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WO2003021668A1 - Wiring board, semiconductor device and method for producing them - Google Patents

Wiring board, semiconductor device and method for producing them Download PDF

Info

Publication number
WO2003021668A1
WO2003021668A1 PCT/JP2001/007555 JP0107555W WO03021668A1 WO 2003021668 A1 WO2003021668 A1 WO 2003021668A1 JP 0107555 W JP0107555 W JP 0107555W WO 03021668 A1 WO03021668 A1 WO 03021668A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
producing
semiconductor device
basic material
insulating basic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2001/007555
Other languages
French (fr)
Japanese (ja)
Inventor
Naoki Fukutomi
Kazuhisa Suzuki
Osamu Shimada
Kazumasa Takeuchi
Yoshiaki Wakashima
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Metals Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2003525905A priority Critical patent/JPWO2003021668A1/en
Priority to PCT/JP2001/007555 priority patent/WO2003021668A1/en
Publication of WO2003021668A1 publication Critical patent/WO2003021668A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W74/019—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W70/635—
    • H10W74/014—
    • H10W74/117—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H10P72/7438—
    • H10W70/656—
    • H10W72/0198—
    • H10W72/072—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/075—
    • H10W72/20—
    • H10W72/884—
    • H10W74/00—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—
    • H10W99/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A wiring board comprising an insulating basic material, a wiring provided on one of the front surface or rear surface thereof, and a conductor member buried in the insulating basic material, wherein the conductor member has one end exposed to the surface of the insulating basic material and connected with the wiring and the other end buried in the insulating basic material. A semiconductor device employing the wiring board and a method for producing them.
PCT/JP2001/007555 2001-08-31 2001-08-31 Wiring board, semiconductor device and method for producing them Ceased WO2003021668A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003525905A JPWO2003021668A1 (en) 2001-08-31 2001-08-31 Wiring board, semiconductor device, and manufacturing method thereof
PCT/JP2001/007555 WO2003021668A1 (en) 2001-08-31 2001-08-31 Wiring board, semiconductor device and method for producing them

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/007555 WO2003021668A1 (en) 2001-08-31 2001-08-31 Wiring board, semiconductor device and method for producing them

Publications (1)

Publication Number Publication Date
WO2003021668A1 true WO2003021668A1 (en) 2003-03-13

Family

ID=11737684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/007555 Ceased WO2003021668A1 (en) 2001-08-31 2001-08-31 Wiring board, semiconductor device and method for producing them

Country Status (2)

Country Link
JP (1) JPWO2003021668A1 (en)
WO (1) WO2003021668A1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159354A (en) * 2003-11-25 2005-06-16 Internatl Business Mach Corp <Ibm> High performance chip carrier substrate
JP2007506279A (en) * 2003-09-18 2007-03-15 クリー　インコーポレイテッド Molded chip manufacturing method and apparatus
JP2008172268A (en) * 2008-02-28 2008-07-24 Nippon Mektron Ltd Multilayer circuit board manufacturing method and circuit substrate
JP2010232524A (en) * 2009-03-27 2010-10-14 Nitto Denko Corp Manufacturing method of semiconductor device
US7897980B2 (en) 2006-11-09 2011-03-01 Cree, Inc. Expandable LED array interconnect
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
KR20150055673A (en) * 2013-11-13 2015-05-22 앰코 테크놀로지 코리아 주식회사 Semiconductor package structure and manufacturing method thereof
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US10505083B2 (en) 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145325A (en) * 1997-11-06 1999-05-28 Yamaichi Electron Co Ltd IC package
JPH11163207A (en) * 1997-12-01 1999-06-18 Hitachi Chem Co Ltd Method of manufacturing substrate for mounting semiconductor chip and semiconductor device
JP2000332145A (en) * 1999-05-18 2000-11-30 Dainippon Printing Co Ltd Circuit member for resin-sealed semiconductor device, resin-sealed semiconductor device using the same, and method of manufacturing circuit member
JP2001044589A (en) * 1999-07-30 2001-02-16 Nitto Denko Corp Circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145325A (en) * 1997-11-06 1999-05-28 Yamaichi Electron Co Ltd IC package
JPH11163207A (en) * 1997-12-01 1999-06-18 Hitachi Chem Co Ltd Method of manufacturing substrate for mounting semiconductor chip and semiconductor device
JP2000332145A (en) * 1999-05-18 2000-11-30 Dainippon Printing Co Ltd Circuit member for resin-sealed semiconductor device, resin-sealed semiconductor device using the same, and method of manufacturing circuit member
JP2001044589A (en) * 1999-07-30 2001-02-16 Nitto Denko Corp Circuit board

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007506279A (en) * 2003-09-18 2007-03-15 クリー　インコーポレイテッド Molded chip manufacturing method and apparatus
US10546978B2 (en) 2003-09-18 2020-01-28 Cree, Inc. Molded chip fabrication method and apparatus
US10164158B2 (en) 2003-09-18 2018-12-25 Cree, Inc. Molded chip fabrication method and apparatus
US9093616B2 (en) 2003-09-18 2015-07-28 Cree, Inc. Molded chip fabrication method and apparatus
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
JP2005159354A (en) * 2003-11-25 2005-06-16 Internatl Business Mach Corp <Ibm> High performance chip carrier substrate
US7863526B2 (en) 2003-11-25 2011-01-04 International Business Machines Corporation High performance chip carrier substrate
US7886435B2 (en) 2003-11-25 2011-02-15 International Business Machines Corporation High performance chip carrier substrate
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US7897980B2 (en) 2006-11-09 2011-03-01 Cree, Inc. Expandable LED array interconnect
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US10505083B2 (en) 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
JP2008172268A (en) * 2008-02-28 2008-07-24 Nippon Mektron Ltd Multilayer circuit board manufacturing method and circuit substrate
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
JP2010232524A (en) * 2009-03-27 2010-10-14 Nitto Denko Corp Manufacturing method of semiconductor device
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
KR20150055673A (en) * 2013-11-13 2015-05-22 앰코 테크놀로지 코리아 주식회사 Semiconductor package structure and manufacturing method thereof
KR101631934B1 (en) 2013-11-13 2016-06-21 앰코 테크놀로지 코리아 주식회사 Semiconductor package structure and manufacturing method thereof

Also Published As

Publication number Publication date
JPWO2003021668A1 (en) 2004-12-24

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