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WO2004062761A2 - Method for the purification of the process gas of a soldering furnace, soldering furnace and purification system for carrying out said method - Google Patents

Method for the purification of the process gas of a soldering furnace, soldering furnace and purification system for carrying out said method Download PDF

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Publication number
WO2004062761A2
WO2004062761A2 PCT/DE2003/004234 DE0304234W WO2004062761A2 WO 2004062761 A2 WO2004062761 A2 WO 2004062761A2 DE 0304234 W DE0304234 W DE 0304234W WO 2004062761 A2 WO2004062761 A2 WO 2004062761A2
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WO
WIPO (PCT)
Prior art keywords
process gas
soldering furnace
cleaned
gas
condensate trap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2003/004234
Other languages
German (de)
French (fr)
Other versions
WO2004062761A3 (en
Inventor
Hartmut Meier
Bernd Müller
Ulrich Wittreich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Rehm Thermal Systems GmbH
Siemens Corp
Original Assignee
Siemens AG
Rehm Thermal Systems GmbH
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Rehm Thermal Systems GmbH, Siemens Corp filed Critical Siemens AG
Publication of WO2004062761A2 publication Critical patent/WO2004062761A2/en
Publication of WO2004062761A3 publication Critical patent/WO2004062761A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B01D5/0033—Other features
    • B01D5/0036—Multiple-effect condensation; Fractional condensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means

Definitions

  • the invention relates to a method for cleaning process gas of a soldering furnace, in which the process gas to be cleaned is removed from the soldering furnace and then the process gas is passed through a condensate trap and where the process gas is cooled with the condensation and retention of impurities.
  • a condensate trap equipped with a heat exchanger is connected with its entrance to a heating zone of a soldering furnace and with its output to a cooling zone of the soldering furnace.
  • the process gas to be cleaned is thus removed from the heating zone and passed through the heat exchanger, so that the process gas to be cleaned emits heat to the heat exchanger and, in the process, impurities in the process gas condense.
  • the cleaned and cooled process gas is then fed to the cooling zone of the soldering furnace.
  • the object of the invention is to provide a method for cleaning process gas of a soldering furnace, with which a condensate trap can be adapted to different operating states in the soldering furnace.
  • the process gas to be cleaned is set on the way from the soldering furnace to the condensate trap in terms of its temperature and its volume flow in such a way that condensation of the contaminants to be retained is ensured in the condensate trap.
  • the temperature and the Volume flow of the process gas to be cleaned is set so that the condensation temperature for the contaminants is reached by cooling the process gas to be cleaned in the condensate trap. If the process gas to be cleaned has an excessively high temperature, the cooling capacity of the condensate trap is not sufficient to reach the condensation temperature for the contaminants.
  • the volume flow of the process gas to be cleaned cannot be increased arbitrarily, since the individual particles of the process gas then have a shorter residence time in the condensate trap, which is associated with less cooling of the process gas to be cleaned.
  • care must be taken to ensure that, given the maximum possible cooling capacity of the condensate trap, they behave antiproportionally with regard to their permissible maximum values, i.e. the higher the volume flow, the lower the maximum permissible temperature of the process gas to be cleaned and vice versa.
  • the setting of temperature and volume flow of the process gas to be cleaned on the way from the soldering furnace to the condensate trap has the great advantage that the condensate trap can be operated with optimal deposition conditions regardless of the process conditions of the soldering process. Therefore, the condensate trap can advantageously be designed with a comparatively low cooling capacity, which is associated with a comparatively low cooling of the process gas to be cleaned during operation of the condensate trap.
  • the process gas to be cleaned should be adjusted with respect to its temperature and its volume flow in such a way that the Process gas in the condensate trap is as small as possible.
  • those parameter pairs are set in which the amount of heat extracted from the process gas by the condensate trap is optimally small.
  • the cleaned process gas is returned to the soldering furnace.
  • This advantageously creates a circuit for cleaning the process gas, so that the cleaned process gas can be used again for the soldering process.
  • the entire system consisting of a cleaning system and a soldering furnace, can advantageously be operated with low energy consumption.
  • a further embodiment of the invention provides that the process gas to be cleaned is removed from a heating zone of the soldering furnace and, after having passed through the condensate trap, is returned to a cooling zone of the soldering furnace as cleaned process gas.
  • This advantageously ensures that the heat extraction, which can be minimized but cannot be avoided due to the functioning of the condensate trap, is used specifically to supply the cleaned process gas to the soldering furnace in an area in which lower temperatures are required for the process gas anyway.
  • a subsequent heating of the cleaned process gas can thus advantageously be omitted, through which the associated energy expenditure can advantageously be saved.
  • Another embodiment of the invention provides that gas is added to the process gas to be cleaned on the way from the soldering furnace to the condensate trap.
  • a supply of process gas to the soldering process is necessary anyway, since the soldering furnace cannot be made absolutely gas-tight due to the supply or removal of components to be soldered, and the resulting leakage losses in process gas must be compensated for.
  • the supply of process gas can therefore advantageously be used according to the invention for the admixture of gas to the process gas to be cleaned, as a result of which temperature and volume flow can advantageously be influenced in the sense of the invention.
  • the gas supplied can be heated with the process gas depending on the required temperature of the mixture. In general, a supply of gas at room temperature is particularly advantageous in order to cool the process gas to be cleaned before it enters the condensate trap.
  • the gas to be mixed is removed from the soldering furnace at a point where the temperature is different from the point at which the process gas to be cleaned is removed. Due to the different temperature of the gas to be mixed, the temperature of the process gas to be cleaned can in particular be influenced in a targeted manner.
  • the process gas to be cleaned is passed through a heat exchanger before removal from the soldering furnace, which is in a
  • the cooler area of the soldering furnace is arranged in comparison to the temperature of the process gases passed through.
  • Another aspect of the invention provides that the cleaned process gas is brought to a predetermined temperature before being returned to the soldering furnace. This advantageously prevents a disturbance in the process in the soldering furnace at the return point of the cleaned process gas.
  • the cleaned process gas can be heated or cooled as required. In the case of heating, the energy supplied is advantageously not lost to the soldering process due to the subsequent return of the cleaned process gas.
  • the cleaned process gas is brought to a predetermined cooler temperature in such a way that the cooling capacity of the condensate trap is specifically increased beyond the cooling capacity required for cleaning the process gas.
  • This measure is to be regarded as particularly advantageous if a lower temperature is required at the supply point of the cleaned process gas in the soldering furnace than that required for the operation of the condensate trap due to its function of separating contaminants.
  • the condensate trap can be deliberately oversized, by advantageously designed as a separate unit
  • Cooler can be saved. Instead of overdimensioning, operating points of the condensate trap can also be set, which ensure cooling of the process gas to the temperature required at the supply point.
  • the invention further relates to a cleaning system for the process gas of a soldering furnace with a removal line for process gas to be cleaned which can be connected to the soldering furnace and which opens into a condensate trap for impurities in the process gas.
  • a cleaning system for the process gas of a soldering furnace with a removal line for process gas to be cleaned which can be connected to the soldering furnace and which opens into a condensate trap for impurities in the process gas.
  • the object of the invention is to provide a cleaning system for the
  • this further object is achieved in that a control element for adjusting the temperature and / or volume flow of the process gas to be cleaned is provided in the extraction line.
  • the volume flow can be controlled, for example, by a throttle in the extraction line.
  • the cleaning system has a return line for cleaned process gas, which is connected to the condensate trap the soldering furnace can be connected.
  • a return line can ensure that the cleaning system can advantageously also be operated in a circuit with the soldering furnace, so that the cleaned process gas can be reused in the soldering furnace.
  • control element is a mixer which has at least one connection for the admixture of gas into the extraction line.
  • connection is connected to a bypass line for the direct removal of process gas from the soldering furnace.
  • Another embodiment of the cleaning system provides that a heat exchanger is provided in the extraction line, which can be arranged in the soldering furnace in such a way that the process gas passed through the heat exchanger releases heat to the process gas located in the soldering furnace.
  • the heat extracted from the process gas to be cleaned thus remains available for the soldering process, as a result of which the advantages already described in connection with the method according to the invention are achieved.
  • the invention also relates to a soldering furnace with a removal connection and a return connection for connecting a cleaning system for the process gas of the soldering furnace.
  • a soldering furnace is also described in the above-mentioned US Pat. No. 5,611,476.
  • the object of the invention is furthermore to provide a soldering furnace with a removal connection for removing process gas to be cleaned, which enables the process gas to be cleaned with a comparatively low heat loss.
  • a soldering furnace in which a heat exchanger is connected upstream of the removal connection and is arranged in the soldering furnace in such a way that the process gas passed through the heat exchanger gives off heat to the process gas located in the soldering furnace. It is hereby advantageously achieved that the amount of heat removed by the heat exchanger from the process gas to be cleaned remains in the soldering furnace and the process gas to be cleaned has a reduced temperature outside the soldering furnace. As a result, heat losses resulting from the difference in heat between the process gas to be cleaned and the environment of the cleaning system used can also be reduced. If a condensate trap is used as the cleaning device, the temperature of the process gas to be cleaned and fed to the condensate trap can advantageously also be adjusted. The advantages associated with this have already been explained in connection with the method according to the invention.
  • a removal part for the process gas and the heat exchanger is arranged in different heating stages of a multi-stage heating zone of the soldering furnace, the heating stage with the removal point being warmer than the heating stage with the heat exchanger.
  • This constructive measure advantageously takes into account the customary structure of soldering furnaces which have several heating levels in the heating zone.
  • the temperature of the component to be soldered is gradually increased, so that it is possible to remove in particular the heavily contaminated process gas from the hottest heating stage (also known as the peak zone) and pass it through the colder heating stages, which means that the process gas to be cleaned is the cooler process gas warms up in the upstream heating stages.
  • a soldering furnace 11 designed as a reflow soldering furnace has a heating zone 12 and a cooling zone 13, the heating zone consisting of individual heating stages 14a, 14b, 14c and 14d and the cooling zone consisting of cooling stages 15a, 15b.
  • the heating levels or cooling levels are shown in a highly schematic form as simple boxes.
  • a conveyor belt (not shown) runs through these stages, on which the components to be soldered are placed and thus exposed to the respective temperatures in the individual stages.
  • the assemblies to be soldered enter and exit through locks 16 in the soldering furnace.
  • the soldering furnace has a removal connection 17 and two return connections 18, to each of which a removal line 19 and return lines 20 of a cleaning system 21 can be connected.
  • the process gas to be cleaned is removed from the soldering furnace 11 via the removal connection 17 and the removal line 19 and fed to a mixer 22.
  • the mixer has connections 23 to which feed lines 24 for the supply of additional process gas into the mixer and a bypass line 25 are connected. Via the connections 23, the process gas to be cleaned from the extraction line 19 can thus be mixed with further process gas, as a result of which the volume flow and the temperature of the process gas to be cleaned can be influenced.
  • the volume flow can also be influenced via an adjustable throttle 26 in the extraction line 19.
  • Process gas at room temperature for example, for cooling the process gas removed from the soldering furnace or else preheated process gas, which only influences the volume flow, can be supplied via the feed lines 24.
  • the bypass line 25 ultimately represents a short circuit in the circuit formed by the soldering furnace 11 and the cleaning system 21 for the process gas.
  • the bypass line 25 can be used to supply the cooling stage 15a with process gas at a lower temperature than the temperature of the process gas to be cleaned, so that the mixture of the two gas streams leads to cooling of the process gas to be cleaned.
  • the bypass lines indicated by the dotted arrows 27 can also be provided.
  • the removal line 19 After passing through the mixer 22, the removal line 19 opens into a condensate trap 28, in which the impurities in the process gas to be cleaned are condensed by a cooling coil 29.
  • the cooling shock is connected to a coolant circuit 30.
  • Various tapping points 31 for the process gas to be cleaned are arranged in the individual heating stages 14a, 14b, 14c, 14d. These are connected to a heat exchanger 32, which allows the process gas to be cleaned to be passed through colder heating stages of the soldering furnace.
  • the heat exchanger is a line with good heat conductivity trained.
  • the heat exchanger which is connected, for example, to the extraction point 31 in the heating stage 14d, first passes through the somewhat cooler heating stage 14c and then through the somewhat cooler heating stages 14b and 14a in the direction of flow of the process gas to be cleaned, the process gas circulating in each of the heating stages insofar acts as a cooling medium that the process gas to be cleaned releases its heat to the process gas in the heating stage.
  • a heat exchanger based on the direct current principle is thus implemented.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a method for the purification of the process gas in a soldering furnace, which influences said gas on the path from the withdrawal points (31) in the soldering furnace (11) to a condensation trap (28), with regard to the temperature and volumetric flow thereof, such that a functioning of the condensation trap is guaranteed, in particular with relation to the heat energy drawn from the process gas by the condensation trap. The temperature and the volumetric flow can be influenced by means of a throttle (26), a heat exchanger (32), inside the soldering furnace, or a mixer (22). By minimizing the heat energy withdrawn by the condensation trap, the energy balance for the soldering and purification process can be optimised, such that energy can be saved to advantage. The condensation trap can also be operated with optimal efficiency, such that an embodiment of the condensation trap with comparatively small capacity is possible. The invention further relates to a soldering furnace (11) with an internal heat exchanger (32) for the process gas for purification and a purification system (21) with a control unit for adjustment of temperature and/or volumetric flow of the gas for purification.

Description

Beschreibungdescription

Verfahren zum Reinigen von Prozessgas eines Lötofens, sowie Lötofen und Reinigungssystem zu Durchführung des VerfahrensProcess for cleaning process gas from a soldering furnace, as well as soldering furnace and cleaning system for carrying out the process

Die Erfindung betrifft ein Verfahren zum Reinigen von Prozessgas eines Lötofens, bei dem das zu reinigende Prozessgas dem Lötofen entnommen wird und danach das Prozessgas durch eine Kondensatfalle geleitet wird und wo das Prozessgas unter Kondensation und Rückbehalt von Verunreinigungen abgekühlt wird. Ein solches Verfahren ist beispielsweise in dem US- Patent mit der Nummer 5,611,476 beschrieben. Danach wird eine mit einem Wärmetauscher ausgestattete Kondensatfalle mit ihrem Eingang an eine Heizzone eines Lötofens und mit ihrem Ausgang an eine Kühlzone des Lötofens angeschlossen. Somit wird der Heizzone das zu reinigende Prozessgas entnommen und durch den Wärmetauscher geleitet, so dass das zu reinigende Prozessgas Wärme an den Wärmetauscher abgibt und dabei Verunreinigungen im Prozessgas kondensieren. Anschließend wird das gereinigte und abgekühlte Prozessgas der Kühlzone des Lötofens zugeführt.The invention relates to a method for cleaning process gas of a soldering furnace, in which the process gas to be cleaned is removed from the soldering furnace and then the process gas is passed through a condensate trap and where the process gas is cooled with the condensation and retention of impurities. Such a method is described, for example, in US Pat. No. 5,611,476. Then a condensate trap equipped with a heat exchanger is connected with its entrance to a heating zone of a soldering furnace and with its output to a cooling zone of the soldering furnace. The process gas to be cleaned is thus removed from the heating zone and passed through the heat exchanger, so that the process gas to be cleaned emits heat to the heat exchanger and, in the process, impurities in the process gas condense. The cleaned and cooled process gas is then fed to the cooling zone of the soldering furnace.

Die Aufgabe der Erfindung besteht darin, ein Verfahren zum Reinigen von Prozessgas eines Lötofens anzugeben, mit dem sich eine Kondensatfalle unterschiedlichen Betriebszuständen im Lötofen anpassen lässt.The object of the invention is to provide a method for cleaning process gas of a soldering furnace, with which a condensate trap can be adapted to different operating states in the soldering furnace.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, dass das zu reinigende Prozessgas auf dem Weg vom Lötofen zur Konden- satfalle hinsichtlich seiner Temperatur und seines Volumenstromes derart eingestellt wird, dass eine Kondensation der rückzubehaltenden Verunreinigungen in der Kondensatfalle gewährleistet ist. Dies bedeutet, dass die Temperatur und der Volumenstrom des zu reinigenden Prozessgases so eingestellt wird, dass die Kondensationstemperatur für die Verunreinigungen durch die Abkühlung des zu reinigenden Prozessgases in der Kondensatfalle erreicht wird. Besitzt nämlich das zu rei- nigende Prozessgas eine zu hohe Temperatur, so genügt die Kühlleistung der Kondensatfalle nicht, um die Kondensationstemperatur für die Verunreinigungen zu erreichen. Ebenso lässt sich der Volumenstrom des zu reinigenden Prozessgases nicht beliebig steigern, da die einzelnen Teilchen des Pro- zessgases dann eine kürzere Verweildauer in der Kondensatfalle haben, womit eine geringere Abkühlung des zu reinigenden Prozessgases verbunden ist. Bei der Einstellung von Temperatur und Volumenstrom des zu reinigenden Prozessgases muss beachtet werden, dass diese sich bei vorgegebener maximal mög- licher Kühlleistung der Kondensatfalle bezüglich ihrer zulässigen Höchstwerte antiproportional verhalten, d. h. je höher der Volumenstrom eingestellt wird, desto geringer ist die maximal zulässige Temperatur des zu reinigenden Prozessgases und umgekehrt.This object is achieved according to the invention in that the process gas to be cleaned is set on the way from the soldering furnace to the condensate trap in terms of its temperature and its volume flow in such a way that condensation of the contaminants to be retained is ensured in the condensate trap. This means that the temperature and the Volume flow of the process gas to be cleaned is set so that the condensation temperature for the contaminants is reached by cooling the process gas to be cleaned in the condensate trap. If the process gas to be cleaned has an excessively high temperature, the cooling capacity of the condensate trap is not sufficient to reach the condensation temperature for the contaminants. Likewise, the volume flow of the process gas to be cleaned cannot be increased arbitrarily, since the individual particles of the process gas then have a shorter residence time in the condensate trap, which is associated with less cooling of the process gas to be cleaned. When setting the temperature and volume flow of the process gas to be cleaned, care must be taken to ensure that, given the maximum possible cooling capacity of the condensate trap, they behave antiproportionally with regard to their permissible maximum values, i.e. the higher the volume flow, the lower the maximum permissible temperature of the process gas to be cleaned and vice versa.

Die Einstellung von Temperatur und Volumenstrom des zu reinigenden Prozessgases auf dem Weg vom Lötofen zur Kondensatfalle hat den großen Vorteil, dass die Kondensatfalle unabhängig von den Prozessbedingungen des Lötprozesses mit optimalen Ab- scheidebedingungen betrieben werden kann. Daher kann die Kondensatfalle vorteilhaft mit einer vergleichsweise geringen Kühlkapazität ausgelegt werden, womit bei dem Betrieb der Kondensatfalle auch eine vergleichsweise geringe Abkühlung des zu reinigenden Prozessgases verbunden ist.The setting of temperature and volume flow of the process gas to be cleaned on the way from the soldering furnace to the condensate trap has the great advantage that the condensate trap can be operated with optimal deposition conditions regardless of the process conditions of the soldering process. Therefore, the condensate trap can advantageously be designed with a comparatively low cooling capacity, which is associated with a comparatively low cooling of the process gas to be cleaned during operation of the condensate trap.

Gemäß einer weiteren Ausführung der Erfindung soll das zu reinigende Prozessgas hinsichtlich seiner Temperatur und seines Volumenstromes derart eingestellt werden, dass die dem Prozessgas in der Kondensatfalle entzogene Wärmemenge möglichst gering ist. Hierdurch lässt sich vorteilhaft der Betrieb der Kondensatfalle daraufhin optimieren, dass dem zu reinigenden Prozessgas möglichst wenig Energie entzogen wird. Von den möglichen, die Funktion der Kondensatfalle gewährleistenden Parameterwerten für die Temperatur und den Volumenstrom des zu reinigenden Prozessgases werden dabei diejenigen Parameterpaare gezielt eingestellt, bei denen die durch die Kondensatfalle entzogene Wärmemenge aus dem Prozessgas optimal gering ist.According to a further embodiment of the invention, the process gas to be cleaned should be adjusted with respect to its temperature and its volume flow in such a way that the Process gas in the condensate trap is as small as possible. This advantageously allows the operation of the condensate trap to be optimized so that as little energy as possible is removed from the process gas to be cleaned. Of the possible parameter values guaranteeing the function of the condensate trap for the temperature and the volume flow of the process gas to be cleaned, those parameter pairs are set in which the amount of heat extracted from the process gas by the condensate trap is optimally small.

Gemäß einer anderen Ausgestaltung der Erfindung ist vorgesehen, dass das gereinigte Prozessgas dem Lötofen wieder zugeführt wird. Hierdurch wird vorteilhafterweise für die Reini- gung des Prozessgases ein Kreislauf erzeugt, so dass das gereinigte Prozessgas für den Lötprozess wieder verwendet werden kann. Insbesondere bei einer energieoptimierten Reinigung des Prozessgases in der Kondensatfalle kann das Gesamtsystem, bestehend aus Reinigungssystem und Lötofen vorteilhaft mit einem geringen Energieverbrauch betrieben werden.According to another embodiment of the invention, it is provided that the cleaned process gas is returned to the soldering furnace. This advantageously creates a circuit for cleaning the process gas, so that the cleaned process gas can be used again for the soldering process. Particularly when the process gas in the condensate trap is cleaned in an energy-optimized manner, the entire system, consisting of a cleaning system and a soldering furnace, can advantageously be operated with low energy consumption.

Eine weitere Ausgestaltung der Erfindung sieht vor, dass das zu reinigende Prozessgas einer Heizzone des Lötofens entnommen und nach Durchlaufen der Kondensatfalle als gereinigtes Prozessgas einer Kühlzone des Lötofens wieder zugeführt wird. Hierdurch wird vorteilhafterweise erreicht, dass der aufgrund der Funktionsweise der Kondensatfalle zwar minimierbare aber nicht vermeidbare Wärmeentzug gezielt dazu genutzt wird, dem Lötofen das gereinigte Prozessgas in einem Bereich zuzufüh- ren, in dem ohnehin geringere Temperaturen für das Prozessgas gefordert sind. Damit kann vorteilhafterweise eine anschließende Aufheizung des gereinigten Prozessgases entfallen, wo- durch sich der damit verbundene Energieaufwand vorteilhafterweise einsparen lässt.A further embodiment of the invention provides that the process gas to be cleaned is removed from a heating zone of the soldering furnace and, after having passed through the condensate trap, is returned to a cooling zone of the soldering furnace as cleaned process gas. This advantageously ensures that the heat extraction, which can be minimized but cannot be avoided due to the functioning of the condensate trap, is used specifically to supply the cleaned process gas to the soldering furnace in an area in which lower temperatures are required for the process gas anyway. A subsequent heating of the cleaned process gas can thus advantageously be omitted, through which the associated energy expenditure can advantageously be saved.

Eine andere Ausgestaltung der Erfindung sieht vor, dass dem zu reinigenden Prozessgas auf dem Weg vom Lötofen zur Kondensatfalle Gas zugemischt wird. Eine Zuführung von Prozessgas zum Lötprozess ist ohnehin notwendig, da der Lötofen aufgrund der Zu- bzw. Abführung von zu lötenden Bauteilen nicht absolut gasdicht ausgeführt werden kann und die deswegen entste- henden Leckverluste an Prozessgas ausgeglichen werden müssen. Die Zuführung von Prozessgas kann erfindungsgemäß also vorteilhaft für die Zumischung von Gas zum zu reinigenden Prozessgas genutzt werden, wodurch sich Temperatur und Volumenstrom vorteilhaft im Sinne der Erfindung beeinflussen lassen. Das zugeführte Gas kann dabei je nach geforderter Temperatur des Gemisches mit dem Prozessgas geheizt werden. Im Allgemeinen ist eine Zuführung von Gas mit Raumtemperatur besonders vorteilhaft, um das zu reinigende Prozessgas vor dem Eintritt in die Kondensatfalle abzukühlen.Another embodiment of the invention provides that gas is added to the process gas to be cleaned on the way from the soldering furnace to the condensate trap. A supply of process gas to the soldering process is necessary anyway, since the soldering furnace cannot be made absolutely gas-tight due to the supply or removal of components to be soldered, and the resulting leakage losses in process gas must be compensated for. The supply of process gas can therefore advantageously be used according to the invention for the admixture of gas to the process gas to be cleaned, as a result of which temperature and volume flow can advantageously be influenced in the sense of the invention. The gas supplied can be heated with the process gas depending on the required temperature of the mixture. In general, a supply of gas at room temperature is particularly advantageous in order to cool the process gas to be cleaned before it enters the condensate trap.

Besonders vorteilhaft ist es weiterhin, wenn das zuzumischen- de Gas dem Lötofen an einer Stelle entnommen wird, an der eine andere Temperatur herrscht, als an der Stelle, an der das zu reinigende Prozessgas entnommen wird. Aufgrund der anderen Temperatur des zuzumischenden Gases kann damit vorteilhaft insbesondere die Temperatur des zu reinigenden Prozessgases gezielt beeinflusst werden. Dabei wird vorteilhafterweise - in der Betrachtung des Lötofens mit dem Reinigungssystem als Gesamtsystem - diesem keine Wärmeenergie entnommen oder zuge- führt, da sich das zugemischte Gas ja bereits im Prozess befindet. Eine andere Ausgestaltung der Erfindung sieht vor, dass das zu reinigende Prozessgas vor der Entnahme aus dem Lötofen durch einen Wärmetauscher geleitet wird, welcher in einem imIt is also particularly advantageous if the gas to be mixed is removed from the soldering furnace at a point where the temperature is different from the point at which the process gas to be cleaned is removed. Due to the different temperature of the gas to be mixed, the temperature of the process gas to be cleaned can in particular be influenced in a targeted manner. Advantageously, when considering the soldering furnace with the cleaning system as an overall system, no thermal energy is removed or supplied to it, since the mixed gas is already in the process. Another embodiment of the invention provides that the process gas to be cleaned is passed through a heat exchanger before removal from the soldering furnace, which is in a

Vergleich zur Temperatur des durchgeleiteten Prozessgase küh- leren Bereich des Lötofens angeordnet ist. Hierdurch kann vorteilhaft das zu reinigende Prozessgas abgekühlt werden, ohne dass die aus dem zu reinigenden Prozessgas abgeführteThe cooler area of the soldering furnace is arranged in comparison to the temperature of the process gases passed through. As a result, the process gas to be cleaned can advantageously be cooled without the process gas to be removed being removed

Energie dem als Gesamtsystem betrachteten Lötprozess entzogen wird, denn die Wärme aus dem zu reinigenden Prozessgas wird über den Wärmetauscher dem bereits im Lötofen befindlichenEnergy is withdrawn from the soldering process, which is viewed as an overall system, because the heat from the process gas to be cleaned is transferred to the one already in the soldering furnace via the heat exchanger

Prozessgas zugeführt.Process gas supplied.

Ein weiterer Aspekt der Erfindung sieht vor, dass das gereinigte Prozessgas vor der Rückführung in den Lötofen auf eine vorgegebene Temperatur gebracht wird. Hierdurch wird vorteilhafterweise eine Störung des Prozesses im Lötofen an der Rückführstelle des gereinigten Prozessgases vermieden. Das gereinigte Prozessgas kann nach Bedarf geheizt oder gekühlt werden. Im Falle einer Beheizung geht die zugeführte Energie aufgrund der anschließenden Rückführung des gereinigten Prozessgases dem Lötprozess vorteilhafterweise nicht verloren.Another aspect of the invention provides that the cleaned process gas is brought to a predetermined temperature before being returned to the soldering furnace. This advantageously prevents a disturbance in the process in the soldering furnace at the return point of the cleaned process gas. The cleaned process gas can be heated or cooled as required. In the case of heating, the energy supplied is advantageously not lost to the soldering process due to the subsequent return of the cleaned process gas.

Soweit erforderlich, ist es besonders vorteilhaft, wenn das gereinigte Prozessgas derart auf eine vorgegebene kühlere Temperatur gebracht wird, das die Kühlkapazität der Kondensatfalle gezielt über die zur Reinigung des Prozessgases erforderliche Kühlkapazität hinaus erhöht wird. Diese Maßnahme ist dann als besonders vorteilhaft zu erachten, wenn an der Zuführstelle des gereinigten Prozessgases im Lötofen eine ge- ringere Temperatur gefordert ist, als diejenige, die beim Betrieb der Kondensatfalle aufgrund ihrer Funktion der Abscheidung von Verunreinigungen gefordert ist. In diesen Fällen kann die Kondensatfalle bewusst überdimensioniert werden, wo- durch vorteilhaft ein als gesonderte Baueinheit ausgeführterIf necessary, it is particularly advantageous if the cleaned process gas is brought to a predetermined cooler temperature in such a way that the cooling capacity of the condensate trap is specifically increased beyond the cooling capacity required for cleaning the process gas. This measure is to be regarded as particularly advantageous if a lower temperature is required at the supply point of the cleaned process gas in the soldering furnace than that required for the operation of the condensate trap due to its function of separating contaminants. In these cases, the condensate trap can be deliberately oversized, by advantageously designed as a separate unit

Kühler eingespart werden kann. Anstelle einer Überdimensionierung können auch Arbeitspunkte der Kondensatfalle eingestellt werden, die eine Abkühlung des Prozessgases auf die an der Zuführstelle geforderte Temperatur gewährleisten.Cooler can be saved. Instead of overdimensioning, operating points of the condensate trap can also be set, which ensure cooling of the process gas to the temperature required at the supply point.

Die Erfindung bezieht sich weiterhin auf ein Reinigungssystem für das Prozessgas eines Lötofes mit einer an den Lötofen anschließbaren Entnahmeleitung für zu reinigendes Prozessgas, die in eine Kondensatfalle für Verunreinigungen des Prozess- gases mündet. Ein solches Reinigungssystem ist in dem eingangs genannten US-Patent mit der Nummer 5,611,476 beschrieben.The invention further relates to a cleaning system for the process gas of a soldering furnace with a removal line for process gas to be cleaned which can be connected to the soldering furnace and which opens into a condensate trap for impurities in the process gas. Such a cleaning system is described in the above-mentioned US patent number 5,611,476.

Aufgabe der Erfindung ist es, ein Reinigungssystem für dasThe object of the invention is to provide a cleaning system for the

Prozessgas eines Lötofens mit einer Kondensatfalle anzugeben, bei dem die durch die Kondensatfalle dem Prozessgas entzogene Wärmemenge vergleichsweise gering ist.Specify the process gas of a soldering furnace with a condensate trap, in which the amount of heat extracted from the process gas by the condensate trap is comparatively small.

Diese weitere Aufgabe wird erfindungsgemäß dadurch gelöst, dass in der Entnahmeleitung ein Steuerorgan zur Einstellung von Temperatur und/oder Volumenstrom des zu reinigenden Prozessgases vorgesehen ist. Der Volumenstrom kann im einfachsten Fall beispielsweise durch eine Drossel in der Entnahme- leitung gesteuert werden. Das Steuerorgan erlaubt damit dieAccording to the invention, this further object is achieved in that a control element for adjusting the temperature and / or volume flow of the process gas to be cleaned is provided in the extraction line. In the simplest case, the volume flow can be controlled, for example, by a throttle in the extraction line. The control body thus allows

Einstellung der Temperatur und/oder des Volumenstromes des zu reinigenden Prozessgases, wodurch die im Zusammenhang mit dem erfindungsgemäßen Verfahren bereits erläuterten Vorteile erreicht werden.Setting the temperature and / or the volume flow of the process gas to be cleaned, as a result of which the advantages already explained in connection with the method according to the invention are achieved.

Gemäß einer Ausgestaltung des Reinigungssystems ist vorgesehen, dass dieses mit einer an der Kondensatfalle angeschlossenen Rückführleitung für gereinigtes Prozessgas, welche an den Lötofen anschließbar ist, ausgestattet ist. Durch eine solche Rückführleitung kann gewährleistet werden, dass das Reinigungssystem vorteilhaft auch im Kreislauf mit dem Lötofen betrieben werden kann, so dass das gereinigte Prozessgas im Lötofen wieder verwendet werden kann.According to one embodiment of the cleaning system, it is provided that it has a return line for cleaned process gas, which is connected to the condensate trap the soldering furnace can be connected. Such a return line can ensure that the cleaning system can advantageously also be operated in a circuit with the soldering furnace, so that the cleaned process gas can be reused in the soldering furnace.

Eine Ausgestaltung des Reinigungssystems sieht vor, dass das Steuerorgan ein Mischer ist, der mindestens einen Anschluss für die Zumischung von Gas in die Entnahmeleitung aufweist. Hierdurch kann dem zu reinigenden Prozessgas ein Gas zugemischt werden, wodurch die bereits im Zusammenhang mit dem Verfahren erläuterten Vorteile erreicht werden. Dabei ist besonders vorteilhaft, wenn der Anschluss mit einer Bypasslei- tung zur direkten Entnahme von Prozessgas aus dem Lötofen verbunden ist.An embodiment of the cleaning system provides that the control element is a mixer which has at least one connection for the admixture of gas into the extraction line. In this way, a gas can be mixed into the process gas to be cleaned, whereby the advantages already explained in connection with the method are achieved. It is particularly advantageous if the connection is connected to a bypass line for the direct removal of process gas from the soldering furnace.

Eine andere Ausgestaltung des Reinigungssystems sieht vor, dass in der Entnahmeleitung ein Wärmetauscher vorgesehen ist, der so im Lötofen anordenbar ist, dass das durch den Wärme- tauscher geleitete Prozessgas Wärme an das im Lötofen befindliche Prozessgas abgibt. Damit bleibt die dem zu reinigenden Prozessgas entzogene Wärme für den Lötprozess verfügbar, wodurch die bereits im Zusammenhang mit dem erfindungsgemäßen Verfahren beschriebenen Vorteile erreicht werden.Another embodiment of the cleaning system provides that a heat exchanger is provided in the extraction line, which can be arranged in the soldering furnace in such a way that the process gas passed through the heat exchanger releases heat to the process gas located in the soldering furnace. The heat extracted from the process gas to be cleaned thus remains available for the soldering process, as a result of which the advantages already described in connection with the method according to the invention are achieved.

Außerdem bezieht sich die Erfindung auf einen Lötofen mit einem Entnahmeanschluss und einem Rückführanschluss zum Anschluss eines Reinigungssystems für das Prozessgas des Lötofens. Ein solcher Lötofen ist ebenfalls in der eingangs ge- nannten US-Patentschrift mit der Nummer 5,611,476 beschrieben. Die Aufgabe der Erfindung besteht weiterhin darin, einen Lötofen mit einem Entnahmeanschluss zur Entnahme von zu reinigendem Prozessgas anzugeben, der eine Reinigung des Prozessgases mit einem vergleichsweise geringen Wärmeverlust ermög- licht.The invention also relates to a soldering furnace with a removal connection and a return connection for connecting a cleaning system for the process gas of the soldering furnace. Such a soldering furnace is also described in the above-mentioned US Pat. No. 5,611,476. The object of the invention is furthermore to provide a soldering furnace with a removal connection for removing process gas to be cleaned, which enables the process gas to be cleaned with a comparatively low heat loss.

Diese weitere Aufgabe wird erfindungsgemäß durch einen Lötofen gelöst, bei dem dem Entnahmeanschluss ein Wärmetauscher vorgeschaltet ist, der so im Lötofen angeordnet ist, dass das durch den Wärmetauscher geleitete Prozessgas Wärme an das im Lötofen befindliche Prozessgas abgibt. Hierdurch wird vorteilhafterweise erreicht, dass die durch den Wärmetauscher abgeführte Wärmemenge aus dem zu reinigenden Prozessgas im Lötofen verbleibt und das zu reinigende Prozessgas außerhalb des Lötofens eine verringerte Temperatur aufweist. Dadurch können auch Wärmeverluste, die sich aufgrund des Wärmeunterschiedes des zu reinigenden Prozessgases und der Umgebung des zum Einsatz kommenden Reinigungssystems ergeben, verringert werden. Wird als Reinigungsvorrichtung eine Kondensatfalle verwendet, lässt sich vorteilhafterweise zudem auch eine Einstellung der Temperatur des der Kondensatfalle zugeleiteten, zu reinigenden Prozessgases erreichen. Die hiermit verbundenen Vorteile sind bereits im Zusammenhang mit dem erfindungsgemäßen Verfahren erläutert worden.This further object is achieved according to the invention by a soldering furnace in which a heat exchanger is connected upstream of the removal connection and is arranged in the soldering furnace in such a way that the process gas passed through the heat exchanger gives off heat to the process gas located in the soldering furnace. It is hereby advantageously achieved that the amount of heat removed by the heat exchanger from the process gas to be cleaned remains in the soldering furnace and the process gas to be cleaned has a reduced temperature outside the soldering furnace. As a result, heat losses resulting from the difference in heat between the process gas to be cleaned and the environment of the cleaning system used can also be reduced. If a condensate trap is used as the cleaning device, the temperature of the process gas to be cleaned and fed to the condensate trap can advantageously also be adjusted. The advantages associated with this have already been explained in connection with the method according to the invention.

Gemäß einer Ausgestaltung des Lötofens ist vorgesehen, dass eine Entnahmesteile für das Prozessgas und der Wärmetauscher in verschiedenen Heizstufen einer mehrstufigen Heizzone des Lötofens angeordnet sind, wobei die Heizstufe mit der Entnah- estelle wärmer ist als die Heizstufe mit dem Wärmetauscher. Durch diese konstruktive Maßnahme wird vorteilhaft dem gebräuchlichen Aufbau von Lötöfen Rechnung getragen, die mehrere Heizstufen in der Heizzone aufweisen. Mit Hilfe dieser Heizstufen wird die Temperatur des zu lötenden Bauteils stufenweise erhöht, so dass es möglich ist, insbesondere das stark verunreinigte Prozessgas aus der heißesten Heizstufe (auch als Peakzone bezeichnet) zu entnehmen und durch die kälteren Heizstufen zu führen, wodurch das zu reinigenden Prozessgas das kühlere Prozessgas in den vorgelagerten Heiz- stufen aufwärmt.According to one embodiment of the soldering furnace, provision is made for a removal part for the process gas and the heat exchanger to be arranged in different heating stages of a multi-stage heating zone of the soldering furnace, the heating stage with the removal point being warmer than the heating stage with the heat exchanger. This constructive measure advantageously takes into account the customary structure of soldering furnaces which have several heating levels in the heating zone. With the help of this Heating stages, the temperature of the component to be soldered is gradually increased, so that it is possible to remove in particular the heavily contaminated process gas from the hottest heating stage (also known as the peak zone) and pass it through the colder heating stages, which means that the process gas to be cleaned is the cooler process gas warms up in the upstream heating stages.

Weitere Einzelheiten der Erfindung werden anhand der Zeich- nung beschrieben. Die einzige Figur zeigt den stark schematisierten Aufbau eines Lötofens mit an diesem angeschlossenen ReinigungsSystem.Further details of the invention are described with reference to the drawing. The only figure shows the highly schematic structure of a soldering furnace with a cleaning system connected to it.

Ein als Reflowlötofen ausgeführter Lötofen 11 weist eine Heizzone 12 und eine Kühlzone 13 auf, wobei die Heizzone aus einzelnen Heizstufen 14a, 14b, 14c und 14d und die Kühlzone aus Kühlstufen 15a, 15b besteht. Die Heizstufen bzw. Kühlstufen sind als einfache Kästen stark schematisiert dargestellt. Durch diese Stufen läuft ein nicht dargestelltes Förderband, auf dem die zu lötenden Bauteile platziert werden und so den jeweiligen Temperaturen in den einzelnen Stufen ausgesetzt werden. Die zu lötenden Baugruppen treten durch Schleusen 16 in den Lötofen ein bzw. aus.A soldering furnace 11 designed as a reflow soldering furnace has a heating zone 12 and a cooling zone 13, the heating zone consisting of individual heating stages 14a, 14b, 14c and 14d and the cooling zone consisting of cooling stages 15a, 15b. The heating levels or cooling levels are shown in a highly schematic form as simple boxes. A conveyor belt (not shown) runs through these stages, on which the components to be soldered are placed and thus exposed to the respective temperatures in the individual stages. The assemblies to be soldered enter and exit through locks 16 in the soldering furnace.

Der Lötofen weist einen Entnahmeanschluss 17 und zwei Rückführanschlüsse 18 auf, an die jeweils eine Entnahmeleitung 19 und Rückführleitungen 20 eines Reinigungssystems 21 angeschlossen werden können. Über den Entnahmeanschluss 17 und die Entnahmeleitung 19 wird das zu reinigende Prozessgas dem Lötofen 11 entnommen und einem Mischer 22 zugeführt. Der Mischer weist Anschlüsse 23 auf, an die Speiseleitungen 24 für die Zuführung von zusätzlichen Prozessgas in den Mischer und eine Bypassleitung 25 angeschlossen sind. Über die Anschlüsse 23 kann somit das zu reinigende Prozessgas aus der Entnahmeleitung 19 mit weiterem Prozessgas gemischt werden, wodurch sich der Volumenstrom und die Temperatur des zu reinigenden Prozessgases beeinflussen lassen. Eine Beeinflussung des Vo- lumenstroms kann zusätzlich über eine einstellbare Drossel 26 in der Entnahmeleitung 19 erreicht werden.The soldering furnace has a removal connection 17 and two return connections 18, to each of which a removal line 19 and return lines 20 of a cleaning system 21 can be connected. The process gas to be cleaned is removed from the soldering furnace 11 via the removal connection 17 and the removal line 19 and fed to a mixer 22. The mixer has connections 23 to which feed lines 24 for the supply of additional process gas into the mixer and a bypass line 25 are connected. Via the connections 23, the process gas to be cleaned from the extraction line 19 can thus be mixed with further process gas, as a result of which the volume flow and the temperature of the process gas to be cleaned can be influenced. The volume flow can also be influenced via an adjustable throttle 26 in the extraction line 19.

Über die Speiseleitungen 24 kann beispielsweise Prozessgas mit Raumtemperatur zur Abkühlung des aus dem Lötofen entno - menen Prozessgases oder auch vorgeheiztes Prozessgas, welches lediglich den Volumenstrom beeinflusst, zugeleitet werden. Die Bypassleitung 25 stellt letztendlich einen Kurzschluss des durch den Lötofen 11 und das Reinigungssystem 21 gebildeten Kreislaufes für das Prozessgas dar. Mit Hilfe der Bypass- leitung 25 kann der Kühlstufe 15a Prozessgas mit im Vergleich zur Temperatur des zu reinigenden Prozessgases geringerer Temperatur zugeführt werden, so dass die Mischung der beiden Gasströme zu einer Kühlung des zu reinigenden Prozessgases führt. Alternativ können auch die durch die gepunkteten Pfei- le 27 angedeuteten Bypassleitungen vorgesehen werden.Process gas at room temperature, for example, for cooling the process gas removed from the soldering furnace or else preheated process gas, which only influences the volume flow, can be supplied via the feed lines 24. The bypass line 25 ultimately represents a short circuit in the circuit formed by the soldering furnace 11 and the cleaning system 21 for the process gas. The bypass line 25 can be used to supply the cooling stage 15a with process gas at a lower temperature than the temperature of the process gas to be cleaned, so that the mixture of the two gas streams leads to cooling of the process gas to be cleaned. Alternatively, the bypass lines indicated by the dotted arrows 27 can also be provided.

Nach Durchlaufen des Mischers 22 mündet die Entnahmeleitung 19 in eine Kondensatfalle 28, in der die Verunreinigungen im zu reinigenden Prozessgas durch eine Kühlschlange 29 konden- siert werden. Die Kühlschlage ist mit einem Kühlmittelkreislauf 30 verbunden.After passing through the mixer 22, the removal line 19 opens into a condensate trap 28, in which the impurities in the process gas to be cleaned are condensed by a cooling coil 29. The cooling shock is connected to a coolant circuit 30.

In den einzelnen Heizstufen 14a, 14b, 14c, 14d sind verschiedene Entnahmestellen 31 für das zu reinigende Prozessgas an- geordnet. Diese sind mit einem Wärmetauscher 32 verbunden, der die Durchleitung des zu reinigenden Prozessgases durch jeweils kältere Heizstufen des Lötofens erlaubt. Im einfachsten Fall ist der Wärmtauscher als Leitung mit guter Wärme- leitfähigkeit ausgebildet. Der Wärmetauscher, der beispielsweise an die Entnahmestelle 31 in der Heizstufe 14d angeschlossen ist, durchläuft in Flussrichtung des zu reinigenden Prozessgases gesehen zunächst die etwas kühlere Heizstufe 14c und anschließend die jeweils wieder etwas kühleren Heizstufen 14b und 14a, wobei das jeweils in den Heizstufen zirkulierende Prozessgas insofern als Kühlmedium fungiert, das das zu reinigende Prozessgas seine Wärme an das jeweils in der Heizstufe befindliche Prozessgas abgibt. Damit ist ein Wärmetau- scher nach dem Gleichstromprinzip verwirklicht. Various tapping points 31 for the process gas to be cleaned are arranged in the individual heating stages 14a, 14b, 14c, 14d. These are connected to a heat exchanger 32, which allows the process gas to be cleaned to be passed through colder heating stages of the soldering furnace. In the simplest case, the heat exchanger is a line with good heat conductivity trained. The heat exchanger, which is connected, for example, to the extraction point 31 in the heating stage 14d, first passes through the somewhat cooler heating stage 14c and then through the somewhat cooler heating stages 14b and 14a in the direction of flow of the process gas to be cleaned, the process gas circulating in each of the heating stages insofar acts as a cooling medium that the process gas to be cleaned releases its heat to the process gas in the heating stage. A heat exchanger based on the direct current principle is thus implemented.

Claims

Patentansprüche claims 1. Verfahren zum Reinigen von Prozessgas eines Lötofens (11), bei dem - das zu reinigende Prozessgas dem Lötofen (11) entnommen wird und danach das Prozessgas durch eine Kondensatfalle (28) geleitet wird, wo das Prozessgas unter Kondensation und Rückbehalt von Verunreinigungen abgekühlt wird, d a d u r c h g e k e n n z e i c h n e t, dass das zu reinigende Prozessgas auf dem Weg vom Lötofen zur Kondensatfalle (28) hinsichtlich seiner Temperatur und seines Volumenstromes derart eingestellt wird, dass eine Kondensation der rückzubehaltenden Verunreinigungen in der Kondensat- falle gewährleistet ist.1. A method for cleaning process gas of a soldering furnace (11), in which - the process gas to be cleaned is removed from the soldering furnace (11) and then the process gas is passed through a condensate trap (28), where the process gas is cooled with the condensation and retention of impurities is characterized in that the process gas to be cleaned on the way from the soldering furnace to the condensate trap (28) is adjusted with regard to its temperature and its volume flow in such a way that condensation of the contaminants to be retained is ensured in the condensate trap. 2. Verfahren nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass das zu reinigende Prozessgas hinsichtlich seiner Tempe- ratur und seines Volumenstromes derart eingestellt wird, dass die dem Prozessgas in der Kondensatfalle (28) entzogene Wärmemenge möglichst gering ist.2. The method according to claim 1, so that the process gas to be cleaned is adjusted in terms of its temperature and volume flow such that the amount of heat extracted from the process gas in the condensate trap (28) is as small as possible. 3. Verfahren nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , dass das gereinigte Prozessgas dem Lötofen (11) wieder zugeführt wird.3. The method according to claim 1 or 2, d a d u r c h g e k e n e z e i c h n e t that the cleaned process gas is fed back to the soldering furnace (11). 4. Verfahren nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t, dass das zu reinigende Prozessgas einer Heizzone (12) des Lötofens (11) entnommen und nach Durchlaufen der Kondensat- falle (28) als gereinigtes Prozessgas einer Kühlzone (13) des4. The method according to claim 3, characterized in that the process gas to be cleaned is removed from a heating zone (12) of the soldering furnace (11) and after passing through the condensate trap (28) as a cleaned process gas of a cooling zone (13) of the Lötofens (11) wieder zugeführt wird.Soldering furnace (11) is fed back. 5. Verfahren nach einem der vorangehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass dem zu reinigenden Prozessgas auf dem Weg vom Lötofen (11) zur Kondensatfalle (28) Gas zugemischt wird.5. The method according to any one of the preceding claims, that the process gas to be cleaned is admixed with gas on the way from the soldering furnace (11) to the condensate trap (28). 6. Verfahren nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t, dass das zuzu ischende Gas dem Lötofen (11) an einer Stelle entnommen wird, an der eine andere Temperatur herrscht als an der Stelle, an der das zu reinigende Prozessgas entnommen wird.6. The method according to claim 5, so that the gas to be added is removed from the soldering furnace (11) at a point at which a different temperature prevails than at the point at which the process gas to be cleaned is removed. 7. Verfahren nach einem der vorangehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass das zu reinigende Prozessgas vor der Entnahme aus dem Lötofen (11) durch einen Wärmetauscher (32) geleitet wird, welcher in einem im Vergleich zur Temperatur des durchgeleiteten Prozessgases kühleren Bereich des Lötofens angeordnet ist.7. The method according to any one of the preceding claims, characterized in that the process gas to be cleaned before removal from the soldering furnace (11) is passed through a heat exchanger (32) which is arranged in a cooler area of the soldering furnace compared to the temperature of the passed through process gas , 8. Verfahren nach einem der Ansprüche 3 bis 7, d a d u r c h g e k e n n z e i c h n e t, dass das gereinigte Prozessgas vor der Rückführung in den Lötofen (11) auf eine vorgegebene Temperatur gebracht wird.8. The method according to any one of claims 3 to 7, so that the cleaned process gas is brought to a predetermined temperature before being returned to the soldering furnace (11). 9. Verfahren nach Anspruch 8, d a d u r c h g e k e n n z e i c h n e t, dass das gereinigte Prozessgas derart auf eine vorgegebene, kühlere Temperatur gebracht wird, dass die Kühlkapazität der Kondensatfalle (28) gezielt über die zur Reinigung des Prozessgases erforderliche Kühlkapazität hinaus erhöht wird.9. The method according to claim 8, characterized in that the cleaned process gas is brought to a predetermined, cooler temperature such that the cooling capacity of the Condensate trap (28) is specifically increased beyond the cooling capacity required for cleaning the process gas. 10. Reinigungssystem für das Prozessgas eines Lötofens (11) mit einer an den Lötofen (11) anschließbaren Entnahmeleitung (19) für zu reinigendes Prozessgas, die in eine Kondensatfalle (28) für Verunreinigungen des Prozessgases mündet, d a d u r c h g e k e n n z e i c h n e t, dass in der Entnahmeleitung (19) ein Steuerorgan (22, 26) zur Einstellung von Temperatur und/oder Volumenstrom des zu reinigenden Gases vorgesehen ist.10. Cleaning system for the process gas of a soldering furnace (11) with a removal line (19) that can be connected to the soldering furnace (11) for process gas to be cleaned and that opens into a condensate trap (28) for contaminations of the process gas, characterized in that in the removal line (19 ) a control element (22, 26) is provided for setting the temperature and / or volume flow of the gas to be cleaned. 11. Reinigungssystem nach Anspruch 10, d a d u r c h g e k e n n z e i c h n e t , dass dieses mit einer an die Kondensatfalle (28) angeschlossenen Rückführleitung (20) für gereinigtes Prozessgas, welche an den Lötofen anschließbar ist, ausgestattet ist.11. Cleaning system according to claim 10, so that it is equipped with a return line (20) for cleaned process gas, which can be connected to the soldering furnace, and is connected to the condensate trap (28). 12. Reinigungssystem nach Anspruch 10 oder 11, d a d u r c h g e k e n n z e i c h n e t, dass das Steuerorgan ein Mischer (22) ist, der mindestens einen Anschluss (23) für die Zumischung von Gas in die Entnahmeleitung (19) aufweist.12. Cleaning system according to claim 10 or 11, so that the control member is a mixer (22) which has at least one connection (23) for the admixture of gas into the extraction line (19). 13. Reinigungssystem nach Anspruch 12, d a d u r c h g e k e n n z e i c h n e t, dass der Anschluss (23) mit einer Bypassleitung (25) zur direkten Entnahme von Prozessgas aus dem Lötofen (11) verbunden ist.13. Cleaning system according to claim 12, so that the connection (23) is connected to a bypass line (25) for the direct removal of process gas from the soldering furnace (11). 14. Reinigungssystem nach einem der Ansprüche 10 bis 13, d a d u r c h g e k e n n z e i c h n e t, dass in der Entnahmeleitung ein Wärmetauscher (32) vorgesehen ist, der so im Lötofen (11) anordenbar ist, dass das durch den Wärmetauscher (32) geleitete Prozessgas Wärme an das im Lötofen befindliche Prozessgas abgibt.14. Cleaning system according to one of claims 10 to 13, characterized in that a heat exchanger (32) is provided in the extraction line and can be arranged in the soldering furnace (11) in such a way that the process gas passed through the heat exchanger (32) gives off heat to the process gas located in the soldering furnace. 15. Lötofen mit einem Entnahmeanschluss (17) und einem Rück- führanschluss (18) zum Anschluss eines Reinigungssystems für das Prozessgas des Lötofens, d a d u r c h g e k e n n z e i c h n e t, dass dem Entnahmeanschluss (17) ein Wärmetauscher (32) vorgeschaltet ist, der so im Lötofen angeordnet ist, dass das durch den Wärmetauscher (32) geleitete Prozessgas Wärme an das im Lötofen befindliche Prozessgas abgibt.15. Soldering furnace with a removal connection (17) and a return connection (18) for connecting a cleaning system for the process gas of the soldering furnace, characterized in that the extraction connection (17) is preceded by a heat exchanger (32) which is arranged in the soldering furnace, that the process gas passed through the heat exchanger (32) gives off heat to the process gas located in the soldering furnace. 16. Lötofen nach Anspruch 13, d a d u r c h g e k e n n z e i c h n e t, dass eine Entnahmestelle (31) für das Prozessgas und der Wärmetauscher (32) in verschiedenen Heizstufen (14a, 14b, 14c, 14d) einer mehrstufigen Heizzone (12) des Lötofens angeordnet sind, wobei die Heizstufe mit der Entnahmestelle (31) wärmer ist als die Heizstufe mit dem Wärmetauscher. 16. Soldering furnace according to claim 13, characterized in that a removal point (31) for the process gas and the heat exchanger (32) in different heating stages (14a, 14b, 14c, 14d) of a multi-stage heating zone (12) of the soldering furnace are arranged, the heating stage with the tapping point (31) is warmer than the heating level with the heat exchanger.
PCT/DE2003/004234 2003-01-08 2003-12-16 Method for the purification of the process gas of a soldering furnace, soldering furnace and purification system for carrying out said method Ceased WO2004062761A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2003101102 DE10301102B3 (en) 2003-01-08 2003-01-08 Cleaning system for process gas, at soldering kiln, takes gas from hot zone to be passed through condensation trap for cooling and retaining any impurities within condensation
DE10301102.1 2003-01-08

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WO2004062761A2 true WO2004062761A2 (en) 2004-07-29
WO2004062761A3 WO2004062761A3 (en) 2004-09-30

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DE102004031713B3 (en) * 2004-06-30 2005-12-22 Fujitsu Siemens Computers Gmbh Cleaning system for soldering furnace, used for PCBs, comprises cyclone separator in which liquid may run down walls into collector while gas escapes through central tube
DE102010046545A1 (en) * 2010-09-27 2012-03-29 Elino Industrie-Ofenbau Gmbh Soldering components such as heat exchangers for motor cars, comprises mechanically fixing the components to be soldered together, and performing the mutually fixed components through a cleaning chamber atmosphere and a soldering chamber
DK2771145T3 (en) 2011-10-25 2017-04-10 Air Liquide PROCEDURE AND DEVICE FOR COOLING PUNCHED PRINTING PLATES
EP2604373B1 (en) * 2011-12-15 2015-03-04 Air Liquide Deutschland GmbH Method of and device for condensing atmospheric impurities in a soldering assembly using a cooling gas for cooling the cooler
DE102014117617B4 (en) 2014-12-01 2022-11-24 Seho Vermögensverwaltungs Gmbh & Co. Kg soldering device
EP4032648A1 (en) * 2021-01-25 2022-07-27 Infineon Technologies AG Arrangement for forming a connection

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