WO2003035739A1 - Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition - Google Patents

Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition Download PDF

Info

Publication number: WO2003035739A1
Authority: WO; WIPO (PCT)
Prior art keywords: electroconductive; powder; resin composition; group; organic solvent
Prior art date: 2001-10-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

PCT/JP2002/010830

Other languages

English (en)

French (fr)

Inventor

Takehiro Shimizu

Hidekazu Matsuura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Corp

Original Assignee

Hitachi Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-10-19

Filing date

2002-10-18

Publication date

2003-05-01

2002-10-18 Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd

2002-10-18 Priority to KR1020047005635A priority Critical patent/KR100616368B1/ko

2002-10-18 Priority to JP2003538251A priority patent/JP3915779B2/ja

2003-05-01 Publication of WO2003035739A1 publication Critical patent/WO2003035739A1/ja

2004-04-19 Anticipated expiration legal-status Critical

Status Ceased legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Dispersion Chemistry (AREA)
Spectroscopy & Molecular Physics (AREA)
Conductive Materials (AREA)
Compositions Of Macromolecular Compounds (AREA)

PCT/JP2002/010830 2001-10-19 2002-10-18 Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition Ceased WO2003035739A1 (fr)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
KR1020047005635A KR100616368B1 (ko)	2001-10-19	2002-10-18	도전성 수지조성물 및 이것을 사용한 전자부품
JP2003538251A JP3915779B2 (ja)	2001-10-19	2002-10-18	導電性樹脂組成物およびこれを用いた電子部品

Applications Claiming Priority (8)

Application Number	Priority Date	Filing Date	Title
JP2001/322320		2001-10-19
JP2001322320		2001-10-19
JP2001322321		2001-10-19
JP2001/322321		2001-10-19
JP2001333649		2001-10-31
JP2001/333649		2001-10-31
JP2001333650		2001-10-31
JP2001/333650		2001-10-31

Publications (1)

Publication Number	Publication Date
WO2003035739A1 true WO2003035739A1 (fr)	2003-05-01

Family

ID=27482633

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PCT/JP2002/010830 Ceased WO2003035739A1 (fr)	2001-10-19	2002-10-18	Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition

Country Status (4)

Country	Link
JP (1)	JP3915779B2 (ja)
KR (1)	KR100616368B1 (ja)
TW (1)	TWI253457B (ja)
WO (1)	WO2003035739A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005109078A (ja) *	2003-09-30	2005-04-21	Nippon Chemicon Corp	固体電解コンデンサの製造方法
JP2005109265A (ja) *	2003-09-30	2005-04-21	Nippon Chemicon Corp	固体電解コンデンサ及びその製造方法
JP2005109077A (ja) *	2003-09-30	2005-04-21	Nippon Chemicon Corp	固体電解コンデンサの製造方法
JP2008300637A (ja) *	2007-05-31	2008-12-11	E I Du Pont De Nemours & Co	固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
WO2011024587A1 (ja) *	2009-08-31	2011-03-03	シャープ株式会社	導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法
EP3236479A1 (en)	2016-04-21	2017-10-25	Henkel AG & Co. KGaA	An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (it)	2018-12-28	2020-06-28	Enrico Luigi Seveso	Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
JP2021105135A (ja) *	2019-12-26	2021-07-26	住友金属鉱山株式会社	熱伝導性組成物
WO2021220976A1 (ja) *	2020-05-01	2021-11-04	昭栄化学工業株式会社	導電性樹脂組成物及び電子部品の製造方法
KR20220020265A (ko) *	2019-06-12	2022-02-18	교토 에렉스 가부시키가이샤	도전성 페이스트 조성물

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR102417311B1 (ko) *	2014-07-22	2022-07-07	알파 어셈블리 솔루션스 인크.	가요성 전자 표면을 위한 연신성 상호접속재
WO2017035710A1 (en) *	2015-08-28	2017-03-09	E.I. Du Pont De Nemours And Company	Electrically conductive adhesives
US10967428B2 (en)	2015-08-28	2021-04-06	Dupont Electronics, Inc.	Coated copper particles and use thereof
WO2017035694A1 (en)	2015-08-28	2017-03-09	E.I. Du Pont De Nemours And Company	Electrically conductive adhesives

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08161930A (ja) *	1994-12-02	1996-06-21	Murata Mfg Co Ltd	導電ペースト並びにそれを用いた導電体および多層セラミック基板
JPH08199041A (ja) *	1994-11-22	1996-08-06	Matsushita Electric Ind Co Ltd	半田付着構造体及びこれに用いる導電性組成物
JP2000007824A (ja) *	1998-06-22	2000-01-11	Jsr Corp	導電性組成物および電極形成用転写フィルム
JP2001351436A (ja) *	2000-06-06	2001-12-21	Hitachi Chem Co Ltd	導電性ペースト組成物及びこれを用いた電子部品

2002
- 2002-10-18 JP JP2003538251A patent/JP3915779B2/ja not_active Expired - Lifetime
- 2002-10-18 TW TW091124102A patent/TWI253457B/zh not_active IP Right Cessation
- 2002-10-18 KR KR1020047005635A patent/KR100616368B1/ko not_active Expired - Fee Related
- 2002-10-18 WO PCT/JP2002/010830 patent/WO2003035739A1/ja not_active Ceased

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08199041A (ja) *	1994-11-22	1996-08-06	Matsushita Electric Ind Co Ltd	半田付着構造体及びこれに用いる導電性組成物
JPH08161930A (ja) *	1994-12-02	1996-06-21	Murata Mfg Co Ltd	導電ペースト並びにそれを用いた導電体および多層セラミック基板
JP2000007824A (ja) *	1998-06-22	2000-01-11	Jsr Corp	導電性組成物および電極形成用転写フィルム
JP2001351436A (ja) *	2000-06-06	2001-12-21	Hitachi Chem Co Ltd	導電性ペースト組成物及びこれを用いた電子部品

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005109078A (ja) *	2003-09-30	2005-04-21	Nippon Chemicon Corp	固体電解コンデンサの製造方法
JP2005109265A (ja) *	2003-09-30	2005-04-21	Nippon Chemicon Corp	固体電解コンデンサ及びその製造方法
JP2005109077A (ja) *	2003-09-30	2005-04-21	Nippon Chemicon Corp	固体電解コンデンサの製造方法
JP2008300637A (ja) *	2007-05-31	2008-12-11	E I Du Pont De Nemours & Co	固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
WO2011024587A1 (ja) *	2009-08-31	2011-03-03	シャープ株式会社	導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法
JP2011054313A (ja) *	2009-08-31	2011-03-17	Sharp Corp	導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法
EP3236479A1 (en)	2016-04-21	2017-10-25	Henkel AG & Co. KGaA	An electrically conductive, hot-melt adhesive or moulding composition
WO2017182621A1 (en)	2016-04-21	2017-10-26	Henkel Ag & Co. Kgaa	An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (it)	2018-12-28	2020-06-28	Enrico Luigi Seveso	Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
KR20220020265A (ko) *	2019-06-12	2022-02-18	교토 에렉스 가부시키가이샤	도전성 페이스트 조성물
KR102824901B1 (ko)	2019-06-12	2025-06-30	교토 에렉스 가부시키가이샤	도전성 페이스트 조성물
JP2021105135A (ja) *	2019-12-26	2021-07-26	住友金属鉱山株式会社	熱伝導性組成物
JP7596634B2 (ja)	2019-12-26	2024-12-10	住友金属鉱山株式会社	熱伝導性組成物
WO2021220976A1 (ja) *	2020-05-01	2021-11-04	昭栄化学工業株式会社	導電性樹脂組成物及び電子部品の製造方法
JPWO2021220976A1 (ja) *	2020-05-01	2021-11-04
JP7078194B2 (ja)	2020-05-01	2022-05-31	昭栄化学工業株式会社	電子部品の電極形成用導電性樹脂組成物

Also Published As

Publication number	Publication date
TWI253457B (en)	2006-04-21
JPWO2003035739A1 (ja)	2005-02-10
KR100616368B1 (ko)	2006-08-28
KR20040058202A (ko)	2004-07-03
JP3915779B2 (ja)	2007-05-16

Publication	Publication Date	Title
WO2003035739A1 (fr)	2003-05-01	Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition
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2003-06-25	121	Ep: the epo has been informed by wipo that ep was designated in this application
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