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WO2004092672A3 - Amorphous carbon layer for heat exchangers - Google Patents

Amorphous carbon layer for heat exchangers Download PDF

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Publication number
WO2004092672A3
WO2004092672A3 PCT/US2004/010619 US2004010619W WO2004092672A3 WO 2004092672 A3 WO2004092672 A3 WO 2004092672A3 US 2004010619 W US2004010619 W US 2004010619W WO 2004092672 A3 WO2004092672 A3 WO 2004092672A3
Authority
WO
WIPO (PCT)
Prior art keywords
amorphous carbon
heat exchangers
carbon layer
heat exchanger
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/010619
Other languages
French (fr)
Other versions
WO2004092672A2 (en
Inventor
Michael William Bradley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Praxair ST Technology Inc
Praxair Technology Inc
Original Assignee
Praxair ST Technology Inc
Praxair Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair ST Technology Inc, Praxair Technology Inc filed Critical Praxair ST Technology Inc
Priority to EP04759186A priority Critical patent/EP1611405A2/en
Priority to BRPI0409103-5A priority patent/BRPI0409103A/en
Priority to JP2006509754A priority patent/JP2006526075A/en
Publication of WO2004092672A2 publication Critical patent/WO2004092672A2/en
Publication of WO2004092672A3 publication Critical patent/WO2004092672A3/en
Anticipated expiration legal-status Critical
Priority to NO20055165A priority patent/NO20055165L/en
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

Process for deposition an amorphous carbon layer on substrates, such as heat exchangers, and the coated substrates so formed, such as an aluminum fined heat exchanger. The heat exchanger comprises a heat sink having deposited on its extended surface a layer of an amorphous carbon coating (DLC) having a hardness of at least 2000Kg/mm2, a specific resistivity of at least 108 ohm cm, and a dielectric strength of at least 106 V/cm.
PCT/US2004/010619 2003-04-10 2004-04-08 Amorphous carbon layer for heat exchangers Ceased WO2004092672A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP04759186A EP1611405A2 (en) 2003-04-10 2004-04-08 Amorphous carbon layer for heat exchangers
BRPI0409103-5A BRPI0409103A (en) 2003-04-10 2004-04-08 heat exchanger, substrate, and process for depositing an amorphous carbon layer on a substrate
JP2006509754A JP2006526075A (en) 2003-04-10 2004-04-08 Amorphous carbon layer for heat exchanger
NO20055165A NO20055165L (en) 2003-04-10 2005-11-03 Amorphous carbon layer for heat exchanger

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/410,211 2003-04-10
US10/410,211 US20040200599A1 (en) 2003-04-10 2003-04-10 Amorphous carbon layer for heat exchangers and processes thereof

Publications (2)

Publication Number Publication Date
WO2004092672A2 WO2004092672A2 (en) 2004-10-28
WO2004092672A3 true WO2004092672A3 (en) 2004-12-23

Family

ID=33130753

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/010619 Ceased WO2004092672A2 (en) 2003-04-10 2004-04-08 Amorphous carbon layer for heat exchangers

Country Status (7)

Country Link
US (1) US20040200599A1 (en)
EP (1) EP1611405A2 (en)
JP (1) JP2006526075A (en)
CN (1) CN1802881A (en)
BR (1) BRPI0409103A (en)
NO (1) NO20055165L (en)
WO (1) WO2004092672A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4423989B2 (en) * 2004-02-05 2010-03-03 トヨタ自動車株式会社 Thermoelectric generator for internal combustion engine
TWI268755B (en) * 2005-03-21 2006-12-11 Mitac Tech Corporation Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof
US7352584B1 (en) 2005-05-10 2008-04-01 Chien-Min Sung Diamond-like carbon coated devices
CN1870863B (en) * 2005-05-28 2011-06-08 鸿富锦精密工业（深圳）有限公司 Casing of portable electronic device and its manufacturing method
JP4735309B2 (en) * 2006-02-10 2011-07-27 トヨタ自動車株式会社 Cavitation erosion resistant member and method of manufacturing the same
CN100412228C (en) * 2006-06-08 2008-08-20 哈尔滨工业大学 Combination strengthening treatment method of ion implantation and deposition on aluminum or aluminum alloy substrate surface
US7968473B2 (en) * 2006-11-03 2011-06-28 Applied Materials, Inc. Low temperature process for depositing a high extinction coefficient non-peeling optical absorber for a scanning laser surface anneal of implanted dopants
TW201020336A (en) * 2008-11-20 2010-06-01 Yu-Hsueh Lin Method for plating film on surface of heat dissipation module and film-plated heat dissipation module
CN101736312B (en) * 2008-11-26 2012-11-21 林玉雪 Surface coating method of cooling module
US10433463B2 (en) * 2011-10-20 2019-10-01 Crucible Intellectual Property, Llc Bulk amorphous alloy heat sink
DE102018101453A1 (en) * 2018-01-23 2019-07-25 Borgwarner Ludwigsburg Gmbh Heating device and method for producing a heating rod
WO2019145795A2 (en) 2018-01-26 2019-08-01 Cellink Ab Systems and methods for optical assessments of bioink printability
US11186736B2 (en) 2018-10-10 2021-11-30 Cellink Ab Double network bioinks
WO2020157077A2 (en) * 2019-01-28 2020-08-06 Cellink Ab A compact fluorescence microscope and a cell monitoring system
US11826951B2 (en) 2019-09-06 2023-11-28 Cellink Ab Temperature-controlled multi-material overprinting

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0344485A (en) * 1989-07-12 1991-02-26 Matsushita Refrig Co Ltd Fin material for heat exchanger
US5031029A (en) * 1990-04-04 1991-07-09 International Business Machines Corporation Copper device and use thereof with semiconductor devices
US5786633A (en) * 1992-01-23 1998-07-28 Siemens Aktiengesellschaft Semiconductor module having high insulating power and high thermal conductivity
US6131533A (en) * 1996-08-15 2000-10-17 Citizen Watch Co., Ltd. Jig for forming hard carbon film over inner surface of guide bush using the jig
JP2002228391A (en) * 2001-01-30 2002-08-14 Daikin Ind Ltd Air heat exchanger with fins

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5840427A (en) * 1996-05-21 1998-11-24 Teledyne Industries Incorporated Method for making corrosion resistant electrical components
US5981000A (en) * 1997-10-14 1999-11-09 International Business Machines Corporation Method for fabricating a thermally stable diamond-like carbon film
US6301333B1 (en) * 1999-12-30 2001-10-09 Genvac Aerospace Corp. Process for coating amorphous carbon coating on to an x-ray target
US6713179B2 (en) * 2000-05-24 2004-03-30 Guardian Industries Corp. Hydrophilic DLC on substrate with UV exposure
US6788841B2 (en) * 2002-01-16 2004-09-07 Genvac Corporation Diamond-like carbon heat sink for reflective optical switches and devices
US6891324B2 (en) * 2002-06-26 2005-05-10 Nanodynamics, Inc. Carbon-metal nano-composite materials for field emission cathodes and devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0344485A (en) * 1989-07-12 1991-02-26 Matsushita Refrig Co Ltd Fin material for heat exchanger
US5031029A (en) * 1990-04-04 1991-07-09 International Business Machines Corporation Copper device and use thereof with semiconductor devices
US5786633A (en) * 1992-01-23 1998-07-28 Siemens Aktiengesellschaft Semiconductor module having high insulating power and high thermal conductivity
US6131533A (en) * 1996-08-15 2000-10-17 Citizen Watch Co., Ltd. Jig for forming hard carbon film over inner surface of guide bush using the jig
JP2002228391A (en) * 2001-01-30 2002-08-14 Daikin Ind Ltd Air heat exchanger with fins

Also Published As

Publication number Publication date
WO2004092672A2 (en) 2004-10-28
NO20055165L (en) 2005-11-03
BRPI0409103A (en) 2006-04-04
CN1802881A (en) 2006-07-12
JP2006526075A (en) 2006-11-16
EP1611405A2 (en) 2006-01-04
US20040200599A1 (en) 2004-10-14

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