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WO2004011368A3 - Low temperature anodic bonding method using focused energy for assembly of micromachined systems - Google Patents

Low temperature anodic bonding method using focused energy for assembly of micromachined systems Download PDF

Info

Publication number
WO2004011368A3
WO2004011368A3 PCT/US2003/023518 US0323518W WO2004011368A3 WO 2004011368 A3 WO2004011368 A3 WO 2004011368A3 US 0323518 W US0323518 W US 0323518W WO 2004011368 A3 WO2004011368 A3 WO 2004011368A3
Authority
WO
WIPO (PCT)
Prior art keywords
low temperature
assembly
focused energy
bonding method
anodic bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/023518
Other languages
French (fr)
Other versions
WO2004011368A2 (en
Inventor
Steven T Cho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abbott Laboratories
Original Assignee
Abbott Laboratories
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abbott Laboratories filed Critical Abbott Laboratories
Priority to AU2003256917A priority Critical patent/AU2003256917A1/en
Publication of WO2004011368A2 publication Critical patent/WO2004011368A2/en
Publication of WO2004011368A3 publication Critical patent/WO2004011368A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0087—Galenical forms not covered by A61K9/02 - A61K9/7023
    • A61K9/0097—Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00—Medicinal preparations characterised by special physical form
    • A61K9/0002—Galenical forms characterised by the drug release technique; Application systems commanded by energy
    • A61K9/0009—Galenical forms characterised by the drug release technique; Application systems commanded by energy involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M2205/00—General characteristics of the apparatus
    • A61M2205/02—General characteristics of the apparatus characterised by a particular materials
    • A61M2205/0244—Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Epidemiology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Dermatology (AREA)
  • Engineering & Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Micromachines (AREA)

Abstract

A method for assembling a medicine delivery system (10) includes providing a substrate (16) with a plurality of compartments (18), filling the compartments (18) with medicine (34), covering the compartments (18) with a cap (24), heating the system (10) at a relatively low temperature, applying a voltage bias (56) across the substrate (16) and the cap (24), and applying focused energy (54) to the substrate (16) and/or the cap (24) to seal them together and create a vacuum in the compartments (18).
PCT/US2003/023518 2002-07-30 2003-07-29 Low temperature anodic bonding method using focused energy for assembly of micromachined systems Ceased WO2004011368A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003256917A AU2003256917A1 (en) 2002-07-30 2003-07-29 Low temperature anodic bonding method using focused energy for assembly of micromachined systems

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/208,309 2002-07-30
US10/208,309 US20040020173A1 (en) 2002-07-30 2002-07-30 Low temperature anodic bonding method using focused energy for assembly of micromachined systems

Publications (2)

Publication Number Publication Date
WO2004011368A2 WO2004011368A2 (en) 2004-02-05
WO2004011368A3 true WO2004011368A3 (en) 2004-06-10

Family

ID=31186792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/023518 Ceased WO2004011368A2 (en) 2002-07-30 2003-07-29 Low temperature anodic bonding method using focused energy for assembly of micromachined systems

Country Status (3)

Country Link
US (1) US20040020173A1 (en)
AU (1) AU2003256917A1 (en)
WO (1) WO2004011368A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002534139A (en) * 1999-01-05 2002-10-15 マサチューセッツ・アイ・アンド・イア・インファーマリー Transscleral sustained release drug targeted delivery to retina and choroid
WO2002089767A1 (en) 2001-05-03 2002-11-14 Massachusetts Eye And Ear Infirmary Implantable drug delivery device and use thereof
WO2003092665A2 (en) * 2002-05-02 2003-11-13 Massachusetts Eye And Ear Infirmary Ocular drug delivery systems and use thereof
US20060167435A1 (en) * 2003-02-18 2006-07-27 Adamis Anthony P Transscleral drug delivery device and related methods
US7176528B2 (en) * 2003-02-18 2007-02-13 Corning Incorporated Glass-based SOI structures
US7399681B2 (en) * 2003-02-18 2008-07-15 Corning Incorporated Glass-based SOI structures
US8191756B2 (en) * 2004-11-04 2012-06-05 Microchips, Inc. Hermetically sealing using a cold welded tongue and groove structure
US20070264796A1 (en) * 2006-05-12 2007-11-15 Stocker Mark A Method for forming a semiconductor on insulator structure
US9937124B2 (en) * 2014-09-11 2018-04-10 International Business Machines Corporation Microchip substance delivery devices having low-power electromechanical release mechanisms
DE102016107059B4 (en) * 2015-07-17 2022-12-22 Infineon Technologies Dresden Gmbh Integrated semiconductor device and manufacturing process
US10881788B2 (en) 2015-10-30 2021-01-05 International Business Machines Corporation Delivery device including reactive material for programmable discrete delivery of a substance
US10286198B2 (en) 2016-04-08 2019-05-14 International Business Machines Corporation Microchip medical substance delivery devices
US10508755B2 (en) * 2017-07-21 2019-12-17 International Business Machines Corporation Fluid delivery device with hydrophobic surface
NL2021872B1 (en) 2018-10-24 2020-05-13 Medspray B V Spray device and spray nozzle unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4219132A1 (en) * 1992-06-11 1993-12-16 Suess Kg Karl Bonded silicon@ wafer-glass or silicon@-silicon@ joint prodn. - comprises using laser light radiation to initially fix materials at spot(s) and/or lines and conventional high temp. bonding for pressure and acceleration sensors or micro-system elements
US5366454A (en) * 1993-03-17 1994-11-22 La Corporation De L'ecole Polytechnique Implantable medication dispensing device
WO2002034684A1 (en) * 2000-10-27 2002-05-02 Institut für Physikalische Hochtechnologie e.V. Method for anodic bonding at low temperatures

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE231287T1 (en) * 1991-09-30 2003-02-15 Canon Kk METHOD FOR ANODIC BONDING USING LIGHT RADIATION
JP3188546B2 (en) * 1993-03-23 2001-07-16 キヤノン株式会社 Bonded body of insulator and conductor and bonding method
US5536354A (en) * 1993-04-23 1996-07-16 Canon Kabushiki Kaisha Solid phase bonding method
US5443450A (en) * 1994-04-29 1995-08-22 Medtronic, Inc. Medication delivery device and method of construction
US5938923A (en) * 1997-04-15 1999-08-17 The Regents Of The University Of California Microfabricated filter and capsule using a substrate sandwich

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4219132A1 (en) * 1992-06-11 1993-12-16 Suess Kg Karl Bonded silicon@ wafer-glass or silicon@-silicon@ joint prodn. - comprises using laser light radiation to initially fix materials at spot(s) and/or lines and conventional high temp. bonding for pressure and acceleration sensors or micro-system elements
US5366454A (en) * 1993-03-17 1994-11-22 La Corporation De L'ecole Polytechnique Implantable medication dispensing device
WO2002034684A1 (en) * 2000-10-27 2002-05-02 Institut für Physikalische Hochtechnologie e.V. Method for anodic bonding at low temperatures

Also Published As

Publication number Publication date
WO2004011368A2 (en) 2004-02-05
AU2003256917A1 (en) 2004-02-16
US20040020173A1 (en) 2004-02-05

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