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WO2004021419A1 - Systeme optique de projection et dispositif d'exposition - Google Patents

Systeme optique de projection et dispositif d'exposition Download PDF

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Publication number
WO2004021419A1
WO2004021419A1 PCT/JP2003/010956 JP0310956W WO2004021419A1 WO 2004021419 A1 WO2004021419 A1 WO 2004021419A1 JP 0310956 W JP0310956 W JP 0310956W WO 2004021419 A1 WO2004021419 A1 WO 2004021419A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical system
holding member
holding
lens barrel
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2003/010956
Other languages
English (en)
Japanese (ja)
Inventor
Jin Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2004532758A priority Critical patent/JP4363328B2/ja
Priority to AU2003261800A priority patent/AU2003261800A1/en
Publication of WO2004021419A1 publication Critical patent/WO2004021419A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Definitions

  • the present invention relates to an exposure apparatus used in a lithographic process in a process of manufacturing a device such as a semiconductor element, a liquid crystal display element, an imaging element, a thin film magnetic head, or a mask such as a reticle or a photomask, and an exposure apparatus provided in the exposure apparatus.
  • a device such as a semiconductor element, a liquid crystal display element, an imaging element, a thin film magnetic head, or a mask such as a reticle or a photomask
  • an exposure apparatus provided in the exposure apparatus.
  • Projection optical system is a projection optical system.
  • a conventional projection optical system is a refraction type projection optical system composed of a number of lenses arranged in an optical axis direction in order to accurately project an image of a predetermined pattern formed on a mask onto a substrate. Is the mainstream.
  • a refractive optical system is a reflecting mirror with power.
  • the lens barrel has a flange formed on its outer surface. Therefore, the conventional projection optical system is supported on the base of the exposure apparatus main body via the flange of the lens barrel.
  • the types of glass materials (optical materials) that can be used are limited.
  • the wavelength of the illumination light is less than 180 nm, the practicable glass material is limited to only fluorite.
  • there is a limit to the allowable chromatic aberration in a refraction type projection optical system made of a single glass material and it is essential to make the laser light source that emits the illumination light extremely narrow.
  • the laser light source is made extremely narrow, the cost and output of the laser light source will inevitably increase.
  • the catadioptric optical system includes, as a reflective optical element, an optical path bending mirror that deflects exposure light that has passed through a circuit pattern on a mask, and a concave reflecting mirror that reflects exposure light deflected by the optical path bending mirror.
  • the lens barrel includes at least a first partial lens barrel (vertical lens barrel) whose optical axis extends vertically and a second partial lens barrel whose optical axis extends horizontally. (Horizontal lens barrel). If the horizontal lens barrel is simply attached to one side of the vertical lens barrel, an eccentric load based on the weight of the horizontal lens barrel may act on the vertical lens barrel. The unbalanced load distorts the vertical lens barrel. When the vertical lens barrel is distorted, the surface accuracy of the optical element housed in the vertical lens barrel is deteriorated, and unpredictable aberration may occur in the projection optical system. The occurrence of this unpredictable aberration leads to a decrease in exposure accuracy.
  • the present invention has been made in view of the problems of the prior art, and has as its object to provide a projection optical system capable of holding an optical element without deteriorating the surface accuracy of the optical element. It is in. Another object of the present invention is to provide an exposure apparatus capable of improving exposure accuracy. A further object of the present invention is to provide a device manufacturing method capable of improving exposure accuracy.
  • a projection optical system that is supported by a gantry and projects an image of a pattern formed on a mask onto a predetermined surface.
  • the first holding member holds at least one first optical element arranged on the first optical axis.
  • the second holding member holds at least one second optical element arranged on a second optical axis intersecting the first optical axis.
  • the connecting member has a first connecting portion connected to the first holding member and a second connecting portion connected to the second holding member.
  • the projection optical system includes a mounting member for mounting the connecting member to the gantry.
  • the first holding member connected to the first connection portion is connected to the second connection portion. It is preferable that the second holding member does not come into contact with the second holding member.
  • the first connecting portion is connected to one end of the first holding member
  • the second connecting portion is connected to one end of the second holding member
  • the first holding member and the second holding member are connected to one end of the second holding member.
  • the optical axis of the first optical element held by the first holding member and the light of the second optical element held by the second holding member Preferably, the axes are oriented in different directions.
  • the attachment member is provided integrally with the connection member.
  • the projection optical system according to one embodiment is provided so as to sandwich the connecting member with respect to the first holding member, and on the first optical axis, or on an axis parallel to the first optical axis, or A third holding member that holds at least one third optical element disposed on an axis that intersects the one optical axis, wherein the connecting member is connected to the third holding member; Having a part.
  • the third holding member is connected to the third connecting portion without the first holding member, the second holding member, and the third holding member coming into contact with each other.
  • the mounting member is provided on the third holding member, and the connecting member is supported by the third holding member.
  • the first holding member includes at least one holding frame that holds the at least one first optical element
  • the second holding member includes the at least one second optical element and the concave reflection member. Includes at least one holding frame for holding the mirror.
  • the at least one first optical element constitutes a first imaging optical system
  • the at least one second optical element and the concave reflecting mirror constitute a second imaging optical system.
  • the holding frame of the first holding member and the holding frame of the second holding member are preferably made of the same material.
  • One embodiment of the projection optical system includes a plurality of optical elements including the at least one first optical element, a first imaging optical system that forms a first intermediate image of the pattern, and the first intermediate image
  • a first optical path bending mirror disposed near the formation position of the first optical path and deflecting a light beam toward the first intermediate image or a light beam from the first intermediate image
  • a second imaging optical system including two second optical elements and a concave reflecting mirror, and forming a second intermediate image near a formation position of the first intermediate image using a light beam from the first intermediate image
  • a second optical path bending mirror disposed near the formation position of the second intermediate image and deflecting a light beam directed to the second intermediate image or a light beam from the second intermediate image
  • the at least one third optical element A plurality of optical elements including an element, and a third imaging optical system that forms a reduced image of the pattern on a substrate using a light beam from the second intermediate image.
  • the first holding member includes a plurality of holding frames that hold a plurality of optical elements including the at least one first optical element
  • the second holding member is configured to bend the first optical path.
  • the coupling member includes an optical element exchange mechanism for exchanging at least one optical element held by at least one of the first, second, and third holding members and housed in the coupling member. It is preferred to have.
  • the second optical element is a first optical path bending mirror that deflects a light beam from a first intermediate image formed by at least a part of the first optical element or a light beam directed to the first intermediate image. And a second optical path bending mirror that deflects a light beam from the second intermediate image formed by the second optical element based on the first intermediate image or a light beam heading for the second intermediate image.
  • the optical element exchange mechanism is for exchanging the reflective optical element.
  • the connecting member is made of a ceramic material.
  • At least one of the first, second and third holding members and the gantry is formed of a material having a linear expansion coefficient different from a linear expansion coefficient of a material forming the connecting member.
  • the difference between the linear expansion coefficients is larger than a predetermined value, and at least one of the first, second, and third holding members, the gantry, and the connection member are connected via a flexure mechanism. preferable.
  • the projection optical system is provided in an exposure apparatus used in a lithographic process for manufacturing a device by exposing an image of a pattern formed on a mask onto a substrate.
  • FIG. 1 is a schematic view of an exposure apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the projection optical system of FIG.
  • FIG. 3 is a partial cross-sectional perspective view of the horizontal lens barrel and the connector of FIG.
  • Fig. 4 is a cross-sectional view taken along line 4-4 in Fig. 2.
  • FIG. 5 is a partially enlarged cross-sectional view of the bolt mounting portion in FIG.
  • FIG. 6 is a sectional view of a projection optical system according to a second embodiment of the present invention.
  • FIG. 7 is a sectional view of a projection optical system according to a third embodiment of the present invention.
  • FIG. 8 is a sectional view of a projection optical system according to a fourth embodiment of the present invention.
  • FIG. 9 is a flowchart of an example of manufacturing a device using the exposure apparatus of the present invention.
  • FIG. 10 is a detailed flowchart of FIG.
  • the projection optical system 25 of the first embodiment is of a catadioptric type, and is provided in a so-called step-and-scan type scanning projection exposure apparatus 11.
  • the X axis is perpendicular to the plane of FIG. 1
  • the Z axis is parallel to the first optical axis AX of the projection optical system 25
  • the Y axis is parallel to the plane of FIG. 1 and the first optical axis. Perpendicular to AX.
  • the exposure apparatus 11 includes, for example, an F 2 laser (oscillation center wavelength: 15.7.624 nm) as a light source 21 for supplying exposure light EL having a wavelength in the vacuum ultraviolet region.
  • Exposure light EL emitted from light source 21 uniformly illuminates reticle R as a mask on which a predetermined circuit pattern is formed, via illumination optical system 22.
  • a beam matching unit (BMU) 23 is provided between the light source 21 and the illumination optical system 22, and the light source 21 and the exposure apparatus main body 12 are optically connected by the BMU 23. Connected. Exposure light EL emitted from the light source 21 is guided to the exposure apparatus main body 12 via the BMU 23.
  • a gas having a low absorption rate of the exposure light EL for example, an inert gas such as helium gas or nitrogen? , Or kept in a nearly vacuum state I have.
  • the exposure apparatus main body 12 includes an upper pedestal 15, a lower pedestal 14, and a surface plate 13 that supports the pedestals 14 and 15.
  • the reticle stage 24 is placed on the upper pedestal 15, and the reticle R is held by a reticle holder (not shown) parallel to the XY plane.
  • a pattern to be transferred is formed on the reticle R, and the pattern area is sequentially illuminated with rectangular exposure light EL having a long side along the X direction and a short side along the Y direction. Is done.
  • the reticle stage 24 is two-dimensionally movable along a reticle plane (that is, an XY plane) by a drive system (not shown). The position (coordinates) of the reticle stage 24 is measured by an interferometer (not shown).
  • the light passing through the reticle R is projected onto a wafer W as a substrate coated with a photosensitive material via a projection optical system 25, and an image of a pattern formed on the reticle R is formed on the wafer W.
  • the wafer W is held in parallel with the XY plane by a wafer stage 26 arranged on a surface plate 13 of the exposure apparatus main body 12 via a wafer holder (not shown). Then, on the wafer W, a rectangular exposure having a long side along the X direction and a short side along the Y direction so as to optically correspond to a rectangular illumination area on the reticle R. A pattern image is formed in the area.
  • the wafer stage 26 can be two-dimensionally moved along the wafer surface (that is, the XY plane) by a drive system (not shown). The position (coordinates) of the wafer stage 26 is measured by an interferometer (not shown).
  • a cover glass 27 as a first optical element arranged on the side closest to the reticle R, and a third optical element arranged on the side closest to the wafer W
  • the internal space defined between the cover glass 28 and the cover glass 28 is kept airtight. It is preferable that the internal space of the projection optical system 25 be replaced with an inert gas such as helium gas or nitrogen, or that the space be maintained in a substantially vacuum state.
  • the reticle R and the reticle stage 24 are arranged between the illumination optical system 22 and the projection optical system 25, and are surrounded by a sealed casing (not shown).
  • the internal space of the casing is filled with an inert gas such as nitrogen or helium gas, or is maintained in a substantially vacuum state.
  • the wafer W and the wafer stage 26 are arranged between the projection optical system 25 and the wafer stage 26, and are surrounded by another sealed casing (not shown).
  • the internal space of the casing is maintained at a force filled with an inert gas such as nitrogen or helium gas or in a substantially vacuum state.
  • the illumination area on the reticle R and the exposure area on the wafer W defined by the illumination optical system 22 are rectangular with short sides along the Y direction. Therefore, the position of the reticle R and the position of the wafer W are controlled using the drive system and the interferometer, and the reticle stage 24 is moved along the short side direction of the rectangular exposure area and the illumination area, that is, along the Y direction.
  • the wafer W has a width equal to the long side of the exposure area and the wafer W
  • the reticle pattern is exposed to an area having a length corresponding to the scanning amount (moving amount) of the reticle.
  • the projection optical system 25 includes a first lens barrel module (upper lens barrel) 32 as a first holding member, It has a second lens barrel module (lateral lens barrel) 33 as a holding member and a third lens barrel module (lower lens barrel) 34 as a third holding member. All refractive optical elements (lenses) of the projection optical system 25 are made of fluorite (C a F 2 crystal).
  • the upper lens barrel 32 is disposed on the side closer to the reticle R on the first optical axis AX of the projection optical system 25.
  • the upper lens barrel 32 has a substantially cylindrical shape and holds therein a first imaging optical system 35 for forming a first intermediate image of the pattern of the reticle R.
  • the first imaging optical system 35 has a plurality of refractive optical elements.
  • the upper lens barrel 32 includes a plurality (four in the present embodiment) of holding frames 37 u each of which holds one or more of the lens 36 a and the cover glass 27 as the first optical element in combination. It is formed by stacking.
  • Each holding frame 37u is made of a metal material such as stainless steel and a titanium alloy.
  • the end of the plurality of holding frames 37 u far from reticle R (that is, the upper lens barrel)
  • the holding frame 37 uw provided at the lower end of 32 has an end 32 a having an outer diameter smaller than the outer diameter of the other holding frame 37 u.
  • the end 32 a is inserted into the connecting member 31, and the upper lens barrel 32 is connected to the connecting member 31.
  • a concave portion (a cut-out portion) 3 2 b is provided in a part of the end 32 a. Is provided.
  • the horizontal lens barrel 33 holds a second imaging optical system 39 for forming a second intermediate image.
  • the horizontal lens barrel 33 is disposed such that the optical axis (second optical axis ⁇ ⁇ ′) of the second imaging optical system 39 is orthogonal to the first optical axis AX.
  • the second imaging optical system 39 includes a right angle reflecting mirror 44 as a reflecting optical element described later, a negative lens 40 as a second optical element, and a concave reflecting mirror 41.
  • the negative lens 40 and the concave reflecting mirror 41 are arranged vertically so that the second optical axis AX, is directed in the horizontal direction.
  • the right-angle reflecting mirror 44 includes a first optical path bending mirror 38 and a second optical path bending mirror 42.
  • the horizontal lens barrel 33 is formed by connecting a plurality of holding frames 37a, 37b, and 37c that hold the right-angle reflecting mirror 44, the negative lens 40, and the concave reflecting mirror 41.
  • a first optical path bending mirror 38 is disposed near the first intermediate image formed by the first imaging optical system 35.
  • the exposure light E deflected by the first optical path bending mirror 38 is guided to the concave reflecting mirror 41 via the negative lens 40, and is reflected by the concave reflecting mirror 41.
  • the exposure light EL reflected by the concave reflecting mirror 41 passes through the negative lens 40 again, and near the position where the first intermediate image is formed, in this embodiment, near the second optical path bending mirror 42 and the second intermediate light. Form an image.
  • the second intermediate image is approximately the same magnification as the first intermediate image, and is a secondary image of the pattern.
  • the second optical path bending mirror 42 is disposed near the second intermediate image formed by the second imaging optical system 39, and is exposed to the exposure light EL toward the second intermediate image or the exposure light from the second intermediate image.
  • the light EL is deflected toward the refraction type third imaging optical system 43.
  • the right-angle reflector 44 is formed on a base material made of a metal material (such as stainless steel), a low thermal expansion ceramic (such as silicon carbide), or the like.
  • the right-angle reflecting mirror 44 has two inclined surfaces orthogonal to each other. One reflecting surface is formed with the reflecting surface of the first optical path bending mirror 38, and the other is formed with the reflecting surface of the second optical path bending mirror 42. Is done.
  • the base material is made of silicon carbide
  • the right angle mirror 4 is formed by pouring silicon carbide into a ⁇ shape and then performing shaping. 4 is formed.
  • the reflecting surface of the first optical path bending mirror 38 and the reflecting surface of the second optical path bending mirror 42 are metal reflecting surfaces.
  • the slopes 45, 46 of the base material are coated with a material suitable for polishing, such as Si, by chemical vapor deposition (CVD), and the slopes 45, 46 are mirror-polished. It is formed by coating the mirror-polished surface with a metal film (such as an aluminum film) or a fluoride film. In addition, a fluoride film is formed on the metal film.
  • the coating of the material for providing a mirror surface such as Si is performed not only on the slopes 45 and 46 of the base material but also on the entire surface of the base material, for example, as described later.
  • the support legs 44a of the right-angle reflector 44 It is also preferable to apply it to the support legs 44a of the right-angle reflector 44.
  • the reflecting surface needs to be mirror-finished, and therefore it is preferable that the reflecting surface be thicker than the other parts.
  • the perpendicularity of both reflecting surfaces is within ⁇ 5 seconds and the surface accuracy is within 3.5 to 7 ⁇ 1000 rms.
  • the reflecting surface of the concave reflecting mirror 41 may be a metal reflecting surface as in the case of the right-angle reflecting mirror 44, and accuracy other than the right angle and other processing may be applied in the same manner as the right-angle reflecting mirror 44. Is desirable.
  • both slopes 45 and 46 of the right-angle reflector 44 are optically isolated. Therefore, the light beam from the first imaging optical system 35 does not enter the second optical path bending mirror 42, and the light beam from the second imaging optical system 39 does not enter the first optical path bending mirror 38.
  • the horizontal lens barrel 33 includes a first holding frame 37 a that holds the concave reflecting mirror 41, a second holding frame 37 b that holds the negative lens 40, and a third holding frame 37 that holds the right-angle reflecting mirror 44. And a holding frame 37c.
  • the first holding frame 37a for holding the concave reflecting mirror 41 has a bottomed cylindrical shape.
  • the first holding frame 37a, the second holding frame 37b, and the third holding frame 37c are connected to each other. That is, the inner end of the first holding frame 37a and the outer end of the second holding frame 37b are connected, and the inner end of the second holding frame 37b and the third holding frame 37c are connected. Is connected to the outer end.
  • the second holding frame 37 b is connected to the connecting member 31 at the inner end 33 a.
  • the outer shape of the inner end 3 3 a of the second holding frame 37 b is outside the outer end. Small compared to diameter.
  • the horizontal lens barrel 33 is connected to the connecting member 31 with the inner end 33 a inserted into the connecting member 31.
  • the inner end 33a functions as one end of the second holding member.
  • the third holding frame 37c is formed in a bottomed quadrangular prism shape.
  • the right-angle reflecting mirror 44 is held such that the ridges of both slopes 45, 46 of the right-angle reflecting mirror 44 face the concave reflecting mirror 41.
  • the right-angle reflecting mirror 44 has support legs 44a formed at positions away from both reflecting surfaces, and is held by the third holding frame 37c via the support legs 44a.
  • a guide rail 49 as part of the optical element exchange mechanism is formed on the bottom 48 of the third holding frame 37c, and the support legs 44a of the right-angle reflector 44 are connected to the guide rail.
  • the mirror 49 can move in a direction parallel to the ridge line of the right-angle reflecting mirror 44.
  • An opening (not shown) is formed in a side wall of the third holding frame 37 c on an extension of the guide rail 49, and the right-angle reflecting mirror 44 can be replaced through this opening. Since the third holding frame 37c is inserted into the coupling body 54, the coupling body 54 also has a reflector exchange opening 67 as a part of the optical element exchange mechanism. (Details are described later).
  • the exposure light EL passing through the first imaging optical system 35 is provided on the side wall 51 a of the third holding frame 37 c facing the reflection surface of the first optical path bending mirror 38 of the right-angle reflecting mirror 4 4.
  • An opening 50a having a dimension that does not cause "exposure" of the exposure light EL when entering the reflecting surface of the first optical path bending mirror 38 of the right-angle reflecting mirror 44 is formed.
  • the exposure light reflected by the reflecting surface of the second optical path bending mirror 42 of the right angle reflecting mirror 44 is provided on the side wall 51b of the third holding frame 37c facing the reflecting surface of the second optical path bending mirror 42.
  • the side wall 51a of the third holding frame 37c passes from the first imaging optical system 35 to the first optical path bending mirror 38, the second imaging optical system 39, and the second optical path bending mirror 42. It functions as a shielding plate for shielding stray light that directly enters the third imaging optical system 43 without being used.
  • the lower lens barrel 34 is arranged on the first optical axis AX of the projection optical system 25, that is, on the same axis as the upper lens barrel 32, on the side closer to the wafer W.
  • the lower lens barrel 34 has a substantially cylindrical shape, and has a reticle scale inside based on the luminous flux from the second intermediate image.
  • a third imaging optical system 43 for forming a reduced image of the pattern (an image of the second intermediate image and a final image of the pattern) on the wafer W is held.
  • the third imaging optical system 43 has a plurality of optical elements.
  • the lower lens barrel 34 includes a plurality (four in the present embodiment) of holding frames 371, each of which holds one or more lenses 36b as a third optical element and a cover glass 28 in combination.
  • the lower end tube 34 is connected to the connecting member 31 with the end 34 a inserted into the connecting member 31.
  • This end 34a functions as one end of the third holding member.
  • a concave portion (lightening portion) 34b is provided in order to avoid interference with the horizontal lens barrel 33 connected to the connecting member 31.
  • the connecting member 31 exposes a connecting body 54 connected to the upper barrel 32, the horizontal barrel 33, and the lower barrel 34, and the connecting body 54.
  • a flange 55 as a mounting member for mounting to the lower frame 14 of the device body 12.
  • the connecting body 54 and the flange 55 are made of, for example, ceramics such as silicon carbide.
  • FIG. 4 is a cross-sectional view of the upper lens barrel 32 taken along line 4-14 in FIG. 2, and shows the upper surface of the connecting member 31.
  • the connecting body 54 has a substantially octagonal prism shape.
  • an upper barrel mounting recess 56 as a first connecting portion into which the end 32a of the upper barrel 32 is inserted. Is formed.
  • a lower lens barrel mounting concave portion 57 as a third coupling portion into which the end portion 34a of the lower lens barrel 34 is inserted is formed.
  • the upper lens barrel mounting recess 56 and the lower lens barrel mounting recess 57 are formed so that the upper lens barrel 32 and the lower lens barrel 34 are arranged on the first optical axis AX.
  • a lens barrel mounting hole 58 is formed.
  • a plurality of (three in this embodiment) fixing portions 54 b fixed to the flanges 55 are formed on the outer peripheral side surface of the connecting body 54.
  • the partition wall 59 that separates the upper lens barrel mounting recess 56 and the lower lens barrel mounting recess 57 has a horizontal barrel mounting hole 58 that is continuous.
  • a notch 60 is formed. The notch 60 accommodates the third holding frame 37 c of the horizontal lens barrel 33.
  • the upper lens barrel 32 is connected to the upper lens barrel mounting recess 56, and the horizontal lens barrel 33 is connected to the horizontal lens barrel mounting hole 58, and is fixed to the connecting body 54 by bolts 61.
  • the fixed portion 54b of the connector 54 and one surface (upper surface) of the flange 55 are fixed with bolts 62, and the connector 54 and the flange 55 are integrated.
  • the flange 55 has a shape larger than the outer diameter of a plane of the coupling body 54 orthogonal to the first optical axis AX, and has an opening 63 into which the lower lens barrel 34 can be inserted.
  • the opening 63 is formed substantially at the center of the flange 55.
  • the lower lens barrel 3 4 is inserted into the opening 63 of the flange 55, and the bolt mounting part 65 formed on the holding frame 3 71 r of the lower lens barrel 34 is fixed to the other end of the flange 55 by bolts 64. It is fixed to the surface (lower surface).
  • the upper lens barrel 32, the horizontal lens barrel 33, and the lower lens barrel 34 are connected to the connector 54 of the connecting member 31, and the upper lens barrel 32 and the horizontal lens barrel 33 are connected.
  • the lens barrels 32 to 34 do not contact each other.
  • the flange 55 is placed on a lower base 14 of the exposure apparatus main body 12 via a plurality of (for example, three) washers having a predetermined thickness arranged at predetermined intervals.
  • the 2 8 may generate heat.
  • the heat of the lenses 36a, 36b and the cover glasses 27, 28 is transferred to the holding frames 37u, 37uw, 37a, 37b,
  • the lens barrels 32 to 34 are transmitted to the coupling body 54 and the flange 55 via the 37 c, 37 1 r, and 37 1.
  • the connecting body 54 and the flange 55 are made of ceramics.
  • the linear expansion coefficient differs between the upper lens barrel 32 and the connector 54, and a difference occurs in the amount of thermal deformation.
  • the horizontal lens barrel 33 and the connector 54 have different coefficients of linear expansion, and a difference occurs in the amount of thermal deformation.
  • the lower tube 34 and the flange 55 have different linear expansion coefficients. Therefore, there is a difference in thermal deformation.
  • a plurality (three in this embodiment) of bolt mounting portions 65 are arranged at equal angular intervals. It is formed in.
  • a pair of substantially ⁇ -shaped slits 66 are formed in the bolt mounting portion 65 so as to surround a bolt hole (not shown) formed in the center.
  • a pair of slits 66 forms a fretastic structure.
  • the bolts 61 that are passed through the bolt holes of the bolt mounting portions 65 and are screwed into the screw holes 54 a of the connecting body 54 by the fretasha structure, and the holding frame 37 uW bolts of the upper lens barrel 32 A slight relative movement of the upper lens barrel 32 in the radial direction with respect to the mounting portion 65 is allowed. Due to this relative movement, the difference between the thermal deformation of the upper lens barrel 32 in the radial direction and the thermal deformation of the coupling body 54 is absorbed.
  • a bolt mounting portion 65 A small relative movement of the lower lens barrel 34 in the radial direction is allowed. Then, due to this relative movement, the difference between the radial thermal deformation of the lower lens barrel 34 and the thermal deformation between the lower lens barrel 34 and the flange 55 is absorbed.
  • an optical element exchange device that allows the right-angled reflecting mirror 44 to pass through is provided on one side corresponding to one longitudinal end face of the right-angled reflecting mirror 44 in the connecting body 54.
  • An opening 67 for exchanging the reflector as a part of is formed to be continuous with the guide rail 49 of the third holding frame 37 c of the horizontal lens barrel 33.
  • the reflector replacement opening 67 is always sealed by the plug 68 to ensure airtightness in the projection optical system 25.
  • the upper lens barrel 32 holding the first imaging optical system 35 arranged on the first optical axis AX is inserted into the upper lens barrel mounting recess 56 of the coupling body 54. Consolidated.
  • the lower lens barrel 34 holding the third imaging optical system 43 arranged on the first optical axis AX is connected to the lower lens barrel mounting recess 57 of the connector 54.
  • the horizontal lens barrel 33 that holds the second imaging optical system 39 disposed on the second optical axis AX ′ is connected to the horizontal lens barrel mounting hole 58 of the connector 54.
  • the lens barrels 32 to 34 are held on the lower frame 14 of the exposure apparatus main body 12 via the connector 54 and the flange 55.
  • the upper lens barrel 32 and the horizontal lens barrel 33 having optical axes orthogonal to each other are independently connected to the connector 54. Further, the lower lens barrel 34, the horizontal lens barrel 33, and the force connector 54 having optical axes orthogonal to each other are connected independently of each other.
  • the lens barrels 32 to 34 are independently supported by the lower frame 14 via the connecting body 54 and the flange 55. As a result, the weight of other lens barrels does not act on the lens barrels 32 to 34 between the lens barrels 32 to 34, and distortion occurs due to uneven load in each of the lens barrels 32 to 34. Is suppressed.
  • the connecting member 31 has a simple configuration including a connecting body 54 and a flange 55.
  • the imaging performance of the projection optical system 25 is improved, and the exposure accuracy can be improved.
  • the structure of the connecting member 31 is simple, and by attaching the connecting member 31 to the projection optical system 25, the weight of the projection optical system 25 does not increase significantly. Even if the projection optical system 25 is increased in size and weight, it can be kept to a small extent.
  • the size of the exposure apparatus main body 12 can be suppressed.
  • the first imaging optical system 35 and the third imaging optical system 43 arranged on the first optical axis AX are divided and held in an upper lens barrel 32 and a lower lens barrel 34, respectively. Thereby, the length of each of the lens barrels 32 and 34 can be shortened. Since the distance from the supporting point of each of the lens barrels 32 and 34 to the tip is reduced, the vibration of the projection optical system 25 is further reduced, and the resolution of the projection optical system 25 can be further improved.
  • the projection optical system 25 has a first imaging optical system 35 and a third imaging optical system 43 of a refraction type, and a concave reflecting mirror is provided between the two imaging optical systems 35 and 43.
  • a second imaging optical system 39 including 41 is provided. That is, the projection optical system 25 has an imaging point for each of the imaging optical systems 35, 43, and 39. For this reason, the aberration state can be adjusted for each of the imaging optical systems 35, 43, and 39.
  • the first and third imaging optical systems 35 and 43 do not include a reflective optical element such as the concave reflecting mirror 41, the upper and lower lens barrels 32 and 34 are not included.
  • the arrangement directions of the held lenses 36 a and 36 b and the cover glasses 27 and 28 can be aligned. Therefore, the configuration of the upper lens barrel 32 and the lower lens barrel 34 can be simplified.
  • the connecting body 54 is connected to the upper lens barrel 32 with the end 32a of the upper lens barrel 32 inserted into the upper lens barrel mounting recess 56.
  • the horizontal barrel 33 is connected to the horizontal barrel 33 with the inner end 33 a inserted into the horizontal barrel mounting hole 58 from a direction different from that of the upper barrel 32. . Therefore, the upper lens barrel 32 and the horizontal lens barrel 33 can be connected to the connecting body 54 from two directions with a simple configuration. Moreover, by inserting the inner end 33 a of the horizontal lens barrel 33 into the horizontal lens barrel mounting hole 58 of the connecting body 54, the horizontal lens barrel 3 with respect to the upper lens barrel 32 and the lower lens barrel 34 can be formed. Positioning of 3 can be easily performed.
  • the upper barrel 32 holds one or more optical elements (cover glass 27, lens 36a) in a holding frame 37 u, 37 uw have.
  • the horizontal lens barrel 33 is a combination of one or more optical elements (first and second optical path bending mirrors 38, 42, negative lens 40, and concave reflecting mirror 41). It has holding frames 37a to 37c that are held together.
  • the lower lens barrel 34 has holding frames 37 1 r and 37 1 for holding one or more optical elements (lens 36 b and cover glass 28) in combination. . Therefore, the relative positions of the optical elements can be finely and precisely adjusted within each of the lens barrels 32 to 34. As a result, more accurate aberration adjustment can be performed, and the resolving power of the projection optical system 25 can be further improved.
  • the right-angle reflector 44 accommodated in the connecting body 54 is exchanged while the horizontal lens barrel 33 and the connecting body 54 are held in the horizontal lens barrel 33. And a reflector exchange opening 67 are provided.
  • the connecting body 54 is formed of a material having sufficiently high rigidity to form the reflector replacement opening 67 for exchanging the right-angle reflector 44, each of the lens barrels 32 to There is no problem with strength in 3-4. Therefore, each optical element (cover glass 27, 28, lens 36a, 36b, first and second optical path bending mirror 38, 42, negative lens) The surface accuracy of 40 and the concave reflecting mirror 4 1) is kept good. Further, maintenance of the projection optical system 25 can be easily performed.
  • the right angle reflecting mirror 44 is exchangeably mounted.
  • Reflective film as a right angle reflector 4 4 formed on the optical path bending mirror 3 8, 4 2, particularly the F 2 laser when using a very short exposure light EL having a wavelength of EUV or the like, stable reflectivity performance It is desirable to replace it after a predetermined period to keep it. For this reason, such a projection optical system 25 is particularly suitable for the exposure apparatus 11 using far ultraviolet light to vacuum ultraviolet light as the exposure light EL.
  • the projection optical system 25 is composed of a connecting body 54 for supporting the lens barrels 32 to 34 and a flange 55 force ceramic material. For this reason, by providing the connector 54 and the flange 55 with high rigidity, the weight increase of the entire projection optical system due to the provision of the connector 54 and the flange 55 can be suppressed.
  • silicon carbide having excellent thermal conductivity is used among the ceramic materials, the heat generated by the irradiation of the exposure light EL is applied to the lens barrels 32 to 34 and the coupling body 54. Then, it can be quickly released to the lower frame 14 of the exposure apparatus main body 12 via the flange 55. This allows the optical elements (cover glass 27, 28) to be exposed during exposure light EL irradiation.
  • the surface states of the lenses 36a, 36b, the first and second optical path bending mirrors 38, 42, the negative lens 40 and the concave reflecting mirror 41) can be kept good.
  • the lens barrels 32 to 34 are made of a metal material, and the coupling body 54 and the flange 55 are made of a ceramic material having a different linear expansion coefficient from the material of the lens barrels 32 to 34. I have.
  • the bolt mounting portion 65 in each of the lens barrels 32 to 34 is formed with a fretting mechanism including a pair of slits 66. For this reason, the thermal deformation of each of the lens barrels 32 to 34 due to the irradiation of the exposure light EL can be absorbed by the deformation of the bolt mounting portion 65.
  • the occurrence of distortion in each of the lens barrels 32 to 34 is suppressed, and the optical elements (the cover glasses 27 and 28, the lenses 36a and 36b, the first and second optical path bending mirrors) during irradiation of the exposure light EL are suppressed. 38, 42, the surface condition of the negative lens 40 and the concave reflecting mirror 41) can be kept good.
  • the connecting body 54 and the flange 55 are formed separately. Therefore, by forming the side surface of the connecting body 54 opposite to the horizontal barrel mounting hole 58 in a planar shape, the horizontal barrel 33 is connected to the connecting body 54 and the horizontal barrel 33 is temporarily Then, the second optical axis AX 'can be arranged in an upright state with the vertical direction. Then, the second imaging optical system 39 held in the horizontal lens barrel 33 can be adjusted while the horizontal lens barrel 33 is set up, so that the adjustment work can be simplified. .
  • the holding frames 37 u, 37 uw, 37 a to 37 c, 37 1 r, and 37 1 of the barrels 32 to 34 are made of the same material in one barrel 32 to 34. It is configured. For this reason, during the irradiation of the exposure light EL, variation occurs in the thermal deformation of each of the holding frames 37 u, 37 uw, 37 a to 37 c, 37 1 r, 371 in each of the lens barrels 32 to 34. Is suppressed.
  • the surfaces of the optical elements cover glass 27, 28, lenses 36a, 36b, first and second optical path bending mirrors 38, 42, negative lens 40, and concave reflecting mirror 41
  • Accuracy can be maintained even better.
  • a projection optical system and an exposure apparatus according to a second embodiment of the present invention will be described focusing on parts different from the first embodiment.
  • the projection optical system 81 of the second embodiment is used as a first holding member.
  • the configuration of the vertical lens barrel 82 and the connecting member 83 is different from that of the first embodiment. That is, in the projection optical system 81, the vertical lens barrel 82 is a single substantially cylindrical structure.
  • a first imaging optical system 35 arranged on the first optical axis AX and a third imaging optical system 43 also arranged on the first optical axis AX are held in the vertical lens barrel 82. Have been.
  • On the side surface of the vertical lens barrel 82, near the center of the longitudinal axis, a horizontal lens barrel housing hole 82a that allows the insertion of the third holding frame 37c of the horizontal lens barrel 33 is formed.
  • the connecting member 83 includes a connecting part 84 connecting the vertical lens barrel 82 and the horizontal lens barrel 33, and a mounting member for attaching the connecting part 84 to the lower frame 14 of the exposure apparatus main body 12.
  • the flange portion 85 is integrally formed.
  • the connecting member 83 is made of Invar (registered trademark) which is a metal material having a small linear expansion coefficient.
  • the connecting member 83 has an outer shape larger than the outer diameter of the vertical lens barrel 82 in a plane orthogonal to the first optical axis AX, and the connecting portion 84 is formed in an octagonal prism shape, and has a central portion from the top.
  • a vertical lens barrel through hole 86 as a first connecting portion is formed over the lower surface.
  • the connecting portion 84 has an outer dimension larger than the outer diameter of the horizontal lens barrel 33 in a plane orthogonal to the second optical axis AX '.
  • a horizontal lens barrel mounting hole 58 as a second connecting portion is formed so as to be connected to the insertion hole 86.
  • the connecting member 83 is formed of Invar. For this reason, the vertical lens barrel 82 and the connecting member 83 have different linear expansion coefficients, resulting in a difference in the amount of thermal deformation. Further, the horizontal lens barrel 33 and the connecting member 83 have different coefficients of linear expansion, and a difference occurs in the amount of thermal deformation.
  • a plurality of (three in this embodiment) bolt mounting portions 6 having a pair of slits 66 slightly above the center of the vertical barrel 82 on the outer peripheral surface of the vertical barrel 82. 5 are formed at equal angular intervals.
  • the vertical lens barrel 82 is inserted into the vertical lens barrel through hole 86 of the connecting member 83, and the horizontal lens barrel receiving hole 82 a is connected to the horizontal lens barrel mounting hole of the connecting member 83. Attached to correspond to 5 and 8.
  • the bolt mounting portion 65 of the vertical lens barrel 82 engages the upper surface of the connecting member 83, and the bolt mounting portion 65 is connected to the connecting member 83. Tighten to 3 with bolt 61.
  • the vertical lens barrel 82, the connecting member 83, and the force Are connected via a fretting structure.
  • the inner end 3 3 a of the second holding frame 3 7 b of the horizontal lens barrel 33 is connected to the third holding frame 37 c of the horizontal lens barrel 33 by the horizontal barrel housing hole 8 2 a of the vertical lens barrel 82. While being inserted inside, it is fitted into the horizontal lens barrel mounting hole 58 of the connecting member 83. In this state, a plurality of bolt mounting portions 65 formed on the outer peripheral surface of the second holding frame 37b of the horizontal lens barrel 33 and having a pair of slits 66 engage with the side surfaces of the connecting member 83. . Then, the bolt mounting portion 65 is tightened and fixed to the connecting member 83 by the bolt 61.
  • the horizontal lens barrel 33, the connecting member 83, and the force are connected via the flexure structure including the pair of slits 66.
  • the bolt 61 fixed to the connecting member 83 and the bolt mounting portion 65 of the second holding frame 37 b of the horizontal barrel 33 have a small relative diameter in the radial direction of the horizontal barrel 33. Movement is allowed. Then, due to this relative movement, the difference between the radial thermal deformation of the horizontal lens barrel 33 and the thermal deformation between the horizontal lens barrel 33 and the connecting member 83 is absorbed.
  • the vertical lens barrel 82 and the horizontal lens barrel 33 are separated from each other and do not come into contact with each other.
  • the vertical lens barrel 82 holding the first imaging optical system 35 and the third imaging optical system 43 arranged on the first optical axis AX is connected to the connecting member 83.
  • the bolt mounting portion 65 and the upper surface of the connecting portion 84 are connected to each other while being passed through the vertical lens barrel insertion hole 86.
  • the lens barrels 82, 33 are held on a lower frame 14 of the exposure apparatus main body 12 via a flange portion 85 of the force connecting member 83.
  • the vertical lens barrel 82 and the horizontal lens barrel 33 having optical axes orthogonal to each other are connected independently on the connecting member 83, and the lower frame 14 is connected independently to each other. Supported on top.
  • the lens barrels 32 and 34 the lens barrels 32 and 3
  • the weight of the other lens barrel does not act on one of the lenses 4, and the occurrence of distortion due to the unbalanced load is suppressed in the lens barrels 82, 33. Therefore, the cover glass 27, 28 in the lens barrels 82, 33, the lenses 36a, 36b, the first and second optical path bending mirrors 38, 42, the negative lens 40 and the concave reflection
  • the surface state of the mirror 41 can be kept good.
  • each of the lens barrels 82, 33 can hold the imaging optical systems 35, 39, 43 in a good state. become. Therefore, the imaging performance of the projection optical system 81 is improved, and the exposure accuracy can be improved.
  • the lens barrels 82, 33 are made of a metal material such as stainless steel or titanium alloy having a relatively large coefficient of linear expansion
  • the connecting member 83 is made up of the lens barrels 82, 3
  • 3 is made of a metal material having a smaller coefficient of linear expansion than the material constituting it.
  • a flexure mechanism including a pair of slits 66 is formed in the bolt mounting portion 65 of each of the lens barrels 82 and 33. For this reason, the thermal deformation of each of the lens barrels 82 and 33 due to the irradiation of the exposure light EL can be absorbed by the deformation of the bolt mounting portion 65.
  • the upper lens barrel 32 is fixed to the connector 54 and the lower lens barrel 34 is fixed to the flange 55.
  • the upper barrel 32 and the lower barrel 34 may be fixed to the connecting body 54.
  • the connection member 31 is engaged with the lower frame 14 of the exposure apparatus main body 12 so as to hang down, and the upper lens barrel 32 and the lower lens barrel 34 are fixed to the connector 54. It may be.
  • the connecting member 3 1 is dropped In this case, the flange 55 is located above and the connecting body 54 is located below, so the upper lens barrel 32 is fixed to the flange 55, and the lower lens barrel 34 is fixed to the connecting body 54. I'm sorry.
  • the upper lens barrel 32 is fixed to the connecting body 54, and the connecting body 54 is fixed to the flange 55.
  • the connecting body 54 is fixed to the flange 55.
  • a configuration in which a flange portion 91 as an attachment member is formed and the connecting body 54 is fixed on the flange portion 91 may be adopted. With such a configuration, an increase in the number of parts can be suppressed.
  • the fixing part of the connecting body 54 to the flange portion 91 may be, for example, as described in the first embodiment. It is desirable to provide a flexure structure such as that formed on the bolt mounting portion 65 of the lens barrel 32.
  • the connecting body 54 and the flange 55 may be integrated. Further, in the second embodiment, the connecting portion 84 and the flange portion 85 may be formed separately. In the first embodiment and the second embodiment, the first optical path bending mirror 38 and the second optical path bending mirror 42 are formed by one member, but the first optical path bending mirror 38 and the second The optical path bending mirrors 42 may be configured independently of each other.
  • each of the holding frames 37 u, 37 uw, 37 b, 37 1 r, and 37 1 has one lens 36 a, 36 b (a cover glass depending on the location). 27, 28) or the negative lens 40 was held.
  • each holding frame 37 u, 37 uw, 37 b, 37 1 r, 37 1 force Even if a plurality of lenses 36 a, 36 b or a negative lens 40 are held, Guess.
  • the horizontal lens barrel 33 holds the second imaging optical system 39 disposed on the second optical axis AX 'orthogonal to the first optical axis AX.
  • an optical system disposed on an optical axis obliquely intersecting the first optical axis AX may be held in the horizontal lens barrel 33.
  • at least one of the upper lens barrel 32, the horizontal lens barrel 33, and the lower lens barrel 34 is diagonally connected to the upper surface, the side surface, or the lower surface of the connector 54. You may.
  • the first imaging optical system 35 and the third imaging optical system 43 are connected to the first optical axis AX.
  • the third imaging optical system 43 is not coaxial with the first optical axis AX, but intersects with the first optical axis AX (or the second optical axis ⁇ ⁇ ′) or the first optical axis AX. It may be arranged on a parallel third optical axis.
  • the lens barrels, each holding an optical system arranged on a plurality of optical axes that continuously intersect, are independently connected to the connecting member without contacting each other, and the exposure is performed via the connecting member. It only needs to be supported by the lower frame 14 of the device main body 12.
  • the first optical path bending mirror 38 and the second optical path bending mirror 42 may be formed as separate reflecting optical elements.
  • the right-angle reflecting mirror 44 is held in the horizontal barrel 33, but the right-angle reflecting mirror 44 may be separated from the horizontal barrel 33.
  • an attachment 100 provided with a right-angled reflecting mirror 44 at its tip is detachably attached to the side wall of the connecting body 54.
  • the right-angle reflecting mirror 44 is held by the connecting member 31. Since there is no need to remove the horizontal lens barrel 33 to replace the right-angle reflector 44, the replacement of the right-angle reflector 44 is easy.
  • the right-angle reflecting mirror 44 may be a separate member detachable from the attachment 100.
  • a single-wavelength laser beam in the infrared or visible range oscillated from a DFB semiconductor laser or fiber laser is amplified by, for example, a fiber amplifier doped with erbium (or both erbium and ytterbium), and nonlinear optics is applied.
  • a harmonic converted into ultraviolet light using a crystal may be used.
  • the present invention is not limited to an exposure apparatus for manufacturing a micro device such as a semiconductor element. That is, the present invention is intended to manufacture a reticle or a mask used in an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, etc., from a mother reticle to a glass substrate or a silicon wafer.
  • the present invention can also be applied to an exposure apparatus that transfers a circuit pattern.
  • a transmission type reticle is generally used, and a reticle substrate is made of quartz glass, fluorine-doped quartz glass, or fluorite. Magnesium fluoride, quartz, or the like is used.
  • proximity type X-ray exposure equipment In an apparatus or an electron beam exposure apparatus, a reflection type mask (stencil mask, membrane mask, etc.) is used, and a silicon wafer is used as a mask substrate.
  • the present invention is applicable to an exposure apparatus other than an exposure apparatus used for manufacturing a semiconductor device.
  • an exposure apparatus that is used in the manufacture of displays including liquid crystal display elements (LCDs) to transfer device patterns onto glass plates, and that is used in the manufacture of thin-film magnetic heads to transfer device patterns onto ceramic wafers
  • the present invention can also be applied to an exposure apparatus and an exposure apparatus used for manufacturing an imaging device such as a CCD.
  • the present invention is applied to the scanning stepper.
  • the step 'and' of transferring the mask pattern to the substrate while the mask and the substrate are stationary and sequentially moving the substrate stepwise The present invention can also be applied to a repeat type exposure apparatus.
  • the projection magnification of the projection optical systems 25 and 81 is the reduction magnification.
  • the projection magnification is not limited to the reduction, and may be the same magnification or the enlargement magnification.
  • the projection magnification is an enlargement magnification, it is arranged so that light enters from the third imaging optical system 43 side, and the primary image of the mask or reticle R is arranged by the third imaging optical system 43.
  • the second image forming optical system 39 forms a secondary image
  • the first image forming optical system 35 forms a tertiary image (final image) on a substrate such as the wafer W.
  • the exposure apparatus 11 of the present invention is manufactured, for example, as follows. That is, optical elements such as a plurality of lenses 36a, 36b, 40, reflecting mirrors 41, 44, and cover glasses 27, 28 constituting the projection optical systems 25, 81 are connected to each lens barrel. Hold at 32 to 34, 82. The lens barrels 32 to 34, 82 are connected by connecting members 31, 83, and assembled into the exposure apparatus main body 12 to perform optical adjustment. Then, a wafer stage 26 (including a reticle stage 24 in the case of a scan type exposure apparatus) including a large number of mechanical parts is attached to the exposure apparatus main body 12 to connect wiring. Next, after connecting a gas supply pipe that supplies gas into the optical path of the exposure light EL, further general adjustments (electrical adjustment, operation confirmation, etc.) are performed.
  • optical elements such as a plurality of lenses 36a, 36b, 40, reflecting mirrors 41, 44, and cover glasses 27, 28 constituting the projection optical systems 25, 81 are connected to each lens barrel. Hold at 32 to 34, 82
  • the components constituting the lens barrels 32 to 34, 82 are assembled after removing impurities such as processing oil and metallic substances by ultrasonic cleaning. Exposure equipment 1 1 It is desirable that the production of refuse be carried out in a clean room where the temperature, humidity and pressure are controlled and the cleanliness level is maintained.
  • Fluorite is used as an example of the glass material, but crystals such as quartz, lithium fluoride, magnesium fluoride, strontium fluoride, lithium-monocalcium-anoremini-mufluoride, and lithium-strontium-aluminum-fluoride, etc.
  • Fluoride glass consisting of zirconia-barium lanthanum-aluminum, quartz glass doped with fluorine, quartz glass doped with hydrogen in addition to fluorine, quartz glass containing OH groups, An improved quartz such as quartz glass containing an OH group may be used.
  • FIG. 9 is a view showing a flowchart of an example of manufacturing devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.).
  • a device for example, circuit design of a semiconductor device
  • step S102 mask manufacturing step
  • step S103 substrate manufacturing step
  • a substrate wafer W, glass plate, etc.
  • step S104 substrate processing step
  • step S105 device assembly step
  • step S105 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.
  • FIG. 10 is a diagram showing an example of a detailed flow of step S104 in FIG. 9 in the case of a semiconductor device.
  • step S111 oxidation step
  • step S112 CVD step
  • step S113 electrode formation step
  • step S114 ion implantation step
  • ions are implanted into the wafer W.
  • step S115 resist forming step
  • step S116 exposure step
  • step S116 exposure step
  • step S117 development step
  • step S118 etching step
  • step S119 resist removing step
  • the exposure apparatus 11 described above is used in the exposure step (step S116), and the resolution can be improved by the exposure light EL in the vacuum ultraviolet region, and the exposure amount can be controlled with high precision. Therefore, according to the above-described device manufacturing method, a highly integrated device having a minimum line width of about 0.1 ⁇ can be produced with a high yield.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)

Abstract

Cette invention se rapporte à un système optique de projection (25) servant à maintenir un élément optique sans affecter son niveau de tolérance en figure, ce système comprenant un barillet à lentilles supérieur (32), un barillet à lentilles latéral (33), un barillet à lentilles inférieur (34), un corps de raccordement (54) et une bride (55). Le barillet à lentilles supérieur (32), le barillet à lentilles latéral (33) et le barillet à lentilles inférieur (34) sont raccordés au corps de raccordement (54) sans contact entre eux. Le corps de raccordement (54) est maintenu par la bride (55) et celle-ci est maintenue par une base de montage inférieure (14).
PCT/JP2003/010956 2002-08-29 2003-08-28 Systeme optique de projection et dispositif d'exposition Ceased WO2004021419A1 (fr)

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JP2004532758A JP4363328B2 (ja) 2002-08-29 2003-08-28 投影光学系及び露光装置
AU2003261800A AU2003261800A1 (en) 2002-08-29 2003-08-28 Projection optical system and exposure device

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JP2002-252186 2002-08-29
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JPWO2004021419A1 (ja) 2005-12-22
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JP4363328B2 (ja) 2009-11-11
AU2003261800A1 (en) 2004-03-19

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