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WO2005091352A1 - Conditionnement d dispositifs micro-electroniques, optoelectroniques et autres dispositifs - Google Patents

Conditionnement d dispositifs micro-electroniques, optoelectroniques et autres dispositifs Download PDF

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Publication number
WO2005091352A1
WO2005091352A1 PCT/GB2005/000654 GB2005000654W WO2005091352A1 WO 2005091352 A1 WO2005091352 A1 WO 2005091352A1 GB 2005000654 W GB2005000654 W GB 2005000654W WO 2005091352 A1 WO2005091352 A1 WO 2005091352A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
component
packaged
polymer
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB2005/000654
Other languages
English (en)
Inventor
Peter Kay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADVANCED MICROPACKAGING TECHNOLOGY Ltd
Original Assignee
ADVANCED MICROPACKAGING TECHNOLOGY Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADVANCED MICROPACKAGING TECHNOLOGY Ltd filed Critical ADVANCED MICROPACKAGING TECHNOLOGY Ltd
Publication of WO2005091352A1 publication Critical patent/WO2005091352A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/034—Moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to the packaging of devices such as microelectronic and optoelectronic devices, microfluidic devices and MEMS.
  • the present invention seeks to provide improved packaging methods and improved packaged products.
  • the present invention provides a method of packaging a micro component, which component comprises a chip with one or more elongate connecting elements attached to and extending therefrom, the method comprising: (a) providing an object having the same physical dimensions as a predetermined working envelope of the chip to be packaged; (b) providing a body of a polymer whose physical characteristics can be altered by application of heat or exposure to radiation, the polymer body having a length and width greater than those of the chip; (c) forming an impression of part of the object in the polymer body by embossing the object into a surface of the body and applying heat or radiation, thereby forming a first packaging element; (d) removing the object from the first packaging element; (e) repeating steps (b) and (c) with the object reversed to form a second packaging element; and (f) securing a component to be packaged between the first and second packaging elements.
  • Fig. 1 shows, in diagrammatic cross-sectional side view, a series of steps in forming a package in one embodiment of the invention
  • Fig. 2a is a similar view illustrating one step of an alternative embodiment
  • Fig. 2b is a perspective view of a package element produced in the alternative embodiment
  • Fig. 3a is a schematic perspective view of a component used in another embodiment of the invention
  • Fig. 3b illustrates a packaging element produced in this embodiment
  • Fig. 3c shows the resulting packaged component of this embodiment.
  • the mould cavity 12 is filled with a liquid or viscous flowable polymer 16.
  • the polymer 16 is one which may be cured by heat or by radiation, preferably UV radiation.
  • Suitable polymers are well known to those in the art and include a UV curable resin, epoxy, glue, adhesive, resist, silicone, acrylate or acrylic material.
  • Step 5 the component 18 is removed from the cured polymer, and the cured polymer is removed from the mould 10 as a lower embossed package element 20 (Step 5) .
  • Steps 1-5 are then repeated, but with the component 18 inverted, to produce an upper package element 22 (see Step 6) .
  • the component 18 is then positioned between the upper and lower package elements 20,22 which are sealed together to form an encapsulated component 24.
  • the procedure is similar to cold embossing (in the case where the polymer is cured by radiation such as UV) or hot embossing (where the polymer is cured by . heat) and known apparatus as used in hot embossing and cold embossing may be used in carrying out the present invention.
  • Fig. 2a shows a mould 30 having a mould cavity 32.
  • the cavity 32 is filled with a liquid polymer 34 and a model 36 is embossed into the polymer surface.
  • the model 36 comprises two parts 38 representing two chips, external leads or fibres 40, and interconnecting leads or fibres 42. (For ease of illustration only a single lead or fibre is shown in each location, but it will be understood that typically multiple leads or fibres are used.)
  • the interconnecting lead or fibre 42 has formed a channel 46 which can be used to align separate leads or fibres from individual chips received in package element cavities 48. It will be understood that the channel 46 is shown exaggerated in size in Fig. 2.
  • heat or radiation is applied while embossing or impressing the object into the polymer.
  • the properties of the polymer may be such that the uncured polymer can retain the embossed shape temporarily, allowing the application of heat or radiation to be done as a separate step after removing the object.
  • the use of a process akin to hot or cold embossing allows additional features to be incorporated. As is well known, hot and cold embossing using known apparatus can produce highly accurate physical features down to nano scale. Fig. 3 shows one example of the use of this.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Selon cette invention, pour conditionner une puce ou analogue, on scelle celle-ci hermétiquement entre des premier et second éléments de conditionnement créés par impression ; on déverse ensuite un polymère liquide dans la cavité d'un moule et on imprime la puce ou autre objet de forme équivalente dans un corps polymère par gaufrage à chaud ou à froid. Le corps polymère peut comprendre un polymère liquide déversé dans la cavité d'un moule et durci sous l'effet de la chaleur ou de rayonnements tels que des UV. Un seul boîtier peut renfermer plusieurs puces.
PCT/GB2005/000654 2004-03-16 2005-02-22 Conditionnement d dispositifs micro-electroniques, optoelectroniques et autres dispositifs Ceased WO2005091352A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0405844.2 2004-03-16
GBGB0405844.2A GB0405844D0 (en) 2004-03-16 2004-03-16 "Microelectronic and optoelectronic device packaging"

Publications (1)

Publication Number Publication Date
WO2005091352A1 true WO2005091352A1 (fr) 2005-09-29

Family

ID=32117750

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2005/000654 Ceased WO2005091352A1 (fr) 2004-03-16 2005-02-22 Conditionnement d dispositifs micro-electroniques, optoelectroniques et autres dispositifs

Country Status (2)

Country Link
GB (1) GB0405844D0 (fr)
WO (1) WO2005091352A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314245A (ja) * 1989-06-13 1991-01-22 Toshiba Corp 半導体装置の樹脂封止方法
EP0626723A1 (fr) * 1993-05-11 1994-11-30 Kabushiki Kaisha Toshiba Feuille en résine pour encapsuler un dispositif semi-conducteur
JPH11105474A (ja) * 1997-10-03 1999-04-20 Tsutsunaka Plast Ind Co Ltd 非接触型ｉｃカードとその製造方法
WO2000067199A1 (fr) * 1999-04-29 2000-11-09 Schlumberger Systemes Procede de fabrication de cartes sans contact par laminage et carte sans contact fabriquee selon un tel procede

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314245A (ja) * 1989-06-13 1991-01-22 Toshiba Corp 半導体装置の樹脂封止方法
EP0626723A1 (fr) * 1993-05-11 1994-11-30 Kabushiki Kaisha Toshiba Feuille en résine pour encapsuler un dispositif semi-conducteur
JPH11105474A (ja) * 1997-10-03 1999-04-20 Tsutsunaka Plast Ind Co Ltd 非接触型ｉｃカードとその製造方法
WO2000067199A1 (fr) * 1999-04-29 2000-11-09 Schlumberger Systemes Procede de fabrication de cartes sans contact par laminage et carte sans contact fabriquee selon un tel procede

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 130 (E - 1051) 29 March 1991 (1991-03-29) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 09 30 July 1999 (1999-07-30) *

Also Published As

Publication number Publication date
GB0405844D0 (en) 2004-04-21

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