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WO2003001860A1 - Dispositif de refroidissement, equipement electronique et procede de production - Google Patents

Dispositif de refroidissement, equipement electronique et procede de production Download PDF

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Publication number
WO2003001860A1
WO2003001860A1 PCT/JP2001/005092 JP0105092W WO03001860A1 WO 2003001860 A1 WO2003001860 A1 WO 2003001860A1 JP 0105092 W JP0105092 W JP 0105092W WO 03001860 A1 WO03001860 A1 WO 03001860A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
cover
cooling
cooling fan
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2001/005092
Other languages
English (en)
Japanese (ja)
Inventor
Eiji Takizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2001/005092 priority Critical patent/WO2003001860A1/fr
Priority to JP2003508114A priority patent/JPWO2003001860A1/ja
Publication of WO2003001860A1 publication Critical patent/WO2003001860A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Definitions

  • the present invention generally relates to a cooling device, and more particularly to a cooling device for cooling a heat-generating circuit element (heating element) of an electronic device.
  • the present invention is suitable, for example, for a notebook personal computer (PC) manufactured by selectively attaching a module for expanding functions according to an order.
  • the electronic device of the present invention is not limited to a notebook computer, but includes portable electronic devices such as personal 'digital' assistants (PDAs), portable game devices, various drives, and desktop PCs and word processors. In addition, it widely includes printers and copiers.
  • BTO Bui Idto Order
  • the BTO can be customized by selecting the necessary functions from the user's point of view, and it is not necessary for the manufacturer to keep useless inventory, which is beneficial to both users and manufacturers. is there.
  • Note-type personal computers are generally provided with printed circuit boards called motherboards (or mainboards) provided in the housing, in addition to CPUs, memories, and chipsets, as well as function expansion modules (eg, network modules, ( (Fax) Modem module etc.), and recently the function expansion module is BTO compliant.
  • function expansion modules eg, network modules, ( (Fax) Modem module etc.
  • a cooling mechanism for cooling the heating elements is provided in the housing. Disclosure of the invention
  • the heating element of a notebook PC has a CPU, memory, etc., which are always installed, and a function expansion module, which is mounted by BTO. Some have large calorific values.
  • the cooling mechanism is set to the maximum cooling capacity, including the cooling fan, in case the function expansion module with the largest heat generation is selected by BTO. Such a configuration makes it possible to produce a notebook PC in advance as a single package regardless of the function expansion modules that can be installed. This hinders the weight and price reduction of PCs.
  • a cooling device is a cooling device for cooling a heating element of an electronic device, wherein the cooling fan cools the heating element for the electronic device. And a cover attached to a housing of the electronic device so that the electronic device can be detached.
  • a cooling device can be attached to an electronic device that requires cooling of the heating element, but a cover is removed for an electronic device that does not require cooling.
  • the cooling device can be removed by removing the cooling fan from the cover.
  • An electronic device having such a cooling device does not include unnecessary components, thereby contributing to a reduction in the weight and cost of the electronic device.
  • a cooling device is a cooling device for cooling a heating element of an electronic device, wherein the cooling fan cools the heating element and the electronic device. And a cover attached to the housing of the electronic device so that the cooling fan can be attached to and detached from the electronic device.
  • the cooling device can be freely removed from the electronic device by removing the cooling fan from the cover attached to the housing or the cover.
  • a cooling device can be attached to an electronic device that requires cooling of the heating element, but a cover is removed for an electronic device that does not require cooling, or The cooling device can be removed by removing the cooling fan from the cover.
  • An electronic device having such a cooling device does not include unnecessary components, thereby contributing to a reduction in the weight and cost of the electronic device.
  • the cover may be configured by a part of a housing that houses the cooling fan or a part of a housing of the electronic device. Further, the cooling fan may be fixed to the cover, or may be detachably fixed to the cover.
  • an electronic device includes a heating element provided in a housing for performing a predetermined process, a cooling fan for cooling the heating element, and the cooling fan for the housing.
  • the electronic device includes the above-described cooling device, and can provide the same operation as the cooling device.
  • cooling fans were installed even in electronic devices that did not require cooling.However, the electronic device of the present invention allows the cooling fan to be removed, reducing the weight of electronic devices that do not require a cooling device. Contribute. Further, according to the electronic apparatus of the present invention, such a cooling fan can be removed, which contributes to reduction in power consumption.
  • the electronic device further includes a socket for detachably storing the heating element, and the cover functions as a cover for the socket.
  • the electronic device further includes a socket for detachably storing the heating element, and a heat dissipating member for dissipating heat of the heating element by utilizing heat conduction by contacting the heating element.
  • the cover functions as a cover of the socket, and the heat radiating member is attached to the cover.
  • the electronic device of the present invention includes a cooling fan and a Z or a heat radiating member depending on the module mounted on the socket. It can be determined whether or not to attach.
  • a cooling fan and a cooling method using a Z or a heat radiating member can be selected.
  • a module has a large calorific value, it is, for example, a network module.
  • the cover is made of aluminum or magnesium.
  • a method of manufacturing an electronic device includes: a step of determining whether a module for expanding the function of the electronic device is mounted on a housing of the electronic device; A cooling fan that cools the module, and a cover attached to a housing of the electronic device so that the cooling fan can be attached to and detached from the electronic device. Attaching the cooling device to the electronic device.
  • the manufacturing method of electronic records it is possible to determine whether the module is a predetermined heating element by including the step of determining whether or not the module is mounted on the housing of the electronic device. it can. If it is determined in this step that the heating element is a predetermined heating element, the cooling device may be attached, and an electronic device having a function of cooling the heating element can be manufactured.
  • the method includes a step of attaching the cover to the housing without attaching the cooling fan.
  • an electronic device without a cooling fan can be manufactured, which contributes to a reduction in the weight and power consumption of the electronic device as described above.
  • the method may further include, when it is determined that the predetermined heating element is mounted, attaching a heat radiating member for radiating heat of the heating element to the cover by utilizing heat conduction by contacting the module. Is also good.
  • the heat dissipating member may be selectably attached according to the module as in the case of the cooling fan. Therefore, such a manufacturing method can also manufacture electronic devices having different cooling methods.
  • a method of manufacturing an electronic device includes a step of predicting a calorific value in the housing of the electronic device, and determining that the predicted calorific value exceeds a predetermined calorific value.
  • a cooling device having a cooling fan for cooling the inside of the housing and a cover attached to the housing of the electronic device so that the cooling fan can be attached to and detached from the electronic device is attached to the electronic device. Installing the cooling fan when it is determined that the predicted heating value does not exceed a predetermined heating value. Attaching the cover to the housing without using the cover.
  • a method of manufacturing an electronic device includes the steps of: producing a module for expanding the function of the electronic device in accordance with an order and configuring the module to be attachable to the electronic device; Configuring a cooling device having a cooling fan for cooling an element and a cover attached to a housing of the electronic device so that the cooling fan can be mounted on and removed from the electronic device so as to be removable from the electronic device; And attaching the cooling device to the electronic device together with the module when there is an order for the module and the module is the predetermined heating element. Also, a step of attaching the force par to the housing without attaching the cooling fan when there is an order for the module and the module is not the predetermined heating element or when there is no order for the module. Have.
  • Such a manufacturing method is a method for manufacturing an electronic device including the above-described two manufacturing methods, and typically has the same operation as the above-described method.
  • FIG. 1 is a schematic perspective view showing an electronic apparatus as an exemplary embodiment of the present invention.
  • FIG. 2 is a schematic perspective view showing the base of the electronic device shown in FIG. 1 from the bottom side.
  • FIG. 3 is a schematic sectional view showing the socket cover shown in FIG. 2 and its vicinity with respect to line AA. .
  • FIG. 4 is a schematic perspective view showing a state where a socket cover is removed from the base shown in FIG.
  • FIG. 5 is an exploded perspective view showing the socket cover shown in FIG.
  • FIG. 6 is a cross-sectional view corresponding to FIG. 3, showing an exemplary embodiment of the notebook PC shown in FIG.
  • FIG. 7 is a cross-sectional view corresponding to FIG. 3, showing an exemplary embodiment of the notebook PC shown in FIG.
  • FIG. 8 is a schematic perspective view showing a socket cover which is a modified example of the socket cover shown in FIG.
  • FIG. 9 is a schematic perspective view showing a socket cover which is a modified example of the socket cover shown in FIG.
  • FIG. 10 is a schematic perspective view showing a socket cover which is a modification of the socket cover shown in FIG.
  • FIG. 11 is a schematic perspective view showing a socket cover which is a modification of the socket cover shown in FIG.
  • FIG. 12 is a flowchart for explaining a method of manufacturing an electronic device according to the present invention.
  • FIG. 1 is a schematic perspective view showing an electronic device 100 as an exemplary embodiment of the present invention.
  • FIG. 2 is a schematic perspective view showing the base 130 of the electronic device 100 shown in FIG. 1 from the bottom side.
  • FIG. 3 is a schematic sectional view showing the socket cover 160 of the base 130 shown in FIG. 2 and the vicinity thereof with respect to the line AA.
  • FIG. 4 is a schematic perspective view showing a state where the socket cover 160 has been removed from the base 130 shown in FIG.
  • FIG. 5 is an exploded perspective view showing the socket cover 160 shown in FIG.
  • the electronic device 100 of the present invention is embodied as a notebook computer (hereinafter, notebook computer 100), as shown in FIG.
  • notebook computer 100 the electronic device of the present invention is not limited to this, and widely includes PDAs, desktop PCs, mobile terminals, printers, copiers, and the like.
  • the size of the notebook PC 100 is A4 size. Cover size, B5 size, other notebook size, mini note size, etc.
  • the notebook PC 100 has a liquid crystal display (LCD) bezel frame 120 and a housing (base) 130 connected by hinges 110, and an LCD bezel frame 120.
  • the base 130 is configured to be foldable via a hinge 110.
  • An LCD screen 122 is arranged on the LCD bezel frame 120.
  • the LCD bezel frame 120 has a substantially rectangular shape that holds (: 13 screen 122.
  • the LCD screen 122 can use any technology known in the art. The detailed description here is omitted.
  • the base 130 typically includes a key section 140, a pointing device 150, and a socket cover 160, and contains a mother port 10 described later therein.
  • the keyport section 140 and the pointing device 150 are provided on the upper surface 132 of the base 130 using the known method.
  • the socket cover 160 is disposed on the bottom surface 134 of the base 130 and fixed so that the user cannot easily remove it using, for example, screws or bonding.
  • the base 130 is a rectangular casing and has, for example, an A4 size.
  • the shape of the base 130 can have various shapes in view of ergonomics, aesthetic factors, and functionality.
  • the base 130 has a B5 size in consideration of portability as described above, a part of the side surface 136 has a curvature in consideration of design, and the base 130 has a In order to incline to one side (tilt function), a projection may be provided on a part of the bottom surface 134.
  • the base 130 is formed of an aluminum die cast or a magnesium die cast, but may be a material other than such a metal material such as plastic, ceramic, or wood. Further, a composite material selected from these materials may be used.
  • the keyboard section 140 is a section where information is typed, and the keyboard type can be any key such as 101, 106, 109, and ergonomic.
  • the board arrangement does not matter, such as QWE RTY arrangement, D VORAK arrangement, JIS arrangement, new JIS arrangement, Japanese input consortium standard arrangement (NI COLA: Nihon on go Ny uryo ku CO nthoti um Layout).
  • the pointing device 150 has a function of emulating a part of the function of the mouse. Regardless of the structure shown in FIG. 1, the pointing device 150 is used for the mouse, the track pole, the track pad, the tablet, and the digitizer. 1. It may include a joystick, joypad, touch panel, stylus pen, and so on.
  • the socket cover 160 is a cover attached to the base 130 to incorporate the module 30 into the socket 12 of the motherboard 10. Therefore, when the socket cover 160 is attached to the base 130, the socket cover 160 functions as a part of the base 130.
  • the socket cover 160 allows the manufacturer to remove the socket cover 160 for mounting the module 30 at the time of manufacture, but the user can remove the socket cover 160 freely. It does not mean that it is possible (ie, the manufacturer does not offer to remove the socket cover 160 as part of the laptop's 100 functionality (eg, expandability). Further, in the present invention, the socket cover 160 characteristically also functions as a cooling device.
  • the socket cover 160 has a cover body 162, a heat conductive rubber 170, and a cooling fan 180, and is fixed so that the heat conductive rubber 170 and the cooling fan 180 are located inside the base 130. ing.
  • the socket cover 160 does not necessarily require both the heat conductive rubber 170 and the cooling fan 180 to be fixed to the cover body 162, and the socket cover 160 depends on the module 30 to be attached. The combination is to be determined.
  • the combination of the heat conductive rubber 170 and the cooling fan 180 will be described in more detail in a method of manufacturing the notebook PC 100 described later. As shown in the figure, the heat-conducting rubber 170 and the cooling fan 180 are fixed in a straight line along the Y direction shown in FIG.
  • the cooling fan 180 may be fixed in parallel to the Y direction in FIG. As described above, the heat conductive rubber 170 and the cooling fan 180 can be arranged in any manner, but the cooling fan 180 is used so that the cooling fan 180 can easily release air to the outside. It is preferable that 0 is arranged near the side surface 13 36 of the base 130. Also, although it does not function as a socket cover 160 for mounting the module 30, the cover body 162 is divided as described later, and only the cooling fan 16 4. It may be a configuration.
  • the cooling fan 180 is fixed by a screw 186, and the cooling fan 180 is detachably fixed to the cover body 162.
  • a fixing method is an example, and other methods are not excluded as long as the cooling fan 180 and the cover body 162 are detachably fixed.
  • a protrusion, a claw or a rail is provided on one of the cooling fan 180 and the cover body 162, and a recess or a groove corresponding to the protrusion, the claw or the rail is provided on a different one, and They may be detachably fixed by engaging with each other.
  • the present invention does not exclude that the cooling fan 180 is fixed to the cover body 162.
  • the cooling fan 180 would be secured to the cover member 162 by means of bonding, welding, or the like.
  • the adhesive has a relatively high melting point so that the adhesive is not melted by the heat generated by the heating element.
  • the adhesive may be a resin-based adhesive such as a silicone-based or epoxy-based adhesive.
  • the cover body 162 is a cover for the socket 12 of the mother board 10 and has a function as a plate material for fixing the heat conductive rubber 170 and the cooling fan 180.
  • the force par main body 16 2 forms a part of the bottom surface 13 4 and the side surface 13 36 of the base 130, and as shown in FIG. It is a bent plate.
  • the cover body 162 is rectangular, but in addition, it has an L-shape or T-shape. Is also good.
  • the cover main body 16 2 may be constituted by a part of the housing 18 1 that houses the cooling fan 180.
  • the cooling fan 180 and the cooling fan 180 may be separated so that they can be detached independently.
  • the cover body 1 62 is the same material as the base 130, That is, it is preferably formed of aluminum or magnesium, but may be formed of other materials.
  • the cover body 162 has a plurality of openings 163 provided to dissipate heat of the heat conductive rubber 170 and a plurality of openings for exhausting heat released by the cooling fan 180. 1 6 4
  • the openings 163 and 164 can be formed by using a processing method such as cutting or pressing, and the shape and number thereof may be arbitrarily determined.
  • the heat conductive rubber 170 functions as a heat radiating member, and radiates heat of the module 30. More specifically, the heat conductive rubber 170 radiates the heat of the module 30 to the outside through the opening 163 by heat conduction. As is well shown in FIG. 3, the heat conductive rubber 170 has substantially the same shape and size as the module 30, and has a sufficient thickness, and is arranged so as to be in surface contact with the module 30. Have been. Thus, the heat conductive rubber 170 can effectively dissipate heat.
  • the heat radiating rubber 170 can be formed from a silicone resin, but is not limited thereto. Naturally, a member having the same action as that of the heat conductive rubber 170 can be widely used. However, since it is in surface contact with the module 30, it is preferable that the module 30 be made of a soft member such as rubber.
  • the cooling fan 180 forcibly cools the heat of the module 30.
  • the cooling fan 180 has a housing 181, a fan 182, a power supply section 1884, and a driving device (not shown). It is removably attached to.
  • the cooling fan 180 is connected so that the rotation center of the fan 1802 coincides with the rotation axis of a driving mechanism (not shown), and the driving mechanism (not shown) is electrically connected to an external power supply via a power supply section 184. It is configured to be connectable.
  • the housing 18 1 is a package that houses the fan 18 2 and a driving device (not shown).
  • the housing 18 1 has a rectangular box shape and is provided with a vent (not shown) for assisting air flow, a mounting hole (not shown) for connection with the cover body 16 2, and the like.
  • the shape of the housing 18 1 may be freely determined and is not limited to the above description.
  • the housing 18 1 of the cooling fan 180 may function as a part or all of the cover body 16 2 of the socket cover 160. In such a configuration, part or all of the cover body 16 2 of the socket cover 16 It can be omitted.
  • the fan 18 2 is a propeller having four blades and forcibly convects air from the lower side to the upper side in FIG.
  • the shape of the fan 18 2, the number of blades, and the like can be any technology known in the art, and a detailed description thereof will be omitted.
  • the power supply section 184 has a cable and a connector, and supplies power for operating the cooling fan 180 to the drive device.
  • the cable and connector of the power supply section 184 are configured to be connectable to the power supply socket 14 of the motherboard 10.
  • the driving device (not shown) is, for example, a driving device having a rotating mechanism such as a motor, and rotates the fan 18.
  • any technology known in the art can be applied, and the detailed description is omitted here. .
  • the cooling fan 180 may include a temperature sensor such as a thermostat. If the cooling fan 180 is provided with a thermostat, the temperature sensor will be located close to the module 30 and the ON / OFF switch will be connected to the power supply 184. In such a configuration, the cooling fan 180 can drive the fan 1802 when the temperature reaches a predetermined temperature. However, the method of driving the cooling fan 180 may be controlled by CPU 20 of the note type PC 100 described later.
  • the cooling fan 100 may be configured to be selectable from a plurality of cooling fans 180 having different cooling capacities.
  • the socket cover 160 functions not only as a cover of the socket 12 for inserting the module 30 but also as a cooling device.
  • the cooling fan 180 can be freely removed by removing the cooling fan 180 from the socket cover 160 attached to the notebook PC 100 or the socket cover 160. 60 can be removed from the electronic device.
  • the socket cover 160 functions as a socket cover 160 having a cooling device for the notebook PC 100 which needs cooling for the module 160.
  • the cooling device that is, the cooling fan 180
  • the cooling fan 180 can be removed from the notebook PC 100.
  • a combination of the heat conductive rubber 170 and the cooling fan 180 may be selected according to the module 30 inserted into the socket 1.2, and the socket cover 160 may be attached to and detached from the cover body 162. It is only necessary to provide such a socket cover 160 on the base 130.
  • the cooling fan 180 is fixed and cannot be removed (specifically, it cannot be removed when the module 30 is mounted on the socket cover 160). This problem is solved by providing the cooling fan 180 detachably on the socket cover 160. Therefore, it contributes to weight reduction and price reduction of the notebook PC 100.
  • FIG. 8 is a schematic perspective view showing a socket cover 160a which is a modified example of the socket force par 160 shown in FIG.
  • FIG. 9 is a schematic perspective view showing a socket cover 160a which is a modified example of the socket cover 160 shown in FIG.
  • the same reference numerals denote the same members, and a duplicate description will be omitted.
  • the socket cover 160a has a cover body 160a, a heat conductive rubber 170a, and a cooling fan 180a, and the heat conductive rubber 170a and the cooling fan 180. a is fixed so that it is located inside the base 130 a. As shown in FIG. 8, the thermal conductive rubber 170a and the cooling fan 180a are fixed in parallel in the Y direction shown in FIG.
  • the cooling fan 180a is fixed by screws 186, and the cooling fan 180a is detachably fixed to the cover body 162a.
  • a fixing method is an example, and other methods are not excluded as long as the cooling fan 180a and the cover body 162a are detachably fixed.
  • the cooling fan 180a is fixed to the cover body 162a. In such a case, the cooling fan 180a would be fixed to the cover member 162 by means of adhesion, welding, or the like.
  • the cover body 16 2 a is a power member for the mother port 1 O a socket 12 a and also functions as a plate material for fixing the heat conductive rubber 170 a and the cooling fan 180 a.
  • the cover body 16 2a constitutes a part of the bottom surface 134a and the side surface 1336a of the base 130a, similar to the state shown in FIG. It is a plate bent in a substantially L-shape.
  • the cover body 162a When the cover body 162a is viewed from the bottom surface 134a of the notebook PC 100a, the cover body 162a has an L-shape.
  • the socket cover functioning as the cooling device of the present invention. 160 can be applied (ie, socket cover 160a).
  • the shape of the cover body 162a has the above-described degrees of freedom such as the rectangle, L-shape, and T-shape.
  • such a degree of freedom leads to an increase in the degree of freedom in designing a notebook PC.
  • FIG. 10 is a schematic perspective view showing a socket cover 160b which is a modification of the socket cover 160 shown in FIG.
  • FIG. 11 is a schematic perspective view showing a socket cover 160b which is a modification of the socket force par 160 shown in FIG.
  • the same members will be denoted by the same reference numerals, and redundant description will be omitted.
  • the socket cover 160 of the present invention does not necessarily require both the heat conductive rubber 170 and the cooling fan 180 to be fixed to the cover body 162, and will be described later.
  • the combination is determined according to the module 30 attached as described above. Therefore, an independent cover may be provided for the cooling fan 180 so that the cooling fan 180 can be independently attached to and detached from the notebook PC 100.
  • the socket cover 160b of the present modified example has a first cover 165, a first cover 166, a heat conductive rubber (not shown), and a cooling fan 180b.
  • the heat The conductive rubber and the cooling fan 180 b are located inside the base 130.
  • a heat conductive rubber (not shown) is fixed to the first cover 165 by a method such as bonding as described above.
  • the cooling fan 180 ID is fixed to the first cover — 16 6 with screws 18 6, and the cooling fan 180 b is detachably fixed to the first cover — 16 6 Have been.
  • such a fixing method is an example, and the other method is not excluded as long as the cooling fan 180b and the first cover 166 are detachably fixed.
  • the cooling fan 180 b is fixed to the first cover 166. In such a case, the cooling fan 180b would be fixed to the first cover 166 using means such as bonding, welding, or the like.
  • the heat conductive rubber 170a and the cooling fan 180a are attached to the first cover 165 and the first cover 166. They do not need to be fixed respectively, and the combination is determined according to the module 30 to be attached as described later.
  • the first cover 165 is a cover for the mother board L0b socket 12b and has a function as a plate material for fixing a heat conductive rubber (not shown).
  • the first cover 165 is a flat plate constituting a part of the bottom surface 134b of the base 130a.
  • the first cover 166 has a function as a plate material for fixing the cooling fan 180b.
  • the first cover 16 6 forms a part of the bottom surface 13 4 b and the side surface 13 36 b of the base 130 b, and is similar to the state shown in FIG. In addition, it is a plate bent into an abbreviation shape. Further, the first cover 166 may be constituted by a part of a housing constituting the cooling fan 180b.
  • the base 130 may further be provided with an expansion slot into which a plurality of types of expansion units can be detachably inserted, a connector such as a USB, and the like. It may have any function that a trader can imagine.
  • the mother port 10 typically includes a socket (not shown) for mounting a CPU 20 and a memory, and a slot 12 for mounting an expansion module 30.
  • the CPU 20 as the control unit and the memory (not shown) as the main storage unit are attached to the motherboard 10 to enable electrical connection with each part.
  • a socket is meant to include both a socket and a slot, and there is no limitation on the shape of the socket; similarly, a memory socket has no limitation in shape).
  • the extension module 30 is, for example, a network module, a fax modem module, a modem module, a sound module, a graphic module, or the like. Further, the motherboard 10 is connected to an auxiliary storage device including a hard disk device (not shown). Since the mother board 10 can be easily understood by those skilled in the art, a detailed description thereof will be omitted.
  • the mother board 10 may have a heat radiating mechanism such as a heat sink (not shown) on the side of the CPU 20 facing the substrate when the CPU 20 is attached.
  • the heat sink is in thermal surface contact with CPU 210.
  • the heat sink and the CPU are fixed by, for example, a clip (not shown). Any shape can be applied to the heat sink, and the detailed description is omitted here.
  • a fan may be provided on the heat sink to increase the heat radiation efficiency.
  • FIG. 12 is a flowchart for explaining the method for manufacturing an electronic device of the present invention.
  • the note type PC 100 relates to BTO which manufactures products according to orders of users.
  • BTO BTO
  • a user can select a module 30 that achieves a desired function.
  • the manufacturer receives an order for the notebook PC 100 and an order for a desired additional module.
  • orders can be widely received by Internet sales, power log sales, and in-store orders.
  • the manufacturer manufactures the notebook PC 100 until the module 30 can be mounted (step 100000).
  • the state in which the module 30 can be mounted is the stage at which the module 30 can be (optionally) mounted on the notebook PC 100 and the socket cover 160 can be mounted as described above to be shipped as a product. Shall mean. It is to be noted that a method of manufacturing the notebook PC 100 to such a state is easy for those skilled in the art, and detailed description here will be omitted. Also, in step 100, production may be performed in advance before receiving an order, and stock may be held.
  • the manufacturer compares the order received in advance with the order and determines whether or not the module 30 is mounted on the notebook PC 100 (step 1005).
  • step 1005 when it is determined that the module 30 is mounted (that is, Y es), it is next determined whether the module 30 is a predetermined module (step 1010). If it is determined in step 1005 that the module is not mounted (that is, No), the manufacturer proceeds to step 1005.
  • the predetermined module 30 is, for example, a module that generates a large amount of heat, such as a network module, or the inside of a notebook PC 100 in combination with a CPU and other elements. It is a module that is expected to generate a large amount of heat.
  • the manufacturer attaches the socket cover 160 to the cover body 162 with the heat conductive rubber 170 and the cooling fan 180. And attach it to the notebook PC 100 (Step 101).
  • the heat transfer rubber 170 and the cooling fan 180 may be fixed to the cover body 162 in advance in various combinations. It may be replaced by a step of selecting a socket cover 160 having a cooling fan 180 and a cooling fan 180. As shown in FIG. 3, such a state is completed as a notebook PC 100 on which a heat conductive rubber 170 and a cooling fan 180 are mounted (step 1205).
  • step 110 if it is determined in step 110 that the module is not the predetermined module 30, the manufacturer predicts the calorific value of the module 30, the calorific value in the notebook PC 100, or According to the calculated manual, either the heat conductive rubber 170 or the cooling fan 180 is fixed to the cover body 16 2, or both are not fixed to the cover body 16 2.
  • Attach the 160 to the base 130 of the notebook PC 100 step 102).
  • FIGS. 6 and 7 Such a state is shown in which a notebook PC 100 equipped with one of the thermal conductive rubber 170 and the cooling fan 180 is mounted.
  • a notebook PC 100 having a socket cover of only the cover body 16 (not shown) as a part of the base 130 is completed (Step 10 25).
  • FIGS. 6 and 7 FIG. 3 is a cross-sectional view corresponding to FIG. 3, showing an exemplary embodiment of the notebook PC 100 shown in FIG.
  • the notebook PC 100 having any of the forms described above can be manufactured as a notebook PC that is low in cost and lightweight.
  • the notebook PC 100 executes a program stored in the hard disk device by operating the keyboard or the mouse by the user.
  • the CPU 20 downloads necessary data to the memory from a hard disk device, ROM, or module 30 (not shown).
  • the heat generated from the module 30 is conducted by the thermally coupled rubber 170.
  • the cooling fan 180 forcibly cools the notebook PC.
  • the heat of module 30 is radiated.
  • the heat value of the module 30 and the cooling capacity of the cooling device are almost the same, so that the heat generating element can be cooled effectively.
  • the cooling fan can be freely removed from the electronic device by removing the cooling fan from the cover attached to the housing of the electronic device or the cover. it can.
  • a cooling device can be attached to an electronic device requiring cooling for the heat generating element, but a cover is removed for an electronic device not requiring cooling.
  • the cooling device ie, cooling fan
  • the cooling fan can be removed by removing the cooling fan from the cover. Therefore, in the notebook PC having such a cooling device, the cooling fan is detachably fixed to the socket cover, so that the module mounted on the socket is not provided. The presence or absence of a cooling fan can be determined according to the yule.
  • Such notebook PCs can achieve low cost and light weight, especially in BTOs produced in response to orders from users.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dispositif de refroidissement permettant d'obtenir une réduction du poids et du coût d'un équipement électronique, équipement électronique et procédé de production dudit dispositif. Le dispositif de refroidissement selon la présente invention, utilisé pour refroidir l'élément chauffant d'un équipement électronique, comporte un couvercle qui est doté d'un ventilateur de refroidissement destiné à refroidir l'élément chauffant et qui est attaché amovible au boîtier de l'équipement électronique.
PCT/JP2001/005092 2001-06-13 2001-06-13 Dispositif de refroidissement, equipement electronique et procede de production Ceased WO2003001860A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2001/005092 WO2003001860A1 (fr) 2001-06-13 2001-06-13 Dispositif de refroidissement, equipement electronique et procede de production
JP2003508114A JPWO2003001860A1 (ja) 2001-06-13 2001-06-13 冷却装置、電子機器及び製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/005092 WO2003001860A1 (fr) 2001-06-13 2001-06-13 Dispositif de refroidissement, equipement electronique et procede de production

Publications (1)

Publication Number Publication Date
WO2003001860A1 true WO2003001860A1 (fr) 2003-01-03

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PCT/JP2001/005092 Ceased WO2003001860A1 (fr) 2001-06-13 2001-06-13 Dispositif de refroidissement, equipement electronique et procede de production

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007149007A (ja) * 2005-11-30 2007-06-14 Toshiba Corp 電子機器
US7652883B2 (en) 2006-09-28 2010-01-26 Fujitsu Limited Electronic device
KR101763896B1 (ko) * 2015-10-05 2017-08-02 아주대학교 산학협력단 휴대용 냉각장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088567A (ja) * 1994-06-23 1996-01-12 Fujitsu Ltd 部品の冷却装置及び熱伝導機構部
JP2000105635A (ja) * 1998-09-29 2000-04-11 Matsushita Electric Ind Co Ltd ノート型パーソナルコンピュータ用冷却装置
JP2000277957A (ja) * 1999-03-19 2000-10-06 Furukawa Electric Co Ltd:The 電子装置の冷却構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088567A (ja) * 1994-06-23 1996-01-12 Fujitsu Ltd 部品の冷却装置及び熱伝導機構部
JP2000105635A (ja) * 1998-09-29 2000-04-11 Matsushita Electric Ind Co Ltd ノート型パーソナルコンピュータ用冷却装置
JP2000277957A (ja) * 1999-03-19 2000-10-06 Furukawa Electric Co Ltd:The 電子装置の冷却構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007149007A (ja) * 2005-11-30 2007-06-14 Toshiba Corp 電子機器
US7652883B2 (en) 2006-09-28 2010-01-26 Fujitsu Limited Electronic device
KR101763896B1 (ko) * 2015-10-05 2017-08-02 아주대학교 산학협력단 휴대용 냉각장치

Also Published As

Publication number Publication date
JPWO2003001860A1 (ja) 2004-10-14

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