[go: up one dir, main page]

WO2004070363A1 - Boite a echantillon - Google Patents

Boite a echantillon Download PDF

Info

Publication number
WO2004070363A1
WO2004070363A1 PCT/NZ2004/000009 NZ2004000009W WO2004070363A1 WO 2004070363 A1 WO2004070363 A1 WO 2004070363A1 NZ 2004000009 W NZ2004000009 W NZ 2004000009W WO 2004070363 A1 WO2004070363 A1 WO 2004070363A1
Authority
WO
WIPO (PCT)
Prior art keywords
container
window
container according
sample
windows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/NZ2004/000009
Other languages
English (en)
Inventor
David Beaglehole
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beaglehole Instruments Ltd
Original Assignee
Beaglehole Instruments Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beaglehole Instruments Ltd filed Critical Beaglehole Instruments Ltd
Publication of WO2004070363A1 publication Critical patent/WO2004070363A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N21/0303—Optical path conditioning in cuvettes, e.g. windows; adapted optical elements or systems; path modifying or adjustment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like

Definitions

  • the invention relates to containers for the storage and transportation of samples, such as standard wafers for use in calibrating ellipsometers or other instruments.
  • Containers for protecting semiconductor wafers and the like are well known. Some of these containers hold a single wafer, and protect it from damage and contamination during transport or while the wafer is stored.
  • One type of prior art container is shown in Figures 1 to 4.
  • Figure 1 shows an exploded view of the lid 1 and the base 2 of the container.
  • the lid and base each have threaded portions 3, 4 such that they can be joined together to close the container.
  • the lid 1 has a sloping section 5.
  • the base includes a spring 7, which is formed of a resilient plastic and has a central portion with a number of limbs.
  • Figure 2 shows the container of Figure 1 when closed, but empty.
  • the container has a circular cross-section as shown in Figure 4.
  • Such containers are generally made from plastic such as polythene or polycarbonate.
  • Figure 3 shows the container of Figures 1 and 2, containing a wafer 10.
  • the wafer 10 is placed on the spring 7, and the lid is screwed onto the base. As the lid is screwed on, the wafer is pressed against the sloping section 5 of the lid 1.
  • the spring 7 compresses so that the wafer is securely held between the sloping section 5 and the spring 7.
  • Figure 4 shows a plan view of the base and spring of the container of Figures 1 to 3.
  • the spring 7 has a central region 11 and eight limbs 12.
  • the limbs 12 curve towards the base, as can be seen in Figures 1 to 3, providing an upwards force when the spring is compressed.
  • Calibration wafers are used for calibrating optical instruments, which are used for measuring various parameters including layer thicknesses.
  • ellipsometers are used for measuring the thicknesses of gate oxides and other layers. These instruments are able to measure thicknesses with an accuracy of less than 1 A.
  • the signal due to an adsorbed layer of water for example, can be as large as the signal due to a thin oxide layer, preventing accurate calibration and therefore preventing use of the instrument to the extent of its accuracy.
  • the problem is increased by the fact that the amount of adsorbed water contamination depends on humidity, which can vary markedly from day to day.
  • the lid of a standard container is transparent to some wavelengths of radiation.
  • it is not possible to make ellipsometric measurements through the lid as the plastic is highly stressed and exhibits significant birefringence. Indeed, most transparent plastics are severely stressed and show large birefringence. The uncertainty in this stress-induced birefringence prevents accurate measurements on an object within the container, without opening the container.
  • the angle that the beam must form with the sample results in an angle of incidence at the lid of around 75 degrees (for a silicon wafer), so that multiple reflections in the lid result in a spreading of the beam and further unpredictable effects on the polarisation of the detected beam due to the lid's birefringence.
  • the invention provides a method of performing a measurement on a sample, including: conveying a container containing the sample into a measurement position, the container having at least one window; irradiating the sample through one of the windows with an irradiation beam; detecting a return beam which passes through one of the windows to generate one or more detection values; and processing the detection values to measure a property of the sample.
  • the processing of the detection values depends on the application. For instance the detection values might be processed to determine a property such as reflectivity or fluorescence, or to measure a phase shift induced by the sample on the irradiation beam (for instance in an ellipsometry measurement).
  • the container preferably includes a sample support (such as the base of the container, or a specially adapted resilient support); a first window section forming a first angle with respect to the sample support and allowing irradiation, when in use, of a sample on the sample support; and a second window section forming a second angle with respect to the sample support and allowing, when in use, the return beam from the sample to exit the container.
  • the angles can then be selected to allow the irradiation and return beams at the desired angle to enter and leave the container perpendicular to the surfaces of the window sections, thus minimising the phase shift described above.
  • the two window "sections" may be separate parts of a single window, or may be separate windows each housed within respective frames.
  • the invention provides a container suitable for conveying a sample, the container including one or more windows which allow irradiation of the sample and detection of a return beam through the one or more windows.
  • the one or more windows may be formed from a different material to the body of the container. This enables the window(s) to be formed from a material that is transparent to wavelengths of interest, whilst the material forming the rest of the container can be chosen for other properties (for instance strength, cost etc).
  • the container may have a single window housed in a single frame, the single window having a first portion for transmission of the irradiation beam and a second portion for transmission of the return beam.
  • the window may be annular, frusto-conical or spherical.
  • the window is spherical, as this shape minimises strain within the window, which can lead to birefringence.
  • the container may have a first window housed in a first frame for transmission of the irradiation beam and a second window housed in a second frame for transmission of the return beam.
  • the container also includes one or more adsorbent materials to adsorb vapours and gases within the container.
  • the adsorbent material(s) are selected to adsorb particular vapours and may include activated carbon and/or silica gel.
  • the adsorbent materials may be contained behind a porous barrier.
  • the container may be used to hold a semiconductor or other wafer of any shape, including a circular semiconductor wafer.
  • the or each window is annealed. This process minimises strains and stresses, which may cause birefringence.
  • Figure 1 shows an exploded cross-section of a prior art wafer container
  • Figure 2 shows a cross-section of the container of Figure 1
  • Figure 3 shows a cross-section of the container of Figures 1 and 2, containing a wafer
  • Figure 4 shows a plan view of the base and spring of the container of Figures 1 to 3;
  • Figure 5 shows a cross-section of a first embodiment of a wafer container according to the invention
  • Figure 6 shows a plan view of the container of Figure 5;
  • Figure 7 shows the container of Figure 5 in use
  • Figure 8 shows a cross-section of a second embodiment of a wafer container according to the invention.
  • Figure 9 shows a plan view of the container of Figure 8;
  • Figure 10 shows a cross-section of a third embodiment of a wafer container according to the invention.
  • Figure 11 shows a plan view of the container of Figure 10
  • Figure 12 shows a cross-section of a fourth embodiment of a wafer container according to the invention.
  • Figure 13 shows an ellipsometer performing a measurement on a wafer contained in a sample container.
  • Figure 5 shows a cross-section of a first embodiment of a wafer container according to the invention.
  • the container is similar in construction to the prior art container shown in Figures 1 to 4, but with the addition of a window insert, as described in further detail below.
  • the container has a base 20, and a lid 21 screwed to the base by a threaded flange.
  • a wafer 22 is held securely between a sloping region 23 and a spring 24.
  • Some other form of sample support may also be suitable to ensure correct positioning of the wafer within the container.
  • the container may include an airtight seal between the lid and the base. The airtight seal may be achieved by an O-ring (not shown), or alternatively the threads may be made such that they form an airtight seal when the container is closed.
  • the lid also contains a square opening that receives a window insert with a base 25 and angled planar side walls 26-29, all shown in the plan view of Figure 6.
  • the base 25 and side walls 28,29 are formed from an opaque material, such as polycarbonate, but the side walls 26,27 are made from a different material that is transparent and exhibits a low birefringence, thus forming a pair of angled windows which permit measurement of the wafer.
  • the window material is selected to be transparent at the wavelength of interest. For example, fused silica may be used if measurements are to be performed in the deep ultraviolet, while Pyrex may be used for measurements in the visible spectral region.
  • a light beam entering the container through the window 26 perpendicular to its surface is reflected from the wafer surface and exits the container through window 27 perpendicular to its surface.
  • the angle of incidence of the light beam is effectively fixed by the angle of the windows 26,27 relative to the spring 24.
  • the window insert is formed with a circular cap 40 and a single annular frustoconical side wall 41 formed from a transparent material with low birefringence.
  • the side wall 41 provides a single window with a first portion which can be used to transmit the irradiation beam and a second opposite portion which can be used to transmit the return beam.
  • the curved window enables the wafer to be illuminated from any azimuthal angle, although the angle of elevation of the beam is fixed by the angle of the window.
  • Figure 10 shows a preferred third embodiment of the invention.
  • a window 30 is mounted in the lid of the container.
  • the window 30 is substantially spherical in shape, with the centre of curvature of the sphere located in the plane of the wafer surface. Light incident perpendicular to the surface of the window and striking the wafer at the centre of curvature will also exit perpendicular to the surface of the window. The angle of incidence is limited only by how close the lid of the container is to the wafer.
  • the container of Figures 10 and 11 is formed by the following method.
  • a circular hole is formed in the lid of a standard wafer container, such as that shown in Figures 1 to 3.
  • the window is formed by blowing molten glass into a sphere of the desired size, and then cutting off the unwanted part of the sphere.
  • the window is then forced into the hole from the inside of the container lid, such that when it is fully inserted into the hole it forms a good contact with the hole around its circumference.
  • the join is sealed with a layer of airtight glue (not shown).
  • the window may have a flange (not shown) around its base to facilitate sealing to the container lid.
  • a flange (not shown) around its base to facilitate sealing to the container lid.
  • Other methods of construction may also be suitable.
  • the window has a spherical shape, it also has the lowest possible strain. This results in the lowest possible birefringence.
  • the window may also be annealed, further reducing its birefringence.
  • One suitable process for annealing Pyrex is to heat the window insert to 560 degrees Celsius, anneal for ten minutes at this temperature and cool to room temperature over two hours.
  • the container also contains some amount of adsorbent 31.
  • This material adsorbs water vapour (and/or other vapours) from the air in the container, thereby further preventing contamination of the wafer surface.
  • the adsorbent may be activated carbon and/or any other suitable substance. Activated carbon adsorbs many organic vapours.
  • Silica gel is a suitable adsorbent of water vapour.
  • several adsorbents may be provided in the container, to adsorb several different vapours from the air in the container.
  • vapour it may also be possible to fill the container with a vapour by inserting, in a similar manner to the adsorbent, a material that will emit a vapour to prevent adsorption of water or other vapours on the sample surface.
  • the adsorbent is contained behind a porous barrier 32, such that vapours in the container are able to be adsorbed, but the adsorbent cannot itself contaminate the wafer surface.
  • a further embodiment of the container is shown in Figure 12.
  • This container is the same as the container of Figure 10, but includes a vacuum outlet 40 closed by a valve 41. This allows the attachment of a vacuum pump to evacuate the container such that the amount of vapour in the container is significantly reduced. After evacuation the valve 41 is closed.
  • This mechanism may be used in a container with or without an adsorbent.
  • the valve may also be used to fill the container with a dry gas (nitrogen for example). If the gas is at greater than atmospheric pressure then any leakage of gases into the container will be lessened.
  • a simple ellipsometer is shown in Figure 13 performing a measurement on a calibration sample in a container of the type shown in Figure 10.
  • the calibration sample can be shipped or air-freighted to a customer in the container, and then conveyed directly to the ellipsometer for use in a calibration routine, without having to expose the sample to the atmosphere at any time.
  • the sample can also be stored in the container by the customer over an extended period, and used in later calibration routines on the same instrument or other instruments.
  • Light from a light source 51 passes through a polarizer 52, forming a beam of plane- polarized light.
  • the light source may be a laser or white light source, depending on the application.
  • the beam passes through a modulator 53, before striking the surface of the sample in the container.
  • the reflected light passes through a second polarizer 54 (usually called the analyser) and enters a light detector 55.
  • the signals from the light detector are processed by a computer 56 to calculate the ellipticity of the light beam which can be used to calibrate the ellipsometer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

La présente invention concerne une boîte convenant au transport d'un échantillon, cette boîte étant pourvue d'au moins une fenêtre permettant de soumettre l'échantillon à un rayonnement et de détecter le faisceau de retour traversant les fenêtres. Les fenêtres peuvent être en Pyrex, en verre de silice, ou en tout autre matériau approprié. La boîte convient au rangement d'échantillons tels que des plaquettes d'étalonnage servant aux routines d'étalonnage d'un instrument d'optique tel qu'un ellipsomètre. Un mode de réalisation préféré comporte une fenêtre sphérique garantissant que les faisceaux du rayonnement et de retour traversent les fenêtres en angle droit. Les fenêtres peuvent être recuites pour atténuer la biréfringence. Pour adsorber les gaz à l'intérieur de la boîte, elle peut inclure au moins un matériau adsorbant tel que le charbon actif ou le gel de silice.
PCT/NZ2004/000009 2003-02-03 2004-01-29 Boite a echantillon Ceased WO2004070363A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NZ52393603 2003-02-03
NZ523936 2003-02-03

Publications (1)

Publication Number Publication Date
WO2004070363A1 true WO2004070363A1 (fr) 2004-08-19

Family

ID=32844995

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NZ2004/000009 Ceased WO2004070363A1 (fr) 2003-02-03 2004-01-29 Boite a echantillon

Country Status (1)

Country Link
WO (1) WO2004070363A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114313A (ja) * 2009-11-30 2011-06-09 Sumika Chemical Analysis Service Ltd 基板収納容器および当該容器を搬送するための搬送容器
WO2012012324A1 (fr) * 2010-07-21 2012-01-26 Corning Incorporated Ensemble fenêtre optique de faible biréfringence
WO2016133805A1 (fr) * 2015-02-16 2016-08-25 Thermo Electron Scientific Instruments Llc Cellule à échantillon raman
CN110514627A (zh) * 2019-08-26 2019-11-29 松山湖材料实验室 硅片反射率测量方法及其测量装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD277123A1 (de) * 1988-11-17 1990-03-21 Univ Rostock Verfahren und anordnung zur schichtdickenbestimmung von deckschichten bei mehrschichtsystemen
WO1994011722A1 (fr) * 1992-11-12 1994-05-26 Santa Barbara Research Center Appareil et procede de mesure ellipsometrique depourvus de reflexions, pour de petites cellules d'echantillon
EP1102057A1 (fr) * 1999-11-17 2001-05-23 EG & G Perkin Elmer Ltd. Support d'échantillon utilisable en analyse spectroscopique
US20020024668A1 (en) * 2000-05-26 2002-02-28 Jean-Louis Stehle Method and apparatus for ellipsometric metrology for a sample contained in a chamber or the like
US20020118365A1 (en) * 2001-02-28 2002-08-29 Kessel Theodore Gerard Van Integrated wafer cassette metrology assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD277123A1 (de) * 1988-11-17 1990-03-21 Univ Rostock Verfahren und anordnung zur schichtdickenbestimmung von deckschichten bei mehrschichtsystemen
WO1994011722A1 (fr) * 1992-11-12 1994-05-26 Santa Barbara Research Center Appareil et procede de mesure ellipsometrique depourvus de reflexions, pour de petites cellules d'echantillon
EP1102057A1 (fr) * 1999-11-17 2001-05-23 EG & G Perkin Elmer Ltd. Support d'échantillon utilisable en analyse spectroscopique
US20020024668A1 (en) * 2000-05-26 2002-02-28 Jean-Louis Stehle Method and apparatus for ellipsometric metrology for a sample contained in a chamber or the like
US20020118365A1 (en) * 2001-02-28 2002-08-29 Kessel Theodore Gerard Van Integrated wafer cassette metrology assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114313A (ja) * 2009-11-30 2011-06-09 Sumika Chemical Analysis Service Ltd 基板収納容器および当該容器を搬送するための搬送容器
WO2012012324A1 (fr) * 2010-07-21 2012-01-26 Corning Incorporated Ensemble fenêtre optique de faible biréfringence
WO2016133805A1 (fr) * 2015-02-16 2016-08-25 Thermo Electron Scientific Instruments Llc Cellule à échantillon raman
CN110514627A (zh) * 2019-08-26 2019-11-29 松山湖材料实验室 硅片反射率测量方法及其测量装置
CN110514627B (zh) * 2019-08-26 2024-06-07 松山湖材料实验室 硅片反射率测量方法及其测量装置

Similar Documents

Publication Publication Date Title
EP3421972B1 (fr) Capteur infrarouge non dispersif pour dioxyde de carbone avec des miroirs recouverts d'une couche mince hydrophobique
US20020162384A1 (en) Method for determining gas accumulation rates
JP4445971B2 (ja) 自動ヘッドスペース分析のためのシステム及び方法
US8729472B2 (en) Systems and methods for permeability rate testing of barrier films
US20090323055A1 (en) Crds brewster gas cell
DE59408304D1 (de) System zur Bevorratung von Testelementen
US3926527A (en) Rotating gas correlation cell
CN101261216A (zh) 衰减全反射探头及设有该探头的分光计
SE1530046A1 (sv) System and method for determining the integrity of containers by optical measurement
EP2372344A1 (fr) Méthode d'analyse d'un composant gazeux dans un récipient hermétiquement fermé
US5321264A (en) Method for evaluating surface state of silicon wafer
WO2004070363A1 (fr) Boite a echantillon
TW200535071A (en) Ready-for-dispatch packaging for semiconductor wafers, and method for the ready-for-dispatch packaging of semiconductor wafers
US8462341B2 (en) Mounting for deviation angle self compensating substantially achromatic retarder
TW201636611A (zh) 在開放容器飲料中量測碳酸化位準的方法
AU2004296938A1 (en) Packaging
US7622310B2 (en) Contamination monitoring and control techniques for use with an optical metrology instrument
EP3193159A9 (fr) Groupe et procédé de mesure du contenu de gaz dans des récipients fermés et une installation automatique de remplissage et / ou d'emballage utilisant un tel groupe
US20140202979A1 (en) Apparatus for storage and sampling of de-ionized water samples and the like
JPH07502344A (ja) 小容積サンプルセルのための無反射の偏光解析システム
US20190162593A1 (en) Infrared spectrophotometer and method of storing window member
US20030218128A1 (en) Actinometric monitor for measuring irradiance in ultraviolet light reactors
Kalow Spectrophotometric determination of fluothane vapour
US20090116021A1 (en) Method and apparatus for determining composition and concentration of contaminants on a film encapsulated in a plasma display panel
JP2003004628A (ja) 分光分析用セル及び分光分析方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase