WO2004051312A1 - Radiation detector and medical image diagnosing device - Google Patents
Radiation detector and medical image diagnosing device Download PDFInfo
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- WO2004051312A1 WO2004051312A1 PCT/JP2003/015410 JP0315410W WO2004051312A1 WO 2004051312 A1 WO2004051312 A1 WO 2004051312A1 JP 0315410 W JP0315410 W JP 0315410W WO 2004051312 A1 WO2004051312 A1 WO 2004051312A1
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- radiation detector
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- radiation
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20183—Arrangements for preventing or correcting crosstalk, e.g. optical or electrical arrangements for correcting crosstalk
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/29—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
- A61B6/032—Transmission computed tomography [CT]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
Definitions
- the present invention relates to a radiation detector that detects X-rays, ⁇ -rays, and the like, and particularly relates to a radiation detector suitable for a medical image diagnostic device such as an X-ray CT device or PET.
- the present invention also relates to a medical image diagnostic device using the radiation detector. Background technology
- Solid-state detectors which combine a phosphor element and a photodiode, are widely used as radiation detectors for medical image diagnostic devices such as X-ray CT and PET.
- the structure of a solid state detector is generally a combination of a scintillator that emits visible light by absorbing X-rays and a photodiode that converts the emitted light into an electric signal.
- Element arrays arranged in one or two dimensions are used. In such a detection element array, the scintillator needs to be channel-separated in order to prevent crosstalk between adjacent channels, and a reflection layer is usually formed between adjacent scintillator elements.
- the scintillator elements and the reflection layer have a rectangular parallelepiped shape for a channel-separated scintillator element, and the reflection layer provided between the elements has a rectangular parallelepiped shape.
- a scintillator element and a reflection layer alternately arranged are adhered on a plane of a photodiode array substrate to form a detection element array block.
- Fig. 12 shows a conventional detector array. Focusing on one detector array block 90, the scintillator element 91 at the center of the block faces the X-ray tube focal point, while the scintillator element 92 at the end of the block faces the X-ray tube focal point. It will be. For this reason, the scintillator element 92 and the scattered ray removing collimator 93 are shifted from each other toward the end of the element array block, and the irradiation area seen from the focal point of the X-ray tube becomes wider. As a result, the amount of light emitted during X-ray irradiation increases, and the output changes. I do.
- the path of the X-ray passing through the element differs between the scintillator element 91 at the center of the block and the scintillator element 92 at the end, the X-ray energy characteristics also change. For these reasons, variations occur in the light emission characteristics within the element array block, and artifacts tend to occur in the CT image.
- Japanese Patent Application Laid-Open No. 2000-237178 discloses that a plurality of detector element array blocks each composed of a plurality of elements are arranged in a chord shape by observing the circle around the focal point of the X-ray tube from the circumferential axis direction. This constitutes a channel detection element array.
- a solid-state detector is provided with a scattered radiation removing collimator in order to prevent scattered X-rays scattered by the subject from being incident on the detector element.
- a plurality of scattered radiation removing collimators are arranged in an arc shape so as to cover the gap between the detector elements and are accurately aligned with the detector element array.
- angles of the plurality of reflective layers are particularly determined such that the plurality of phosphors fractionated by the plurality of reflective layers on the substrate are directed to the radiation source (focal point). .
- the radiation detector according to the present invention includes a substrate, a plurality of phosphor elements arranged on the substrate, and a reflection layer disposed between the adjacent phosphor elements to prevent crosstalk between the adjacent phosphor elements.
- a radiation detector comprising: a plurality of photoelectric conversion elements provided at positions corresponding to the phosphor elements on the substrate; and a contact surface between the phosphor element and the reflective layer; and a substrate at a central portion of the substrate. The angle between the substrate and the surface changes from the center of the substrate toward the end along the arrangement direction of the phosphor elements.
- the orientation of the phosphor element defined by the phosphor element and the reflection layers on both sides of the phosphor element is substantially changed with respect to all the phosphor elements arranged in a plane. Since the incident direction can be the same, the apparent irradiation area of the radially incident radiation and the passage in the element can be made uniform, and the Variations in the output of the element can be eliminated.
- the angle formed between the contact surface between the phosphor element and the reflective layer and the substrate surface at the central portion of the substrate is, for example, with respect to the contact surface between the phosphor element and the reflective layer located at the central portion of the substrate or the position closest to the central portion.
- the distance from the radiation source to the top surface of the phosphor element is calculated from 90 ° for each phosphor array pitch, where Ld is the distance from the radiation source to the top of the phosphor element. Lp should be varied by the arrangement pitch of the phosphor elements.) Considering the processing accuracy of the radiation detector, an error of ⁇ 0.2 ° can be tolerated.
- the angle between the contact surface between the base phosphor element and the reflection layer located at the end of the substrate and the substrate surface at the center of the substrate (the angle at the center of the substrate).
- the width changes along the depth direction by changing the direction of the phosphor elements in the arrangement direction.
- This change in width can be provided in the phosphor element and / or the reflective layer.
- the length in the direction in which the phosphor elements and the reflection layer are arranged is referred to as the width of the phosphor elements and the reflection layer, and the distance from the radiation incident surface to the substrate surface is referred to as the height or the depth.
- a medical image diagnostic apparatus includes a radiation source, a radiation detector having the above-described features disposed to face the radiation source, and holding the radiation source and the radiation detector, and driving the radiation source around a subject. Rotating disk, and radiation detected by the radiation detector. Image reconstruction means for reconstructing an image of the tomographic image of the subject based on the intensity of the line.
- a substrate having a plurality of photoelectric conversion elements arranged in at least one predetermined direction is disposed on the substrate so as to correspond one-to-one to the plurality of photoelectric conversion elements.
- a radiation detector in which an angle between a contact surface between a phosphor element and the reflective layer and the substrate surface changes from the center to the end of the substrate along the arrangement direction.
- the angle between the contact surface between the phosphor element and the reflective layer and the substrate surface becomes smaller from the center to the end of the substrate.
- the width of the phosphor element in the predetermined direction is constant irrespective of the position in the depth direction of the phosphor element orthogonal to the predetermined direction.
- the width of the reflective layer in the predetermined direction is constant irrespective of the position in the depth direction of the reflective layer orthogonal to the predetermined direction.
- the plurality of phosphor elements are formed of a single member, and the upper surface and the lower surface thereof are respectively aligned and parallel, and the reflection layer is formed of the plurality of phosphor elements. It is formed in a groove for partitioning the phosphor element.
- the width of the groove for partitioning the plurality of phosphor elements is substantially constant irrespective of the position in the thickness direction, and the reflecting material is cured after filling with a curable material. Then, a metal plate or a metal plate was adhered in the groove.
- the width of the groove for partitioning the plurality of phosphor elements becomes thicker as the position in the thickness direction becomes deeper, and the reflecting material is cured after filling and shrinking a material that cures and contracts. did.
- the material to be cured is epoxy resin, acrylic resin It is at least one of inorganic resin powders such as titanium oxide, aluminum oxide, and barium sulfate contained in an organic resin such as lunar phenol resin.
- the material that cures and shrinks is an organic resin such as an epoxy resin, an acryl resin, or a phenol resin, and an inorganic compound powder such as titanium oxide, silicon oxide, or barium sulfate. It is at least one of those contained.
- a plurality of the above-described radiation detectors are prepared and juxtaposed in a one-dimensional or 2′-dimensional direction such that their long-axis directions intersect at a predetermined angle of 0 ° to 90 °.
- a radiation detector unit configured as follows.
- a radiation detector arranged to face a radiation source, a rotating disk that is driven to rotate while holding the radiation detector, and detected by the radiation detector 3.
- a medical image diagnostic apparatus comprising: image reconstruction means for reconstructing a tomographic image of an object based on the intensity of radiation, wherein the medical image diagnostic apparatus uses the radiation detector according to claim 2 as the radiation detector.
- a radiation detector arranged to face a radiation source, a rotating disk that is driven to rotate while holding the radiation detector, and detected by the radiation detector
- a medical image diagnostic apparatus comprising: image reconstruction means for reconstructing a tomographic image of an object based on the intensity of radiation, wherein the medical image diagnosis uses the radiation detector unit according to claim 10 as the radiation detector.
- the shortest distance from the radiation source to the upper surface of the phosphor element is Ld
- the arrangement pitch of the phosphor elements in the predetermined direction is Ld.
- the shortest distance from the radiation source to the upper surface of the phosphor element is Ld,
- FIG. 1 is a cross-sectional view of a radiation detector according to one embodiment of the present invention.
- 2A and 2B are cross-sectional views of a main part of the radiation detection element array block in FIG. 1, wherein FIG. 2A shows a case where the number of detection elements is even, and FIG. 2B shows a case where the number of detection elements is odd.
- Figure 3 is a diagram showing the positional relationship between the radiation source and the radiation detection element array.
- FIG. 4 is a sectional view of a main part of a radiation detector according to another embodiment of the present invention.
- FIG. 5 is an example in which a plurality of detectors are arranged in the rotation axis direction according to the embodiment.
- FIG. 1 is a cross-sectional view of a radiation detector according to one embodiment of the present invention.
- 2A and 2B are cross-sectional views of a main part of the radiation detection element array block in FIG. 1, wherein FIG. 2A shows a case where the number of detection elements is even, and FIG
- FIG. 6 is a diagram illustrating an example of a method for manufacturing a radiation detector according to the present invention.
- FIG. 1 is a configuration diagram of an X-ray CT apparatus equipped with a radiation detector according to the present invention.
- FIG. 8 (a) is a diagram showing the X-ray energy characteristics of the radiation detector of the present invention
- FIG. 8 (b) is a diagram showing the X-ray energy characteristics of the conventional radiation detector.
- FIG. 9 shows a flow of manufacturing the detector according to the first embodiment of the present invention.
- FIG. 10 shows a flow of manufacturing a detector according to the second embodiment of the present invention.
- FIG. 11 shows a flow of manufacturing the detector according to the third embodiment.
- FIG. 12 is a diagram showing the relationship between a conventional radiation detecting element array and a scattered radiation removing collimator.
- FIG. 1 is a cross-sectional view of a radiation detector according to one embodiment of the present invention.
- the radiation detector includes a substrate 11, a photodiode 14 (photoelectric conversion element) formed on the substrate, a plurality of scintillator elements 12 (phosphor elements), and a reflection layer 13.
- the scintillator elements 12 are arranged directly above the photodiodes 14 in a one-to-one relationship, and the scintillator elements 12 and the reflective layers 13 are alternately arranged in the width direction. Therefore, immediately below the reflective layer 13 is a portion of the substrate 11 where the photodiode 14 does not substantially exist.
- One scintillator element is constituted by the scintillator element 12 which is channel-separated by sandwiching both sides in the width direction with the reflective layer 13 and the photodiode 14 immediately below the scintillator element.
- the size of the scintillator element and the reflective layer and the number of scintillator elements arranged depend on the application of the radiation detector and are not particularly limited.For example, in the case of a detector array for an X-ray CT device, a substrate having a width of about 20 to 40 mm is used.
- the scintillator elements 12 are provided at an arrangement pitch Lp of about 1 mm.
- the width of the reflective layer 13 in the arrangement direction is about 1/10 to 210 of the normal arrangement pitch Lp.
- the radiation detector according to the present embodiment is configured so that the angle formed between the contact surface between the scintillator element 12 and the reflective layer 13 and the substrate surface gradually changes while keeping the arrangement pitch of the scintillator elements constant.
- the change in the angle is such that the direction of the normal to the contact surface between the scintillator element 12 and the reflective layer 13 is almost perpendicular to the line connecting the scintillator element 12 and the radiation source (or the focal point, if it is an X-ray).
- the arrangement of the scintillator element 12 and the reflective layer 13 of the radiation detector is bilaterally symmetric about the reflective layer 13 in FIG. 2A, and bilaterally symmetric about the scintillator element 120 in FIG. 2B.
- the center of the reflective layer 13 is located at the center of the substrate 11, as shown in FIG.
- the angle ⁇ no between the contact surface between the reflective layer 13 and the scintillator elements 121 on both sides and the substrate plane is 90 °.
- Scintillator elements 121, 121 of the angle theta .kappa.1 the contact surface of the reflective layer and the scintillator elements in the end portion side on the outside makes with the substrate surface (angle of the substrate center side) as will be hereinafter both 90 ° I do. Thereafter, the angle between the contact surface and the substrate surface gradually decreases toward the end. I do.
- the center of the scintillator element 120 is located at the center of the substrate 11, as shown in FIG.
- the angle 0so between the contact surface of the scintillator element 120 and the reflective layers 131 on both sides with the substrate plane is 90 °.
- the angle 0 S1 (the angle at the center of the substrate) formed by the contact surface between the scintillator elements 121 and 121 and the reflection layers 131 at the end further to be 90 ° or less. You. Thereafter, the angle between the contact surface and the substrate surface is gradually reduced toward the end.
- the angle is changed such that the direction of the scintillator element matches the direction of the radiation source.
- the number of phosphor elements in the arrangement direction is an even number
- the contact surface between the reflective layer 13 and the scintillator element 12 located at the edge of the substrate and the substrate at the center of the substrate are described.
- Ld is the distance from the radiation source to the top of the scintillator element
- Lp is the The arrangement pitch
- a in the above equations 1 and 2 is a coefficient.
- ⁇ Otan-1 (Lp / Ld)) is equivalent to the elevation angle per pitch of the scintillator element, and thus the shape of the scintillator element for each elevation pitch By inclining the shape, the shape of the scintillator element always faces the radiation source. This can prevent radiation entering the adjacent scintillator element from entering, thereby suppressing variations in the amount of emitted light.
- Ld 1037 mm
- the detection element array block 32 is the conventional detection element array block 80
- the reflective layer at the center of the substrate is configured to be parallel to the normal direction of the substrate.
- the angle between the normal to the side of the reflective layer at the center of the substrate (the surface that intersects the substrate surface) and the direction of the focal point of the X-ray tube is 90 degrees.
- the shape of the scintillator element is not Will be. The same applies to the case where an odd number of scintillator elements are arranged.
- FIGS. 1 and 2 show a case where the width of the reflective layer is constant at any position in the depth direction, but as shown in FIG. 4, the width of the reflective layer is changed in the depth direction.
- the width of the scintillator element may be constant at any position in the depth direction by changing the position.
- only one-dimensional array is shown in the figure, a two-dimensional element array can have a similar structure in each two-dimensional array direction.
- a two-dimensional element array As shown in FIG. 5, a plurality of the above-described two-dimensional element arrays are rotated so that their major axes intersect at a predetermined angle of 0 ° or more and 90 ° or less.
- the two-dimensional element arrays can be arranged at different angles so that each two-dimensional element array faces the direction of the X-ray tube focal point. In this case, the variation in the detector array direction can be suppressed over a wider area, and the artifact caused by this can be reduced and eliminated.
- any of the following conventional methods (1) to (3) for manufacturing a channel-separated scintillator element block can be applied.
- the method (3) is desirable in terms of ease of production and performance of the obtained element.
- a plurality of plate-shaped scintillator materials are laminated at predetermined Then, the laminated block is cut to a predetermined thickness and bonded to the substrate on which the photodiode array is formed.
- Cut grooves are formed at a predetermined pitch in the plate-shaped scintillator material, and the material constituting the reflective layer is filled in this groove by a specific method. A method of bonding on a substrate on which is formed.
- Figure 6 illustrates the method (3).
- a notch groove 51 having a predetermined pitch, a predetermined width, and a predetermined depth is formed in a rectangular parallelepiped scintillator raw material 50 without leaving a bottom thereof.
- a phosphor having a high radiation-to-light conversion efficiency such as a rare-earth phosphor can be used.
- the phosphor is, for example, a rare-earth acid composed of a host crystal having a garnet structure containing at least Gd, Al, Ga, and O with Ce as a light-emitting element as described in Japanese Patent Application Publication No. JP-A-2001-004753. It is a scintillator of arsenal.
- the cut groove 51 is filled with a material 52 for forming a reflective layer.
- each cut groove 51 is formed to have a predetermined angle with respect to the surface of the scintillator material. This angle is such that the angle formed by the contact surface between the reflective layer and the scintillator element and the substrate surface, when formed as a detection element array as described above, is inclined from the center to the end of the substrate.
- the processing can be achieved by sequentially changing the angle between the material and the cutting edge in a processing machine such as a multi-wire saw-slicer every time it approaches the end.
- the material 52 is a material that cures and shrinks
- the cut grooves 51 may be formed in parallel.
- the reflective layer tries to shrink due to curing shrinkage, but the dimensions of the bottom surface do not change because the bottom surface of the scintillator material is connected. Therefore, the reflective layer near the bottom of the scintillator does not shrink much, but shrinks greatly toward the top. As a result, a substantially wedge-shaped cross-sectional shape whose width changes in the depth direction as described above can be provided to the reflective layer. After the cut grooves 51 are formed in this way, a material 52 for forming a reflective layer is filled in the grooves.
- epoxy resin acrylic resin
- acrylic resin An organic resin such as an enol resin, a powder containing an inorganic compound powder such as titanium oxide, aluminum oxide, barium sulfate or the like as a reflective material, a metal plate having a high light reflectance, or a combination thereof.
- the material 52 when a material containing a reflecting material in a resin is used as the material 52, it is centrifugally injected using a centrifuge. As a result, the material 52 can be injected to the bottom of the groove, and air bubbles in the resin can be substantially eliminated.
- the reflecting layer is formed by hardening the organic resin in the material 52.
- the adhesive is cured as necessary. Thereafter, the slice is sliced to a desired thickness in a direction orthogonal to the depth direction of the groove.
- the resin shrinks when the organic resin hardens, but does not shrink because the bottom of the groove is fixed to the bottom of the scintillator material. Therefore, a slope is formed from the bottom to the top of the groove.
- the degree of cure shrinkage varies depending on the type and viscosity of the resin, and by appropriately selecting these conditions, a desired inclination can be imparted to the groove. For example, when an epoxy resin having a viscosity of 10000 20000 cPs is used as an organic resin, a groove having a width of 0.15 mm and a depth of 10 mm can form a slope of about 0.0400 °.
- the width in the depth direction as described above is substantially changed.
- a wedge-shaped cross-sectional shape can be imparted to the reflective layer.
- a reflection layer having a desired angle can be formed by previously inclining the cut groove 51 itself.
- the radiation detector of the present invention is obtained by bonding the scintillator manufactured in this manner on the substrate 53 on which the photodiode array is formed in advance in the same arrangement pitch as the scintillator elements.
- a known photodiode such as a PIN photodiode can be used as the photodiode.
- the outline of an X-ray CT apparatus is shown as an example of medical image diagnosis to which the present invention is applied.
- the X-ray CT apparatus includes a scan gantry unit 610 and an image reconstruction unit 620.
- the scan gantry unit 610 includes a rotating disk 611 having an opening 614 into which a subject is loaded, and the rotating disk 611.
- X-ray tube 612 mounted on the X-ray tube
- collimator 613 mounted on the X-ray tube 612 to control the radiation direction of the X-ray flux
- an X-ray detector mounted on a rotating disk 611 facing the X-ray tube 612 615
- a detector circuit 616 for converting the X-rays detected by the X-ray detector 615 into a predetermined signal
- a scan control circuit 617 for controlling the rotation of the rotating disk 611 and the width of the X-ray flux.
- the image reconstruction unit 620 performs image processing for reconstructing a CT image by processing the measurement data S1 transmitted from the input device 621 and the detector circuit 616 for inputting the subject's name, examination date and time, examination conditions, and the like.
- Circuit 622 an image information adding unit 623 for adding information such as the subject name, examination date and time, and examination conditions input from the input device 621 to the CT image created by the image arithmetic circuit 622, and image information added.
- a display circuit 624 that adjusts the display gain of the CT image signal S2 and outputs the result to the display monitor 630.
- X-rays are emitted from an X-ray tube 612 in a state where a subject is placed on a bed (not shown) installed in an opening 614 of a scan gantry section 610.
- This X-ray is given directivity by a collimator 613 and detected by an X-ray detector 615.
- X-rays transmitted through the subject are detected while changing the direction of X-ray irradiation.
- the tomographic image created by the image reconstruction unit 620 based on the measurement data is displayed on the display monitor 630.
- the X-ray detector 615 is composed of a large number of detection element array blocks, each of which has a plurality of detection elements that combine a scintillator element (phosphor element) and a photodiode (photoelectric conversion element), arranged in a polygonal shape close to an arc. Consists of It is assumed that the radiation detector has a detection element array block according to the present embodiment as shown in FIG. 1, FIG. 2, or FIG.
- the radiation detector may be a one-dimensional detector in which elements are arranged in a row in the circumferential direction, or a two-dimensional detector in which elements are arranged in a row. In the case of a two-dimensional detector, the array direction parallel to the rotation axis of the rotating disk 611 (the body axis direction of the subject) Also, each element is arranged facing the direction of the X-ray tube focal point.
- the X-ray detector 615 is arranged on an arc centered on the focal point of the X-ray tube 612 so that the side where the scintillator element is arranged faces the radiation source.
- the X-ray detector 615 is configured to have a shape directed in the X-ray irradiation direction from the focal point because the scintillator element is divided by the scintillator element and the reflective layers on both sides thereof. Even in the case of a scintillator element, sufficient radiation is incident as in the case of the central scintillator element, and a uniform output can be obtained.
- Fig. 8 (a) shows the X-ray energy characteristics when the X-ray detector according to the embodiment of the present invention as shown in Fig. 1 is used
- Fig. 8 (b) shows the results using the conventional X-ray detector.
- the X-ray energy characteristics in each case are schematically shown.
- the X-ray energy characteristics in the element array block vary widely. This causes variations in the light emission characteristics, and artifacts are likely to occur in CT images.
- the dispersion of the X-ray energy characteristics inside the block can be suppressed, and the dispersion of the emission characteristics can be reduced. For this reason, a high-quality CT image with few artifacts can be obtained.
- Gds (Al, Ga) 5 0 12 Ce ceramic scintillator from configured scintillator plate X- Y plane of the (X, Y and Z directions of dimensions each 26 X 30 X 1.8mm), 24 at lmm pitch
- the channel was attached to a substrate on which a one-dimensional photodiode array was formed. Then, using a 0.13 mm thick diamond grindstone, grooves parallel to the Y direction were machined at lmm pitch in the X direction of the scintillator plate. The depth of the groove at this time is 1.8 mm.
- the setting was such that the grindstone entered at an angle of 0.66 ° with respect to the Z direction (the normal direction of the photodiode array substrate).
- the grindstone was set to enter the groove at the angle of 0.605 ° in the second and subsequent grooves from the end.
- the angle of the grindstone was gradually reduced in steps of 0.055 ° toward the center. In this way, the center groove (13th groove) of the scintillator plate
- the angle of the grindstone becomes 0 °
- the groove on the other end side gradually increases the angle of the grindstone in the opposite direction, and the grindstone becomes 0.66 ° in the groove closest to the other end (25th).
- the angle was set for machining.
- the reflective layer has a shape in which both side surfaces are parallel as shown in FIG.
- the X-ray energy characteristics E were defined as follows by irradiating X-rays at a tube voltage of 100 kV and 120 kV and a tube current of 100 mA, and by the output ratio of each channel at that time.
- X 10 o (X120), R100 (Ri2o) is sump lambda ⁇ when the respective tube voltages 100 kV (120 kV), which is the output of the reference.
- the variation in X-ray energy characteristics was defined as the difference between the maximum value and the minimum value of the characteristic ⁇ of each channel in the detector element block. If this variation is 5 or more, ring artifacts are likely to occur in CT images.
- the grooves of the scintillator plate subjected to groove processing cured by pouring Epoki sheet resin mixed with Ti0 2 powder to form a reflective layer.
- the scintillator elements were connected at the bottom, so that the shape became inclined toward the center.
- the upper and lower surfaces were cut and polished to a thickness of 1.8 mm to produce a 24 ⁇ 16 channel scintillator element array.
- the scintillator element was parallelized on both sides because it was burned by a wire saw, but the reflective layer had a shape in which the upper surface in the Z direction became thin due to curing shrinkage.
- the angle formed between the side surface of the scintillator element and the substrate surface was 89.43 ° for the end element in the X direction and 89.14 ° for the end element in the Y direction.
- the scintillator element array produced as described above was adhered to a 24 ⁇ 16 channel photodiode array substrate to obtain a detector element block.
- This detector element block was mounted on an X-ray CT apparatus so that the X direction was the circumferential direction, and the light emission characteristics were measured as in Example 1.
- the variation in the conventional element block in both the X and Y directions is 1, the value is about 0.4, indicating that the X-ray CT system using this detector element block can suppress artifacts in CT images. .
- a phosphor defined by a phosphor element (scintillator element) and reflection layers disposed on both sides thereof
- a plurality of scintillator element arrays may be prepared, and the radiation detectors may be configured by juxtaposing them in a one-dimensional or two-dimensional direction such that their major axes intersect at a predetermined angle of 0 ° or more and 90 ° or less. .
- a 24 x 8 channel scintillator element array was produced in the same process as in Example 2, A radiation detector was obtained by adhering to a 24 ⁇ 16 channel photodiode array substrate in a state where these two long axes were arranged in the channel direction at a predetermined angle. At this time, the photodiode of 24 ⁇ 16 channels was divided into regions of 24 ⁇ 8 channels, and each region was inclined at 0.50 ° with respect to the substrate surface.
- each detector element can be a detection element array oriented in the direction of the X-ray tube focal point, and since it is juxtaposed at a predetermined angle, Variations in the detector array direction can be suppressed over a wider area, and artifacts due to this can be reduced and eliminated.
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Abstract
Description
放射線検出器及び医用画像診断装置 ' 技術分野' Radiation detectors and medical diagnostic imaging equipment 'Technical field'
本発明は X線、 γ線などを検出する放射線検出器、 特に X線 CT装置や PET などの医用画像診断装置に好適な放射線検出器に関する。 また本発明は前記放射 線検出器を用いた医用画像診断装明置に関する。 背景技術 田 The present invention relates to a radiation detector that detects X-rays, γ-rays, and the like, and particularly relates to a radiation detector suitable for a medical image diagnostic device such as an X-ray CT device or PET. The present invention also relates to a medical image diagnostic device using the radiation detector. Background technology
X線 CT装置や PETなどの医用画像診断装置に用いる放射線検出器として、蛍 光体素子とフォトダイオードを組み合わせた固体検出器が広く用いられている。 固体検出器の構造は、 X線を吸収して可視光を発光するシンチレータと、 その発 光を電気信号に変換するフォトダイォードとを組み合わせた構造が一般的であり、 これらの検出器素子が一次元あるいは二次元に並んだ素子ァレイが用いられてい る。 このような検出素子アレイにおいては、 隣接するチャンネル間のクロストー クを防止するため、 シンチレータをチャンネル分離する必要があり、 通常隣接す るシンチレータ素子間に反射層が形成されている。 これらシンチレータ素子と反 射層の形状は、 一次元アレイ検出器の場合、 例えばチャンネル分離されたシンチ レータ素子は直方体形状であり、 各素子間に設けられる反射層は直方体形状を有 している。 このようなシンチレータ素子と反射層を交互に配置したものをフォト ダイォードアレイ基板の平面上に接着し、 検出素子アレイプロックを構成してい る。 Solid-state detectors, which combine a phosphor element and a photodiode, are widely used as radiation detectors for medical image diagnostic devices such as X-ray CT and PET. The structure of a solid state detector is generally a combination of a scintillator that emits visible light by absorbing X-rays and a photodiode that converts the emitted light into an electric signal. Element arrays arranged in one or two dimensions are used. In such a detection element array, the scintillator needs to be channel-separated in order to prevent crosstalk between adjacent channels, and a reflection layer is usually formed between adjacent scintillator elements. In the case of a one-dimensional array detector, for example, the scintillator elements and the reflection layer have a rectangular parallelepiped shape for a channel-separated scintillator element, and the reflection layer provided between the elements has a rectangular parallelepiped shape. Such a scintillator element and a reflection layer alternately arranged are adhered on a plane of a photodiode array substrate to form a detection element array block.
図 12に従来の検出素子アレイを示す。一個の検出素子アレイブロック 90内に 注目すると、 ブロック中心部のシンチレータ素子 91は X線管焦点の方向を向い ているが、 ブロック端部のシンチレータ素子 92は、 X線管焦点の方向を向かな くなることになる。 このため素子アレイブロックの端部へ行くに従い、 シンチレ ータ素子 92と散乱線除去コリメータ 93とのずれを生じ、 X線管焦点からの見か けの照射領域が広くなる。 このため、 X線照射時の発光量が増加し、 出力が変化 する。 またブロック中心部のシンチレータ素子 91と端部のシンチレータ素子 92 とでは素子内を通過する X線の通路も異なってくるため、 X線エネルギー特性も 変化する。これらのことから素子ァレイブロック内の発光特性にばらつきが生じ、 CT画像にアーチファタ トが生じやすくなる。 Fig. 12 shows a conventional detector array. Focusing on one detector array block 90, the scintillator element 91 at the center of the block faces the X-ray tube focal point, while the scintillator element 92 at the end of the block faces the X-ray tube focal point. It will be. For this reason, the scintillator element 92 and the scattered ray removing collimator 93 are shifted from each other toward the end of the element array block, and the irradiation area seen from the focal point of the X-ray tube becomes wider. As a result, the amount of light emitted during X-ray irradiation increases, and the output changes. I do. In addition, since the path of the X-ray passing through the element differs between the scintillator element 91 at the center of the block and the scintillator element 92 at the end, the X-ray energy characteristics also change. For these reasons, variations occur in the light emission characteristics within the element array block, and artifacts tend to occur in the CT image.
この対策として、 特開 2000— 237178号公報には、 複数素子からなる検出素子 アレイブロックを X線管焦点を中心とした円上に周回軸方向から観察して弦状と なるよう複数個並べて多チャンネルの検出素子アレイを構成している。 この際、 被検体によつて散乱された散乱 X線が検出器素子に入射することを防止するため に固体検出器に散乱線除去コリメータを設けている。 散乱線除去コリメータは各 検出器素子の間隙を覆うように検出素子アレイと精度良く位置合わせされた状態 で円弧状に複数配列されている。 しかし、 このように円弧状に多数の検出素子ァ レイプロックを配置する際に精度を維持するのは困難である。 さらに一個一個の 検出素子を X線方向に向けるためには検出器自体を円弧状に作らざるを得なくな るが、 円弧状の検出器の作成は大変な困難を伴う。 発明の開示 As a countermeasure against this, Japanese Patent Application Laid-Open No. 2000-237178 discloses that a plurality of detector element array blocks each composed of a plurality of elements are arranged in a chord shape by observing the circle around the focal point of the X-ray tube from the circumferential axis direction. This constitutes a channel detection element array. At this time, a solid-state detector is provided with a scattered radiation removing collimator in order to prevent scattered X-rays scattered by the subject from being incident on the detector element. A plurality of scattered radiation removing collimators are arranged in an arc shape so as to cover the gap between the detector elements and are accurately aligned with the detector element array. However, it is difficult to maintain accuracy when arranging a large number of detection element array locks in an arc shape. Furthermore, in order to orient each of the detection elements in the X-ray direction, the detector itself must be formed in an arc shape, but it is extremely difficult to create an arc shape detector. Disclosure of the invention
本発明の放射線検出器は、 基板上で複数の反射層によって分画された複数の蛍 光体素が放射線源 (焦点) に向かうようにその複数の反射層の角度を特に定めた ものである。 In the radiation detector of the present invention, the angles of the plurality of reflective layers are particularly determined such that the plurality of phosphors fractionated by the plurality of reflective layers on the substrate are directed to the radiation source (focal point). .
即ち、 本発明の放射線検出器は、 基板と、 前記基板上に配列した複数の蛍光体 素子と、 隣接する蛍光体素子間に配置され、 隣接する蛍光体素子間のクロストー クを防止する反射層と、 前記基板の、 蛍光体素子に対応する位置に設けられた複 数の光電変換素子とを備えた放射線検出器において、 前記蛍光体素子と反射層と の接触面と、 基板中央部における基板面とのなす角度が、 蛍光体素子の配列方向 に沿って基板中央部から端部に向かって変化することを特徴とするものである。 この放射線検出器によれば、平面状に配列されたすべての蛍光体素子にっレヽて、 蛍光体素子とその両側の反射層とで規定される蛍光体素子の向きを実質的に放射 線の入射方向と同じにすることができるので、 放射状に入射される放射線の見か けの照射領域および素子内の通路を均一にすることができ、 配列方向についての 素子の出力のばらつきをなくすことができる。 That is, the radiation detector according to the present invention includes a substrate, a plurality of phosphor elements arranged on the substrate, and a reflection layer disposed between the adjacent phosphor elements to prevent crosstalk between the adjacent phosphor elements. A radiation detector comprising: a plurality of photoelectric conversion elements provided at positions corresponding to the phosphor elements on the substrate; and a contact surface between the phosphor element and the reflective layer; and a substrate at a central portion of the substrate. The angle between the substrate and the surface changes from the center of the substrate toward the end along the arrangement direction of the phosphor elements. According to this radiation detector, the orientation of the phosphor element defined by the phosphor element and the reflection layers on both sides of the phosphor element is substantially changed with respect to all the phosphor elements arranged in a plane. Since the incident direction can be the same, the apparent irradiation area of the radially incident radiation and the passage in the element can be made uniform, and the Variations in the output of the element can be eliminated.
蛍光体素子と反射層との接触面と、基板中央部における基板面とのなす角度は、 例えば、 基板中央部或いは中央部に最も近い場所に位置する蛍光体素子と反射層 との接触面について 90° とし、端部に向かうに従レ、、蛍光体の配列ピッチごとに 90° から— 0 ( Θ =tan"i (Ld/Lp) 、 Ld は放射線源から蛍光体素子上面まで の距離、 Lpは蛍光体素子の配列ピッチ) ずつ変化するようにする。 放射線検出器 の加工精度等を考慮し、 ±0.2° の誤差は許容することができる。 The angle formed between the contact surface between the phosphor element and the reflective layer and the substrate surface at the central portion of the substrate is, for example, with respect to the contact surface between the phosphor element and the reflective layer located at the central portion of the substrate or the position closest to the central portion. At 90 °, the distance from the radiation source to the top surface of the phosphor element is calculated from 90 ° for each phosphor array pitch, where Ld is the distance from the radiation source to the top of the phosphor element. Lp should be varied by the arrangement pitch of the phosphor elements.) Considering the processing accuracy of the radiation detector, an error of ± 0.2 ° can be tolerated.
即ち、 配列方向の蛍光体素子数が偶数のときには、 反射層とその基板端部側に 位置する蛍光体素子との接触面と、 基板中央部における基板面とのなす角度 (基 板中央部側の角度) を、 基板中央から順にそれぞれ (η=0,1,2 · · · ) とし たとき、 0 Rn=9O— a (n · θ ) ±0.2° (0< a≤2、 η=0,1,2 · · - ) とする。 ま た蛍光体素子数が奇数のときには、 基蛍光体素子とその基板端部側に位置する反 射層との接触面と、 基板中央部における基板面とのなす角度 (基板中央部側の角 度) を、 基板中央から順にそれぞれ 0 sn (η=0,1,2 · · · ) としたとき、 0 Sn = 90— a (n · θ ) ±0.2° (0く a^2、 n=0,l,2 · · · ) とする。 That is, when the number of phosphor elements in the arrangement direction is an even number, the angle between the contact surface between the reflective layer and the phosphor element located on the edge side of the substrate and the substrate surface at the center of the substrate (the center of the substrate) ) Is (η = 0, 1, 2, · · ·) in order from the center of the substrate, and 0 R n = 90-a (n · θ) ± 0.2 ° (0 <a ≤ 2, η = 0, 1, 2 ·-). When the number of phosphor elements is an odd number, the angle between the contact surface between the base phosphor element and the reflection layer located at the end of the substrate and the substrate surface at the center of the substrate (the angle at the center of the substrate). ) Is 0 s n (η = 0, 1, 2 · · ·) in order from the center of the substrate, and 0 Sn = 90—a (n · θ) ± 0.2 ° (0 a a2, n = 0, l, 2 · · ·).
従来の検出器では 0 であった。 発明者らの検討によれば、 0 Rnが 90° より小さければ本発明の効果があり、 また 9Ο_2η· 0 ° より小さければ、 逆に発 光特性が劣ってくることが分かった。 厳密に上記のような角度を有した素子ァレ ィを作製することは難しいため所定寸法誤差を許容範囲とした。 たとえば各要素 の傾斜角度が、 ±0.2° の精度で素子ァレイプロックを作製すれば充分な効果が得 られる。 0 for conventional detectors Met. According to the studies by the inventors, it has been found that if 0 Rn is smaller than 90 °, the effect of the present invention is obtained, and if 0 Rn is smaller than 9Ο_2η · 0 °, on the contrary, the light emission characteristics are inferior. Since it is difficult to manufacture an element array having the above-described angle exactly, a predetermined dimensional error is set as an allowable range. For example, a sufficient effect can be obtained if an element array lock is manufactured with an inclination angle of each element of ± 0.2 °.
本発明の放射線検出器において、 蛍光体素子の向きを配列方向に変化させたこ とにより、 深さ方向に沿って幅が変化することとなる。 この幅の変化は蛍光体素 子および反射層の両方またはいずれか一方に持たせることができる。 以下、 蛍光 体素子及び反射層が配列される方向の長さを蛍光体素子及び反射層の幅と呼び、 放射線入射面から基板面までの距離を高さあるいは深さと呼ぶことにする。 In the radiation detector of the present invention, the width changes along the depth direction by changing the direction of the phosphor elements in the arrangement direction. This change in width can be provided in the phosphor element and / or the reflective layer. Hereinafter, the length in the direction in which the phosphor elements and the reflection layer are arranged is referred to as the width of the phosphor elements and the reflection layer, and the distance from the radiation incident surface to the substrate surface is referred to as the height or the depth.
本発明の医用画像診断装置は、 放射線源と、 この放射線源に対向して配置され た上記特徴を有する放射線検出器と、これら放射線源及び放射線検出器を保持し、 被検体の周りで回転駆動される回転円板と、 前記放射線検出器で検出された放射 線の強度に基づき前記被検体の断層像を画像再構成する画像再構成手段とを備え たものである。 A medical image diagnostic apparatus according to the present invention includes a radiation source, a radiation detector having the above-described features disposed to face the radiation source, and holding the radiation source and the radiation detector, and driving the radiation source around a subject. Rotating disk, and radiation detected by the radiation detector. Image reconstruction means for reconstructing an image of the tomographic image of the subject based on the intensity of the line.
本発明に係わる医用画像診断装置では、 放射線検出器の配列方向における出力 のばらつきが抑制されるので、 出力のばらつきに起因するアーチファクト、 特に ソフトウエアによる補正が困難な放射線エネルギー依存性のばらつきに起因する アーチファタトを効果的に抑制することができる。 In the medical image diagnostic apparatus according to the present invention, variations in output in the array direction of the radiation detectors are suppressed, and therefore, artifacts due to variations in output, particularly due to variations in radiation energy dependence that are difficult to correct by software. Yes Artifacts can be effectively suppressed.
本発明の第 1の特徴によれば、 複数の光電変換素子を少なくとも一つの所定方 向に配列して有する基板と、 上記複数の光電変換素子に一対一で対応するよう上 記基板上に配置した複数の蛍光体素子と、 上記所定方向に配列された上記蛍光体 素子間のクロストークを防止するようにその間に挿入された反射層と、 を備えた 放射線検出器にぉレ、て、 上記蛍光体素子と上記反射層間の接触面と上記基板面と の間の角度が上記配列方向に沿って基板中央部から端部に向かって変化する放射 線検出器を提供する。 According to the first feature of the present invention, a substrate having a plurality of photoelectric conversion elements arranged in at least one predetermined direction is disposed on the substrate so as to correspond one-to-one to the plurality of photoelectric conversion elements. A plurality of phosphor elements, and a reflective layer inserted between the phosphor elements arranged in the predetermined direction so as to prevent crosstalk between the phosphor elements. Provided is a radiation detector in which an angle between a contact surface between a phosphor element and the reflective layer and the substrate surface changes from the center to the end of the substrate along the arrangement direction.
本発明の第 2の特徴によれば、 上記蛍光体素子と上記反射層間の接触面と上記 基板面との間の角度は基板中央部から端部に向かうほど小さくなる。 According to the second feature of the present invention, the angle between the contact surface between the phosphor element and the reflective layer and the substrate surface becomes smaller from the center to the end of the substrate.
本発明の第 3の特徴によれば、 上記蛍光体素子の上記所定方向の幅は上記所定 方向と直交する上記蛍光体素子の深さ方向の位置にかかわらず一定である。 本発明の第 4の特徴によれば、 上記反射層の上記所定方向の幅は上記所定方向 と直交する上記反射層の深さ方向の位置にかかわらず一定である。 According to a third feature of the present invention, the width of the phosphor element in the predetermined direction is constant irrespective of the position in the depth direction of the phosphor element orthogonal to the predetermined direction. According to a fourth feature of the present invention, the width of the reflective layer in the predetermined direction is constant irrespective of the position in the depth direction of the reflective layer orthogonal to the predetermined direction.
本発明の第 5の特徴によれば、 上記複数の蛍光体素子は単一の部材からなつて おりその上面と下面はそれぞれ一致して平行であり、 上記反射層は上記部材を上 記複数の蛍光体素子に区画するための溝の中に形成されている。 According to a fifth aspect of the present invention, the plurality of phosphor elements are formed of a single member, and the upper surface and the lower surface thereof are respectively aligned and parallel, and the reflection layer is formed of the plurality of phosphor elements. It is formed in a groove for partitioning the phosphor element.
本発明の第 6の特徴によれば、 上記複数の蛍光体素子に区画するための溝の幅 はその厚み方向の位置にかかわらずほぼ一定であり、 上記反射材は硬化する材料 を充填後硬化したものあるいは金属板を溝内に接着した。 According to the sixth aspect of the present invention, the width of the groove for partitioning the plurality of phosphor elements is substantially constant irrespective of the position in the thickness direction, and the reflecting material is cured after filling with a curable material. Then, a metal plate or a metal plate was adhered in the groove.
本発明の第 7の特徴によれば、 上記複数の蛍光体素子に区画するための溝の幅 はその厚み方向の位置が深いほど厚くなり、 上記反射材は硬化収縮する材料を充 填後硬化した。 According to the seventh feature of the present invention, the width of the groove for partitioning the plurality of phosphor elements becomes thicker as the position in the thickness direction becomes deeper, and the reflecting material is cured after filling and shrinking a material that cures and contracts. did.
本発明の第 8の特徴によれば、 上記硬化する材料はエポキシ樹脂、 アクリル樹 月旨、 フエノーノレ樹脂等の有機樹脂中に、 酸化チタン、 酸ィ匕アルミニウム、 硫酸バ リゥム等の無機化合物粉末を含有させたもののうち少なくとも一つである。 According to an eighth aspect of the present invention, the material to be cured is epoxy resin, acrylic resin It is at least one of inorganic resin powders such as titanium oxide, aluminum oxide, and barium sulfate contained in an organic resin such as lunar phenol resin.
本発明の第 9の特徴によれば、 上記硬化収縮する材料はエポキシ樹脂、 アタリ ル樹脂、 フヱノール樹脂等の有機樹脂中に、 酸化チタン、 酸ィ匕ァノレミニゥム、 硫 酸バリウム等の無機化合物粉末を含有させたもののうち少なくとも一つである。 本発明の第 10の特徴によれば、 上記放射線検出器を複数用意し、 これらの長 軸方向が 0° 以上 90° 以下の所定の角度をもって交差するように 1次元または 2 ' 次元方向に並置して構成された放射線検出器ユニットを提供する。 According to a ninth feature of the present invention, the material that cures and shrinks is an organic resin such as an epoxy resin, an acryl resin, or a phenol resin, and an inorganic compound powder such as titanium oxide, silicon oxide, or barium sulfate. It is at least one of those contained. According to a tenth feature of the present invention, a plurality of the above-described radiation detectors are prepared and juxtaposed in a one-dimensional or 2′-dimensional direction such that their long-axis directions intersect at a predetermined angle of 0 ° to 90 °. A radiation detector unit configured as follows.
本発明の第 11 の特徴によれば、 放射線源に対向して配置された放射線検出器 と、 前記放射線検出器を保持して回転駆動される回転円板と、 前記放射線検出器 で検出された放射線の強度に基づき対象物の断層像を画像再構成する画像再構成 手段とを備えた医用画像診断装置において、 上記放射線検出器として請求項 2に 記載の放射線検出器を用いた医用画像診断装置を提供する。 According to an eleventh aspect of the present invention, a radiation detector arranged to face a radiation source, a rotating disk that is driven to rotate while holding the radiation detector, and detected by the radiation detector 3.A medical image diagnostic apparatus comprising: image reconstruction means for reconstructing a tomographic image of an object based on the intensity of radiation, wherein the medical image diagnostic apparatus uses the radiation detector according to claim 2 as the radiation detector. I will provide a.
本発明の第 12の特徴によれば、 放射線源に対向して配置された放射線検出器 と、 前記放射線検出器を保持して回転駆動される回転円板と、 前記放射線検出器 で検出された放射線の強度に基づき対象物の断層像を画像再構成する画像再構成 手段とを備えた医用画像診断装置において、 上記放射線検出器として請求項 10 に記載の放射線検出器ュニットを用いた医用画像診断装置を提供する。 According to a twelfth aspect of the present invention, a radiation detector arranged to face a radiation source, a rotating disk that is driven to rotate while holding the radiation detector, and detected by the radiation detector A medical image diagnostic apparatus, comprising: image reconstruction means for reconstructing a tomographic image of an object based on the intensity of radiation, wherein the medical image diagnosis uses the radiation detector unit according to claim 10 as the radiation detector. Provide equipment.
本発明の第 13の特徴によれば、 上記医用画像診断装置の放射線検出器におい て、上記放射線源から上記蛍光体素子上面までの最短距離を Ld、上記蛍光体素子 の上記所定方向における配列ピッチを Lp、 Θ =tan"i (Lp/Ld) としたとき、 上 記蛍光体素子の上記所定方向における配列数が偶数のときには上記反射層のうち ひとつとその基板端部側に位置する蛍光体素子との間の接触面と上記基板表面と の間の基板中央部側の角度を基板中央から順にそれぞれ 0 Rn (η=0,1,2 · · - ) とすると 0 Rn=9O— a (n · θ ) ±0.2° (0< a≤2 η=0,1,2 · · · ) であり、 上 記蛍光体素子の配列数が奇数のときには、 上記蛍光体素子のうちひとつとその基 板端部側に位置する反射層との間の接触面と基板表面との間の基板中央部側の角 度を基板中央から順にそれぞれ 0 sn (η=0,1,2 · · · ) とすると 0 sn=9O— a (n · θ ) ±0.2° (0<a≤2、 η=0,1,2 · · · ) である医用画像診断装置を提供する。 本発明の第 14の特徴によれば、 上記医用画像診断装置の放射線検出器ュニッ ト中の放射線検出器それぞれにおいて、 上記放射線源から上記蛍光体素子上面ま での最短距離を Ld、 上記蛍光体素子の上記所定方向における配列ピッチを Lp、 Θ =tan-i (Lp/Ld) としたとき、 上記蛍光体素子の上記所定方向における配列 数が偶数のときには上記反射層のうちひとつとその基板端部側に位置する蛍光体 素子との間の接触面と上記基板表面との間の基板中央部側の角度を基板中央から 順にそれぞれ 0 Rn (η=0,1,2 · · · ) とすると 0 Rn=9O— a (n · θ ) ±0.2。 (0 < a≤2 n=0,l,2 · · · ) であり、 上記蛍光体素子の配列数が奇数のときには、 上記蛍光体素子のうちひとつとその基板端部側に位置する反射層との間の接触面 と基板表面との間の基板中央部側の角度を基板中央から順にそれぞれ 0 sn (n= 0,1,2 - · · ) とすると 0 Sn=9O— a (η · Θ ) ±0.2。 (0く a≤2、 n=0,l,2 · · · ) である医用画像診断装置を提供する。 図面の簡単な説明 According to a thirteenth feature of the present invention, in the radiation detector of the medical image diagnostic apparatus, the shortest distance from the radiation source to the upper surface of the phosphor element is Ld, and the arrangement pitch of the phosphor elements in the predetermined direction is Ld. Where Lp and Θ = tan "i (Lp / Ld), and when the number of the phosphor elements in the predetermined direction is an even number, one of the reflective layers and the phosphor located on the end side of the substrate are disposed. If the angle between the contact surface between the element and the substrate surface and the substrate center side is 0 Rn (η = 0, 1, 2, ··-) in order from the substrate center, 0 Rn = 9O— a ( n · θ) ± 0.2 ° (0 <a≤2η = 0,1,2, ·), and when the number of phosphor elements is odd, one of the above phosphor elements and its base The angle between the contact surface between the reflective layer located on the edge of the board and the surface of the board and the center of the board is 0 s n in order from the center of the board. (η = 0,1,2 ···) 0 s n = 9O— a (n · θ) ± 0.2 ° (0 <a≤2, η = 0,1,2 ···) An image diagnostic apparatus is provided. According to a fourteenth feature of the present invention, in each of the radiation detectors in the radiation detector unit of the medical image diagnostic apparatus, the shortest distance from the radiation source to the upper surface of the phosphor element is Ld, When the arrangement pitch of the elements in the predetermined direction is Lp, Θ = tan-i (Lp / Ld), when the number of the phosphor elements in the predetermined direction is even, one of the reflection layers and the end of the substrate are disposed. The angle between the contact surface between the phosphor element located on the side of the substrate and the surface of the substrate and the center of the substrate is 0 R n (η = 0, 1, 2, · · ·) in order from the substrate center. Then 0 Rn = 9O—a (n · θ) ± 0.2. (0 <a≤2 n = 0, l, 2 · · ·), and when the number of the phosphor elements is an odd number, one of the phosphor elements and the reflective layer Assuming that the angle between the contact surface between the substrate and the substrate surface at the center of the substrate is 0 s n (n = 0,1,2-· ·) in order from the substrate center, 0 Sn = 9O—a (η · Θ) ± 0.2. (0 <a≤2, n = 0, l, 2 ···). BRIEF DESCRIPTION OF THE FIGURES
図 1は本発明の一実施形態による放射線検出器の断面図である。 図 2は図 1の 放射線検出素子ァレイブロックの要部断面図で、 (a) は検出素子数が偶数の場 合を、 (b) は検出素子数が奇数の場合を示す。 図 3 は放射線源と放射線検出素 子ァレイプロックとの位置的関係を示す図である。 図 4は本発明の他の実施形態 による放射線検出器の要部断面図である。 図 5は実施例に係わり回転軸方向に複 数の検出器を並べた例である。 図 6は本発明の放射線検出器の製造方法の一例を 示す図である。 図つは本発明に係わる放射線検出器を搭載した X線 CT装置の構 成図である。 図 8 (a) は本発明の放射線検出器の X線エネルギー特性を示す図 であり、 (b) は従来の放射線検出器の X線エネルギー特性を示す図である。 図 9は本発明の実施例 1に係わる検出器製造のフローをしめす。図 10は本発明の実 施例 2に係わる検出器製造のフローをしめす。 図 11は実施例 3に係わる検出器 製造のフローをしめす。 図 12 は従来の放射線検出素子アレイと散乱線除去コリ メータの関係を示す図である。 発明を実施するための最良の形態 以下、 本発明の実施形態を添付図面に基づいて詳細に説明する。 FIG. 1 is a cross-sectional view of a radiation detector according to one embodiment of the present invention. 2A and 2B are cross-sectional views of a main part of the radiation detection element array block in FIG. 1, wherein FIG. 2A shows a case where the number of detection elements is even, and FIG. 2B shows a case where the number of detection elements is odd. Figure 3 is a diagram showing the positional relationship between the radiation source and the radiation detection element array. FIG. 4 is a sectional view of a main part of a radiation detector according to another embodiment of the present invention. FIG. 5 is an example in which a plurality of detectors are arranged in the rotation axis direction according to the embodiment. FIG. 6 is a diagram illustrating an example of a method for manufacturing a radiation detector according to the present invention. FIG. 1 is a configuration diagram of an X-ray CT apparatus equipped with a radiation detector according to the present invention. FIG. 8 (a) is a diagram showing the X-ray energy characteristics of the radiation detector of the present invention, and FIG. 8 (b) is a diagram showing the X-ray energy characteristics of the conventional radiation detector. FIG. 9 shows a flow of manufacturing the detector according to the first embodiment of the present invention. FIG. 10 shows a flow of manufacturing a detector according to the second embodiment of the present invention. FIG. 11 shows a flow of manufacturing the detector according to the third embodiment. FIG. 12 is a diagram showing the relationship between a conventional radiation detecting element array and a scattered radiation removing collimator. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
本発明の一実施形態に係わる放射線検出器の断面図を図 1に示す。 この放射線 検出器は、基板 11、基板上に形成されたフォトダイオード 14 (光電変換素子) 、 複数のシンチレータ素子 12 (蛍光体素子) 、 および反射層 13からなつている。 フォトダイォード 14の直上にシンチレータ素子 12が一対一の関係で配置され、 シンチレータ素子 12と反射層 13は幅方向に交互に並べられる。 したがって反射 層 13の直下は実質的に基板 11のフォトダイオード 14が存在しない部分となる。 反射層 13で幅方向両側を挟まれてチヤンネル分離されたシンチレータ素子 12と その直下のフォトダイォード 14とで一つの検出素子が構成される。 FIG. 1 is a cross-sectional view of a radiation detector according to one embodiment of the present invention. The radiation detector includes a substrate 11, a photodiode 14 (photoelectric conversion element) formed on the substrate, a plurality of scintillator elements 12 (phosphor elements), and a reflection layer 13. The scintillator elements 12 are arranged directly above the photodiodes 14 in a one-to-one relationship, and the scintillator elements 12 and the reflective layers 13 are alternately arranged in the width direction. Therefore, immediately below the reflective layer 13 is a portion of the substrate 11 where the photodiode 14 does not substantially exist. One scintillator element is constituted by the scintillator element 12 which is channel-separated by sandwiching both sides in the width direction with the reflective layer 13 and the photodiode 14 immediately below the scintillator element.
シンチレータ素子および反射層の大きさやシンチレータ素子の配列数は放射線 検出器の用途により異なり、 特に限定されないが、 例えば、 X線 CT装置用の検 出器ァレイの場合、 幅 20〜40mm程度の基板上に約 1mmの配列ピッチ Lpでシ ンチレータ素子 12が設けられる。 反射層 13の配列方向における幅は、 通常配列 ピツチ Lpの 1/10〜2 10程度である。 The size of the scintillator element and the reflective layer and the number of scintillator elements arranged depend on the application of the radiation detector and are not particularly limited.For example, in the case of a detector array for an X-ray CT device, a substrate having a width of about 20 to 40 mm is used. The scintillator elements 12 are provided at an arrangement pitch Lp of about 1 mm. The width of the reflective layer 13 in the arrangement direction is about 1/10 to 210 of the normal arrangement pitch Lp.
本実施形態による放射線検出器では、 シンチレータ素子の配列ピッチを一定に 保ちながら、シンチレータ素子 12と反射層 13との接触面と基板表面とのなす角 度が徐々に変化するように構成する。 角度の変化は、 シンチレータ素子 12 と反 射層 13との接触面の法線の方向が、 そのシンチレータ素子 12と放射線源 (X線 であれば、 その焦点) とを結ぶ線とほぼ直角になるようにする。 放射線検出器の シンチレータ素子 12と反射層 13の配列は図 2 (a) では反射層 13を中心として 左右対称であり、 図 2 (b) ではシンチレータ素子 120 を中心として左右対称で ある。 The radiation detector according to the present embodiment is configured so that the angle formed between the contact surface between the scintillator element 12 and the reflective layer 13 and the substrate surface gradually changes while keeping the arrangement pitch of the scintillator elements constant. The change in the angle is such that the direction of the normal to the contact surface between the scintillator element 12 and the reflective layer 13 is almost perpendicular to the line connecting the scintillator element 12 and the radiation source (or the focal point, if it is an X-ray). To do. The arrangement of the scintillator element 12 and the reflective layer 13 of the radiation detector is bilaterally symmetric about the reflective layer 13 in FIG. 2A, and bilaterally symmetric about the scintillator element 120 in FIG. 2B.
基板上に設けられるシンチレータ素子の配列数が偶数の場合には、 図 2 (a) に 示すように、 基板 11の中心部には反射層 13の中心が位置することになる。 この 場合には、例えば、 この反射層 13と両側のシンチレータ素子 121、 121との接触 面が基板平面となす角度 Θ noをいずれも 90° とする。シンチレータ素子 121、 121 の外側にある反射層とその端部側にあるシンチレータ素子との接触面が基板面と なす角度 Θ Κ1 (基板中央部側の角度) はいずれも 90° 以下となるようにする。 以 後、 端部に行くに従い、 接触面と基板面とのなす角度が徐々に小さぐなるように する。 When the number of scintillator elements provided on the substrate is even, the center of the reflective layer 13 is located at the center of the substrate 11, as shown in FIG. In this case, for example, the angle Θno between the contact surface between the reflective layer 13 and the scintillator elements 121 on both sides and the substrate plane is 90 °. Scintillator elements 121, 121 of the angle theta .kappa.1 the contact surface of the reflective layer and the scintillator elements in the end portion side on the outside makes with the substrate surface (angle of the substrate center side) as will be hereinafter both 90 ° I do. Thereafter, the angle between the contact surface and the substrate surface gradually decreases toward the end. I do.
また基板上に設けられるシンチレータ素子の配列数が奇数の場合には、 図 2 (b) に示すように、基板 11の中心部にはシンチレータ素子 120の中心が位置す ることになる。 この場合には、 例えば、 このシンチレータ素子 120と両側の反射 層 131、 131との接触面が基板平面となす角度 0 soをいずれも 90° とする。 シン チレータ素子 121、 121 とさらに端部側にある反射層 131、 131 との接触面が基 板面となす角度 0 S1 (基板中央部側の角度) はいずれも 90° 以下となるようにす る。 以後、 端部に行くに従い、 接触面と基板面とのなす角度が徐々に小さくなる ようにする。 When the number of scintillator elements provided on the substrate is odd, the center of the scintillator element 120 is located at the center of the substrate 11, as shown in FIG. In this case, for example, the angle 0so between the contact surface of the scintillator element 120 and the reflective layers 131 on both sides with the substrate plane is 90 °. The angle 0 S1 (the angle at the center of the substrate) formed by the contact surface between the scintillator elements 121 and 121 and the reflection layers 131 at the end further to be 90 ° or less. You. Thereafter, the angle between the contact surface and the substrate surface is gradually reduced toward the end.
上述したように、 上記角度は、 シンチレータ素子の向きが放射線源の方向と一 致するように変化させる。 この変化を一般的に記述すると、 配列方向の蛍光体素 子数が偶数の場合には、 反射層 13 とその基板端部側に位置するシンチレータ素 子 12 との接触面と基板中央部における基板面とのなす角度 (基板中央部側の角 度) を、 基板中央から順にそれぞれ (η=0,1,2 · · · ) としたとき、式 1のよ うになる。 As described above, the angle is changed such that the direction of the scintillator element matches the direction of the radiation source. Generally speaking, when the number of phosphor elements in the arrangement direction is an even number, the contact surface between the reflective layer 13 and the scintillator element 12 located at the edge of the substrate and the substrate at the center of the substrate are described. When the angle between the plane and the plane (the angle at the center of the substrate) is (η = 0, 1, 2, · · ·) in order from the center of the substrate, Equation 1 is obtained.
0 Rn-9O-a (η · Θ ) ±0.2。 · · · (1) 0 Rn-9O-a (η · Θ) ± 0.2. · · · (1)
(ここで、 0< a≤2、 n=0,l,2 · · ·、 Θ =tan~i (Lp/Ld) 、 Ld は放射線源か らシンチレータ素子上面までの距離、 Lpはシンチレータ素子の配列ピッチである。 以下、 同じ) となる。 (Where 0 <a≤2, n = 0, l, 2 · ·, Θ = tan ~ i (Lp / Ld), Ld is the distance from the radiation source to the top of the scintillator element, and Lp is the The arrangement pitch is the same hereafter.)
またシンチレータ素子数が奇数の場合には、 シンチレータ素子 12 とその基板 端部側に位置する反射層 13 との接触面と、 基板中央部における基板面とのなす 角度 (基板中央部側の角度) を、基板中央から順にそれぞれ 0 Sn (η=0,1,2 · · · ) としたとき、 式 2のようになる。 If the number of scintillator elements is an odd number, the angle between the contact surface between the scintillator element 12 and the reflective layer 13 located at the edge of the substrate and the substrate surface at the center of the substrate (the angle at the center of the substrate) Is defined as 0 Sn (η = 0,1,2 · · ·) in order from the center of the substrate.
0 Sn=9O-a (η · Θ ) ±0.2° · · · (2) 0 Sn = 9O-a (η · ±) ± 0.2 ° (2)
なお、 上記式 1と式 2中の aは係数である。 0< a≤2を満たす値で a= lのと きにシンチレータの中心線は X線源の方向を向くことになる。 ちなみに a=0が 従来の技術によるシンチレータの配置を示し、 各シンチレータの中心線はすべて 平行に同一方向を指向する。 本実施例によれば各シンチレ一タの中心線が少しで も傾いて 0<a< lとなれば効果を発揮しはじめ、 a= lのときに理想的となり、 1 < a≤2でもなお効果を発揮する。 Note that a in the above equations 1 and 2 is a coefficient. The center line of the scintillator points to the direction of the X-ray source when a = l with a value satisfying 0 <a≤2. By the way, a = 0 indicates the arrangement of scintillators according to the conventional technology, and the center lines of each scintillator point in the same direction in parallel. According to this embodiment, the effect starts when the center line of each scintillator is slightly inclined and 0 <a <l, and becomes ideal when a = l. <a≤2 is still effective.
また、 上記式 1と式 2中、 Θ Otan— 1 (Lp/Ld) ) は、 シンチレータ素子の 1ピッチ当たりの仰角に相当するので、 このように 1ピッチ毎に仰角分シンチレ ータ素子の形状を傾斜させることによりシンチレータ素子の形状は常に放射線源 に向くことになる。 これによつて隣接するシンチレータ素子に入射する放射線が 入ることを防止できるので、 発光量のばらつきが抑制できる。 In Equations 1 and 2 above, Θ Otan-1 (Lp / Ld)) is equivalent to the elevation angle per pitch of the scintillator element, and thus the shape of the scintillator element for each elevation pitch By inclining the shape, the shape of the scintillator element always faces the radiation source. This can prevent radiation entering the adjacent scintillator element from entering, thereby suppressing variations in the amount of emitted light.
また、 上記式 1 と式 2中、 ±0.2° は製造上の寸法誤差を考慮した許容誤差で ある。 即ち、本発明者らの検討したところによると、各要素の傾斜角度が ±0.2° の精度で素子ァレイブロックを作製すれば本発明の本実施の形態における効果が 得られるが、 それ以上のばらつきがあるとこの効果は低減してしまう。 また、 各 要素の傾斜角度が、 Ο< 0 η^η · 0の範囲では本発明の効果が得られるが、 それ 以上傾斜すると発光特性が悪化してしまう。 そこで、 各要素の接触面 (境界面) と基板面とのなす角度は、 0 n=9O— a (n ' θ ) ±0.2° (0< a≤2、 η=0,1,2 · · · ) としている。 In Equations 1 and 2, ± 0.2 ° is a permissible error in consideration of dimensional errors in manufacturing. That is, according to the study of the present inventors, if an element array block is manufactured with an inclination angle of each element of ± 0.2 °, the effect of the present embodiment of the present invention can be obtained. If there is a variation, this effect is reduced. In addition, the effect of the present invention can be obtained when the inclination angle of each element is in the range of η < 0η ^ η · 0, but when the inclination angle is more than that, the light emission characteristics deteriorate. Therefore, the angle between the contact surface (boundary surface) of each element and the substrate surface is 0 n = 9O—a (n'θ) ± 0.2 ° (0 <a≤2, η = 0, 1, 2, ·).
本実施の形態における効果をさらに具体的に説明する。 例えば、 図 3に示すよ うに、 X線管 31の焦点から Ld=1037mmの距離、 つまり半径 1037mmの円弧 上、 にシンチレータ素子の配列ピッチ Lpが 1mmの 24チャンネル検出素子ァレ イブロック 32が配置されているとする。 ここで検出素子アレイブロック 32が従 来の検出素子アレイブロック 80 の場合には、 基板中央の反射層は基板法線方向 と平行に構成されている。 上記基板中央の反射層は X線管焦点の方向を向いてい るが、 基板中央以外に位置する反射層は基板中央から一素子離れるに従って Θ (=tan— 1 (Lp/Ld) ) =約 0.055° ずつ X線管焦点の方向からずれていく。 つま り中央から 12素子離れたプロック端部の反射層は X線焦点の方向から約 0.66° ( = 12x 0 ) ずれることになる。 ここで基板中央の反射層の側面 (基板面と交わ る面) の法線と X線管焦点の方向とのなす角度は 90度であり基板中央から n個 目の反射層側面の法線と X線管焦点の方向とのなす角度 (鈍角の場合はその補 角) は 0 Rn=9O— η · 0であるため、 ブロック端部での反射層の側面の法線と X線 管焦点の方向とがなす角度は 90— 0.66° =約 89.34° となる。 The effects of the present embodiment will be described more specifically. For example, as shown in FIG. 3, a 24-channel detection element array block 32 having a scintillator element arrangement pitch Lp of 1 mm is arranged at a distance of Ld = 1037 mm from the focal point of the X-ray tube 31, that is, on an arc having a radius of 1037 mm. Suppose you have been. Here, when the detection element array block 32 is the conventional detection element array block 80, the reflective layer at the center of the substrate is configured to be parallel to the normal direction of the substrate. The reflective layer at the center of the substrate is oriented in the direction of the X-ray tube focal point, but the reflective layers located at positions other than the center of the substrate are 素 子 (= tan-1 (Lp / Ld)) = approx. ° deviates from the direction of the X-ray tube focal point. In other words, the reflection layer at the end of the block, which is 12 elements away from the center, is shifted by about 0.66 ° (= 12x0) from the direction of the X-ray focal point. Here, the angle between the normal to the side of the reflective layer at the center of the substrate (the surface that intersects the substrate surface) and the direction of the focal point of the X-ray tube is 90 degrees. Since the angle formed by the direction of the X-ray tube focal point (complementary angle in the case of an obtuse angle) is 0 R n = 9O—η · 0, the normal to the side surface of the reflective layer at the end of the block and the X-ray tube focal point The angle between this direction and 90 ° is about 0.66 ° = about 89.34 °.
当然ながらシンチレータ素子の形状は反射層と同様に X線管焦点の方向からず れることになる。 このことは、 シンチレータ素子が奇数個並んでいる場合につい ても同様であり、ブロック中央のシンチレータ素子は X線管焦点の方向を向いた 形状であるが、 基板中心から離れるに従い約 0.055° ずつ X線管焦点の方向から ずれた形状になっていく。 したがって、 シンチレータ素子側面の法線と X線管焦 点の方向とのなす角度は、 基板中央から順に 0 sn=9O_n · θ (η=0,1,2 · · · ) となる。 Naturally, the shape of the scintillator element is not Will be. The same applies to the case where an odd number of scintillator elements are arranged.The scintillator element in the center of the block has a shape facing the X-ray tube focal point, but the distance from the center of the substrate increases by approximately 0.055 °. The shape is shifted from the direction of the tube focus. Therefore, the angle between the normal to the side surface of the scintillator element and the direction of the X-ray tube focal point is 0 s n = 9O_n · θ (η = 0, 1, 2, · · ·) in order from the center of the substrate.
これに対して、 図 1に示す本実施の形態に係わる検出素子アレイプロックの場 合には、 反射層側面と基板面とのなす角度 (基板中央部側の角度) 0 Rn (Π = On the other hand, in the case of the detection element array block according to the present embodiment shown in FIG. 1, the angle formed between the side surface of the reflective layer and the substrate surface (the angle on the substrate center side) 0 Rn (Π =
0,1,2 · · · ) 力 S 0 Rn=9O— η · θ (η=0,1,2 · · · ) となるようにシンチレータ素 子 12及び反射層 13を配列してあるので、素子ァレイブロックを円弧に擬似した 多角形状 (ポリゴン) の上に配列した場合においても全ての素子を X線管焦点の 方向に向けて配列することができる。 0,1,2 ···) force S 0 Rn = 9O— η · θ (η = 0,1,2 ···), the scintillator elements 12 and the reflective layer 13 are arranged, Even when the element array blocks are arranged on a polygonal shape (polygon) simulating an arc, all the elements can be arranged in the direction of the X-ray tube focal point.
なお、 図 1及び図 2では、 反射層の幅がその深さ方向のどの位置においても一 定である場合を図示しているが、 図 4に示すように反射層の幅を深さ方向の位置 において変化させシンチレータ素子の幅を深さ方向のどの位置においても一定と なるようにしてもよい。 また図では一次元方向の配列しか示していないが、 二次 元素子アレイの場合には、 2次元のそれぞれの配列方向について同様の構造を有 するものとすることができる。 Note that FIGS. 1 and 2 show a case where the width of the reflective layer is constant at any position in the depth direction, but as shown in FIG. 4, the width of the reflective layer is changed in the depth direction. The width of the scintillator element may be constant at any position in the depth direction by changing the position. Although only one-dimensional array is shown in the figure, a two-dimensional element array can have a similar structure in each two-dimensional array direction.
また二次元素子アレイの場合には、 図 5に示すように、 上述の二次元素子ァレ ィを複数個これらの長軸方向が 0° 以上 90° 以下の所定の角度をもって交差する ように回転軸方向に並べ、 その際に、 各々の二次元素子アレイが X線管焦点の方 向を向くように、 角度を変えて配列することもできる。 この場合、 より広い面積 にわたり検出器配列方向のばらつきが抑制でき、 これに起因するアーチファタト を軽減除去可能である。 In the case of a two-dimensional element array, as shown in FIG. 5, a plurality of the above-described two-dimensional element arrays are rotated so that their major axes intersect at a predetermined angle of 0 ° or more and 90 ° or less. The two-dimensional element arrays can be arranged at different angles so that each two-dimensional element array faces the direction of the X-ray tube focal point. In this case, the variation in the detector array direction can be suppressed over a wider area, and the artifact caused by this can be reduced and eliminated.
次に、 本実施の形態に係わる放射線検出装置の製造方法としては下記に示すチ ヤンネル分離されたシンチレータ素子プロックを製造する従来技術の方法 (1) から (3) までがいずれも適用可能である。 特に製造のし易さおよび得られる素 子の性能の点で (3) の方法が望ましい。 Next, as a method of manufacturing the radiation detecting apparatus according to the present embodiment, any of the following conventional methods (1) to (3) for manufacturing a channel-separated scintillator element block can be applied. . In particular, the method (3) is desirable in terms of ease of production and performance of the obtained element.
(1) 複数の板状シンチレータ素材を反射材を介して所定間隔に積層してプロ ックとした後、 その積層ブロックを所定の厚さに切断し、 フォトダイオードァレ ィが形成された基板上に接着する方法 (1) A plurality of plate-shaped scintillator materials are laminated at predetermined Then, the laminated block is cut to a predetermined thickness and bonded to the substrate on which the photodiode array is formed.
(2) 板状シンチレータ素材をフォトダイオードアレイ基板上に接着した後、 板状シンチレータ素材に所定ピッチで切り込み溝を形成し、 この溝内に反射層を 構成する材料を入れる方法 (2) A method in which a plate-shaped scintillator material is adhered to a photodiode array substrate, and then a cutout groove is formed at a predetermined pitch in the plate-shaped scintillator material, and a material constituting a reflective layer is placed in the groove.
(3) 板状シンチレータ素材に所定ピッチで切り込み溝を形成し、 この溝内に 反射層を構成する材料を特定の方法で充填した後、 所定の厚さに切断し、 これを フォトダイォードアレイが形成された基板上に接着する方法。 (3) Cut grooves are formed at a predetermined pitch in the plate-shaped scintillator material, and the material constituting the reflective layer is filled in this groove by a specific method. A method of bonding on a substrate on which is formed.
図 6に上記 (3) の方法を説明する。 まず直方体状のシンチレータ素材 50に、 底部を切離れないように残して、 所定ピッチ、 所定幅、 所定深さの切り込み溝 51 を形成する。 シンチレータ素材としては、 希土類蛍光体など放射線から光への変 換効率の高い蛍光体が使用できる。 この蛍光体はたとえば日本特許出願公開番号 JP-A-2001 -004753に記載されるような Ceを発光元素とし、少なくとも Gd、 Al、 Ga、 Oを含んだガーネット構造の母体結晶からなる希土類酸ィヒ物シンチレ一 タである。 Figure 6 illustrates the method (3). First, a notch groove 51 having a predetermined pitch, a predetermined width, and a predetermined depth is formed in a rectangular parallelepiped scintillator raw material 50 without leaving a bottom thereof. As the scintillator material, a phosphor having a high radiation-to-light conversion efficiency such as a rare-earth phosphor can be used. The phosphor is, for example, a rare-earth acid composed of a host crystal having a garnet structure containing at least Gd, Al, Ga, and O with Ce as a light-emitting element as described in Japanese Patent Application Publication No. JP-A-2001-004753. It is a scintillator of arsenal.
次に切り込み溝 51に反射層を形成する材料 52を充填する。 この材料 52が硬 化収縮しない材料の場合には、 それぞれの切り込み溝 51 はシンチレータ素材の 面に対し所定の角度を持つように形成される。 この角度は上述したように検出素 子ァレイとして作り上げた際に反射層とシンチレータ素子間の接触面と基板面と のなす角が基板中央部から端部にいくに従い傾斜するような角度である。 加工は マルチワイヤーソーゃスライサー等の加工機械における材料と切刃との角度を端 部に向かう毎に順次変化させることにより達成できる。 一方、 材料 52 が硬化収 縮する材料の場合には、 切り込み溝 51 は平行に形成させてもよい。 この場合、 硬化収縮によって反射層は縮もうとするが、 シンチレータ素材の底面がつながつ ているために、 底面の寸法は変化しない。 従って、 シンチレータ底面付近の反射 層はあまり収縮せず、 上部へ行くに従って、 大きく収縮する。 この結果、 上述し たような深さ方向に幅の変化する略くさび型断面形状を反射層に付与できる。 このように切り込み溝 51を形成した後、溝内に反射層を形成する材料 52を充 填する。 反射層を形成する材料 52 としては、 エポキシ樹脂、 アクリル樹脂、 フ ェノール樹脂等の有機樹脂中に、 酸化チタン、 酸ィ匕アルミニウム、 硫酸バリウム 等の無機化合物粉末を反射材として含有させたものや、 光反射率の高い金属板、 およびそれらを組み合わせたものなどを用いることができる。 Next, the cut groove 51 is filled with a material 52 for forming a reflective layer. When the material 52 does not harden and shrink, each cut groove 51 is formed to have a predetermined angle with respect to the surface of the scintillator material. This angle is such that the angle formed by the contact surface between the reflective layer and the scintillator element and the substrate surface, when formed as a detection element array as described above, is inclined from the center to the end of the substrate. The processing can be achieved by sequentially changing the angle between the material and the cutting edge in a processing machine such as a multi-wire saw-slicer every time it approaches the end. On the other hand, when the material 52 is a material that cures and shrinks, the cut grooves 51 may be formed in parallel. In this case, the reflective layer tries to shrink due to curing shrinkage, but the dimensions of the bottom surface do not change because the bottom surface of the scintillator material is connected. Therefore, the reflective layer near the bottom of the scintillator does not shrink much, but shrinks greatly toward the top. As a result, a substantially wedge-shaped cross-sectional shape whose width changes in the depth direction as described above can be provided to the reflective layer. After the cut grooves 51 are formed in this way, a material 52 for forming a reflective layer is filled in the grooves. As the material 52 for forming the reflection layer, epoxy resin, acrylic resin, An organic resin such as an enol resin, a powder containing an inorganic compound powder such as titanium oxide, aluminum oxide, barium sulfate or the like as a reflective material, a metal plate having a high light reflectance, or a combination thereof. Can be used.
ここで、 材料 52 として樹脂中に反射材を含有させたものを用いる場合には、 遠心機を用いて遠心注入する。 これにより溝の底部まで材料 52 を注入すること ができ、 しかも樹脂中の気泡を実質的になくすことができる。 Here, when a material containing a reflecting material in a resin is used as the material 52, it is centrifugally injected using a centrifuge. As a result, the material 52 can be injected to the bottom of the groove, and air bubbles in the resin can be substantially eliminated.
あるいは材料 52 として有機樹脂中に反射材を分散させたものを用いる場合に は、 材料 52中の有機樹脂を硬ィ匕させて反射層を形成する。 Alternatively, in the case where a material in which a reflecting material is dispersed in an organic resin is used as the material 52, the reflecting layer is formed by hardening the organic resin in the material 52.
また、 金属板などをそのまま或いは接着剤を介して挿入した場合には、 必要に 応じて接着剤を硬化させる。 しかる後に溝の深さ方向と直交する方向に所望の厚 さにスライスする。 When a metal plate or the like is inserted as it is or through an adhesive, the adhesive is cured as necessary. Thereafter, the slice is sliced to a desired thickness in a direction orthogonal to the depth direction of the groove.
上記材料 52 として有機樹脂中に反射材を分散させたものを用いた場合には有 機樹脂が硬化する際に収縮するが、 溝の底部はシンチレータ素材の底部に固定さ れているため収縮しないので、 溝の底部から上部に向かつて傾斜が形成される。 硬化収縮の程度は樹脂の種類や粘度により異なり、 これら条件を適切に選択する ことにより、 溝に所望の傾斜を与えることができる。 例えば、 有機樹脂として粘 度 10000 20000cPsのエポキシ樹脂を用いた場合には、幅 0.15mm、深さ 10mm の溝について約 0.04 0·06° の傾斜を形成することができる。 したがって、 切り 込み溝形成工程において、 深さ方向に平行な溝を形成するとともに適切に選択さ れた有機樹脂を含む材料 52 を用いることにより、 上述したような深さ方向に幅 の変化する略くさび型断面形状を反射層に付与できる。 When a material in which a reflective material is dispersed in an organic resin is used as the material 52, the resin shrinks when the organic resin hardens, but does not shrink because the bottom of the groove is fixed to the bottom of the scintillator material. Therefore, a slope is formed from the bottom to the top of the groove. The degree of cure shrinkage varies depending on the type and viscosity of the resin, and by appropriately selecting these conditions, a desired inclination can be imparted to the groove. For example, when an epoxy resin having a viscosity of 10000 20000 cPs is used as an organic resin, a groove having a width of 0.15 mm and a depth of 10 mm can form a slope of about 0.0400 °. Therefore, in the notch groove forming step, by forming grooves parallel to the depth direction and using a material 52 containing an organic resin appropriately selected, the width in the depth direction as described above is substantially changed. A wedge-shaped cross-sectional shape can be imparted to the reflective layer.
一方、 このような硬化収縮のない材料、 例えば金属板などを用いた場合には、 予め切り込み溝 51 自体に傾斜をつけておくことにより、 所望の角度を持つ反射 層を形成することができる。 On the other hand, when a material without such curing shrinkage, for example, a metal plate, is used, a reflection layer having a desired angle can be formed by previously inclining the cut groove 51 itself.
こうして製造したシンチレータを、 シンチレータ素子の配列ピッチと同じ配列 で、 予めフォトダイオードアレイを形成した基板 53上に接着することにより、 本発明の放射線検出器を得る。 なお、 フォ トダイオードとしては、 PINフォトダ ィォード等の公知のフォトダイォードを用いることができる。 The radiation detector of the present invention is obtained by bonding the scintillator manufactured in this manner on the substrate 53 on which the photodiode array is formed in advance in the same arrangement pitch as the scintillator elements. A known photodiode such as a PIN photodiode can be used as the photodiode.
次に本発明の放射線検出器を採用した X線 CT装置について説明する。 図 6は 本発明が適用される医用画像診断の一例として X線 CT装置の概略を示す。 この X線 CT装置は、 スキャンガントリ部 610と画像再構成部 620とを備え、 スキヤ ンガントリ部 610には被検体が搬入される開口部 614を備えた回転円板 611と、 この回転円板 611に搭載された X線管 612と、 X線管 612に取り付けられ X線 束の放射方向を制御するコリメータ 613と、 X線管 612と対向して回転円板 611 に搭載された X線検出器 615と、 X線検出器 615で検出された X線を所定の信 号に変換する検出器回路 616 と、 回転円板 611の回転及び X線束の幅を制御す るスキャン制御回路 617とが備えられている。 Next, an X-ray CT apparatus using the radiation detector of the present invention will be described. Figure 6 The outline of an X-ray CT apparatus is shown as an example of medical image diagnosis to which the present invention is applied. The X-ray CT apparatus includes a scan gantry unit 610 and an image reconstruction unit 620. The scan gantry unit 610 includes a rotating disk 611 having an opening 614 into which a subject is loaded, and the rotating disk 611. X-ray tube 612 mounted on the X-ray tube, a collimator 613 mounted on the X-ray tube 612 to control the radiation direction of the X-ray flux, and an X-ray detector mounted on a rotating disk 611 facing the X-ray tube 612 615, a detector circuit 616 for converting the X-rays detected by the X-ray detector 615 into a predetermined signal, and a scan control circuit 617 for controlling the rotation of the rotating disk 611 and the width of the X-ray flux. Have been.
画像再構成部 620は、 被検者氏名、 検査日時、 検査条件などを入力する入力装 置 621、 検出器回路 616から送出される計測データ S1を演算処理して CT画像 再構成を行う画像演算回路 622、 画像演算回路 622で作成された CT画像に入力 装置 621から入力された被検者氏名、 検査日時、 検査条件などの情報を付加する 画像情報付加部 623と、 画像情報を付加された CT画像信号 S2の表示ゲインを 調整してディスプレイモニタ 630へ出力するディスプレイ回路 624とを備えてい る。 The image reconstruction unit 620 performs image processing for reconstructing a CT image by processing the measurement data S1 transmitted from the input device 621 and the detector circuit 616 for inputting the subject's name, examination date and time, examination conditions, and the like. Circuit 622, an image information adding unit 623 for adding information such as the subject name, examination date and time, and examination conditions input from the input device 621 to the CT image created by the image arithmetic circuit 622, and image information added. A display circuit 624 that adjusts the display gain of the CT image signal S2 and outputs the result to the display monitor 630.
この X線 CT装置では、スキャンガントリ部 610の開口部 614に、設置された 寝台(図示せず)に被検者を寝かせた状態で、 X線管 612から X線が照射される。 この X線はコリメータ 613により指向性を与えられ、 X線検出器 615により検 出される。 この際、 回転円板 611を被検者の周りに回転させることにより、 X線 を照射する方向を変えながら、被検者を透過した X線を検出する。 この計測デー タをもとに画像再構成部 620で作成された断層像は、ディスプレイモニタ 630に 表示される。 In this X-ray CT apparatus, X-rays are emitted from an X-ray tube 612 in a state where a subject is placed on a bed (not shown) installed in an opening 614 of a scan gantry section 610. This X-ray is given directivity by a collimator 613 and detected by an X-ray detector 615. At this time, by rotating the rotating disk 611 around the subject, X-rays transmitted through the subject are detected while changing the direction of X-ray irradiation. The tomographic image created by the image reconstruction unit 620 based on the measurement data is displayed on the display monitor 630.
X線検出器 615は、 シンチレータ素子 (蛍光体素子) とフォトダイオード (光 電変換素子) とを組み合わせた検出素子を複数個配列した検出素子ァレイプロッ クを多数、 円弧に近い多角形状に配列したものからなる。 放射線検出器としては この図 1、 図 2あるいは図 4に示すような本実施の形態による検出素子アレイブ ロックを有するものとする。 同放射線検出器は、 素子を円周方向に一列配列した 一次元検出器であっても、 数列配列した二次元検出器であってもよい。 二次元検 出器の場合には、 回転円板 611の回転軸に平行な配列方向 (被検体の体軸方向) についても、 それぞれの素子が X線管焦点の方向を向いて配列される。 The X-ray detector 615 is composed of a large number of detection element array blocks, each of which has a plurality of detection elements that combine a scintillator element (phosphor element) and a photodiode (photoelectric conversion element), arranged in a polygonal shape close to an arc. Consists of It is assumed that the radiation detector has a detection element array block according to the present embodiment as shown in FIG. 1, FIG. 2, or FIG. The radiation detector may be a one-dimensional detector in which elements are arranged in a row in the circumferential direction, or a two-dimensional detector in which elements are arranged in a row. In the case of a two-dimensional detector, the array direction parallel to the rotation axis of the rotating disk 611 (the body axis direction of the subject) Also, each element is arranged facing the direction of the X-ray tube focal point.
この X線検出器 615は、シンチレータ素子を配置した側が放射線源に対向する ように、 X線管 612の焦点を中心とする円弧上に配置される。 ここで X線検出器 615は、 シンチレータ素子とその両側の反射層とで区画されるシンチレータ素子 力 S、 焦点からの X線照射方向に指向する形状に構成されているので、 ブロック端 部に位置するシンチレータ素子であっても中心部のシンチレータ素子と同じよう に充分な放射線が入射されることになり均一な出力が得られる。 The X-ray detector 615 is arranged on an arc centered on the focal point of the X-ray tube 612 so that the side where the scintillator element is arranged faces the radiation source. Here, the X-ray detector 615 is configured to have a shape directed in the X-ray irradiation direction from the focal point because the scintillator element is divided by the scintillator element and the reflective layers on both sides thereof. Even in the case of a scintillator element, sufficient radiation is incident as in the case of the central scintillator element, and a uniform output can be obtained.
図 8 (a) は図 1に示すような本発明の実施の形態に係わる X線検出器を用い た場合の X線エネルギー特性を、 図 8 (b) は従来の X線検出器を用いた場合の X線エネルギー特性をそれぞれ模式的に示す。 図 8 (b) に示す従来の X線検出 器では素子ァレイブロック内の X線エネルギー特性のばらつきが大きい。 これに より発光特性にばらつきが生じ、 CT画像にアーチファタトが生じやすくなる。 これに対し本実施の形態に係わる X線検出器では、プロック内部での X線ェネル ギー特性のばらつきが抑制され発光特性のばらっきを小さくすることができる。 このためアーチファタトの少ない高画質な CT画像を得ることができる。 Fig. 8 (a) shows the X-ray energy characteristics when the X-ray detector according to the embodiment of the present invention as shown in Fig. 1 is used, and Fig. 8 (b) shows the results using the conventional X-ray detector. The X-ray energy characteristics in each case are schematically shown. In the conventional X-ray detector shown in Fig. 8 (b), the X-ray energy characteristics in the element array block vary widely. This causes variations in the light emission characteristics, and artifacts are likely to occur in CT images. On the other hand, in the X-ray detector according to the present embodiment, the dispersion of the X-ray energy characteristics inside the block can be suppressed, and the dispersion of the emission characteristics can be reduced. For this reason, a high-quality CT image with few artifacts can be obtained.
以下、 本発明による放射線検出器の実施例を説明する。 Hereinafter, embodiments of the radiation detector according to the present invention will be described.
く実施例 1〉 Example 1>
図 9をもとに本実施例による放射線検出器の製造のフローを説明する。 The manufacturing flow of the radiation detector according to the present embodiment will be described based on FIG.
Gds (Al,Ga) 5012: Ceセラミックシンチレータから構成されるシンチレータ板 (X方向、 Y方向および Z方向の寸法が各々 26 X 30 X 1.8mm)の X— Y面を、 lmm ピッチで 24 チャンネルの一次元フォトダイォードアレイが形成された基板に接 着した。 次いで厚さ 0.13mmのダイヤモンド砥石を用いて、 Y方向に平行な溝を シンチレータ板の X方向に lmm ピッチで加工した。 このときの溝の深さは 1.8mmである。 Gds (Al, Ga) 5 0 12: Ce ceramic scintillator from configured scintillator plate X- Y plane of the (X, Y and Z directions of dimensions each 26 X 30 X 1.8mm), 24 at lmm pitch The channel was attached to a substrate on which a one-dimensional photodiode array was formed. Then, using a 0.13 mm thick diamond grindstone, grooves parallel to the Y direction were machined at lmm pitch in the X direction of the scintillator plate. The depth of the groove at this time is 1.8 mm.
この際、 シンチレータ板の一端に最も近い溝を加工するときには、 Z方向 (フ ォトダイォードアレイ基板の法線方向) に対して 0.66° の角度で砥石が入るよう に設定した。 端から 2番目以降の溝には同様に 0.605° の角度で砥石が入るよう に設定した。 引き続き中央に進むに従って 0.055° ずつ徐々に砥石の角度が小さ くなるようにした。 このようにしてシンチレータ板の中央の溝 (13番目の溝) で は砥石の角度が 0° になり、 以降他の端部側の溝は逆方向に砥石の角度を順次大 きくしていき、 他端に最も近い溝 (25番目) で 0.66° となるように砥石の角度 を設定して加工した。 At this time, when machining the groove closest to one end of the scintillator plate, the setting was such that the grindstone entered at an angle of 0.66 ° with respect to the Z direction (the normal direction of the photodiode array substrate). Similarly, the grindstone was set to enter the groove at the angle of 0.605 ° in the second and subsequent grooves from the end. The angle of the grindstone was gradually reduced in steps of 0.055 ° toward the center. In this way, the center groove (13th groove) of the scintillator plate The angle of the grindstone becomes 0 °, the groove on the other end side gradually increases the angle of the grindstone in the opposite direction, and the grindstone becomes 0.66 ° in the groove closest to the other end (25th). The angle was set for machining.
このように傾斜角度を変えて溝加工を行った後、 溝に T >2粉末を混合したェ ポキシ樹脂を流し込んで硬化させ、 反射層を形成し検出器素子ブロックを作製し た(図 5参照)。 この検出器素子ブロックは、シンチレータ材料を基板に接着後、 反射層となる溝を厚さ一定の砥石で加工したため、 図 2に示すように、 反射層の 両側面が平行な形状を有する。 After the groove processing was performed with the inclination angle changed in this way, an epoxy resin mixed with T> 2 powder was poured into the groove and cured, forming a reflective layer and producing a detector element block (see Fig. 5). ). In this detector element block, since the scintillator material is adhered to the substrate and the groove serving as the reflective layer is processed with a grindstone having a constant thickness, the reflective layer has a shape in which both side surfaces are parallel as shown in FIG.
こうして作製した検出器素子ブロック 40個を X線 CT装置に搭載し、 発光特 性 (X線エネルギー特性) 及びそのばらつきを測定した。 X線管焦点から検出器 素子プロックまでの距離は、 1037mmとした。 X線エネルギー特性 Eは、管電圧 100kVおよび 120kV、管電流 100mAの X線を照射し、そのときの各チヤンネル の出力比によって、 次式のように定義した。 Forty detector element blocks fabricated in this way were mounted on an X-ray CT system, and the emission characteristics (X-ray energy characteristics) and their variations were measured. The distance from the X-ray tube focal point to the detector element block was 1037 mm. The X-ray energy characteristics E were defined as follows by irradiating X-rays at a tube voltage of 100 kV and 120 kV and a tube current of 100 mA, and by the output ratio of each channel at that time.
E=6095 · log{ (Rioo/Xioo) / (R120ZX120) } E = 6095 · log {(Rioo / Xioo) / (R120ZX120)}
式中、 X10o (X120) 、 R100 (Ri2o) はそれぞれ管電圧 100kV (120kV) のとき のサンプ Λ^、 リファレンスの出力である。 Wherein, X 10 o (X120), R100 (Ri2o) is sump lambda ^ when the respective tube voltages 100 kV (120 kV), which is the output of the reference.
X線エネルギー特性のばらつきは、 検出器素子ブロック内の各チャンネルの特 性 Εの最大値と最小値の差で定義した。 このばらつきが 5以上であると CT画像 にリングアーチファク トが生じやすくなる。 The variation in X-ray energy characteristics was defined as the difference between the maximum value and the minimum value of the characteristic の of each channel in the detector element block. If this variation is 5 or more, ring artifacts are likely to occur in CT images.
本実施例のブロック内での X線エネルギー特性のばらつきは、従来の素子ブロ ックのばらつきを 1とすると約 0.3であった。 したがって、 この X線 CT装置で は CT画像のアーチファタトが抑えられることが示された。 The variation of the X-ray energy characteristics within the block of this example was about 0.3, where the variation of the conventional device block was 1. Therefore, it was shown that this X-ray CT device can suppress artifacts in CT images.
<実施例 2〉 <Example 2>
図 10 をもとに本実施例による放射線検出器の製造のフローを説明する。 Gd3 (Al,Ga) 5012: Ce セラミックシンチレータから構成されるシンチレータ板 (X 方向、 Y方向および Z方向の寸法が各々 24 X 36 X 4mm) の X—Y面に、 線径 0.13mmのマルチワイヤーソーを用いて、 X方向及び Y方向に平行な格子状の溝 入れ加工を行った。 Y方向には、 X方向に lmmピッチで 23本の溝を加工し、 X 方向には、 Y方向に 2.25mmピッチで 15本の溝を加工した。 溝の深さはいずれ も 3mmとし、 シンチレ一タ板底部ではつながっている状態とした。 またいずれ の溝もシンチレータ底部に垂直に加工した。 The manufacturing flow of the radiation detector according to the present embodiment will be described with reference to FIG. Gd 3 (Al, Ga) 5 0 12: Ce ceramic scintillator from configured scintillator plate onto the X-Y plane of the (X, Y and Z directions of dimensions each 24 X 36 X 4mm), diameter 0.13mm Using a multi-wire saw, a grid-like grooving process parallel to the X and Y directions was performed. In the Y direction, 23 grooves were machined in the X direction at lmm pitch, and in the X direction, 15 grooves were machined in the Y direction at 2.25mm pitch. Any depth of groove Was 3 mm, and it was connected at the bottom of the scintillator plate. Each groove was machined vertically to the bottom of the scintillator.
このように溝加工を行ったシンチレータ板の溝に、 Ti02粉末を混合したェポキ シ樹脂を流し込んで硬化させ、 反射層を形成した。 このとき、 エポキシ樹脂の硬 化収縮が起こるが、 各シンチレータ素子は底部でつながつているため、 中央部に 向かって傾斜した形状になった。 その後、 上下面を切断、 研磨加工によって厚さ 1.8mmに仕上げ、 24X 16チャンネルのシンチレータ素子アレイを作製した。 こ のシンチレータ素子アレイにおいて、 シンチレータ素子は、 ワイヤーソ一でカロェ したため、 両側面が平行であるが、 反射層は硬化収縮のために Z方向上面側が細 くなる形状であった。 またシンチレータ素子側面と基板面のなす角度は、 X方向 の端部素子で 89.43° 、 Y方向の端部素子で 89.14° であった。 Thus the grooves of the scintillator plate subjected to groove processing, cured by pouring Epoki sheet resin mixed with Ti0 2 powder to form a reflective layer. At this time, curing and shrinkage of the epoxy resin occurred, but the scintillator elements were connected at the bottom, so that the shape became inclined toward the center. After that, the upper and lower surfaces were cut and polished to a thickness of 1.8 mm to produce a 24 × 16 channel scintillator element array. In this scintillator element array, the scintillator element was parallelized on both sides because it was burned by a wire saw, but the reflective layer had a shape in which the upper surface in the Z direction became thin due to curing shrinkage. The angle formed between the side surface of the scintillator element and the substrate surface was 89.43 ° for the end element in the X direction and 89.14 ° for the end element in the Y direction.
以上のように作製したシンチレータ素子アレイを、 24 X 16チャンネルのフォト ダイオードアレイ基板に接着して、 検出器素子ブロックを得た。 この検出器素子 ブロックを X方向が円周方向となるように X線 CT装置に搭載して、実施例 1と 同様に発光特性を測定した。 その結果、 X方向、 Y方向共に従来の素子ブロック でのばらつきを 1とすると約 0.4であり、 この検出器素子ブロックを採用した X 線 CT装置では CT画像のアーチファタトが抑えられることが示された。 The scintillator element array produced as described above was adhered to a 24 × 16 channel photodiode array substrate to obtain a detector element block. This detector element block was mounted on an X-ray CT apparatus so that the X direction was the circumferential direction, and the light emission characteristics were measured as in Example 1. As a result, if the variation in the conventional element block in both the X and Y directions is 1, the value is about 0.4, indicating that the X-ray CT system using this detector element block can suppress artifacts in CT images. .
本発明によれば、 複数の蛍光体素子が一次元あるいは二次元方向に配列した放 射線検出器において、 蛍光体素子 (シンチレータ素子) とその両側に配置される 反射層とで規定される蛍光体素子の向きを、 放射線の入射方向と実質的に同じに することにより、 放射状に入射される放射線に対し、 検出器ブロック内での発光 特性のばらつきを抑制し、高精度の放射線検出器を提供することができる。また、 このような放射線検出器を備えることにより、 アーチファタ トの少ない X線 CT 装置などの医用画像診断装置を提供することができる。 According to the present invention, in a radiation detector in which a plurality of phosphor elements are arranged in a one-dimensional or two-dimensional direction, a phosphor defined by a phosphor element (scintillator element) and reflection layers disposed on both sides thereof By providing the direction of the element substantially the same as the direction of incidence of radiation, it is possible to suppress variations in light emission characteristics within the detector block for radially incident radiation and provide a highly accurate radiation detector can do. Further, by providing such a radiation detector, it is possible to provide a medical image diagnostic apparatus such as an X-ray CT apparatus with less artifact.
<実施例 3> <Example 3>
シンチレータ素子アレイを複数用意し、 これらの長軸方向が 0° 以上 90° 以下 の所定の角度をもつて交差するように 1次元または 2次元方向に並置して放射線 検出器を構成してもよい。 A plurality of scintillator element arrays may be prepared, and the radiation detectors may be configured by juxtaposing them in a one-dimensional or two-dimensional direction such that their major axes intersect at a predetermined angle of 0 ° or more and 90 ° or less. .
実施例 2と同様の工程で 24 X 8チャンネルのシンチレータ素子ァレイを作製し、 これら 2個の長軸方向に所定の角度をつけてチャンネル方向に並べた状態で 24 X 16チャンネルのフォトダイォードアレイ基板に接着し放射線検出器を得た。こ の際、 24 X 16チャンネルのフォトダイオードは、 24 X 8チャンネルごとの領域に 分割されており、各々の領域は 0.50° ずつ基板面に対して傾斜しているものを用 いた。 A 24 x 8 channel scintillator element array was produced in the same process as in Example 2, A radiation detector was obtained by adhering to a 24 × 16 channel photodiode array substrate in a state where these two long axes were arranged in the channel direction at a predetermined angle. At this time, the photodiode of 24 × 16 channels was divided into regions of 24 × 8 channels, and each region was inclined at 0.50 ° with respect to the substrate surface.
この検出器を用いても、 実施例 2の場合と同様に、各検出器素子が X線管焦点 の方向を向いた検出素子アレイとすることができ、 さらに所定の角度で並置され るため、 より広い面積にわたって検出器配列方向のばらつきが抑制でき、 これに 起因するアーチファタトを軽減除去可能である。 Even when this detector is used, as in the case of the second embodiment, each detector element can be a detection element array oriented in the direction of the X-ray tube focal point, and since it is juxtaposed at a predetermined angle, Variations in the detector array direction can be suppressed over a wider area, and artifacts due to this can be reduced and eliminated.
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| JP2014510274A (en) * | 2011-03-03 | 2014-04-24 | サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド | System, method and apparatus for imaging array using non-uniform partition walls |
| CN105190775B (en) * | 2013-04-01 | 2018-02-23 | 株式会社东芝 | Scintillator arrays, X-ray detector and X ray checking device |
| CN104345070B (en) * | 2013-07-29 | 2018-03-23 | 同方威视技术股份有限公司 | Detector module, the method and ray detection system for installing detector module |
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| JP6968419B2 (en) * | 2018-04-27 | 2021-11-17 | 国立大学法人東北大学 | Manufacturing method of wavefront control element |
| KR102092889B1 (en) * | 2018-05-17 | 2020-04-23 | 국립암센터 | Apparatus for measuring radiation, system for measuring radiation having the same and method for measuring radiation |
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Citations (2)
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