[go: up one dir, main page]

WO2004041658A3 - Substrate process tank with acoustical source transmission and method of processing substrates - Google Patents

Substrate process tank with acoustical source transmission and method of processing substrates Download PDF

Info

Publication number
WO2004041658A3
WO2004041658A3 PCT/US2003/034649 US0334649W WO2004041658A3 WO 2004041658 A3 WO2004041658 A3 WO 2004041658A3 US 0334649 W US0334649 W US 0334649W WO 2004041658 A3 WO2004041658 A3 WO 2004041658A3
Authority
WO
WIPO (PCT)
Prior art keywords
acoustical
acoustical energy
source
process fluid
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/034649
Other languages
French (fr)
Other versions
WO2004041658A2 (en
Inventor
John Korbler
Xuecang Geng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akrion Inc
Original Assignee
Akrion Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Inc filed Critical Akrion Inc
Priority to AU2003286798A priority Critical patent/AU2003286798A1/en
Priority to CN2003801077617A priority patent/CN1732711B/en
Priority to EP03778012A priority patent/EP1600039A2/en
Publication of WO2004041658A2 publication Critical patent/WO2004041658A2/en
Publication of WO2004041658A3 publication Critical patent/WO2004041658A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H10P72/0416—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)

Abstract

A system and method for improving the efficiency and effectiveness of the transmission of acoustical energy to process fluids during substrate processing, such as cleaning or photoresist stripping. The invention utilizes a layered stack of materials to transmit acoustical energy from a source of acoustical energy to the process fluid. The material of which each layer is constructed is chosen so as to reduce the differences in acoustical impedance between consecutive layers of the stack, providing a more gradual transition, in terms of acoustical impedance, when acoustical energy is being transmitted from the source to the process fluid. In one aspect, the invention is a system comprising: a process chamber for receiving a process fluid; an acoustical energy source; and an acoustical stack having a first transmission layer and a second transmission layer that forms an acoustical energy pathway from the acoustical energy source to the process fluid in the process chamber.
PCT/US2003/034649 2002-11-01 2003-10-31 Substrate process tank with acoustical source transmission and method of processing substrates Ceased WO2004041658A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2003286798A AU2003286798A1 (en) 2002-11-01 2003-10-31 Substrate process tank with acoustical source transmission and method of processing substrates
CN2003801077617A CN1732711B (en) 2002-11-01 2003-10-31 Substrate processing tank with acoustic energy transmission and method for processing substrate
EP03778012A EP1600039A2 (en) 2002-11-01 2003-10-31 Substrate process tank with acoustical source transmission and method of processing substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42326302P 2002-11-01 2002-11-01
US60/423,263 2002-11-01

Publications (2)

Publication Number Publication Date
WO2004041658A2 WO2004041658A2 (en) 2004-05-21
WO2004041658A3 true WO2004041658A3 (en) 2004-08-19

Family

ID=32312631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/034649 Ceased WO2004041658A2 (en) 2002-11-01 2003-10-31 Substrate process tank with acoustical source transmission and method of processing substrates

Country Status (6)

Country Link
US (1) US6955727B2 (en)
EP (1) EP1600039A2 (en)
KR (1) KR101034188B1 (en)
CN (1) CN1732711B (en)
AU (1) AU2003286798A1 (en)
WO (1) WO2004041658A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1635960A2 (en) 2003-06-06 2006-03-22 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
KR100671031B1 (en) 2004-07-09 2007-01-18 사공건 Flow Level Measurement System Using Acoustic Impedance Matching
GB2420639A (en) * 2004-11-24 2006-05-31 Hewlett Packard Development Co Monitoring Copy on write (COW) faults to control zero-copy data transfer
US9049520B2 (en) 2006-01-20 2015-06-02 Akrion Systems Llc Composite transducer apparatus and system for processing a substrate and method of constructing the same
US20070170812A1 (en) * 2006-01-20 2007-07-26 Pejman Fani System apparatus and methods for processing substrates using acoustic energy
US7784478B2 (en) 2006-01-20 2010-08-31 Akrion Systems Llc Acoustic energy system, method and apparatus for processing flat articles
US9987666B2 (en) 2006-01-20 2018-06-05 Naura Akrion Inc. Composite transducer apparatus and system for processing a substrate and method of constructing the same
CN102479682B (en) 2010-11-30 2013-12-04 京东方科技集团股份有限公司 Method of lift off and manufacturing method of TFT array substrate
GB2518136B (en) * 2013-07-22 2016-09-14 Echovista Gmbh Ultrasonically clearing precipitation
US9991056B2 (en) * 2015-09-09 2018-06-05 Pacesetter, Inc. Sonicating bath for anode foils

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355048A (en) * 1993-07-21 1994-10-11 Fsi International, Inc. Megasonic transducer for cleaning substrate surfaces
US6188162B1 (en) * 1999-08-27 2001-02-13 Product Systems Incorporated High power megasonic transducer
US20020050768A1 (en) * 1999-08-27 2002-05-02 Beck Mark J. One-piece cleaning tank with indium bonded megasonic transducer

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US50758A (en) * 1865-10-31 Apparatus for bending chain-links
US4899276A (en) * 1984-08-14 1990-02-06 International Business Machines Corporation Field-directed screen help technique
US4736760A (en) 1986-02-21 1988-04-12 Robert A. Coberly Apparatus for cleaning, rinsing and drying substrates
US5037481B1 (en) 1987-04-29 1993-05-11 Verteq, Inc. Megasonic cleaning method
US4804007A (en) 1987-04-29 1989-02-14 Verteq, Inc. Cleaning apparatus
US4998549A (en) 1987-04-29 1991-03-12 Verteq, Inc. Megasonic cleaning apparatus
US4859278A (en) 1988-08-11 1989-08-22 Xerox Corporation Fabrication of high resistive loads utilizing a single level polycide process
US4995549A (en) * 1988-12-01 1991-02-26 Hellman Sr Robert R Method and apparatus for forming and welding thin-wall tubing
US4977688A (en) * 1989-10-27 1990-12-18 Semifab Incorporated Vapor device and method for drying articles such as semiconductor wafers with substances such as isopropyl alcohol
DE19648498C1 (en) * 1996-11-22 1998-06-10 Steag Micro Tech Gmbh Device for treating substrates, in particular semiconductor wafers
US6186162B1 (en) * 1999-07-06 2001-02-13 Michael J. Purvis Leak detection and shut-off apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355048A (en) * 1993-07-21 1994-10-11 Fsi International, Inc. Megasonic transducer for cleaning substrate surfaces
US6188162B1 (en) * 1999-08-27 2001-02-13 Product Systems Incorporated High power megasonic transducer
US20020050768A1 (en) * 1999-08-27 2002-05-02 Beck Mark J. One-piece cleaning tank with indium bonded megasonic transducer

Also Published As

Publication number Publication date
WO2004041658A2 (en) 2004-05-21
KR20050074515A (en) 2005-07-18
US6955727B2 (en) 2005-10-18
EP1600039A2 (en) 2005-11-30
CN1732711B (en) 2010-11-03
AU2003286798A1 (en) 2004-06-07
KR101034188B1 (en) 2011-05-12
US20040149308A1 (en) 2004-08-05
AU2003286798A8 (en) 2004-06-07
CN1732711A (en) 2006-02-08

Similar Documents

Publication Publication Date Title
WO2004041658A3 (en) Substrate process tank with acoustical source transmission and method of processing substrates
WO2006101886A3 (en) A plasma enhanced atomic layer deposition system and method
WO2007112454A3 (en) Apparatus and method for processing substrates using one or more vacuum transfer chamber units
AU1613801A (en) Cleaning process which uses ultrasonic waves
GB2429025A (en) Apparatus and method for handling pipe
AU2002367608A1 (en) Medical devices comprising a multilayer construction
AU2003256295A1 (en) Microwave susceptor with fluid absorbent structure
TW200636009A (en) Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet
WO2002048783A3 (en) Stacked liquid cell
WO2009112969A3 (en) Patterned ultrasonic transducers
AU2002334841A1 (en) High pressure processing chamber for multiple semiconductor substrates
AU2003276623A1 (en) Manufacturing process of detachable substrates
WO2003084684A8 (en) In-situ local heating using megasonic transducer resonator
WO2004062966A3 (en) Molded lightweight foam acoustical barrier and its method of application
FI20020998A0 (en) Procedure for forming a film
WO2009056723A3 (en) Method for producing a polymer laminate comprising a plasma processing activation step
TW200735433A (en) Manufacturing method of semiconductor device
EP1600031A4 (en) Device having matched accoustical impedance and method
MXPA04001102A (en) Surface treatment system, surface treatment method and product produced by surface treatment method.
WO2003065575A3 (en) Surface acoustic wave devices based on unpolished nanocrystalline diamond
AU2003273400A1 (en) Process for the copolymerization of ethylene
TW200614886A (en) Wiring substrate and semiconductor device using the same
WO2004067217A3 (en) Ultrasonic welding of resilient layers to plates
BRPI0408907A (en) method to produce a laminate for packaging, and laminate and container for packaging
GB2401807A (en) A manufacturing substrate and a method for forming it

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020057007603

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2003778012

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 20038A77617

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020057007603

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2003778012

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP