WO2003034078A1 - Probe pin, probe card, test apparatus, and method of manufacturing probe pin - Google Patents

Abstract

A probe pin and a method of manufacturing the probe pin, the probe pin having a first surface, a second surface generally parallel with the first surface and having an area larger than that of the first surface, and four third surfaces generally perpendicular to the first surface comprising a contact part coming into contact with an electronic component and an elastic part having the contact part; the method of manufacturing the probe pin comprising the steps of preparing a silicon substrate having a surface {100}, forming a mask, having a rectangular opening with four sides in a direction <100> in the surface of the silicon substrate, forming a groove part by anisotropic wet etching, and filling conductive material in the formed groove part.

Description

 Description Probe pin, probe card, test equipment, and probe pin manufacturing method

 The present invention relates to a test apparatus for testing an electronic device, a probe card for transmitting and receiving signals to and from the electronic device, a probe pin connected to a terminal of the electronic device, and a probe pin manufacturing method. This application is related to the following Japanese patent application. For those designated countries that are permitted to be incorporated by reference to the literature, the contents described in the following application are incorporated into this application by reference and are incorporated as part of the description of this application.

 Japanese Patent Application No. 2 0 0 1— 3 1 6 0 5 8 Filing Date 2 0 0 1 Year 1 October 1 2 Background Technology

 Conventionally, when testing an electronic device, a probe card has been used to exchange signals with the electronic device. The probe card has a plurality of probe pins. The plurality of probe pins are respectively connected to terminals of the electronic device.

 Figure 8 shows a conventional probe pin. The probe pin has a contact portion that contacts a terminal of the electronic device (DUT), and an elastic portion provided with the contact portion. The contact part of the conventional probe pin has a quadrangular pyramid shape. The tip of the contact portion made contact with the terminal of the electronic device, and the tip of the contact portion scribed the terminal.

 As shown in FIG. 8, the probe pins are provided at a predetermined angle with respect to the probe card. For this reason, as shown in FIG. 8, the tip of the contact portion may not be able to sufficiently scrub the terminal of the electronic device. For example, if one side of the contact part is almost parallel to the terminal of the electronic device, one side of the contact part will come into contact with the terminal, and the tip of the contact part will scrub the terminal of the electronic device sufficiently. As a result, it was difficult to obtain good electrical connection characteristics.

Therefore, the present invention provides a probe pin and a probe that can solve the above-described problems. An object of the present invention is to provide a card, a test apparatus, and a method of manufacturing a probe pin. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous embodiments of the present invention. Disclosure of the invention

 In order to solve the above problems, in a first aspect of the present invention, there is provided a probe pin for supplying a signal to an electronic component by contacting the electronic component, the probe pin comprising: a first surface; A second surface substantially parallel to the first surface and having a larger area than the first surface, comprising: a contact portion that contacts the electronic component; and an elastic portion provided with the contact portion. Provide vepin.

 The contact portion may further have a third surface substantially perpendicular to the first surface. Further, the contact portion may have four third surfaces. Further, the first surface is preferably a quadrangular shape, and the second surface is preferably a pentagonal or more polygonal shape. The second surface may be octagonal. The contact portion may further include a fourth surface having an angle with respect to the first surface different from an angle of the third surface with respect to the first surface. The contact portion may have four fourth surfaces. Further, the contact portion and the elastic portion may be formed of the same material.

 According to a second aspect of the present invention, there is provided a probe pin for supplying a signal to an electronic component by contacting the electronic component, the probe pin being in contact with the electronic component, and being substantially perpendicular to the first surface and the first surface. A probe pin, comprising: a contact portion having a suitable second surface; and an elastic portion provided with the contact portion.

According to a third aspect of the present invention, there is provided a probe card electrically connected to a plurality of connection terminals provided on an electronic device to supply a signal to an electronic device, wherein the probe card is provided on the substrate and the substrate. A plurality of probe pins electrically connected to connection terminals of the electronic device, and a transmission line electrically connected to the plurality of probe pins, wherein the probe pins are in contact with the connection terminals, and the first surface And a contact portion having a second surface substantially parallel to the first surface and an elastic portion provided with the contact portion. According to a fourth aspect of the present invention, there is provided a probe card electrically connected to a plurality of connection terminals provided on an electronic device to supply signals to an electronic device, the probe card being provided on a substrate and a substrate. A plurality of probe pins electrically connected to connection terminals of the electronic device, and a transmission line electrically connected to the plurality of probe pins, wherein the probe pins are in contact with the connection terminals, and the first surface And a contact portion having a second surface substantially perpendicular to the first surface and an elastic portion provided with the contact portion.

 According to a fifth aspect of the present invention, there is provided a test apparatus for testing an electronic device, comprising: a pattern generation unit for generating a test signal for testing an electronic device; and a test signal generated by the pattern generation unit. A waveform shaper that shapes the waveform, a probe card that supplies the test signal shaped by the waveform shaper to the electronic device and receives the output signal output from the electronic device, and an electronic device that outputs based on the test signal A determination unit that determines pass / fail of the electronic device based on the output signal; the probe card includes a substrate, a plurality of probe pins provided on the substrate, and electrically connected to connection terminals of the electronic device; A transmission line electrically connected to the probe pin, wherein the probe pin is in contact with the connection terminal and is substantially parallel to the first surface and the first surface. A contact portion having a second surface, providing a test apparatus which comprises an elastic portion contacting portion is provided.

According to a sixth aspect of the present invention, there is provided a test apparatus for testing an electronic device, comprising: a pattern generation section for generating a test signal for testing an electronic device; and a test signal generated by the pattern generation section. A waveform shaper that shapes the waveform, a probe card that supplies the test signal shaped by the waveform shaper to the electronic device and receives the output signal output from the electronic device, and an electronic device that outputs based on the test signal A determination unit that determines pass / fail of the electronic device based on the output signal; the probe card includes a substrate, a plurality of probe pins provided on the substrate, and electrically connected to connection terminals of the electronic device; A transmission line electrically connected to the probe pin, wherein the probe pin is in contact with the connection terminal and is substantially perpendicular to the first surface and the first surface. And a second surface A test device comprising: a contact portion having the contact portion; and an elastic portion provided with the contact portion.

 According to a seventh aspect of the present invention, there is provided a probe pin manufacturing method for manufacturing a probe pin for supplying a signal to an electronic component, comprising: a substrate preparing step of preparing a silicon substrate; An etching step of forming a groove having a bottom surface substantially parallel to the surface of the silicon substrate and having a smaller area than the opening on the surface of the substrate; a filling step of filling the groove with a conductive material; Removing the probe pin.

 In the substrate preparation step, a silicon substrate with a {100} surface is prepared. In the probe pin manufacturing method, the four sides are in the <100> direction on the silicon substrate surface before the etching step. The method further includes an etching mask forming step of forming an etching mask having a rectangular opening, and a mask removing step of removing the etching mask after the etching step, wherein the etching step includes determining whether the etching mask has an opening. Therefore, it is preferable to etch the silicon substrate. In the etching step, a groove may be formed in the silicon substrate further having a surface substantially perpendicular to the surface of the silicon substrate.

 The above summary of the present invention does not list all of the necessary features of the present invention, and a sub-combination of these features may also be an invention. BRIEF DESCRIPTION OF THE FIGURES

 FIG. 1 is a diagram showing an example of a configuration of a test apparatus 100 according to the present invention.

 FIG. 2 is a diagram showing an example of the configuration of the probe card 50.

 FIG. 3 is a diagram showing an example of the configuration of the probe pin 60.

 FIG. 4 is a diagram showing another example of the contact portion 64. As shown in FIG.

 FIG. 5 is a diagram showing another example of the contact portion 6.

 FIG. 6 is a diagram illustrating an example of the method of manufacturing a probe pin according to the present invention.

FIG. 7 is a view for explaining another example of the probe pin manufacturing method according to the present invention. FIG. 8 is a diagram showing a conventional probe pin. BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, the present invention will be described through embodiments of the present invention. However, the following embodiments do not limit the invention according to the scope of the patent request, and all combinations of the features described in the embodiments are described. Is not necessarily essential to the solution of the invention.

 FIG. 1 shows an example of the configuration of a test apparatus 100 according to the present invention. The test apparatus 100 includes a pattern generation section 10, a waveform shaping section 20, a judgment section 40, and a probe card 50. Be prepared. The pattern generation unit 10 generates a test signal for testing the electronic device and supplies the test signal to the waveform shaping unit 20.

 The waveform shaping unit 20 shapes the received test signal, and supplies the shaped test signal to the probe card 50. The waveform shaping section 20 may supply the test signal to the probe card 50 at a desired timing, for example. In the present example, the waveform shaping section 20 has a timing generator for generating desired timing.

 The timing generator generates a desired timing. The timing generator has, for example, a variable delay circuit. In this example, the timing generator receives a reference clock for controlling the operation of the test apparatus 100, delays the received reference clock by a desired time by a variable delay circuit, and sets a waveform shaping unit as the desired timing.

20 may be supplied.

 The probe card 50 is electrically connected to a plurality of connection terminals provided on the electronic device 30 and supplies signals to the electronic device. Further, the probe card 50 receives an output signal output from the electronic device based on the test signal, and supplies the received output signal to the determination unit 40.

The determination unit 40 determines pass / fail of the electronic device 30 based on an output signal output by the electronic device 30 based on the test signal. For example, the determination unit 40 may determine whether the electronic device 30 is good by comparing an expected value signal to be output by the electronic device 30 based on the test signal with an output signal output by the electronic device 30. . In this case, putter The generation unit 10 generates the expected value signal based on the generated test signal, and supplies the generated expected value signal to the determination unit 40.

 FIG. 2 shows an example of the configuration of the probe card 50. The probe card 50 has a substrate 52, a plurality of probe pins 60, and a transmission line (not shown). The plurality of probe pins 60 are provided on the substrate 52, and are electrically connected to the plurality of connection terminals 56 of the electronic device 30, respectively. The probe pins 60 exchange signals with the electronic device 30 by contacting the electronic device 30 as an electronic component. Further, the transmission line is electrically connected to a plurality of probe pins. The probe card 50 receives the test signal from the waveform shaping unit 20 (see FIG. 1), and supplies the test signal to the electronic device 30 via the transmission line and the probe pin 60. Further, the probe card 50 supplies the output signal of the electronic device received via the probe pin 60 and the transmission line to the determination unit 40.

 In this example, the plurality of probe pins 60 make a predetermined angle with respect to the substrate. In addition, the test apparatus 100 moves the probe card 50 and / or the electronic device 30 to a desired position, and electrically connects the plurality of probe pins 60 and the plurality of connection terminals 56. It is preferable to have In this example, the probe card 50 exchanges signals with one electronic device 30. In other examples, the probe card 50 exchanges signals with a plurality of electronic devices 30. May be performed. Further, the probe card 50 according to the present invention may be a part of a probe card. That is, the probe card 50 may be a replacement member of a probe card in which a plurality of probe pins 60 can be replaced.

FIG. 3 shows an example of the configuration of the probe pin 60. FIG. 3A is a schematic diagram illustrating an example of the configuration of the probe pin 60. The probe pin 60 has a contact portion 64 and an elastic portion 62. The contact portion 64 contacts the connection terminal 56 of the electronic device 30 (see FIG. 2). In addition, the contact portion 64 has a first surface and a second surface substantially parallel to the first surface. The contact portion 64 in this example contacts the connection terminal 56 at the contact point shown in FIG. JP02 / 10517

 7

 The elastic portion 62 is provided with a contact portion 64. A contact portion 64 is provided at one end of the elastic portion 62, and the other end is connected to the substrate 52 (see FIG. 2). The other end of the elastic portion 62 is connected to the transmission line of the substrate 52. For example, the other end of the elastic portion 62 may be connected to the transmission line of the substrate 52 by solder or the like. Further, it is preferable that the elastic portion 62 has a predetermined angle with respect to the substrate 52.

 Further, in this example, the contact portion 64 and the elastic portion 62 are formed of a conductive material. The probe pin 60 supplies a test signal received from the transmission line of the substrate 52 to the connection terminal 56 of the electronic device 30 via the elastic portion 62 and the contact portion 64. The probe pin 60 supplies the output signal of the electronic device 30 to the transmission line of the substrate 52 via the contact portion 64 and the elastic portion 62. In the case where the elastic portion 62 is made of a conductive material, the elastic portion 62 and the contact portion 64 preferably have a transmission line for transmitting a signal.

 FIG. 3B shows a perspective view of an example of the contact portion 64. FIG. 3C shows a top view of the contact portion 64 in this example. Further, FIG. 3 (d) shows a side view of the contact portion 64 viewed from the direction of ① in FIG. 3 (c), and FIG. 3 (e) shows a side view of the contact portion 64 as viewed from the direction of ② in FIG. The side view of the contact part 64 is shown.

 The contact portion 64 has a first surface 66 and a second surface 72 substantially parallel to the first surface 66 and having a larger area than the first surface 66. The second surface 72 may be a pentagon or more polygonal shape. The contact portion 64 is joined to the elastic portion 62 on the second surface. The contact portion 64 may be formed integrally with the elastic portion 62, and the contact portion 64 may be bonded to the elastic portion 62 with a conductive adhesive material. Further, the contact portion 64 and the elastic portion 62 may be formed of the same material.

The contact portion 64 further has a third surface 68 substantially perpendicular to the first surface 66. The first surface 66 of the contact portion 64 has a rectangular shape, and the second surface 72 has an octagonal shape. The contact portion 64 has four third surfaces 68. Each of the third surfaces 68 is substantially perpendicular to the first surface, and each of the third surfaces 68 is substantially perpendicular to any of the other third surfaces 68. Further, each third surface 68 is substantially parallel to the other opposing third surface. In addition, the contact portion 64 further has a fourth surface 70 whose angle with respect to the first surface 66 is different from the angle of the third surface 68 with respect to the first surface. The contact portion 64 has four fourth surfaces 70. The third surface 68 and the fourth surface 70 are alternately arranged on the side surface of the contact portion 64. The third surface 68 has a triangular shape that shares one vertex with the first surface 66 and shares one side with the second surface 72. The fourth surface 70 has a trapezoidal shape in which one side of the parallel sides is shared with the first surface 66 and the other side is shared with the second surface 72.

 The contact portion 64 contacts the connection terminal 56 at the contact point shown in FIG. In this example, the contact point is one of the vertices shared by the first surface 66 and the third surface 68. Since the third surface 68 is substantially perpendicular to the elastic portion 60 and the first surface 66 is substantially parallel to the elastic portion 60, as shown in FIG. When the elastic portion 60 has an inclination with respect to the contact terminal 56, that is, when the elastic portion 60 is provided obliquely with respect to the contact terminal 56, the contact portion 64 becomes Contact only with the connection terminal 56. Therefore, the probe pins 60 can easily scrub the connection terminals 56. Therefore, the probe pin 60 and the connection terminal 56 can be electrically connected with good characteristics.

 FIG. 4 shows another example of the contact portion 64. FIG. 4A shows a perspective view of an example of the contact portion 64. FIG. 4B shows a top view of the contact portion 64 in this example. Further, FIG. 4 (c) shows a side view of the contact portion 64 viewed from the direction of ① in FIG. 4 (b), and FIG. 4 (d) shows a contact view viewed from the direction of ② in FIG. 4 (b). A side view of part 64 is shown.

 The contact portion 64 shown in FIG. 4 is similar to the contact portion 64 shown in FIG. 3 in that the first surface 66, the second surface 72, the third surface 68, and the fourth surface Has 70. The second side 72, the third side 68, and the fourth side 70 are the second side 72, the third side 68, and the fourth side described with reference to FIG. Same as 70.

The first surface 66 has an octagonal shape. The third surface 68 has a trapezoidal shape. The third surface 68 shares one side of the parallel sides with the first surface 66 and shares the other side with the second surface 72. The contact portion 64 contacts the connection terminal 56 (see FIG. 2) at the contact portion shown in FIG. 4 (a). The contact area includes the first surface 66 and the third surface 68. Is one side to share. For this reason, the contact area between the contact portion 64 and the connection terminal 56 can be reduced as compared with the conventional case, and scrubbing can be easily performed.

 FIG. 5 shows another example of the contact portion 64. FIG. 5A shows a perspective view of the contact portion 64 in the present example. FIG. 5B shows a top view of the contact portion 64 in this example. FIG. 5 (c) shows a side view of the contact portion 64 viewed from the direction ① of FIG. 5 (b), and FIG. 5 (d) shows the contact portion 64 viewed from the direction ② of FIG. 5 (b). A side view of part 64 is shown.

 The contact portion 64 shown in FIG. 5 has a first surface 66, a second surface 72, a third surface 68, and a fourth surface 70, similarly to the contact portion 64 shown in FIG. The first surface 66, the second surface 72, the third surface 68, and the fourth surface 70 correspond to the first surface 66, the second surface 72, Similar to the third surface 68 and the fourth surface 70.

 As shown in FIG. 5 (a), the contact portion 64 in this example further has a ridge line 74 connecting the vertex of the third surface 68 and the vertex of the first surface 66. The ridge 74 connects a vertex of the third surface 68 that is not shared with the second surface 72 and a vertex of the first surface 66. The contact portion 64 comes into contact with the connection terminal 56 (see FIG. 2) at the ridge line 74. For this reason, the contact area between the contact portion 64 and the connection terminal 56 can be reduced as compared with the related art, and the scrub can be easily performed.

FIG. 6 illustrates an example of the probe pin manufacturing method according to the present invention. In this example, a method of manufacturing a contact portion of a prop pin will be described. First, as shown in FIG. 6A, a silicon substrate 200 having a {100} surface is prepared. FIG. 6B is a cross-sectional view of the silicon substrate 200 shown in FIG. Here, the {100} plane is a plane represented by the Miller index, and includes all the planes having symmetry with the (100) plane. Next, in an etching mask formation step, an etching mask 202 having a rectangular opening 210 having four sides in the <100> direction is formed on the surface of the silicon substrate 200. The etching mask 202 may be a silicon oxide film. In the step of forming the etching mask, the etching mask 202 is formed by thermal oxidation. Here, the <100> direction is a direction represented by the Miller index, and includes all directions having symmetry with the [100] direction. Next, as shown in FIG. 6 (c), in the etching step, the bottom surface 2 1 2 which is substantially parallel to the surface of the silicon Is formed. In this example, the etching step forms a trench 204 having a bottom surface 212 having an area smaller than the area of the opening 214 of the trench 204.

 A top view of the groove 204 shown in the sectional view of FIG. 6C is shown in the right view of FIG. 6C. The shape of the groove portion 204 in FIG. 6C is the same as the shape of the contact portion 64 described in FIG. A {100} plane and a {111} plane are formed on the side surfaces of the groove 204 by anisotropic jet etching. The {100} face of the groove 204 corresponds to the third face 68 of the contact portion 64 described in FIG. Further, the {111} surface of the groove 204 corresponds to the fourth surface 70 of the contact portion 64 described in FIG.

 In anisotropic wet etching of a silicon substrate, the <111> direction is less likely to be eroded than the <100> direction. Therefore, as the anisotropic wet etching is performed, the area ratio of the {111} plane to the {100} plane gradually increases. Therefore, when the groove 204 shown in FIG. 6C is further anisotropically wet-etched, the shape of the groove 204 becomes the same as the shape of the contact portion 64 described in FIG. FIG. 6D shows a case where the groove 204 having the same shape as the contact portion 64 described in FIG. 3 is further subjected to anisotropic wet etching.

 The shape of the groove portion 204 in FIG. 6D is the same as the shape of the contact portion 64 described in FIG. A ridgeline 2 16 is formed in the groove 204. The ridge line 2 16 corresponds to the ridge line 74 of the contact portion 64 described in FIG. 5 and is in the <1 110> direction.

Next, as shown in FIG. 6E, the etching mask is removed. Next, in the filling step, the groove 204 is filled with the conductive material 218. This step may include the step of forming a mask for filling the groove 204 with the conductive material 218 before filling the groove 204 with the conductive material 218. In this case, the method further includes a step of removing the mask after filling the groove 204 with the conductive material 218. Further, the method may further include a step of polishing the surface of the silicon substrate 200 after removing the mask. Next, as shown in FIG. 6 (f), the silicon substrate 20 ° is removed to form a contact portion of the probe pin. According to the probe pin manufacturing method described above, the probe pin contact portion according to the present invention can be easily manufactured. In addition, by controlling the etching conditions such as the etching time, a desired contact portion 64 among the contact portions 64 described in FIGS. 3 to 5 can be easily manufactured. Further, the method may further include a step of preparing the elastic portion 62 described in FIG. 3 and a step of bonding the contact portion and the elastic portion 62 manufactured in this example.

 FIG. 7 illustrates another example of the probe pin manufacturing method according to the present invention. The manufacturing method in this example has the steps described with reference to FIGS. 6A to 6E of the probe pin manufacturing method described in FIG. In this example, after the step described with reference to FIG. 6 (e), as shown in FIG. 7 (a), a mask 2 for forming an elastic portion having a desired shape on the surface of the silicon substrate 200. There is further the step of forming 08. The mask 208 may be a mask having a rectangular opening.

 Next, as shown in FIG. 7B, a conductive regenerated material 220 is formed on the surface of the silicon substrate 200. The conductive material 220 may be formed on the surface of the silicon substrate 200 by plating or evaporation.

 Next, as shown in FIG. 7 (c), the silicon substrate 200 and the mask 208 are removed. By removing the silicon substrate 200 and the mask 208, a probe pin can be obtained.

 According to the probe pin manufacturing method described above, the probe pins described with reference to FIGS. 3 to 5 can be easily manufactured.

As described above, the present invention has been described using the embodiment, but the technical scope of the present invention is not limited to the scope described in the above embodiment. It is apparent to those skilled in the art that various changes or improvements can be added to the above embodiment. It is apparent from the description of the appended claims that embodiments with such modifications or improvements can be included in the technical scope of the present invention. Industrial applicability

 As is clear from the above description, according to the probe pin and the probe card according to the present invention, good contact characteristics can be obtained with respect to the connection terminal of the electronic device. In the test apparatus, since good contact characteristics with the electronic device can be obtained, the test of the electronic device can be performed with high accuracy. Further, according to the method of manufacturing a probe pin according to the present invention, it is possible to easily manufacture a probe pin capable of obtaining good contact characteristics with a connection terminal of an electronic device.

Claims

The scope of the claims 1. A probe pin for supplying a signal to the electronic component by contacting the electronic component,  A first surface; a second surface that is substantially parallel to the first surface and has a larger area than the first surface; and a contact portion that contacts the electronic component;  An elastic portion provided with the contact portion; A probe pin comprising:  2. The probe pin according to claim 1, wherein the contact portion further has a third surface substantially perpendicular to the first surface.  3. The probe pin according to claim 2, wherein the contact portion has four surfaces of the third surface.  4. The first surface has a square shape,  The probe pin according to claim 3, wherein the second surface has a polygonal shape of a pentagon or more.  5. The probe pin according to claim 4, wherein the second surface has an octagonal shape.  6. The plug according to claim 5, wherein the contact portion further has a fourth surface having an angle with respect to the first surface different from an angle of the third surface with respect to the first surface. Rope pin.  7. The probe pin according to claim 6, wherein the contact portion has four surfaces of the fourth surface.  8. The probe pin according to claim 1, wherein the contact portion and the elastic portion are formed of the same material. 9. A probe pin for supplying a signal to the electronic component by contacting the electronic component, A first surface which is in contact with the electronic component and has a second surface substantially perpendicular to the first surface; A contact part,  An elastic portion provided with the contact portion; Special feature = [Probe pin to be laid.  10. A probe card which is electrically connected to a plurality of connection terminals provided on an electronic device and supplies a signal to the electronic device,  Board and  A plurality of probe pins provided on the substrate and electrically connected to the connection terminals of the electronic device;  A transmission line electrically connected to the plurality of probe pins; With  The probe pin is  A contact portion that contacts the connection terminal and has a first surface and a second surface substantially parallel to the first surface;  An elastic portion provided with the contact portion; A probe card, comprising:  11. A probe card electrically connected to a plurality of connection terminals provided on an electronic device to supply signals to the electronic device,  Board and  A plurality of probe pins provided on the substrate and electrically connected to the connection terminals of the electronic device;  A transmission line electrically connected to the plurality of probe pins; With  The probe pin is  A contact portion that contacts the connection terminal and has a first surface and a second surface substantially perpendicular to the first surface;  An elastic part provided with the contact part; A probe card, comprising: 1 2. A test apparatus for testing an electronic device,  A pattern generator for generating a test signal for testing the electronic device; a waveform shaper for shaping the waveform of the test signal generated by the pattern generator; A probe card that supplies the test signal to the electronic device and receives an output signal output from the electronic device;  A determination unit configured to determine whether the electronic device is acceptable based on the output signal output by the electronic device based on the test signal; With  The probe card,  Board and the '  A plurality of probe pins provided on the substrate and electrically connected to connection terminals of the electronic device;  A transmission line electrically connected to the plurality of probe pins; With  A contact portion having a first surface and a second surface substantially parallel to the first surface, the contact portion being in contact with the connection terminal;  An elastic portion provided with the contact portion; A test device that specially includes: 1 3. A test apparatus for testing an electronic device,  A pattern generator for generating a test signal for testing the electronic device, a waveform shaper for shaping the waveform of the test signal generated by the pattern generator, and a waveform shaper. A probe card for supplying the test signal to the electronic device and receiving an output signal output from the electronic device;  Based on the output signal that the electronic device has output based on the test signal, a determination unit that determines the quality of the electronic device. With The probe card,  Board and  A plurality of probe pins provided on the substrate and electrically connected to connection terminals of the electronic device;  A transmission line electrically connected to the plurality of probe pins; ,  The probe pin is  A contact portion that contacts the connection terminal and has a first surface and a second surface substantially perpendicular to the first surface;  An elastic portion provided with the contact portion; A test apparatus comprising:  14. A probe pin manufacturing method for manufacturing a probe pin for supplying a signal to an electronic component,  A substrate preparation stage for preparing a silicon substrate,  An etching step of forming a groove having a bottom surface that is substantially parallel to the surface of the silicon substrate and has a smaller area than the opening, on the surface of the silicon substrate by anisotropic wet etching;  A filling step of filling the groove with a conductive material,  Removing the silicon substrate; A method of manufacturing a probe pin, comprising:  15. In the substrate preparing step, a silicon substrate having a {100} surface is prepared.  Before the etching step, an etching mask forming step of forming an etching mask having a rectangular opening having four sides in the <100> direction on the surface of the silicon substrate; A mask removing step of removing the etching mask after the etching step; Further comprising  15. The method according to claim 14, wherein in the etching step, the silicon substrate is etched from an opening of the etching mask. 16. The probe pin manufacturing method according to claim 15, wherein in the etching step, a groove having a surface substantially perpendicular to the surface of the silicon substrate is further formed in the silicon substrate.