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WO2003019579A1 - Conductive paste and conductive film using it, plating method and production method for fine metal component - Google Patents

Conductive paste and conductive film using it, plating method and production method for fine metal component Download PDF

Info

Publication number
WO2003019579A1
WO2003019579A1 PCT/JP2002/008421 JP0208421W WO03019579A1 WO 2003019579 A1 WO2003019579 A1 WO 2003019579A1 JP 0208421 W JP0208421 W JP 0208421W WO 03019579 A1 WO03019579 A1 WO 03019579A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive film
fine metal
conductive paste
metal component
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/008421
Other languages
English (en)
French (fr)
Inventor
Jun Yorita
Shinji Inazawa
Masatoshi Majima
Hideki Kashihara
Toshihiro Sakamoto
Hideaki Toshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2003522950A priority Critical patent/JPWO2003019579A1/ja
Priority to US10/487,345 priority patent/US7220370B2/en
Priority to EP02765342A priority patent/EP1426978A4/en
Priority to KR1020047002575A priority patent/KR100804924B1/ko
Publication of WO2003019579A1 publication Critical patent/WO2003019579A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)
  • Powder Metallurgy (AREA)
PCT/JP2002/008421 2001-08-22 2002-08-21 Conductive paste and conductive film using it, plating method and production method for fine metal component Ceased WO2003019579A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003522950A JPWO2003019579A1 (ja) 2001-08-22 2002-08-21 導電ペーストとそれを用いた導電膜、めっき方法および微細金属部品の製造方法
US10/487,345 US7220370B2 (en) 2001-08-22 2002-08-21 Plating and production methods for producing a fine metal component using a conductive paste
EP02765342A EP1426978A4 (en) 2001-08-22 2002-08-21 CONDUCTIVE PASTE AND CONDUCTIVE FILM USING THE SAME, DEPOSITION METHOD, AND PROCESS FOR PRODUCING A COMPOUND METAL COMPONENT
KR1020047002575A KR100804924B1 (ko) 2001-08-22 2002-08-21 도전페이스트와 그것을 이용한 도전막, 도금방법 및미세금속부품의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001251833 2001-08-22
JP2001-251833 2001-08-22

Publications (1)

Publication Number Publication Date
WO2003019579A1 true WO2003019579A1 (en) 2003-03-06

Family

ID=19080414

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008421 Ceased WO2003019579A1 (en) 2001-08-22 2002-08-21 Conductive paste and conductive film using it, plating method and production method for fine metal component

Country Status (7)

Country Link
US (1) US7220370B2 (ja)
EP (1) EP1426978A4 (ja)
JP (1) JPWO2003019579A1 (ja)
KR (1) KR100804924B1 (ja)
CN (1) CN1290120C (ja)
TW (1) TWI281676B (ja)
WO (1) WO2003019579A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003147570A (ja) * 2001-11-08 2003-05-21 Sumitomo Electric Ind Ltd 微細金属部品の製造方法
US7285152B2 (en) 2003-05-08 2007-10-23 Sumitomo Electric Industries, Ltd. Method of manufacturing chain-structure metal powder
US7438835B2 (en) * 2002-03-25 2008-10-21 Sumitomo Metal Mining Co., Ltd. Transparent conductive film, coating liquid for forming such film, transparent conductive layered structure, and display device
US7850760B2 (en) 2004-04-30 2010-12-14 Sumitomo Electric Industries, Ltd. Process for production of chain metal powders, chain metal powders produced thereby, and anisotropic conductive film formed using the powders

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316100B1 (en) 1997-02-24 2001-11-13 Superior Micropowders Llc Nickel powders, methods for producing powders and devices fabricated from same
JP2004162096A (ja) * 2002-11-11 2004-06-10 Sumitomo Electric Ind Ltd 無電解めっき用ペーストと、これを用いた金属構造体および微細金属部品の製造方法
US7055756B2 (en) * 2004-10-25 2006-06-06 Lexmark International, Inc. Deposition fabrication using inkjet technology
JP2006161066A (ja) * 2004-12-02 2006-06-22 Seiko Epson Corp スパッタリングターゲットとその製造方法及びスパッタリング装置並びに液体噴射ヘッド
US20060189113A1 (en) 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
JP4967771B2 (ja) * 2007-04-11 2012-07-04 オムロン株式会社 コンタクトおよびコネクタ
US20100031501A1 (en) * 2008-08-08 2010-02-11 Napra Co., Ltd. Method for filling through hole or non-through hole formed on board with filler
WO2010147095A1 (ja) * 2009-06-17 2010-12-23 昭和電工株式会社 放電ギャップ充填用組成物および静電放電保護体
KR101108769B1 (ko) * 2010-05-28 2012-02-24 삼성전기주식회사 금속분말의 제조 방법 및 이를 이용한 적층콘덴서용 내부전극의 제조 방법
JP5614135B2 (ja) * 2010-07-06 2014-10-29 デクセリアルズ株式会社 異方性導電接着剤、その製造方法、接続構造体及びその製造方法
CN102922213B (zh) * 2012-11-21 2014-12-03 苏州永创金属科技有限公司 一种低温、无色差修补镀银工件表面缺陷的方法
KR102410173B1 (ko) * 2014-05-14 2022-06-20 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 도전 페이스트의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
CN105219202A (zh) * 2015-09-15 2016-01-06 熊平伟 用于非金属电镀的导电胶及其制成的模具及其电镀方法
CN106498464B (zh) * 2016-10-24 2019-07-30 电子科技大学 一种金属纳微米枝晶有序阵列的制备方法
CN106757173B (zh) * 2016-11-25 2019-02-22 电子科技大学 一种无表面配体的银多面体微纳米晶体的制备方法
CN106604560B (zh) * 2017-02-22 2020-10-02 武汉光谷创元电子有限公司 电路板加工方法
CN108878678A (zh) * 2018-06-14 2018-11-23 武汉华星光电半导体显示技术有限公司 导电胶结构制作方法、导电胶结构及显示面板组件
US11805603B2 (en) * 2019-06-24 2023-10-31 International Business Machines Corporation Applying a solderable surface to conductive ink
EP3792962A1 (en) * 2019-09-12 2021-03-17 Infineon Technologies AG Method for monitoring a process of forming a sinterable connection layer by photometric measurements
CN112663098B (zh) * 2020-12-08 2023-01-03 南京航空航天大学 一种用于电铸芯模快速脱模的粘性导电箔及快速脱模方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124662A (ja) * 1998-10-14 2000-04-28 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
JP2001085397A (ja) * 1999-09-10 2001-03-30 Toshiba Corp パターン形成方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613526A (en) * 1979-07-11 1981-02-09 Tdk Corp Magnetic recording medium
US4923739A (en) * 1987-07-30 1990-05-08 American Telephone And Telegraph Company Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method
US5958590A (en) 1995-03-31 1999-09-28 International Business Machines Corporation Dendritic powder materials for high conductivity paste applications
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
JP3790869B2 (ja) 1996-01-11 2006-06-28 東洋紡績株式会社 金属めっき下地用導電性ペースト
US6620344B2 (en) * 1999-05-28 2003-09-16 Dowa Mining Co., Ltd. Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
JP3597098B2 (ja) 2000-01-21 2004-12-02 住友電気工業株式会社 合金微粉末とその製造方法、それを用いた成型用材料、スラリーおよび電磁波シールド材料
JP3952743B2 (ja) 2001-11-08 2007-08-01 住友電気工業株式会社 微細金属部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124662A (ja) * 1998-10-14 2000-04-28 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
JP2001085397A (ja) * 1999-09-10 2001-03-30 Toshiba Corp パターン形成方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003147570A (ja) * 2001-11-08 2003-05-21 Sumitomo Electric Ind Ltd 微細金属部品の製造方法
US7438835B2 (en) * 2002-03-25 2008-10-21 Sumitomo Metal Mining Co., Ltd. Transparent conductive film, coating liquid for forming such film, transparent conductive layered structure, and display device
US7285152B2 (en) 2003-05-08 2007-10-23 Sumitomo Electric Industries, Ltd. Method of manufacturing chain-structure metal powder
US7850760B2 (en) 2004-04-30 2010-12-14 Sumitomo Electric Industries, Ltd. Process for production of chain metal powders, chain metal powders produced thereby, and anisotropic conductive film formed using the powders
US8038762B2 (en) 2004-04-30 2011-10-18 Sumitomo Electric Industries, Ltd. Process for production of chain metal powders, chain metal powers produced thereby, and anisotropic conductive film formed by using the powders

Also Published As

Publication number Publication date
US7220370B2 (en) 2007-05-22
CN1290120C (zh) 2006-12-13
TWI281676B (en) 2007-05-21
KR20040044466A (ko) 2004-05-28
EP1426978A1 (en) 2004-06-09
EP1426978A4 (en) 2008-09-10
KR100804924B1 (ko) 2008-02-20
TW200409144A (en) 2004-06-01
JPWO2003019579A1 (ja) 2004-12-16
CN1557000A (zh) 2004-12-22
US20040232386A1 (en) 2004-11-25

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