 4 according to Example 1, so the projection optical system according to Example 1 is used. The description will be made using the same reference numerals as those used in the description of the PL 1.
- Exposure area Maximum image height 21.lmm
- Quartz glass refractive index 1. 50839
- FIG. 27 is a lateral aberration diagram showing lateral aberrations in the tangential direction and the sagittal direction of the dry projection optical system PL2.
- Y indicates the image height
- the solid line indicates the transverse aberration at a wavelength of 248.4000 nm.
- aberrations are corrected in a well-balanced manner.
- the thickness of the parallel plane plate L56 and the thickness of the parallel plane plate L57 are changed so that water is interposed between the parallel plane plate L57 and the wafer W2.
- Table 8 shows the optical member specifications.
- the surface numbers 1-151 are the same as the optical member specifications of the surface numbers 1-151 shown in Table 6, the display is omitted.
- FIG. 28 is a lateral aberration diagram showing lateral aberrations of the immersion type projection optical system PL2 in the tangential direction and the sagittal direction.
- Y indicates the image height
- the solid line indicates the wavelength 24. 8.
- the lateral aberrations at 4000 nm are shown.
- the aberration is corrected with good balance.
- the optical characteristics of the dry projection optical system PL2 and the immersion projection optical system PL2 are changed.
- the optical properties of are maintained almost the same.
- the lens configuration of the projection optical system according to the third embodiment is the same as that of the projection optical system PL3 according to the fourth embodiment shown in FIG.
- the description uses the same reference numerals used in the description of the projection optical system PL3 according to the fourth embodiment.
- Exposure area Maximum image height 21.lmm
- Quartz glass refractive index 1. 50839
- FIG. 29 is a lateral aberration diagram showing lateral aberrations in the tangential direction and the sagittal direction of the dry projection optical system PL3 in which gas is interposed between the parallel plane plate L86 and the wafer W3.
- Y indicates the image height
- the solid line indicates the horizontal difference at a wavelength of 248.4000 nm.
- the aberration of the dry projection optical system PL3 is corrected in a well-balanced manner.
- the optical member specifications of the liquid immersion type projection optical system PL3 in which the parallel flat plate L86 is replaced with a parallel flat plate L86 'and water is interposed between the parallel flat plate L86' and the wafer W3. are shown in Table 11. Since the surface numbers 1 to 50 are the same as the optical member specifications of the surface numbers 1 to 50 shown in Table 9, the display is omitted.
- Figure 30 shows the immersion type projection optical system PL3 in the tangential and sagittal directions.
- FIG. 4 is a lateral aberration diagram illustrating lateral aberrations in the present invention.
- Y indicates the image height
- the solid line indicates the wavelength 24.
- the lateral aberration at 4000 nm is shown. As shown in FIG. 30, the aberration of the immersion type projection optical system PL3 is corrected in a well-balanced manner.
- the optical characteristics of the dry projection optical system PL3 and the optical characteristics of the immersion projection optical system PL3 are improved. , And are kept almost identical.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2005511015A JPWO2005001544A1 (ja) | 2003-06-26 | 2004-06-22 | 光学ユニット、結像光学系、結像光学系の収差調整方法、投影光学系、投影光学系の製造方法、露光装置、および露光方法 |
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| JP2003-182886 | 2003-06-26 | ||
| JP2003182886 | 2003-06-26 | ||
| JP2004-020036 | 2004-01-28 | ||
| JP2004020036 | 2004-01-28 | ||
| JP2004-146310 | 2004-05-17 | ||
| JP2004146310 | 2004-05-17 |
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| WO (1) | WO2005001544A1 (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006037444A3 (en) * | 2004-10-05 | 2006-08-10 | Zeiss Carl Smt Ag | Microlithographic projection exposure apparatus |
| JP2006332669A (ja) * | 2005-05-25 | 2006-12-07 | Carl Zeiss Smt Ag | 異なる浸漬液とともに使用するのに適した投影レンズとその変換方法及び製造方法 |
| US8908269B2 (en) | 2004-01-14 | 2014-12-09 | Carl Zeiss Smt Gmbh | Immersion catadioptric projection objective having two intermediate images |
| US8913316B2 (en) | 2004-05-17 | 2014-12-16 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
| US9772478B2 (en) | 2004-01-14 | 2017-09-26 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with parallel, offset optical axes |
| US20210271064A1 (en) * | 2020-03-02 | 2021-09-02 | Kyocera Soc Corporation | Liquid Immersion Objective, Microscope, and Observation Method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8908269B2 (en) | 2004-01-14 | 2014-12-09 | Carl Zeiss Smt Gmbh | Immersion catadioptric projection objective having two intermediate images |
| US9772478B2 (en) | 2004-01-14 | 2017-09-26 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with parallel, offset optical axes |
| US8913316B2 (en) | 2004-05-17 | 2014-12-16 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
| US9019596B2 (en) | 2004-05-17 | 2015-04-28 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
| US9134618B2 (en) | 2004-05-17 | 2015-09-15 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
| US9726979B2 (en) | 2004-05-17 | 2017-08-08 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
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| US20210271064A1 (en) * | 2020-03-02 | 2021-09-02 | Kyocera Soc Corporation | Liquid Immersion Objective, Microscope, and Observation Method |
| US11808933B2 (en) * | 2020-03-02 | 2023-11-07 | Kyocera Soc Corporation | Liquid immersion objective, microscope, and observation method |
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| Publication number | Publication date |
|---|---|
| JPWO2005001544A1 (ja) | 2006-08-10 |
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