WO2004090700A1 - Hardware structure of computer - Google Patents

Abstract

Hardware structure of computer. (1) store up heat to radiate, heat is stored up by the greatly hot capacity of a shell or a heat-conductor; (2) Let tightly-paste as shield, restrain the two-way direct radiation of electromagnetic wave, it can obtain the better effect if fixing the heat source at reverse side of the circuit board; (3) solve the known problems of the radiate and shield technologys, provide better attachments for many kinds of combinations of the radiate, and provide necessary attachments for many kinds of computers which have newer function. The position of the heat source is close to the inside wall of the shell, and makes the heat-conductor of the heat source or of the heat source tightly-paste paste tightly to the inside walls of shell, wherein the heat-conductor have lower heat resistance. (1) The diameter or width and thickness of the cross section of the nearest heat route of the heat source pasting tightly to the inside walls of shell through heat-conductor is > 0.4mm, (2). and the route length of the nearest heat route is 0 - 277mm, (3). and the route length of the nearest heat route is 0 - 2400% of the diameter or the diagonal length of cross section of heat route.

Description

 Computer hardware structure

 The invention relates to the heat dissipation or shielding of a computer and its computer extension appliances. Background technique

 Known technologies usually use a heat sink to dissipate heat. For heat source radiators with large power consumption, they must also rely on active heat sinks such as electric fans or electric pumps.

 A. The operation of the electric fan or pump directly affects the normal operation of the service heat source, the plug of the electric fan is disconnected, and the power cord of the electric fan is roasted by the radiator and short-circuited.

 B. The jitter generated by the electric fan or the electric pump and the resonance caused by the jitter, as well as the interference of its inductive load on the power supply, have affected the contact reliability of the hard disk, the CPU and other nearby devices, and the speed and stability of the hard disk operation.

 C. A lot of dust is blown into the heat dissipation holes of the radiator; the external electric fan will also suck more dust; the internal electric fan will also collect a lot of dust, and all kinds of dust will be affected by moisture absorption, corrosion, heat dissipation and other factors. Damage the stability of various devices, such as the contact of memory, the operation of the optical drive, and the operation of the hard disk.

 D. A large amount of dust must be cleaned and maintained regularly, and the fans must be refueled for maintenance. The wear and tear of the fans is replaced, which increases the workload of maintenance and increases the incidence of failures.

 E. The heat dissipated by the radiator must also be dissipated by other electric fans. The secondary active heat dissipation generates secondary power consumption, which increases the configuration, workload and heat generation of the power circuit.

 F. The configuration of the radiator, the increase in the configuration of the active radiator and its supporting power supply system have increased the weight, volume, cost, and structural complexity of the computer, and the costs of manufacturing, assembly, carrying, and maintenance, as well as the cost of operation. Difficulty, etc.

 G. Increasing the power consumption of the portable machine brings troubles in operation and increase of battery use cost, and the increase of battery usage is not good for environmental protection.

 H. It is known that the heat sink components rely on the spring to adhere to the CPU heat dissipation surface. Since the chip parts in the middle of the CPU are small, the springs are designed to stably fix the heat sink, and the spring force is designed to be large. If the insulation protection layer is thin, it is easy to be crushed by the snap spring when the heat sink is installed. To prevent the heat sink from crushing the corner of the CPU, the insulation protection layer outside the core of the CPU must be thickened. The protective layer greatly affects the heat dissipation effect of the CPU core.

Confirm this I. The noise of electric fan rotation affects people's work.

 J. Larger and heavier heat sinks on the circuit board affect the vibration resistance of the system.

 K. For computers with multiple hard disks, such as servers, it is obviously inadequate to use multiple fans or multiple pumps to dissipate heat due to issues such as power consumption, number of sockets, and reliability.

 L. The cooling airflow channels take up a lot of housing space.

 The known heat dissipation method also uses a semiconductor cooling device to dissipate heat. Although the heat dissipation effect is improved, the dew condensation water generated by the semiconductor cooling device is likely to damage the heat source device. It seems that it must be between the heat source and the active heat sink. Add metal blocks that reduce the effect of heat transfer and heat dissipation, or design a special control heat transfer plate to use it with less condensation.

 With the increase of the speed of the hard disk, the high temperature generated by the hard disk during operation has affected the stability and performance of the hard disk. The magnetic storage medium of the hard disk is more resistant to high temperature than the semiconductor heat source. The hard disk heat sink known in the market has the structure of an electric fan box, and the disadvantages of the active heat dissipation still exist. Hard disks often copy and misappropriate each other. Fixing with bolts requires careful operation of tools, which makes disassembly difficult. Due to the resonance between the operation of the hard disk and the casing, the noise of the hard disk is relatively high during operation. Because the hard disk is directly fixed to the components inside the casing without any protection, the shock resistance of the hard disk is not good. When the system is running, a slight vibration of the casing will affect the operation of the hard disk.

 It is known that the metal shell of the computer mainframe is galvanized iron. Due to the high operating frequency of the computer, the radiation frequency band is very wide. For medium and low frequency radiation, a thick iron shell can serve as a shield, and for high frequency radiation due to high frequency eddy current resistance, the iron shell and its zinc coating The shielding effect is not good.

 At present, among the electric appliances with large power consumption and high working frequency, computers will obviously stand out. It is known that the fixed position of the heat source is relatively far away from the inner wall of the housing, and there is no contact with the inner wall of the housing. Due to the high input impedance, more and more CMOS devices are more and more applied. As the higher the operating frequency of the device, the sharper the digital signal pulses will be and the more it will interfere with the normal operation of other devices or components. The operating frequency is already rampant, and it will be higher and higher; as the size of the computer is getting smaller and smaller, the mutual interference of heat sources and the interference of heat sources to other components will also increase. The components include: a built-in modem, a television receiver, and the like. Summary of the Invention

 Use heat storage to dissipate heat, make full use of the large area of the shell that is in contact with air for heat dissipation, and more importantly, make full use of the large heat capacity of the shell or heat conductor for heat storage.

Shielding by being close to a house with open doors and windows is more like a shell with many vents. In the middle, more outdoor scenery is seen than near the wall, and more outsiders will see it. The two-way direct radiation of electromagnetic waves is similar. Various configurations of the invention have their own shielding effects.

 Overcoming the shortcomings of known heat dissipation and shielding technologies, newer types of computers provide the necessary accessories. The closest heat path length of the heat source through the solid core heat conductor or the container heat conductor against the inner wall of the shell is 0 ~ 33mm, including Omm, or, 33-66mm, including 33mm. Or, 66-99mm, including 66mm, or, 99-122mm, Contains 99mm, or, 122 ~ 155mm, Contains 122mm, or, 155 ~ 277mm, Contains 155 bandits,

 And the diameter or width and thickness of the cross section of the recent heat path are 0.4 ~ 0.8 mm, including 0.8 draws, or 0.8 ~ 1.6 mm, including 1.6 legs, or 1. 6 ~ 3.2mm, including 3.2mm. Or, 3.2 ~ 6.4mm, including 6.4mm, or, 6.4.4 ~ 12.8mm, including 12.8mm, or,> 12.8mm,

 And the length of the nearest heat path is 0 ~ 300% of the diameter or diagonal of the nearest heat path cross section, including 0%, or, 300 ~ 600%, 300%, or, 600 ~ 1200%, or 600%, or 1200 ~ 2400%, including 1200%, or, 2400 ~ 4800%, including 2400%.

 The close contact of the heat source with the inner wall of the housing means that the fixed position of the heat source is as close as possible to the inner wall of the housing. The heat source may choose to directly adhere to the inner wall of the housing. 0% of the round diameter or square diagonal length; the heat source can also be selected to indirectly contact the inner wall of the housing via a low thermal resistance heat conductor. The heat source is in close contact with the inner wall of the housing via a low thermal resistance heat conductor. For shielding, the low thermal resistance should have as much heat cross section as possible and a large shielding area.

 The nearest heat path length refers to the length between the part where the heat source is in close contact with the heat conductor and the part where the heat conductor is in close contact with the inner wall of the housing. OK, best = 0mm.

 The diameter or width and thickness of the cross section of the heat path refers to the total size of the smallest part of the total size where one or more cylinders or cuboids are separated and juxtaposed or superimposed closely, which is an important structural condition for achieving the purpose of the present invention. If a single layer or fewer layers of metal foil are used, the thermal resistance of the cross-sectional area of the heat path is large, and the large-width metal foil will increase the heat dissipation area inside the case, so that the heat transmitted to the inner wall of the case will be correspondingly reduced. Less shielding is not good.

 If multiple layers of thinner metal are used for thicker applications, the cross-sectional area of the heat path will increase quickly, and it will be beneficial to the contact flexibility between the heat conductor and the heat source and the inner wall of the housing.

The diameter or diagonal of the nearest cross section of the hot path refers to the total size of the smallest part where one or more cylinders or cuboids are separated and juxtaposed or closely stacked. In order to maintain a small thermal resistance, if the thermal path is longer, the cross-sectional area of the thermal path must be increased accordingly. Table 1 is a comparison example of the length of the nearest heat path and the diameter or diagonal of the nearest heat path cross section,

 Table 1

图 1外壳 1上部的左右散热孔各有一个电磁干扰辐射源 10，图 1和图 2外 壳 1的内壁和中部， 分别有热源 2和热源 3。 热源 2直接对外和直接受到的电 磁辐射都比热源 3少。 热源 2靠近外壳 1有助于利用外壳 1吸收更多的低频磁 力线。

The left and right heat dissipation holes in the upper part of the casing 1 in FIG. 1 each have an electromagnetic interference radiation source 10. The inner wall and the middle of the casing 1 in FIGS. 1 and 2 have heat sources 2 and 3 respectively. Heat source 2 receives less external and direct electromagnetic radiation than heat source 3. The proximity of the heat source 2 to the casing 1 helps to use the casing 1 to absorb more low-frequency magnetic field lines.

 About heat source

 The heat source at least includes or combines: single chip, or, integrated chip, or, CPU, or, GPU, or, Northbridge, or, hard disk, or, optical drive, or, high-power tube, or, battery, and Components of its heat source.

 The components of the heat source at least include or combine: a metal cover or shell combined with a hard disk, and a power supply unit combined with a high-power tube.

 The single chip refers to a chip in which one or more processor chips are integrated with other computer chips and manufactured in a single chip. The processor includes at least a microprocessor MPU, a central processing unit CPU, an image processor GPU, and a system processor.

 The integrated chip refers to a chip in which one or more processor chips are integrated and packaged with other computer chips. The interface of the chip includes or combines at least: ordinary flat pin interface, Slot l-like socket contact next to the CPU, refer to Figure 20, and contact with each other may be used in the future.

 The optical disc drive includes or combines at least: CD-R, CD-RW, DVD-R, DVD + R, DVD-RW, and the high-power tube includes or combines at least: a triode and a diode of a power supply system.

 The battery includes at least a rechargeable battery and a fuel cell. Fuel cells generate much more heat than rechargeable batteries, but the energy capacity of fuel cells is very large and is being valued by people. The effect of heat dissipation on fuel cells will directly affect the promotion and application of fuel cells. For the heat dissipation of fuel cells, refer to this document directly. Inventing the heat dissipation structure of other heat sources proceeds.

It is best to choose a heat source that is close to the inner wall of the casing. If all the heat sources are attached to the casing, the effect will be limited and the assembly will be more difficult. Focusing on the CPU as the focus of the invention, the largest heat, the highest frequency, leads It has the largest volume and small volume, the largest amount of heat, the most important heat dissipation, the highest frequency, the largest data flow, the most important shielding, the most leads, and it is afraid of the resonance of electric fans or pumps.

 Since the hard disk is a precision product of an electromechanical combination, there are also many leads, a large data flow, a large amount of heat, and the greatest fear of vibration, which is also good for the application of the present invention.

 About thermal conductor

 The heat conductor or heat sink of the prior art is insulated from the inner wall of the housing or has a large contact resistance, and its structure has not considered shielding.

 The heat-conducting body of the invention is in close contact with the housing, and the heat dissipation, heat conduction and shielding are considered, and the effect is also good.

 The material of the thermal conductor at least includes or combines: a metal or non-metal thermal conductor, a rigid or elastic thermal conductor. The heat conductor can be made of rubber or plastic to be an elastic heat conductor. The elastic heat conductor can reduce the hard damage of the heat source during installation and use, and can suppress resonance.

 The shape or structure of the heat-conducting body at least includes or combines: the elasticity of a square, an L-shape, a U-shape, a cylindrical shape, a square tube shape, a heat sink, a heat-conducting plate, and a small metal body with a diameter or a thickness of <5 mm. The thermal conductor can be a metal wire or a small piece or chip. The small metal body is good for shielding and heat conduction. For heat sources that should be considered for insulation, silicone rubber or other insulation layers can be added to the surface of the heat conductor. The heat conductor can be a solid core or a container heat conductor.

 The container heat-conducting body refers to various containers containing liquid or vapor, and sealed containers, heat-conducting bodies, or through-hole container heat-conducting bodies that can be replenished with liquid or vapor substances at any time can be selected. The minimum contains: a sealed liquid heat pipe, a sealed steam container heat conductor and a heat pipe.

 The function of the heat conductor is: ① When the heat radiation surface of the heat source and the inner wall of the housing have different heights or directions, the heat conductor can be used for thermal circuit connection. ② It can also strengthen the heat storage and reduce the temperature difference in various parts of the shell. ③ It can also cooperate with the inner wall of the shell to form electromagnetic wave isolation and low-frequency electromagnetic absorption of heat sources. ④ For the contacts that may be used in the future, which are pressed against each other, to contact the chip heat source, the heat conductor will replace the heat sink to fix the chip heat source.

 The heat source, heat conductor, and the inner wall of the housing. The parts that are in close contact with each other can be made of soft thermally conductive materials such as thermally conductive silica gel or graphite film, aluminum foil or copper film pads, or phase change thermal pads to establish a thermal conductive layer to enhance the thermal conductive effect.

 About the shell

The inner wall of the shell at least contains or combines: a panel, a bottom plate, a side, a door or a cover of the shell. The shell part, for a computer combined with a shell and a keyboard, includes a keyboard key and a keyboard combined with the shell Peripheral parts.

 The inner wall of the shell at least includes or combines: an upward inner wall, or, a downward inner wall, or, a left inner wall, or, a right inner wall, or, a forward inner wall, or a rear inner wall. Each heat source should be distributed as much as possible on various parts of the inner wall of the enclosure. For example: Fix the CPU on the upper inner wall so that heat can be transferred to other parts of the casing as quickly as possible. Since hard disks generate less heat than other semiconductor device heat sources, the main reason is to keep the hard disks as far away from other heat sources as possible so that The hard disk makes better use of the inner wall of the casing for heat dissipation. The hard disk is fixed on the inner wall facing away from the CPU with large heat; the optical disc drive is fixed on the left inner wall; the high-power tube is fixed on the right inner wall.

 The shell includes or combines at least: a flat metal plate shell, a metal plate shell with a bending groove, a partially thickened shell fixed on the surface of the shell with a metal plate, a shell partially or entirely of a metal profile, a metal layer and Non-metallic combined shell, metal-containing composite shell. If a metal-containing synthetic material is used to make the casing, the thickness, especially the fixing structure of the internal components, is necessarily different from that of the metal casing.

 The metal profile shell refers to a structure in which other metal members are combined on the inner wall of the shell material. Minimal inclusion: casting, cold forging, rolling edge, hot pressing, extrusion.

 ① It is known that the circuit boards that are fixed inside the shell are fixed on independent metal frames and are not directly connected to the inner wall of the shell.

 The circuit board erected and fixed inside the housing of the present invention can choose a component directly fixed to the inner wall of the housing, that is, the inner wall of the housing has a component directly fixed to the vertical circuit board. This structure greatly simplifies the structure, and its components can be stamped with the housing and welded parts. , 'Accessories gluing or other methods to manufacture or fix on the inner wall of the shell, see Example 2 in Figure 4. The fixing member at least includes or combines: a threaded metal member. The erected circuit board includes not only 90 ° vertical erection, but also when the inner wall of the housing is inclined and the circuit board is also inclined. The erection angle of the erected circuit board is 10 ~ 30 ~ 60 ~ 90 °.

 ② For better heat dissipation and shielding, you can choose to add a shaving treatment layer on the inner wall of the shell. The shaving method can be a known method such as sand blasting and a blackening layer. The shell has a plating layer of gold or silver or other metal with a resistivity less than copper. The plating layer can be selected as the outermost layer or the middle layer or the bottom layer. The shell can be first plated with copper of 30 ~ 50 μm and then plated ~ 20 μm silver.

③ In the present invention, the high-power tube can be directly fixed to the inner wall of the housing and fixed on the reverse side of the circuit board or next to the circuit board, which minimizes the way for the heat source to closely contact the housing for heat dissipation, and reduces the capacitance next to the high-power tube Heating temperature. In order to strengthen the shielding of the circuit board, the shielding cover of the circuit board can be directly fixed on the inner wall of the housing. ④ In order to allow the heat sources with different heights on the common circuit board to adhere to the inner wall of the housing, the structure of the inner wall of the housing can be selected: at the position of the housing, the height and height, the boss surface corresponding to the heat source, such as a thin elastic material The boss surface can also apply a pressing elastic force to the heat source, the heat conductor, and the inner wall of the shell in series. A heat-conducting plate corresponding to the heat source is provided on the inner wall of the housing. The added heat-conducting plate can also speed up heat conduction. The heat-conducting plate can also be optionally installed on the outer wall of the housing.

 ⑤ For the fixing of hard disks, recorders and other drives, you can use bolts directly from the outside of the shell to fix the screw holes on the bottom or side of the drive. You can also choose to seal the hard disk inside the noise-proof box, and then fix the noise-proof box on the inner wall of the shell. When the end of the bolt is exposed on the side or top of the housing, the end of the bolt should be beautified. Of course, in order to make the heat source on the circuit board more reliable and more convenient to adhere to the inner wall of the housing, the fixing structure with the exposed ends of the bolts can also be selected, and the screw holes on the other side of the circuit board can be fixed with the bolts. A component of a fixed heat source or a heat source assembly is provided on the outer wall of the housing of the present invention.

 ⑥ The thickness of the stamped material or welding material of the known shell is 0. 6 ~ 1. Omra.

 The present invention can choose to increase the thickness of the material of the stamped or welded parts of the shell, which can be a thicker overall thickness, or it can be used at a certain part of the shell's stamped or welded parts, especially near the heat source, using forging, electric welding, Fixing structures such as riveting adhere to the thickened heat conductor, or when the heat source is installed in the shell, use a bolt or a spring card to adhere the thick heat conductor to increase the total thickness of the single or multiple layers of the shell material.

 The total thickness of a certain part of the material that can be selected for the stamping or welding of the shell is 1. 25 ~ 1. 35mm, including 1. 35mm, or, 1. 35 ~ L 55mm, including 1. 55mm, or, 1. 55 ~ 2.5 Legs, including 2.5mm, or, 2.5 ~ 3.5mm, including 3.5mm, or, 3.5 ~ 4.5mm, including .5mm, or> 4.5mm.

 About the combination of heat source near the inner wall of the shell

 ① It is known that various devices and chip heat sources of common circuit boards and CPU sockets are designed on the front surface of the common surface of the circuit board.

In order to make the chip heat source close to the inner wall of the housing, the present invention may choose to design the chip heat source or the socket of the chip heat source on the reverse side of the circuit board. For the chip heat source or chip heat source socket on the reverse side of the circuit board, you can choose to solder manually or automatically. For example: After the reflow and wave soldering of the circuit board are completed, refer to the method of scraping solder paste on a steel screen for reflow soldering, apply solder paste to the chip heat source hole of the PCB board, and then use the middle opening to expose and shield the surrounding metal with folds. The cover is used to cover the peripheral positions. The chip heat source hole exposed at the middle of the metal cover is heated with a hot air gun to heat the solder paste. Figures 8 and 9 are a bottom view and a front view of the square metal cover, respectively. You can also choose to apply solder paste to the chip heat source hole of the PCB board when scraping the solder paste on the stencil of the PCB, and then install the chip heat source or CPU socket and temporarily support it with the support plate. The PCB is reflowed at the same time.

 When the circuit board is debugged and repaired, the CPU should fix the temporary heat sink. For this reason, the known heat sink fixing card on the CPU socket should still be retained.

 The chip heat source is designed on the reverse side of the circuit board. It not only uses the surface of the circuit board or the copper foil of the sandwich to shield the mutual interference between the heat source and other devices, but also reduces the occupation of the circuit board area by the heat source, and makes full use of the original empty circuit board. The space between the housing and the inner wall of the housing creates convenience for reducing the area of the circuit board and the volume of the whole machine. Moreover, the plane of the circuit board and the plane of the inner wall of the housing are relatively large, thereby avoiding the installation of a radiator with a small plane area. When the CPU is reached, the corners of the CPU are crushed due to more tilt and pressure. The structure of the CPU on the reverse side of the circuit board can appropriately reduce the thickness of the outer package insulation layer of the CPU core. In this way, it can greatly reduce Improve the heat dissipation effect of the CPU core. The close proximity of the CPU core to a large area of metal is beneficial to the shielding effect.

 A small removable and replaceable baffle is connected between the keyboard socket of the computer motherboard and other nearby sockets and the casing. It is known that the fixing base of the metal plate of the computer motherboard card and the casing are fixed and cannot be moved or exchanged.

 If the computer of the present invention fixes the heat source on the back of the motherboard, there may be different thicknesses for the same heat source. In order to ensure the proper cooperation between the keyboard socket and other nearby sockets and the shell, and to ensure the metal plate of the card and its fixing seat For proper cooperation, you can choose to change or increase or decrease the thickness of the heat conductor between the heat source and the shell or whether there is a heat conductor; you can also choose to use an elastic heat conductor between the heat source and the shell; you can also choose to connect the keyboard socket and its vicinity. The small bezel of the socket and the fixed seat of the card are combined into a large bezel, and the two sides of the large bezel above the front face of the motherboard can be moved with the sliding grooves of the casing.

 ② The graphics card slots of known computer circuit boards are designed in the middle of the circuit board.

 In order to facilitate the chip heat source to adhere to the inner wall of the housing, the present invention may choose to design the slot of the graphics card on the side of the circuit board.

 ③ In order to better dissipate the heat from the case and the inside of the case to the air, and to reduce the heat transferred to the case through the circuit board, or to return to the inside of the case via the convection between the circuit board and the case, the heat source can be selected. Between the circuit board and the casing, there is a heat insulation plate or a channel for airflow communication with the exterior of the casing.

 The heat insulation plate is made of an insulating material, and has a corresponding heat source hole at a position corresponding to the heat source, so that the heat source or the heat conductor of the heat source conducts heat to the inner wall of the housing through the heat source hole.

 The material of the channel can be selected from metal, plastic or other materials.

The structure of the channel contains or combines at least: the shell and the channel member are produced at the same time or separately after the production, and the combination of the shell and the channel member is more suitable for portable models; the clamp between the shell and the circuit board Inside the layer, the channel ribs are used as sides to form a channel. The combination of the shell channel and the circuit board channel is more suitable for desktop models.

 At the exit end of the passage, a continuous working electric fan or a temperature-controlled electric fan can be set for use in the wild summer temperature. The fan can be selected in combination with a housing or a channel accessory.

 The channel ribs can be combined with the heat conductor, which can reduce the temperature difference in various positions of the shell.

 ④ In order to make the heat source, the heat conductor, and the inner wall of the shell more closely adhere to each other, there can be an elastic sheet member on the outer side of the heat source and the heat conductor and the inner wall of the shell in series. The series structure is compressed, and the point of elastic force is in series On the outside of the combination, the direction of the elastic force is the direction in which the heat source, the heat conductor, and the inner wall of the housing are in close contact with each other.

 The spring piece can be made of plastic, or you can choose a metal plate to punch into the spring piece. You can also choose a harder metal wire to make a spring card. elastic force.

 For the fixing of the elastic piece, it is optional to fix the threaded metal body with a structure such as welding or pasting on the inner wall of the shell in advance, and then fix it with the bolt and the two ends of the elastic body or the surrounding bolt holes. The fixing of the elastic piece can also refer to the fixing structure of the radiator, and it can be fixed with a spring card.

 For a server with multiple CPU structures such as a common circuit board with multiple heat sources, and for a large-span close-fit structure with a heat source in the middle of the circuit board, it is very suitable to use the elastic sheet to apply close pressure to each other.

 For drives such as hard disks, you can choose to use a structure such as a shrapnel to directly squeeze the drive against the inner wall of the casing, which is convenient for disassembly and assembly of the drive. You can also install the hard disk inside the hard disk cover, and then squeeze it together with the hard disk cover to press it against the inner wall of the casing. The hard disk is fixed by adding a hard disk cover, which is good for shock resistance and resonance suppression.

 Application comparison of various computer models

 The computer includes at least: IBM compatible computer and Apple computer; the minimum includes: server, workstation, industrial computer, business machine, home machine; the minimum includes: display screen and host computer; the minimum includes: a. Cabinet computer, b .Desktop computer, c. Network computer, d. Pocket computer, e.-computer, f. Palmtop computer, g. Portable computer, h. Tablet computer, i. Dedicated computer, j. Computer peripherals, k. Computer Expansion Appliance.

 a. The cabinet computer refers to a variety of computers suitable for ground placement, including at least: a heavier computer such as a tower computer server.

b. The desktop computer refers to a variety of computers suitable for desktop placement, including at least: horizontal computers (including: rack servers, blade servers), and vertical computers. c. The network computer refers to a desktop computer without a hard disk.

 d. The pocket computer refers to a small computer host without a display.

 e. The all-in-one computer refers to a combined display of 14. 5 to 15. 5 inches, including 15. 5 inches, or 15. 5 to 16. 5 inches, including 16. 5 inches, or 16. 5 ~ 17.5 inches, containing 17.5 inches, or, 17.5 ~: 18.5 inches, containing 18.5 inches, or, 18.5 ~; 19.5 inches, containing 19.5 inches, or, > 19. 5-inch computer, with or without keyboard, for example: Computer with 17-inch display and keyboard.

 f. The handheld computer refers to a combined display of 1 to 6. 5 inches, including 6.5 inches, or, 6. 5 to 8 inches, including 8 inches, or, 8 to 9. 5 inches, including 9 5 inches, or, 9. 5 to 11 inches, including: 11 inches, or, 11 to 12. 5 inches, including 12. 5 inches computer. For example:: Notepad computer.

 g. The portable computer refers to a computer whose combined display screen is larger than a palm computer and smaller than an all-in-one computer, and the display screen is combined with a keyboard with a flip connection, and has a cooling fan or a cooling pump, for example: no battery configuration Mobile PC.

 h. The tablet computer refers to a combined display screen that is larger than a palm computer and smaller than an all-in-one computer, excluding other computers such as a portable computer, such as a tablet PC, a smart display, a wireless display, an e-reader, and a rotatable display. Computer etc.

 i. The special computer refers to a display with a CPU, a video player, a game console, a mobile phone, a watch, and a color TV.

 j. The peripheral electrical appliances of the computer at least include: a monitor, a switch, a router, a hub, a modem, a disk array, a projector, and a mobile drive for external use.

 k. The computer's extended electrical appliances at least include or combine: various audio-visual electrical appliances with hard disks. The application and combination of various heat sources, heat conductors and shells of the present invention have great differences and limitations in their application effects. For cabinet computers and desktop computers with larger casings, because of the thicker casing material, the use of the casing to store heat and shield the effect is the best, more importantly for the server, especially for computers that require absolute reliability in important occasions, heat storage The reliability has been brought into play here.

 For tablet computers and special-purpose computers, due to the special emphasis on slimness, low power consumption, and no noise, although the direct heat storage is reduced by using the present invention, the series of computers usually use low-power and relatively low-speed CPU heat itself. The present invention The structure of the heat source close to the shell can be greatly matched, and the structure of close heat storage body outside the body for large heat storage can completely solve the problem of heat storage.

 As for a portable computer, since the requirements for lightness, thinness, and low noise, especially the noise-free habit are relatively low, the importance of utilizing the structure of the present invention is slightly lower than that of other computers.

The invention can also be applied to other appliances, but the necessity and applicability are reduced. BRIEF DESCRIPTION OF THE DRAWINGS

 Figure 1 is a schematic diagram of the technical issues regarding the direct and direct exposure of the heat source to electromagnetic wave radiation.

 FIG. 2 is a schematic diagram of a technical issue regarding direct radiation of electromagnetic waves by a heat source.

 FIG. 3 is a schematic diagram of the heat source of the stand-up computer near the inner wall of the housing and the nearest heat path of the heat conductor in Example 1. FIG. FIG. 4 is an enlarged view of a combination of a square groove with a cylindrical blind hole screw hole member 41 inside the casing 1 made of a metal profile.

 Fig. 5 is an enlarged view of a combination of trapezoidal grooves and cylindrical through-hole screw holes 41 on the inner wall of the casing 1 made of metal profile.

 Fig. 6 is an enlarged view of a combination of trapezoidal grooves with upper and lower trapezoidal grooves on the inner wall of the casing 1 made of metal profile.

 Fig. 7 is an enlarged view of a combination of a casing 1 made of a metal profile or a metal plate and a metal plate opening screw hole member 41.

 Fig. 8 is a side view of the heat source of the tablet computer near the inner wall of the case in Example 2.

 Figure 9 is a bottom view of a metal cover used to shield the surrounding devices from the hot air when the chip heat source and its socket are fixed on the reverse side of the circuit board.

 FIG. 10 is a front view of FIG. 3.

 Fig. 11 is a plan view of Example 3 with the heat source of the color display or color television of the fluorescent screen abutting the inner wall of the casing.

 Fig. 12 is a perspective view of a passageway between a circuit board and a case of a stand-up computer, and a fixed side view of a hard disk and an optical drive in Example 4.

 FIG. 13 is a perspective view of a hard disk case for fixing a hard disk.

 Fig. 14 is an enlarged front view of Example 5 in which the pins fixed on the reverse side of the circuit board are in contact with both sides of the inner wall of the CPU against the inner wall of the housing, and the double-sided shield is enlarged.

 FIG. 15 is a left side view of FIG. 14.

 Fig. 16 is an enlarged front view of Example 6 in which the pins fixed on the front side of the circuit board contact the CPU against the inner wall of the housing via the heat conductor.

 FIG. 17 is a left side view of FIG. 16.

 Fig. 18 is an enlarged front view of Example 7 in which the pins fixed on the front side of the circuit board are in contact with both sides of the inner wall of the CPU against the inner wall of the housing, and the double-sided shield is enlarged.

 FIG. 19 is a left side view of FIG. 18.

FIG. 20 is an enlarged front view of Example 8 with the CPU in contact with the socket against the inner wall of the casing. FIG. 21 is another enlarged left side view of Example 9 in which the pins fixed on the front side of the circuit board are in contact with the CPU and the inner wall of the housing is close to both sides to dissipate heat and shield.

 Table 2: Marking description of accessories

具体实施方式

detailed description

 Example 1 and FIG. 3 are desktop computers. The inner wall of the casing 1 has components for directly fixing the circuit board 8 in the upright direction, heat conductors 15 with screw holes, and screw holes 44. Such fixing is different from the known technology.

 The front side of the circuit board 8 has a multi-lead socket 18, which can be used for external equipment connection. The heat source 2 passes through the U-shaped heat conductor 12 and the heat conductor 22 closely superimposed thereon, and indirectly adheres to the inner wall of the housing 1. The nearest heat path length = ab + bc + cd, and the heat conductor 12 and the heat conductor 22 are closely overlapped with the smallest thickness. Total thickness = e + f. The bolt 31 and the bolt 32 are combined with the screw hole member 41 and the screw hole member 42 through the flat washer 19, respectively, so that the heat conducting body 22, the heat conducting body 12, and the heat source 2 and the casing 1 are in close contact with each other.

 The lower part of the front of the circuit board 8 has a slot for the graphics card 58. The lower part of the graphics card 58 has a heat source 3 and a heat source 4. The heat source 3 is in close contact with the boss surface 11 in the lower part of the housing 1. The large heat source 4 is directly in close contact with the housing 1. The combination of 35 and the screw hole 45 of the graphics card 58 makes the heat source 3 and the heat source 4 closely contact the inner wall of the casing 1.

 A high-power tube 5 is fixed on the reverse side of the circuit board 8. The left and right sides of the high-power tube 5 are respectively provided with an insulating pad 43 and a heat-conducting plate 15. The heat-conducting plate 15 has screw holes fixed on the inner wall of the housing 1, and the circuit board 15 and bolts The 33 combination makes the high-power tube 5 close to the inner wall of the casing 1. The large-area heat-conducting plate 15 can reduce the temperature difference of the heat source portion of the casing 1.

The reverse side of the circuit board 8 is provided with a heat source 6 which is in close contact with the inner wall of the casing 1 via the heat conductor 16 of the liquid container. The heat conductor 16 of the device can store a large amount of heat. Bolts 33 and 34 are combined with screw holes 43 and 44 fixed to the inner wall of the casing 1, respectively. The bolts 33 and 34 fix the spring 9 in a large span, so that the heat source 6 The series combination of the heat conductor 16 and the inner wall of the housing is closely attached.

 Below the reverse side of the circuit board 8, there is a heat source 7, which is in close contact with the inner wall of the housing 1 via the L-shaped heat conductor 17, the bolts 36 and 37 are respectively screw holes 46 fixed to the inner wall of the housing 1 and screw holes fixed to the circuit board The combination of 47 makes the heat source 7, the heat conductor 17, and the inner wall of the casing 1 close to each other.

 In order to better achieve the purpose of the present invention, the right side of the casing 1 is made of a thickened material, which can be a common metal plate or a metal profile. For the close fixation of the heat source to the housing 1, you can choose to use bolt holes through the housing holes to fix the screw holes of the heat source; you can choose to use bolts to combine the screw holes inside the housing material to clamp the heat source; you can choose to combine the screws on the inner wall of the housing with bolts Hole piece to clamp the heat source; the spring card structure of the computer radiator can be used to fix the heat source. There are also many structures to choose from for the combined structure of the inner wall of the housing and the screw holes, for example: Figure 4, Figure 5, Figure 6, Figure 7.

 Fig. 4 shows an outer casing 1 made of a metal profile with an upper, lower, and larger opening square groove, and the square groove is combined with a cylindrical blind hole screw hole member 41.

 Fig. 5 is a casing 1 made of metal profile. The inner wall of the casing 1 has upper and lower small bird-shaped trapezoidal grooves. The trapezoidal grooves are combined with cylindrical through-hole screw holes 41.

 Fig. 6 shows a casing 1 made of a metal profile. The inner wall of the casing 1 has trapezoidal grooves with large and small bird tails. The trapezoidal grooves are combined with metal plate bayonet screw holes 41.

 Fig. 7 shows a combination of a shell 1 made of a metal profile or a metal plate and a metal plate opening screw hole member 41. The screw hole member 41 and the shell 1 can be fixed by gluing, spot welding, or riveting.

 Example 2, FIG. 8 is a heat source 2 fixed to a socket 62 behind a small computer circuit board 8, a heat source 3 attached to the inner wall of the housing 1 via a square heat conductor 13, and a heat source 4 directly attached to the inner wall of the housing 1, There is also a heat source 5 which is raised by an insulating pad 52. Bolts 31 and bolts 32 are combined with spring pieces 9 to be combined with screw holes 41 and screw holes 42 fixed above the circuit board 8, respectively, so that the thinner shell 1 is in close contact with the heat source 3 and the heat source 4.

 Example 3, FIG. 11 shows that the heat source 2 and the heat source 3 of the color display or color television of the fluorescent screen are in close contact with the inner wall of the casing 1. A heat source 2 and a heat source 3 are located on the reverse side of the circuit board 8 and are directly attached to the inner wall of the casing 1. For non-fluorescent screen tablets or color televisions, refer to other example structures.

Example 4, Fig. 12 There is a straight-through channel 28 and a labyrinth channel 29 between the desktop computer casing 1 and the circuit board of the fixed heat source 5 for air circulation to the outside of the casing 1. It is better to cooperate with heat storage in a hot summer environment. For the case 1 to store and dissipate heat, the fan 30 is more suitable for use in the wild or in harsh environments. Shell 1 There are a heat source optical drive 2, a heat source optical drive 3, and a heat source assembly with a hard disk 4 in a sealed box, which are directly attached to the inner wall of the casing 1.

 The hard disk 4 can also be installed in the hard disk cover of FIG. 13 and then fixed, which can better resist vibration, reduce noise and reduce resonance.

 Example 5, Figures 14 and 15, the front side of the CPU heat source 2 fixed on the reverse side of the circuit board 8 is directly attached to the inner wall of the housing 1, and the reverse side of the heat source 2 is also adhered to the inner wall of the housing 1 via the heat conductor 12 to form two sides of the heat source 2. Heat dissipation and double-sided shielding. On the reverse side of the circuit board 8, four bolts 31 are respectively combined with the screw holes of the heat conductor 12 to fix the heat conductor 12 on the front of the circuit board 8. The circuit board 8 is fixed by combining four bolts 33 with screw holes 43 fixed to the inner wall of the casing 1. In order to lock the heat source 2 after the circuit board 8 is fixed on the inner wall of the casing 1, the socket locking lever 62 of the heat source 2 is preferably extended to the outside of the circuit board 8.

 Example 6, FIG. 16 and FIG. 17, the CPU heat source 2 fixed on the front surface of the circuit board 8 is pressed against the inner wall of the casing 1 through the heat conductor 12. The opposite side of the heat source 2 with the socket 62 is provided with an elastic material 20 to support the heat source 2 to contact the heat conductor 12 more reliably. The heat conductor 12 is fixed on the front side of the circuit board 8 by combining four sets of bolts 31, 32, and screw holes 41. The heat conductor 12 has lateral through holes near the housing 1, and the inner walls of the left and right housings 1 of the heat conductor 12 have The snap ring 48 and the hook 49, the spring rod 50 passes through the through hole of the heat conductor 12, and the heat ring 12 is brought into close contact with the inner wall of the housing 1 by the snap ring 48, the hook 49, and the spring rod 50. The circuit board 8 is fixed by combining four sets of bolts 33 and sleeves 53 with screw holes in the inner wall of the casing 1 respectively.

 For contacting the chip heat source 2 which may be used in the future with mutually compacted contacts, the heat conductor 12 will replace the heat sink to fix the chip heat source 2 on the front side of the circuit board, which is a structure that can be directly applied.

 Example 7, FIG. 18 and FIG. 19, the CPU heat source 2 fixed on the front surface of the circuit board 8 is attached to the inner wall of the casing 1 through the heat conductor 12, and the through hole of the circuit board 8 on the reverse side of the heat source 2 passes through the heat conductor 22 with the heat pipe 72 structure. The opposite side of the heat source 2 is in close contact with the inner wall of the casing 1 through the heat conductor 22 to form double-sided heat dissipation and double-sided shielding. The heat conducting body 12 has vertical through holes near the casing 1. The lower and upper sides of the heat conducting body 12 each have a snap ring 48 and a hook 49. The spring rod 50 passes through the through hole of the heat conducting body 12 and depends on the snap ring 48 and the hook 49 make the heat conductor 12 abut against the inner wall of the casing 1. The circuit board 8 is fixed by combining four bolts 33 with screw holes 43 fixed to the inner wall of the casing 1, respectively.

 Example 8, Figure 20: The CPU heat source 2 in contact with the socket is in close contact with the inner wall of the housing 1 via the heat conductor 12, and the combination of the heat source 2 and the socket 62 is conductive with the circuit board. The heat conductor 12 presses the heat source 2 and relies on the circuit board 8 and the housing 1. The inner wall is snug.

Example 9, FIG. 21 The CPU heat source 2 fixed on the front side of the circuit board 8 is attached to the inner wall of the housing 1 via the L-shaped heat conductor 12, and the opposite side of the heat source 2 is attached to the inner wall of the housing 1 through the heat conductor 22 to form a double-sided heat sink Double-sided shielding. The heat conducting body 12 has a vertical through hole near the housing 1, and the heat conducting body 12 and the inner wall of the housing 1 are firmly attached to each other by means of a spring rod 50 below.

 The above description is for reference only, not limitation. The structure and function can be selected according to actual needs and combined and applied separately. Industrial applications

 Known heat sinks are isolated and fixed on the chip surface, which easily crushes the exposed chip core.

 The core temperature of the chip is the highest, and it is also the fastest, most obvious and most important part of heat transfer. The chip of the present invention directly adheres to the inner wall of the housing, or the chip is in close contact with the heat conductor with a large cross-sectional area of the heat path and the inner wall of the housing. Since the plane of the circuit board and the inner wall of the housing are relatively large, the chip core is prevented from being tilted and crushed. It helps promote the use of bare chip cores, helps to reduce the thickness of the package insulation layer of the chip core, and can greatly improve the heat dissipation effect of the chip core.

 The heat source is in close contact with the inner wall of the casing, which increases the resonance frequency of the casing and suppresses the resonance of the casing, which is conducive to the improvement of the overall performance and stability.

 The heat source is close to the inner wall of the shell, which greatly reduces the temperature difference between the inner and outer heat paths of the shell, reduces the heat inside the shell, improves the heat resistance performance, can reduce the air conditioner for low temperature service, and has a greater effect, reducing the number of air conditioners, saving Air-conditioning machine room, saving air-conditioning power consumption, no air-conditioning noise, high reliability, low cost, high efficiency, indirectly improving convenience (UPS can be used for computers, air-conditioning must prepare high-energy, high-noise engines), direct and indirect effects The high reliability, which prevents various failures in case of accident, is of great significance for military, aviation, aerospace, meteorology, scientific research, websites, servers, industrial control computers and other important fields, as well as high-end applications that must be continuously operated for a long time.

 Reduce the external noise of the radiator; reduce the noise of the air conditioner.

 Heat storage is used to dissipate heat, which is conducive to heat dissipation in the low-pressure environment of the plateau.

 People are accustomed to thinking about what scheme to use after fixing the location of the heat source, and what kind of heat-dissipating equipment to use, after absorbing the heat of the heat source to the heat sink material, and then dissipating it to the outside of the housing. People are accustomed to block radiators and ignore the heat storage of the sheet shell.

 Before fixing the position of the heat source in the present invention, first consider the position where the heat source is fixed, which can make the heat source directly close to or closer to the inner wall of the housing, so that heat can be transferred to the housing for storage or dissipation as soon as possible. The heat dissipation effect is improved, and the concept that the computer must rely on the heat dissipation device to dissipate heat is changed.

Known technology: mainly scattered, supplemented by storage. The technology of the present invention: mainly storage, supplemented by scattered. The improvement of performance easily leads to an increase in the heat of the heat source and an increase in the number of heat source devices. It is difficult to resolve the contradiction of high reliability and low cost. The invention reduces the temperature difference between the inside and outside of the shell, reduces the air flow inside and outside the shell, and reduces the difference between inside and outside the shell for heat dissipation. With almost zero cost and absolute reliability, it has solved the problem of high-reliability, low-cost, and low-noise heat dissipation that people have been unable to solve for many years. Such heat dissipation also helps shielding, which has long been expected.

 ① Heat source close to the shell can reduce or eliminate heat dissipation holes; ② The heat source and the heat conductor with a large cross-sectional area of the heat path are in close contact with the shell; ③ The heat source is fixed on the reverse side of the circuit board due to the isolation of the multilayer copper foil and the copper foil and The interlayer formed by the shell suppresses the mutual interference between the heat source and other devices, which all help to shield; help prevent the electromagnetic radiation of the computer from leaking information; help prevent damage by high-power microwaves.

 The present invention overcomes the disadvantages of A to L of the known technology described in the background to the greatest extent, and changes the disadvantages of the known technology into the effects of the present invention.

 With auxiliary solutions such as thicker shells, without the cooperation of active radiator components, the temperature rise of the heat source can be effectively controlled in the ordinary environment, which greatly reduces the necessity of using active radiator components. For higher standards or coping with the possible severe use environment, you can choose special heat sinks such as temperature-controlled electric fans, but the heat sinks are only auxiliary, not necessary.

 The heat source is close to the inner wall of the shell, which provides a supporting basis for combinations of double-sided heat dissipation, heat dissipation outside the shell, and external temperature measurement. Reducing or sealing the heat dissipation holes provides a technical basis for manufacturing new computers such as dust and sand protection, water and moisture resistance, and theft and vandal resistance.

Claims

1. A computer hardware structure, consisting of a heat source and a casing, characterized in that the closest heat path length of the heat source to the inner wall of the casing via the solid core or container heat conductor is 0 ~ 33mm, including 0mm, or 33- 66mm, including 33 recitations, or 66 to 99mm, including 66 wakes, or, 99 to 122 legs, including 99mm, or, 122 to 155ram, including 122mm, or, 155 to 277mm, including 155mm,  And the diameter or width and thickness of the cross section of the recent hot road are all 0.4 ~ 0.8mm, including 0.8. See, or, 0.8-1. 6 wake up, including 1. 6mm, or, 1.6 weight. ~ 3. 2mm, including 3.2mm, or, 3.2 ~ 6.4mm, including 6.4mm, or, 6. '1 ~ 12.8mra, including 12.8mm, or,> 12.8 wake up'  And the length of the nearest heat path is 0 ~ 300% of the diameter or diagonal of the nearest heat path cross section, including 0%, or, 300 ~ 600%, including 300%, or, 600 ~ 1200%, including 600%, or 1200 ~ 2400%, including 1200%, or, 2400 ~ 4800%, including 2400%.  2. The computer hardware structure according to claim 1, said hot source, comprising or combining: single chip, or, integrated chip, or, CPU, or, GPU, or, hard disk, or, optical disk drive , Or, high-power tubes, or batteries, and components of their heat sources.  3. The computer hardware structure according to claim 1, wherein the inner wall of the shell comprises or combines: a panel, a bottom plate, a side, a door or a cover of the shell, keyboard keys combined with the shell, and a peripheral portion of the keyboard.  4. The computer hardware structure according to claim 1, wherein the casing comprises or combines: a flat metal plate casing, a metal plate casing with a bending groove, and a metal plate fixed on the surface of the casing and partially thickened. Shell, shell partially or entirely of metal profile, shell of metal casting, shell of combination of metal layer and non-metal layer, shell of composite material structure containing metal.  5. The casing according to claim 1, characterized in that the casing contains or combines at least: the inner wall of the casing has a member directly fixing the erect circuit board; or the inner wall of the casing has a shaved layer or a blackened layer or a resistivity Electroplated layer smaller than copper; or, the inner wall of the shell is directly fixed with the shield of the circuit board; or the shell is provided with a boss surface or a heat conducting plate corresponding to the position of the heat source; or the outer wall of the shell is provided with a fixed heat source or a component having a heat source assembly; Alternatively, the total thickness of a certain part of the shell's stamped or welded material is 1. 25 ~ 1. 35 drawing 1, including 1. 35 wake, or 1. 35 ~ 1. 55 mm, 1.35 wake, Or, 1. 55 ~ 2.5mm, including 2.5mm, or, 2.5-5. 5mm, including 3.5mm, or, 3.5-4. 5mm, including 4.5mm, or, 4. 5 legs. 6. The computer hardware structure according to claim 1, wherein the heat source is close to the inside of the housing The structure of the wall includes or combines: designing the chip heat source or the socket of the chip heat source on the reverse side of the circuit board; or, designing the slot of the graphics card on the side of the circuit board; or, there is between the circuit board of the heat source and the housing A heat insulation plate or a channel communicating with the airflow outside the housing; or, there is an elastic sheet member on the outside of the series structure of the heat source and the heat conductor and the inner wall of the housing  7. The computer hardware structure according to claim 1, wherein the computer comprises at least: a cabinet computer, a desktop computer, a network computer, a pocket computer, an all-in-one computer, a palmtop computer, a portable computer, a tablet computer, a dedicated computer, Computer peripheral appliances, computer expansion appliances.  8. The computer hardware structure according to claim 7, characterized in that the integrated computer refers to a combination of 14. 5 to 15. 5 inches, including 15. 5 inches, or 15. 5 to 16. 5 inches, Including 16. 5 inches, or, 16. 5 ~ 17.5 inches, Including 17.5 inches, or, 17. 5 ~ 18.5 inches, Including 18. 5 inches, or, 18. 5 ~: 19. 5 Inch, various combination computers with 19.5 inch, or> 19. 5 inch display, you can choose to have or not keyboard.  9. The hardware structure of a computer according to claim 7, characterized in that the handheld computer refers to a combined display of 1 to 6. 5 inches, including 6. 5 inches, or 6. 5 to 8 inches, including 8 Inch, or, 8 to 9. 5 inches, including 9.5 inches, or, 9. 5 to: 11 inches, including 11 inches, or, 11 to 12. 5 inches, including 12. 5 inches of computers.