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WO2003025647A1 - Dispositif optique et son procede de fabrication - Google Patents

Dispositif optique et son procede de fabrication Download PDF

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Publication number
WO2003025647A1
WO2003025647A1 PCT/KR2002/001632 KR0201632W WO03025647A1 WO 2003025647 A1 WO2003025647 A1 WO 2003025647A1 KR 0201632 W KR0201632 W KR 0201632W WO 03025647 A1 WO03025647 A1 WO 03025647A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
optical
forming
sub
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2002/001632
Other languages
English (en)
Inventor
Sangheum Park
Sangmo Shin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MicroSolutions Inc
Original Assignee
MicroSolutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2001-0053440A external-priority patent/KR100396252B1/ko
Priority claimed from KR1020010053730A external-priority patent/KR100558887B1/ko
Application filed by MicroSolutions Inc filed Critical MicroSolutions Inc
Publication of WO2003025647A1 publication Critical patent/WO2003025647A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G02B6/3881—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls using grooves to align ferrule ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/1215—Splitter
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps

Definitions

  • the present invention relates to an optical device used in an optical
  • optical components that connect to optical fibers, and these optical components are
  • LD laser diode
  • PD photo diode
  • optical filter optical filter
  • lens lens
  • FIG. 1 a schematic diagram of the widely used
  • the blocks to mount the input/output fibers are fabricated first.
  • the blocks have grooves of V, U, or other shapes, and the optical fibers are mounted and fixed in the grooves.
  • the fibers are aligned accurately and connected with the aid of the alignment apparatus
  • optical fiber is fixed is put first in contact with the input side of the optical waveguide
  • the alignment station moves the input optical fiber block minutely to
  • the output optical fiber block on which one or more output optical fiber
  • the alignment station moves the output optical fiber block minutely to
  • the one or more output optical fiber from the input optical fiber reaches the maximum
  • the method is not good enough for mass production.
  • optical waveguide devices and input/output optical fiber since optical waveguide devices and input/output optical fiber
  • silicon wafers a plurality of devices and blocks are fabricated at one time.
  • optical waveguide device have been.
  • One example of this structure is disclosed in
  • optical device on which an optical fiber block is integrated,
  • the method has a disadvantage that the price of the device is high
  • the present invention is to solve the above problems, and therefore the object
  • Another object of the present invention is to provide a simple fabrication
  • optical fibers which is either integrated optical devices
  • optical waveguide made of optical waveguide or active/passive components such as LD (laser diode), PD
  • the substrate is diced to each block, each block is lapped
  • the optical device according to the present invention comprises: a first
  • optical fiber block having one or more first optical fiber; a second optical fiber block
  • first and second optical fiber blocks wherein the first and second optical fiber blocks
  • connection guide of groove form can be formed on a part of
  • the optical device block is an optical waveguide device having one
  • optical waveguide or more optical waveguide, and the first and second optical fiber blocks are connected to
  • optical waveguide device block and the first and second optical fiber blocks are identical to the optical waveguide device block and the first and second optical fiber blocks.
  • the substrate can be made of any one of wafers for semiconductor fabrication
  • waveguide device or active optical devices including LD/PD and being able to form
  • passive optical devices such as mirror, filter, or lens of 3 -dimensional structure by
  • the substrate can be made of any one of Si, GaAs, InP,
  • Quartz, LiNb03, AIN, or plastic Quartz, LiNb03, AIN, or plastic.
  • the optical device block may include any one of planar optical
  • a fabrication method of an optical device according to the present invention is
  • one or more optical fiber are connected to two lateral faces of an optical waveguide
  • substrate having a first, second, and third areas; forming one or more optical waveguide
  • the lapped and polished lateral faces stand opposite to each other.
  • optical waveguide is formed.
  • the substrate can be diced to make the dicing faces between the first,
  • Another fabrication method according to the present invention comprises the
  • first and third sub-substrates and aligning and connecting the first and third sub-
  • polished lateral faces stand opposite to each other.
  • Another fabrication method according to the present invention comprises the
  • first and third sub-substrates aligning and connecting the first and third sub- substrates to two lateral faces of the second sub-substrate to make the lapped and
  • polished lateral faces stand opposite to each other.
  • Another fabrication method according to the present invention comprises the
  • the first and third sub-substrates to a prescribed depth by etching using the mask pattern
  • the lapped and polished lateral faces stand opposite to each other.
  • Another fabrication method according to the present invention comprises the
  • clad layer on the entire surface of the substrate; forming one or more optical waveguide in the second area of the substrate by forming a core layer on the lower clad layer and
  • the lapped and polished lateral faces stand opposite to each other.
  • a mask layer may be constituted of the steps of: forming and patterning a mask layer on the upper
  • Another fabrication method according to the present invention comprises the
  • a second groove is formed by half cutting the connecting part between the optical waveguide and the optical fiber block using dry or wet etching or
  • the method comprises the steps of: preparing a substrate; forming one or
  • the substrate to a prescribed depth; forming one or more optical waveguide on the
  • optical fiber to the optical waveguide.
  • the step of forming the first groove may include the steps of: exposing an
  • the substrate can be made of any one of wafers for semiconductor
  • etching method such as dry, wet, or laser etching, substrates for optical materials being
  • planar waveguide device or active optical devices including LD/PD and being able to form passive optical devices such as mirror, filter, or lens of 3-dimensional structure by
  • the first groove is etched to make the width of the upper
  • the step of forming the optical waveguide may includes the steps of:
  • the second groove is formed by any one of dry etching, wet etching, dicing,
  • the lower surface of the second groove is placed lower than the lower
  • Another fabrication method according to the present invention comprises the
  • optical fiber to the optical waveguide.
  • the step of forming the first groove may include the steps of: forming
  • first groove by etching the exposed substrate to a prescribed depth using the upper clad
  • Another fabrication method according to the present invention comprises the
  • Fig. 1 shows a conventional method of connecting an optical waveguide device
  • Figs. 2a through 2j are process perspective views showing a fabrication process
  • Figs. 3a through 3j are process perspective views showing the fabrication
  • Figs. 4a through 4j are process perspective views showing the fabrication
  • Fig. 5 is a structural perspective view showing an optical device of the present
  • Figs. 6a through 6g are process perspective views showing the fabrication
  • Fig. 7 is a structural perspective view showing an optical device of the present
  • Figs. 8a through 8g are process perspective views showing the fabrication
  • Fig. 9 is a sectional view of an optical device in which the connection surface
  • Fig. 10 is a layout diagram showing a dicing method of a substrate according
  • Figs. 11a through l lj are process perspective views showing the fabrication
  • Figs. 12a through 12j are process perspective views showing the fabrication
  • Figs. 13a through 13h are process perspective views showing the fabrication
  • Figs. 14a through 14h are process perspective views showing the fabrication
  • optical fibers which is either integrated optical devices made of optical waveguide or active/passive components such as LD (laser diode), PD (photo diode),
  • optical filter, lens, etc., and input/output optical fiber blocks are fabricated on one
  • the substrate is diced to each block, each block is lapped and polished, and all
  • optical waveguide and optical fibers are connected to each other. Then, the optical waveguide and optical fibers can be
  • an optical waveguide device is mentioned as an example of an optical waveguide
  • Figs. 2a through 2j are process perspective views showing a fabrication
  • optical fibers which optical fibers are supposed to be arranged and second area on which an optical
  • the mask layer 12 is patterned using conventional photolithography process
  • optical fibers are supposed to be arranged.
  • a lower clad layer 13 and a core layer 14 are shown in Figs. 2c and 2d.
  • the lower clad layer 13 and the core layer 14 are made of Si02, and the
  • each layer is a few to several tens ⁇ m.
  • the core layer 14 is patterned and one or more
  • optical waveguide 14a is formed on the substrate of the second area.
  • the lower clad layer 13 has lower refractive index than that of the core
  • the optical waveguide 14a has a role to transmit
  • an upper clad layer 15 is formed on the entire
  • the upper clad layer 15 is also made of Si02 same as the lower clad layer 13,
  • the thickness thereof is about 20 ⁇ m. It also has low refractive index to make the
  • the substrate 11 is diced to separate the first, second,
  • substrate 1 la having the first area
  • second sub-substrate 1 lb having the second area
  • first and third sub-substrates 11a and l ie become first and second
  • the second sub-substrate 1 lb becomes an optical waveguide device through the following process.
  • reaction gas such as CxFy group or CxCly group or wet
  • l ie are etched to a prescribed depth using the mask layer 12 as mask to form one or
  • the grooves are formed in V shape, U shape, or other shapes in which the
  • optical fibers can be mounted, and now the first sub-substrate 11a and the third sub-
  • substrate 1 lc on which grooves are formed become the input optical fiber block and the
  • optical fibers are arranged
  • fiber blocks are fabricated using the same substrate and separated according to the
  • the optical axes of the optical waveguide and the optical fibers are
  • Figs. 3a through 3j are process perspective views showing the fabrication
  • the optical waveguide is formed
  • grooves for mounting the optical fibers are formed, and the substrate is diced to form
  • a silicon substrate 21 having first and third areas on which optical fibers are supposed to be arranged and second area on which an optical
  • Si3N4, etc. are formed on upper and lower surfaces of prepared silicon substrate 21.
  • the first mask layer 22 is patterned using conventional
  • optical waveguide is supposed to be formed and the first and third areas of the substrate
  • a lower clad layer 23 and a core layer 24 are
  • the core layer 24 is patterned and one or more
  • optical waveguide 24a is formed on the substrate of the second area.
  • an upper clad layer 25 is formed on the entire
  • the second mask layer 26 is formed on the upper
  • mask layer 26 pattern as mask to expose the first mask layer 22.
  • the substrate 21 is diced to separate the first, second,
  • substrate 21a having the first area
  • second sub-substrate 21b having the second area
  • optical fibers are arranged
  • Figs. 4a through 4j are process perspective views showing the fabrication
  • substrate is diced to form, each block.
  • optical fibers which optical fibers are supposed to be arranged and second area on which an optical
  • the mask layer 32 is patterned using conventional photolithography process
  • the grooves can be formed using a mask formed separately
  • shadow mask other than the mask layer 32 is formed and patterned though the method
  • Fig. 4c is to use photolithography process which patterns the mask layer 32
  • the mask formed separately and the wet etching process are used. If the mask formed
  • a lower clad layer 33 and a core layer 34 are
  • the core layer 34 is patterned and one or more
  • optical waveguide 34a is formed on the substrate of the second area.
  • an upper clad layer 35 is formed on the entire
  • connection guide parallel to the grooves where the
  • optical fibers are supposed to be mounted can be formed by etching the first, second,
  • connection guides 41 are formed parallel to the optical waveguide
  • optical fiber blocks correspond to each other.
  • input/output optical fiber blocks 45 and 46 correspond to those of the optical waveguide
  • connection between the optical waveguide and the optical fibers become simple.
  • Figs. 6a through 6g are process perspective views showing the fabrication
  • mounting the optical fibers are formed using the upper clad layer used in the step of
  • optical waveguide as mask other than the mask layer.
  • a lower clad layer 53 and a core layer 54 are formed
  • the core layer 54 is patterned and one or more optical waveguide 54a is formed on the substrate of the second area.
  • an upper clad layer 55 is formed on the entire
  • a mask layer (not shown) is formed on the substrate
  • a mask formed in advance (shadow mask) can also be used
  • Such mask can be aligned minutely using the align mark formed on the substrate or
  • the optical waveguide as reference point.
  • third areas of the substrate 51 are removed to expose the substrate 51.
  • connection guide parallel to the grooves where optical fibers are supposed to be
  • connection guide can be easily formed if the connection guide
  • the com ection guides 41 are formed parallel to the optical waveguide
  • fiber blocks 45 and 46 correspond to each other.
  • Fig. 7 shows the connection status of optical fibers and the 1x8 optical
  • grooves for mounting optical fibers can be formed on the
  • Figs. 8a through 8g are process perspective views showing the fabrication
  • optical fibers which optical fibers are supposed to be arranged and second area on which an optical
  • the mask layer 82 is patterned using conventional photolithography process to expose
  • a mask formed separately can also be used other than the mask
  • a lower clad layer 83 and a core layer 84 are formed
  • the core layer 84 is patterned and one or more
  • optical waveguide 84a is formed on the substrate 81 of the second area.
  • an upper clad layer 85 is formed on the entire
  • the substrate 81 is diced to separate the first, second,
  • substrate 81a having the first area
  • second sub-substrate 81b having the second area
  • the optical fibers are arranged and mounted to correspond on the grooves
  • optical fiber blocks are lapped and polished through the following process.
  • optical waveguide device to make the lapped and polished side end surfaces be
  • the optical waveguide are easily aligned if only the center of the optical waveguide and
  • the optical waveguide are formed after forming the grooves
  • the sixth embodiment of the present invention is related to a method of
  • waveguide are connected to be pe ⁇ endicular to the proceeding direction of the light.
  • connection surfaces are polished and connected to make both
  • FIG. 9 shows the sections of the connection surfaces using the
  • optical fiber block and the optical waveguide block are polished and connected to have
  • connection surface between the optical fiber and the optical waveguide not
  • polishing process to make each block be slanted requires a pretty
  • Fig. 10 is a layout diagram showing a dicing method of a substrate according
  • Fig. 10 shows a method of dicing the
  • the substrate is diced in z direction to have a little inclination to the y direction.
  • angle between the diced section and y direction is preferably around 8 degree.
  • connection part between the optical waveguide and the optical fiber block using dry or wet etching, dicing saw, laser processing, and/or any combination of
  • Figs. 11a through l lj are process perspective views showing the fabrication
  • a mask layer 112 made of silicon nitride, etc. is formed
  • the mask layer 112 is patterned using conventional
  • the exposed substrate 111 is etched by wet etching
  • the first groove 113 is formed to have a V shape where the width of the
  • a lower clad layer 114 and a core layer 115 are
  • the lower clad layer 114 and the core layer are made of Si02, and the
  • thicknesses are around 20 ⁇ m and 8 ⁇ m, respectively.
  • the core layer 115 is patterned to form an optical
  • a silica layer having low refractive index is deposited as the lower clad layer
  • the optical waveguide 115a is to pass the light.
  • an upper clad layer 116 is formed on the entire
  • the upper clad layer is also made of Si02 as the lower clad layer 114, and the
  • core layer is deposited to make the light total reflect in the optical waveguide 115a to
  • reaction gas such as CxFy group, CxCly group, etc.
  • optical fiber are arranged is completed.
  • connection part between the optical waveguide 115a As shown in Fig. Hi, the connection part between the optical waveguide 115a
  • optical fiber block is half cut by dry or wet etching, dicing saw, laser processing,
  • an optical fiber 110 is arranged on the first
  • the optical device in which the optical fiber array block is integrated is integrated.
  • Figs. 12a through 12j are process perspective views showing the fabrication
  • a mask 122 where a prescribed pattern is formed is
  • the first groove 123 is formed to have a V shape where the width of the
  • the ninth embodiment is identical to those of the seventh embodiment.
  • Figs. 13a through 13h are process perspective views showing the fabrication
  • grooves are
  • a lower clad layer 134 and a core layer 135 are formed
  • an optical waveguide 135a is
  • an upper clad layer 136 is formed on the entire
  • the exposed substrate 131 is wet etched to a
  • connection part between the optical waveguide is shown in Fig. 13g.
  • the optical fiber block is half cut by dry or wet etching, dicing saw, laser
  • an optical fiber 130 is arranged on the first
  • the optical device in which the optical fiber array block is integrated is integrated.
  • Figs. 14a through 14h are process perspective views showing the fabrication
  • waveguide 145a is same as that of the ninth embodiment.
  • next step is, as shown in Fig. 14d, to form a mask layer 142 on
  • an upper clad layer 146 and pattern it. Then, the upper and lower clad layers 146 and
  • the exposed substrate 141 is etched to a prescribed
  • a mask layer According to the eleventh embodiment of the present invention, a mask layer
  • this embodiment can be used with a
  • a first mask layer made of Si3N4, etc. is formed on the entire surface of the
  • the core layer is patterned to form an optical waveguide in
  • a second mask layer is formed on the entire surface of the substrate and patterned to expose the first mask layer by etching the upper and lower clad layers of the
  • optical fiber is arranged on the first groove, and the optical fiber is
  • optical materials being able to form grooves by dicing or laser processing
  • substrates being able to form planar waveguide device or active optical devices
  • LD/PD including LD/PD and being able to form passive optical devices such as mirror, filter, or
  • lens of 3-dimensional structure by micro-machining can be also used. Moreover, the
  • present invention can be applied to the A1N (Aluminum Nitride) or plastic substrate if
  • optical waveguides or active/passive devices can be formed on the substrate.
  • planar optical device using Si02, polymer material, etc. can be
  • micro-machining such as filter, lens, mirror, etc. can be also formed on the substrate.
  • the optical fiber can be connected accurately without expensive alignment station.
  • the process is improved as well as the processing time and cost.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne la connexion d'un guide d'ondes à une fibre optique sans avoir recours à un instrument d'alignement coûteux. Le procédé consiste à : découper en dés et roder/polir la surface de contact après obtention du dispositif de guide d'ondes et d'un bloc de fibres optiques sur un substrat unique ; puis connecter à nouveau le dispositif de guide d'ondes et le bloc de fibres optiques ensemble. Il est en outre possible de réduire le temps de fabrication et le coût associé grâce au procédé consistant à : former la première rainure par gravure d'une zone spécifique de la surface du substrat où les fibres optiques sont supposées être disposées ; former le guide d'ondes sur le substrat afin d'aligner ledit guide sur la première rainure correspondante dans une ligne droite; former la seconde rainure par gravure de la surface de séparation entre la première rainure et le guide d'ondes à une profondeur définie ; et aligner la fibre optique sur la première rainure, puis fixer la fibre optique au guide d'ondes.
PCT/KR2002/001632 2001-08-31 2002-08-31 Dispositif optique et son procede de fabrication Ceased WO2003025647A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2001-0053440A KR100396252B1 (ko) 2001-08-31 2001-08-31 광소자 및 그 제조방법
KR2001-53440 2001-08-31
KR2001-53730 2001-09-01
KR1020010053730A KR100558887B1 (ko) 2001-09-01 2001-09-01 광소자 제조방법

Publications (1)

Publication Number Publication Date
WO2003025647A1 true WO2003025647A1 (fr) 2003-03-27

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PCT/KR2002/001632 Ceased WO2003025647A1 (fr) 2001-08-31 2002-08-31 Dispositif optique et son procede de fabrication

Country Status (1)

Country Link
WO (1) WO2003025647A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2427795A1 (fr) * 2009-05-05 2012-03-14 Lemoptix SA Procédé d'alignement passif et son application dans des dispositifs de microprojection
CN108152896A (zh) * 2013-02-01 2018-06-12 南安泉鸿孵化器管理有限公司 光纤耦合连接器的组装方法
CN108318976A (zh) * 2018-01-24 2018-07-24 深圳市中兴新地技术股份有限公司 一种光传输器件的耦合成型方法
WO2020235041A1 (fr) * 2019-05-22 2020-11-26 日本電信電話株式会社 Structure de connexion de guide d'ondes, puce de guide d'ondes, connecteur, procédé de fabrication de composant de connexion de guide d'ondes, et procédé de connexion de gude d'ondes

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461708A (en) * 1987-09-01 1989-03-08 Ibiden Co Ltd Channelwaveguide type optical isolator
JPH03134603A (ja) * 1989-10-20 1991-06-07 Nippon Telegr & Teleph Corp <Ntt> 高精度接着方法
JPH1172643A (ja) * 1997-08-27 1999-03-16 Nhk Spring Co Ltd 光ファイバ用ｖ溝基板の製造方法および光ファイバの端末保持構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461708A (en) * 1987-09-01 1989-03-08 Ibiden Co Ltd Channelwaveguide type optical isolator
JPH03134603A (ja) * 1989-10-20 1991-06-07 Nippon Telegr & Teleph Corp <Ntt> 高精度接着方法
JPH1172643A (ja) * 1997-08-27 1999-03-16 Nhk Spring Co Ltd 光ファイバ用ｖ溝基板の製造方法および光ファイバの端末保持構造

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2427795A1 (fr) * 2009-05-05 2012-03-14 Lemoptix SA Procédé d'alignement passif et son application dans des dispositifs de microprojection
CN108152896A (zh) * 2013-02-01 2018-06-12 南安泉鸿孵化器管理有限公司 光纤耦合连接器的组装方法
CN108152896B (zh) * 2013-02-01 2019-12-13 东莞市川富电子有限公司 光纤耦合连接器的组装方法
CN108318976A (zh) * 2018-01-24 2018-07-24 深圳市中兴新地技术股份有限公司 一种光传输器件的耦合成型方法
CN108318976B (zh) * 2018-01-24 2019-10-25 深圳市中兴新地技术股份有限公司 一种光传输器件的耦合成型方法
WO2020235041A1 (fr) * 2019-05-22 2020-11-26 日本電信電話株式会社 Structure de connexion de guide d'ondes, puce de guide d'ondes, connecteur, procédé de fabrication de composant de connexion de guide d'ondes, et procédé de connexion de gude d'ondes
JPWO2020235041A1 (fr) * 2019-05-22 2020-11-26
JP7222424B2 (ja) 2019-05-22 2023-02-15 日本電信電話株式会社 導波路接続構造、導波路チップ、コネクタ、および導波路接続部品の製造方法、ならびに導波路接続方法

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