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WO2003008359A1 - Ceramic connection body, method of connecting the ceramic bodies, and ceramic structural body - Google Patents

Ceramic connection body, method of connecting the ceramic bodies, and ceramic structural body Download PDF

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Publication number
WO2003008359A1
WO2003008359A1 PCT/JP2002/007362 JP0207362W WO03008359A1 WO 2003008359 A1 WO2003008359 A1 WO 2003008359A1 JP 0207362 W JP0207362 W JP 0207362W WO 03008359 A1 WO03008359 A1 WO 03008359A1
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic
bodies
connection
connection body
structural body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/007362
Other languages
English (en)
French (fr)
Inventor
Yasutaka Ito
Jun Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to KR10-2004-7000360A priority Critical patent/KR20040030803A/ko
Priority to US10/483,256 priority patent/US20040175549A1/en
Priority to JP2003513920A priority patent/JPWO2003008359A1/ja
Priority to EP02746121A priority patent/EP1418160A1/en
Publication of WO2003008359A1 publication Critical patent/WO2003008359A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Products (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/JP2002/007362 2001-07-19 2002-07-19 Ceramic connection body, method of connecting the ceramic bodies, and ceramic structural body Ceased WO2003008359A1 (en)

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KR10-2004-7000360A KR20040030803A (ko) 2001-07-19 2002-07-19 세라믹 접합체 및 그 접합방법, 세라믹 구조체
US10/483,256 US20040175549A1 (en) 2001-07-19 2002-07-19 Ceramic connection body, method of connecting the ceramic bodies, and ceramic structural body
JP2003513920A JPWO2003008359A1 (ja) 2001-07-19 2002-07-19 セラミック接合体およびその接合方法、セラミック構造体
EP02746121A EP1418160A1 (en) 2001-07-19 2002-07-19 CERAMIC CONNECTION BODY, METHOD OF CONNECTING THE CERAMIC BODIES, AND CERAMIC STRUCTURAL BODY

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JP2001-220385 2001-07-19

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EP (1) EP1418160A1 (ja)
JP (1) JPWO2003008359A1 (ja)
KR (1) KR20040030803A (ja)
CN (1) CN1533370A (ja)
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WO2004110957A1 (ja) * 2003-06-13 2004-12-23 Tokuyama Corporation 窒化アルミニウム接合体及びその製造方法
JP2005022966A (ja) * 2003-06-13 2005-01-27 Tokuyama Corp 窒化アルミニウム接合体及びその製造方法
JP2005166830A (ja) * 2003-12-01 2005-06-23 Bridgestone Corp セラミックヒータユニット
JP2012071995A (ja) * 2010-09-27 2012-04-12 Taiheiyo Cement Corp アルミナセラミックス接合体及びその製造方法
JP2014065631A (ja) * 2012-09-26 2014-04-17 Taiheiyo Cement Corp セラミックス接合体及びその製造方法
JP2015164882A (ja) * 2014-02-28 2015-09-17 株式会社日本セラテック 窒化アルミニウム接合体およびその製造方法
JP2023541774A (ja) * 2020-09-18 2023-10-04 アプライド マテリアルズ インコーポレイテッド 加熱及びチャッキング能を有する静電チャック

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US20080009417A1 (en) * 2006-07-05 2008-01-10 General Electric Company Coating composition, article, and associated method
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KR101316804B1 (ko) * 2008-12-25 2013-10-11 가부시키가이샤 알박 정전척용의 척 플레이트의 제조 방법
TWI547379B (zh) * 2010-12-21 2016-09-01 鴻海精密工業股份有限公司 黃銅與碳化矽陶瓷複合件及其製造方法
JP5973731B2 (ja) * 2012-01-13 2016-08-23 東京エレクトロン株式会社 プラズマ処理装置及びヒータの温度制御方法
WO2013130918A1 (en) * 2012-02-29 2013-09-06 Harris, Jonathan, H. Transient liquid phase, pressureless joining of aluminum nitride components
KR101475860B1 (ko) * 2013-07-03 2014-12-23 (주)나노엘엔피 직접접합에 의한 동시 소성이 가능한 세라믹 정전척 및 그 제조방법
JP6219227B2 (ja) * 2014-05-12 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構及びステージの温度制御方法
US20170267591A1 (en) * 2014-07-10 2017-09-21 Ceramtec Gmbh Laminated ceramic molded article having recesses
JP6463938B2 (ja) * 2014-10-08 2019-02-06 日本特殊陶業株式会社 静電チャック
JP5962833B2 (ja) * 2015-01-16 2016-08-03 Toto株式会社 静電チャック
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WO2017115758A1 (ja) * 2015-12-28 2017-07-06 日本碍子株式会社 円板状ヒータ及びヒータ冷却板アセンブリ
KR101694754B1 (ko) * 2016-09-08 2017-01-11 (주)브이앤아이솔루션 정전척 및 그 제조방법
US11043401B2 (en) * 2017-04-19 2021-06-22 Ngk Spark Plug Co., Ltd. Ceramic member
KR102069423B1 (ko) * 2017-12-19 2020-01-22 주식회사 티씨케이 접합 세라믹 및 이의 제조방법
WO2020067129A1 (ja) * 2018-09-28 2020-04-02 京セラ株式会社 ウェハ用部材、ウェハ用システム及びウェハ用部材の製造方法
JP6873178B2 (ja) * 2019-03-26 2021-05-19 日本碍子株式会社 半導体製造装置用部材、その製法及び成形型
JP7248607B2 (ja) * 2020-02-03 2023-03-29 日本碍子株式会社 セラミックヒータ
WO2021157135A1 (ja) * 2020-02-07 2021-08-12 Ｊｘ金属株式会社 Ｙａｇセラミックス接合体及びその製造方法
JP7202326B2 (ja) * 2020-03-11 2023-01-11 日本碍子株式会社 セラミックヒータ
JP7430617B2 (ja) * 2020-10-16 2024-02-13 日本碍子株式会社 ウエハ載置台
KR102461995B1 (ko) 2021-09-17 2022-11-03 주식회사 미코세라믹스 저열전도 샤프트를 구비하는 고온용 서셉터
KR20230086958A (ko) * 2021-12-09 2023-06-16 삼성전자주식회사 웨이퍼 베이킹 장치

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WO2004110957A1 (ja) * 2003-06-13 2004-12-23 Tokuyama Corporation 窒化アルミニウム接合体及びその製造方法
JP2005022966A (ja) * 2003-06-13 2005-01-27 Tokuyama Corp 窒化アルミニウム接合体及びその製造方法
KR100716100B1 (ko) * 2003-06-13 2007-05-09 가부시끼가이샤 도꾸야마 질화알루미늄 접합체 및 그의 제조 방법
CN100381401C (zh) * 2003-06-13 2008-04-16 株式会社德山 氮化铝接合体及其制造方法
US7488543B2 (en) 2003-06-13 2009-02-10 Tokuyama Corporation Aluminum nitride conjugate body and method of producing the same
JP2005166830A (ja) * 2003-12-01 2005-06-23 Bridgestone Corp セラミックヒータユニット
WO2005059975A1 (ja) * 2003-12-01 2005-06-30 Bridgestone Corporation セラミックヒータユニット
JP2012071995A (ja) * 2010-09-27 2012-04-12 Taiheiyo Cement Corp アルミナセラミックス接合体及びその製造方法
JP2014065631A (ja) * 2012-09-26 2014-04-17 Taiheiyo Cement Corp セラミックス接合体及びその製造方法
JP2015164882A (ja) * 2014-02-28 2015-09-17 株式会社日本セラテック 窒化アルミニウム接合体およびその製造方法
JP2023541774A (ja) * 2020-09-18 2023-10-04 アプライド マテリアルズ インコーポレイテッド 加熱及びチャッキング能を有する静電チャック
JP7587675B2 (ja) 2020-09-18 2024-11-20 アプライド マテリアルズ インコーポレイテッド 加熱及びチャッキング能を有する静電チャック

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TW567177B (en) 2003-12-21
US20040175549A1 (en) 2004-09-09
EP1418160A1 (en) 2004-05-12
KR20040030803A (ko) 2004-04-09
CN1533370A (zh) 2004-09-29

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