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WO2004072181A3 - Thermoconductive silicone composition - Google Patents

Thermoconductive silicone composition Download PDF

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Publication number
WO2004072181A3
WO2004072181A3 PCT/JP2004/001356 JP2004001356W WO2004072181A3 WO 2004072181 A3 WO2004072181 A3 WO 2004072181A3 JP 2004001356 W JP2004001356 W JP 2004001356W WO 2004072181 A3 WO2004072181 A3 WO 2004072181A3
Authority
WO
WIPO (PCT)
Prior art keywords
silicone composition
thermoconductive
thermoconductive silicone
integer
alkoxyalkyi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/001356
Other languages
French (fr)
Other versions
WO2004072181A2 (en
Inventor
Hiroshi Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Priority to US10/544,909 priority Critical patent/US7291671B2/en
Priority to EP04709348A priority patent/EP1592749B1/en
Priority to DE602004005670T priority patent/DE602004005670T2/en
Publication of WO2004072181A2 publication Critical patent/WO2004072181A2/en
Publication of WO2004072181A3 publication Critical patent/WO2004072181A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)

Abstract

A thermoconductive silicone composition comprising : (A) an organopolysiloxane (excluding component (C)), (B) a thermoconductive filler, and (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n (I), wherein each R1 is independently selected from monovalent hydrocarbon groups ; R2 is an oxygen atom or divalent hydrocarbon group ; R3 is an alkyl, alkoxyalkyi, alkenyl, or acyl ; n is an integer from 5 to 100 ; and a is an integer from 1 to 3.
PCT/JP2004/001356 2003-02-13 2004-02-09 Thermoconductive silicone composition Ceased WO2004072181A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/544,909 US7291671B2 (en) 2003-02-13 2004-02-09 Thermoconductive silicone composition
EP04709348A EP1592749B1 (en) 2003-02-13 2004-02-09 Thermoconductive silicone composition
DE602004005670T DE602004005670T2 (en) 2003-02-13 2004-02-09 HEAT-RESISTANT SILICONE COMPOSITION

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003034744A JP4646496B2 (en) 2003-02-13 2003-02-13 Thermally conductive silicone composition
JP2003-034744 2003-02-13

Publications (2)

Publication Number Publication Date
WO2004072181A2 WO2004072181A2 (en) 2004-08-26
WO2004072181A3 true WO2004072181A3 (en) 2005-02-24

Family

ID=32866278

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/001356 Ceased WO2004072181A2 (en) 2003-02-13 2004-02-09 Thermoconductive silicone composition

Country Status (9)

Country Link
US (1) US7291671B2 (en)
EP (1) EP1592749B1 (en)
JP (1) JP4646496B2 (en)
KR (1) KR100997372B1 (en)
AT (1) ATE358699T1 (en)
DE (1) DE602004005670T2 (en)
MY (1) MY135170A (en)
TW (1) TWI332518B (en)
WO (1) WO2004072181A2 (en)

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JP4687887B2 (en) * 2004-10-14 2011-05-25 信越化学工業株式会社 Thermally conductive silicone grease composition
JP4828146B2 (en) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 Thermally conductive silicone rubber composition
JP4828145B2 (en) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 Thermally conductive silicone rubber composition
JP5004433B2 (en) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 Curable silicone composition and cured product thereof
JP4569765B2 (en) * 2005-05-13 2010-10-27 信越化学工業株式会社 Room temperature curable silicone rubber composition for protecting electrical and electronic components, mounting circuit board, silver electrode and silver chip resistor
JP4811562B2 (en) * 2005-05-13 2011-11-09 信越化学工業株式会社 Room temperature curable organopolysiloxane composition
JP4933094B2 (en) * 2005-12-27 2012-05-16 信越化学工業株式会社 Thermally conductive silicone grease composition
CN101375395B (en) * 2006-01-26 2012-10-03 迈图高新材料日本合同公司 Heat dissipation material and semiconductor device using same
JP2007277387A (en) * 2006-04-06 2007-10-25 Shin Etsu Chem Co Ltd Thermally conductive silicone grease composition
JP4495749B2 (en) * 2006-06-16 2010-07-07 信越化学工業株式会社 Thermally conductive silicone grease composition
TWI419931B (en) * 2006-06-16 2013-12-21 信越化學工業股份有限公司 Thermal conductive polyoxygen grease composition
EP1878767A1 (en) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
GB0616021D0 (en) 2006-08-14 2006-09-20 Dow Corning Silicone release coating compositions
JP4514058B2 (en) 2006-08-30 2010-07-28 信越化学工業株式会社 Thermally conductive silicone composition and cured product thereof
JP2009203373A (en) * 2008-02-28 2009-09-10 Momentive Performance Materials Inc Thermoconductive silicone composition
JP5507059B2 (en) 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 Thermally conductive silicone composition and electronic device
JP5300408B2 (en) * 2008-10-21 2013-09-25 信越化学工業株式会社 Thermally conductive silicone grease composition
JP2010100784A (en) * 2008-10-27 2010-05-06 Asahi Kasei Corp Inorganic compound microparticle with modified surface, and its dispersion
WO2010107516A1 (en) 2009-03-16 2010-09-23 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP5131648B2 (en) * 2009-07-09 2013-01-30 信越化学工業株式会社 Thermally conductive silicone composition and thermally conductive silicone molding using the same
CN102648501A (en) 2009-12-04 2012-08-22 Abb研究有限公司 High voltage surge arrester
JP5534837B2 (en) * 2010-01-28 2014-07-02 東レ・ダウコーニング株式会社 Thermally conductive silicone rubber composition
JP5365572B2 (en) * 2010-04-13 2013-12-11 信越化学工業株式会社 Room temperature moisture thickening type thermally conductive silicone grease composition
JP5619487B2 (en) 2010-06-24 2014-11-05 東レ・ダウコーニング株式会社 Thermally conductive silicone grease composition
JP5367656B2 (en) * 2010-07-29 2013-12-11 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
JP2012077256A (en) * 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd Room temperature moisture-thickening heat-conductive silicone grease composition
JP5553006B2 (en) * 2010-11-12 2014-07-16 信越化学工業株式会社 Thermally conductive silicone grease composition
JP5733087B2 (en) 2011-07-29 2015-06-10 信越化学工業株式会社 Room temperature moisture thickening type thermally conductive silicone grease composition
JP5699901B2 (en) * 2011-10-24 2015-04-15 信越化学工業株式会社 Room temperature moisture thickening type thermally conductive silicone grease composition
JP2012052137A (en) * 2011-11-28 2012-03-15 Shin-Etsu Chemical Co Ltd Heat conductive silicone grease composition
CN104471012B (en) 2012-07-30 2017-03-29 道康宁公司 The preparation and application of heat conduction condensation reaction curable polyorganosiloxane compositionss and said composition
US20150240124A1 (en) * 2012-09-28 2015-08-27 Danmarks Tekniske Universitet Mechanically invisible polymer coatings
JP6213257B2 (en) * 2013-01-25 2017-10-18 セントラル硝子株式会社 Curable composition containing silicone and cured product thereof
WO2014129805A1 (en) * 2013-02-21 2014-08-28 제일모직주식회사 Thermally conductive resin composition
JP6568201B2 (en) * 2014-08-06 2019-08-28 ダウ シリコーンズ コーポレーション Organosiloxane composition and use thereof
JP5846323B2 (en) * 2015-01-22 2016-01-20 信越化学工業株式会社 Room temperature moisture thickening type thermally conductive silicone grease composition
CN104887109A (en) * 2015-05-21 2015-09-09 蚌埠市耀得保温容器有限公司 Heat and corrosion resistant vacuum bottle with long service life
CN106519700A (en) * 2015-09-09 2017-03-22 中兴通讯股份有限公司 High thermal conductivity composite interface material and preparation method thereof
JP6553520B2 (en) * 2016-01-14 2019-07-31 信越化学工業株式会社 Thermally conductive cured product, adhesive tape and adhesive sheet having the cured product
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JP2024142155A (en) * 2023-03-29 2024-10-10 信越化学工業株式会社 Organopolysiloxane
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EP0839869A2 (en) * 1996-10-29 1998-05-06 Dow Corning Toray Silicone Company, Limited Silicone rubber composition
EP1101798A2 (en) * 1999-11-15 2001-05-23 Dow Corning Toray Silicone Co., Ltd. Thermally conductive silicone rubber composition

Also Published As

Publication number Publication date
TWI332518B (en) 2010-11-01
DE602004005670D1 (en) 2007-05-16
KR100997372B1 (en) 2010-11-30
ATE358699T1 (en) 2007-04-15
EP1592749A2 (en) 2005-11-09
EP1592749B1 (en) 2007-04-04
JP4646496B2 (en) 2011-03-09
KR20050106009A (en) 2005-11-08
DE602004005670T2 (en) 2007-12-27
US20060135687A1 (en) 2006-06-22
JP2004262972A (en) 2004-09-24
MY135170A (en) 2008-02-29
US7291671B2 (en) 2007-11-06
TW200427781A (en) 2004-12-16
WO2004072181A2 (en) 2004-08-26

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